DE20219869U1 - Rapidly cooled light emitting diode has gas tight thermally conductive cover and cooling fins on the substrate - Google Patents

Rapidly cooled light emitting diode has gas tight thermally conductive cover and cooling fins on the substrate

Info

Publication number
DE20219869U1
DE20219869U1 DE20219869U DE20219869U DE20219869U1 DE 20219869 U1 DE20219869 U1 DE 20219869U1 DE 20219869 U DE20219869 U DE 20219869U DE 20219869 U DE20219869 U DE 20219869U DE 20219869 U1 DE20219869 U1 DE 20219869U1
Authority
DE
Germany
Prior art keywords
substrate
gas
cover
emitting diode
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20219869U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUH, LIH MING, TW
Original Assignee
Ming Fuh Lih
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ming Fuh Lih filed Critical Ming Fuh Lih
Priority to DE20219869U priority Critical patent/DE20219869U1/en
Publication of DE20219869U1 publication Critical patent/DE20219869U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/777—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A rapidly cooled LED comprises many semiconductor areas (31) on a substrate (32) connected to an electrode (33) and sealed into a thermally conductive cover (50) containing a cooling fluid dielectric (37). Operational heat is dissipated through the leads, the conductive cover and cooling fins on the substrate.

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (3)

1. Schnell kühlende Leuchtdiode mit einem Substrat (32) mit einem Satz von Halbleitern, die an dem Substrat befestigt sind, einer gasdichten Abdeckung (36) aus hochthermisch leitfähigem Material, wobei deren Innenseite den Halbleiter (31) und das Substrat (32) aufnimmt, mit einer Elektrode (33), wobei eine Mehrzahl von Halbleitern auf dem Substrat befestigt und mit der Elektrode verbunden sind, mit einer Abdeckung, welche in einem Metallbehälter aufgenommen ist und den Grund der gasdichten Abdeckung abdichten kann, mit zwei oder mehr Zuleitungen, die sich von der gasdichten Abdeckung erstrecken, einem Dielektrikum (37) als isolierende Kühlflüssigkeit oder Gasfüllung in der gasdichten Abdeckung, welche die Halbleiter berührt, wobei das Dielektrikum in die gasdichte Abdeckung einführbar ist, nachdem Gas aus der Abdeckung entfernt ist, und die Wärme durch die dielektrische Umgebung des Halbleiters, des Substrats und der Zuleitungen abführbar und von der Oberfläche der gasdichten Abdeckung entfernbar ist, wobei Substratlamellen den thermischen Austausch bei der Erzeugung von Lichtenergie verbessern.1. Fast-cooling light-emitting diode with a substrate ( 32 ) with a set of semiconductors which are attached to the substrate, a gas-tight cover ( 36 ) made of highly thermally conductive material, the inside of which accommodates the semiconductor ( 31 ) and the substrate ( 32 ) , with an electrode ( 33 ), wherein a plurality of semiconductors are attached to the substrate and connected to the electrode, with a cover which is accommodated in a metal container and can seal the base of the gas-tight cover, with two or more leads which extend from the gas-tight cover, a dielectric ( 37 ) as an insulating cooling liquid or gas filling in the gas-tight cover, which contacts the semiconductors, the dielectric being insertable into the gas-tight cover after gas has been removed from the cover, and the heat through the dielectric environment of the semiconductor, the substrate and the leads can be removed and from the surface d he gas-tight cover can be removed, with substrate lamellae improving the thermal exchange in the generation of light energy. 2. Leuchtdiode nach Anspruch 1, bei der das Dielektrikum als Vakuum ausgebildet ist und die durch die Halbleiter erzeugte Wärme über Strahlungsabgabe verteilt wird.2. Light emitting diode according to claim 1, wherein the dielectric as a vacuum is formed and the heat generated by the semiconductor Radiation emission is distributed. 3. Leuchtdiode nach Anspruch 1, bei der die Abdeckung mit einem üblichen Lampensockel verbindbar ist, und die Leiterenden der Abdichtung mit der Zuleitung der Elektrode verbunden sind.3. LED according to claim 1, wherein the cover with a conventional Lamp base is connectable, and the conductor ends of the seal with the Lead of the electrode are connected.
DE20219869U 2002-12-21 2002-12-21 Rapidly cooled light emitting diode has gas tight thermally conductive cover and cooling fins on the substrate Expired - Lifetime DE20219869U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20219869U DE20219869U1 (en) 2002-12-21 2002-12-21 Rapidly cooled light emitting diode has gas tight thermally conductive cover and cooling fins on the substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20219869U DE20219869U1 (en) 2002-12-21 2002-12-21 Rapidly cooled light emitting diode has gas tight thermally conductive cover and cooling fins on the substrate

Publications (1)

Publication Number Publication Date
DE20219869U1 true DE20219869U1 (en) 2003-05-15

Family

ID=7978237

Family Applications (1)

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DE20219869U Expired - Lifetime DE20219869U1 (en) 2002-12-21 2002-12-21 Rapidly cooled light emitting diode has gas tight thermally conductive cover and cooling fins on the substrate

Country Status (1)

Country Link
DE (1) DE20219869U1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1596440A1 (en) * 2004-05-11 2005-11-16 Excel Cell Electronic Co., Ltd. Light emitting device
US7253447B2 (en) 2003-02-28 2007-08-07 Citizen Electronics Co., Ltd. Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element
DE102007017113A1 (en) * 2007-01-31 2008-08-07 Osram Opto Semiconductors Gmbh Semiconductor device with an optically active layer, arrangement with a plurality of optically active layers and method for producing a semiconductor device
DE102008008599A1 (en) * 2007-12-20 2009-06-25 Osram Opto Semiconductors Gmbh Light-emitting semiconductor component has epitaxially grown semiconductor layer sequence with sublayer suitable for light generation and electrical contacts, which are contacting semiconductor layer sequence
US7851815B2 (en) 2005-10-22 2010-12-14 Noctron Holding S.A. Light-emitting element having at least one light-emitting chip crystal
EP2187119A3 (en) * 2008-09-19 2011-06-15 Toshiba Lighting & Technology Corporation Lamp device and lighting apparatus
EP1953837A3 (en) * 2007-01-31 2014-01-15 OSRAM Opto Semiconductors GmbH Semiconductor component with an optically active layer, assembly with a number of optically active layers and method for producing a semiconductor component

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7253447B2 (en) 2003-02-28 2007-08-07 Citizen Electronics Co., Ltd. Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element
DE102004009998B4 (en) * 2003-02-28 2010-05-06 Citizen Electronics Co., Ltd., Fujiyoshida-shi A light emitting diode and light emitting diode device comprising a light emitting diode
US7737462B2 (en) 2003-02-28 2010-06-15 Citizen Electronics Co., Ltd Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
US7745835B2 (en) 2003-02-28 2010-06-29 Citizen Electronics Co., Ltd. Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
EP1596440A1 (en) * 2004-05-11 2005-11-16 Excel Cell Electronic Co., Ltd. Light emitting device
US7851815B2 (en) 2005-10-22 2010-12-14 Noctron Holding S.A. Light-emitting element having at least one light-emitting chip crystal
DE102007017113A1 (en) * 2007-01-31 2008-08-07 Osram Opto Semiconductors Gmbh Semiconductor device with an optically active layer, arrangement with a plurality of optically active layers and method for producing a semiconductor device
US8564007B2 (en) 2007-01-31 2013-10-22 Osram Opto Semiconductors Gmbh Semiconductor component comprising an optically active layer, arrangement comprising a multiplicity of optically active layers and method for producing a semiconductor component
EP1953837A3 (en) * 2007-01-31 2014-01-15 OSRAM Opto Semiconductors GmbH Semiconductor component with an optically active layer, assembly with a number of optically active layers and method for producing a semiconductor component
DE102008008599A1 (en) * 2007-12-20 2009-06-25 Osram Opto Semiconductors Gmbh Light-emitting semiconductor component has epitaxially grown semiconductor layer sequence with sublayer suitable for light generation and electrical contacts, which are contacting semiconductor layer sequence
EP2187119A3 (en) * 2008-09-19 2011-06-15 Toshiba Lighting & Technology Corporation Lamp device and lighting apparatus

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030618

R081 Change of applicant/patentee

Owner name: FUH, LIH MING, TW

Free format text: FORMER OWNER: MING, FUH LIH, TALI, TW

Effective date: 20051004

R156 Lapse of ip right after 3 years

Effective date: 20060701