DE20300770U1 - Modular unit for fan-less, high-computing power panel-computer, has one or more cooling walls mounted directly on assembly plate - Google Patents

Modular unit for fan-less, high-computing power panel-computer, has one or more cooling walls mounted directly on assembly plate

Info

Publication number
DE20300770U1
DE20300770U1 DE20300770U DE20300770U DE20300770U1 DE 20300770 U1 DE20300770 U1 DE 20300770U1 DE 20300770 U DE20300770 U DE 20300770U DE 20300770 U DE20300770 U DE 20300770U DE 20300770 U1 DE20300770 U1 DE 20300770U1
Authority
DE
Germany
Prior art keywords
fanless
heat
computing power
creating
protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20300770U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Richard Woehr GmbH
Original Assignee
Richard Woehr GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Richard Woehr GmbH filed Critical Richard Woehr GmbH
Priority to DE20300770U priority Critical patent/DE20300770U1/en
Publication of DE20300770U1 publication Critical patent/DE20300770U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A modular unit for panel-computer includes an assembly plate on the front- and/or rear-face of which are mounted the motherboard and/or back-plane with slot-CPU and/or all-in-one board and other boards with integrated processors. The board is arranged parallel, and /or parallel and at right-angles to the display; and/or the hard disk drives and/or the CD-ROM and/or working memory and other sub-assemblies are integrated on additional adapter plates. One and/or more cooling walls and/or cooling bodies are mounted directly and/or via spacer-retainers on the assembly plate or loosely as built-in elements. The heat arising in the processor is removed by one and/or several liquid coolers without fans, where the heat-removing part of the liquid cooler is placed directly on the surface of the processor by means of a plate and/or adapter system, and that of the liquid cooler is fixed by adapter plates and/or directly on the cooling wall.

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (8)

1. Moduleinheit um Erstellen von lüfterlosen Panel-Computer mit hoher Rechenleistung und hoher Schutzart und geringer Bautiefe bestehend aus einer Montageplatte, an der front- und/oder rückseitig das Display mit den Wandlern und den Bauelementen Motherboard und/oder Backplane mit Slot-CPU und/oder All-in-one Board und/oder sonstiges Board mit darauf integrierten Prozessoren befestigt sind, wobei das Board parallel und/oder parallel und rechtwinklig zum Display angeordnet ist, und/oder Festplattenlaufwerk und/oder CD-ROM und/oder Arbeitsspeicher u. ä. Bausteine auf weiteren Adapterplatten integriert sind, dadurch gekennzeichnet, dass an der Montageplatte eine und/oder mehrere Kühlwände und/oder Kühlkörper direkt und/oder über Abstandshalter befestigt sind und/oder lose als Einbauelemente vorhanden sind und die in dem Prozessor entstehende Wärme mittels einem und/oder mehreren Flüssigkeitskühler ohne Lüfter abgeführt wird, wobei der wärmeaufnehmende Teil des Flüssigkeitskühlers mittels einer Platte und/oder Adaptersystem direkt auf der Oberfläche des Prozessors aufliegt und der wärmeabgebende Teil des Flüssigkeitskühlers mittels Adapterplatten und/oder direkt auf der Kühlwand befestigt ist.1.Module unit for creating fanless panel computers with high computing power and a high degree of protection and low installation depth consisting of a mounting plate on the front and / or back of the display with the converters and the components motherboard and / or backplane with slot CPU and / or all-in-one board and / or other board with processors integrated thereon, the board being arranged in parallel and / or in parallel and at right angles to the display, and / or hard disk drive and / or CD-ROM and / or working memory and the like , Modules are integrated on further adapter plates, characterized in that one and / or more cooling walls and / or heat sinks are attached directly and / or via spacers to the mounting plate and / or are loosely present as built-in elements and the heat generated in the processor is by means of one and / or more liquid coolers is removed without a fan, the heat-absorbing part of the liquid cooler resting directly on the surface of the processor by means of a plate and / or adapter system and the heat-emitting part of the liquid cooler being fastened by means of adapter plates and / or directly on the cooling wall. 2. Moduleinheit zum Erstellen von lüfterlosen Panel-Computer mit hoher Rechenleistung und hoher Schutzart und geringer Bautiefe nach Anspruche 1, dadurch gekennzeichnet, dass das lüfterlose Netzteil an der Kühlwand und/oder Kühlkörper befestigt ist, so dass die direkte Wärmeübertragung des Netzteilkühlkörpers auf die Kühlwand und/oder Kühlkörper erfolgt.2. Module unit for creating fanless panel computers with high computing power and high degree of protection and shallow depth according to claim 1, characterized in that the fanless power supply is attached to the cooling wall and / or heat sink, so that the direct Heat transfer from the power pack heat sink to the cooling wall and / or heat sink takes place. 3. Moduleinheit zum Erstellen von lüfterlosen Panel-Computer mit hoher Rechenleistung und hoher Schutzart und geringer Bautiefe nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die wärmeabgebenden Komponenten des lüfterlosen Netzteils direkt auf der Kühlwand und/oder Kühlkörper montiert wird.3. Module unit for creating fanless panel computers with high computing power and high degree of protection and shallow depth according to one of the preceding claims, thereby characterized that the heat-emitting components of the fanless power supply directly on the cooling wall and / or heat sink is installed. 4. Moduleinheit zum Erstellen von lüfterlosen Panel-Computer mit hoher Rechenleistung und hoher Schutzart und geringer Bautiefe nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass als Flüssigkeitskühler eine Heat-Pipe eingesetzt wird.4. Module unit for creating fanless panel computers with high computing power and high degree of protection and shallow depth according to one of the preceding claims, thereby characterized in that a heat pipe is used as the liquid cooler. 5. Moduleinheit zum Erstellen von lüfterlosen Panel-Computer mit hoher Rechenleistung und hoher Schutzart und geringer Bautiefe nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Platte und/oder das Adaptersystem und/oder die Adapterplatten des Flüssigkeitskühlers aus Kupfer und/oder Aluminium und/oder deren Legierungen sind.5. Module unit for creating fanless panel computers with high computing power and high degree of protection and shallow depth according to one of the preceding claims, thereby characterized in that the plate and / or the adapter system and / or the adapter plates of the Liquid cooler made of copper and / or aluminum and / or their alloys. 6. Moduleinheit zum Erstellen von lüfterlosen Panel-Computer mit hoher Rechenleistung und hoher Schutzart und geringer Bautiefe nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Kühlwand und/oder Kühlkörper integrierte Kühlrippen und/oder Kühllamellen zur Vergrößerung der Kühlfläche aufweisen.6. Module unit for creating fanless panel computers with high computing power and high degree of protection and shallow depth according to one of the preceding claims, thereby characterized in that the cooling wall and / or heat sink integrated cooling fins and / or Have cooling fins to enlarge the cooling surface. 7. Moduleinheit zum Erstellen von lüfterlosen Panel-Computer mit hoher Rechenleistung und hoher Schutzart und geringer Bautiefe nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die. Form des Flüssigkeitskühlers der Einbauanordnung der Komponenten innerhalb der Montageplatten angepasst ist.7. Module unit for creating fanless panel computers with high computing power and high degree of protection and shallow depth according to one of the preceding claims, thereby characterized that the. Shape of the liquid cooler of the mounting arrangement of the components is adapted within the mounting plates. 8. Moduleinheit zum Erstellen von lüfterlosen Panel-Computer mit hoher Rechenleistung und hoher Schutzart und geringer Bautiefe nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass zur Befestigung der Platte und/oder des Adaptersystems des wärmeaufnehmenden Endes des Flüssigkeitskühlers verschiedene Befestigungssysteme und - möglichkeiten eingesetzt werden, die von der Wahl des Prozessors und des Prozessorsockels abhängig sind.8. Module unit for creating fanless panel computers with high computing power and high degree of protection and shallow depth according to one of the preceding claims, thereby characterized in that for fastening the plate and / or the adapter system of the heat-absorbing end of the liquid cooler various fastening systems and Possibilities are used by the choice of the processor and the processor socket are dependent.
DE20300770U 2003-01-17 2003-01-17 Modular unit for fan-less, high-computing power panel-computer, has one or more cooling walls mounted directly on assembly plate Expired - Lifetime DE20300770U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20300770U DE20300770U1 (en) 2003-01-17 2003-01-17 Modular unit for fan-less, high-computing power panel-computer, has one or more cooling walls mounted directly on assembly plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20300770U DE20300770U1 (en) 2003-01-17 2003-01-17 Modular unit for fan-less, high-computing power panel-computer, has one or more cooling walls mounted directly on assembly plate

Publications (1)

Publication Number Publication Date
DE20300770U1 true DE20300770U1 (en) 2003-03-13

Family

ID=7979209

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20300770U Expired - Lifetime DE20300770U1 (en) 2003-01-17 2003-01-17 Modular unit for fan-less, high-computing power panel-computer, has one or more cooling walls mounted directly on assembly plate

Country Status (1)

Country Link
DE (1) DE20300770U1 (en)

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030417

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: G06F0001000000

Ipc: G06F0001200000

R150 Term of protection extended to 6 years

Effective date: 20060214

R151 Term of protection extended to 8 years

Effective date: 20090218

R152 Term of protection extended to 10 years

Effective date: 20110216

R071 Expiry of right
R071 Expiry of right