DE20218209U1 - Cooling wall for a computer housing with integral external cooling which disperses heat to the surroundings by convection - Google Patents

Cooling wall for a computer housing with integral external cooling which disperses heat to the surroundings by convection

Info

Publication number
DE20218209U1
DE20218209U1 DE20218209U DE20218209U DE20218209U1 DE 20218209 U1 DE20218209 U1 DE 20218209U1 DE 20218209 U DE20218209 U DE 20218209U DE 20218209 U DE20218209 U DE 20218209U DE 20218209 U1 DE20218209 U1 DE 20218209U1
Authority
DE
Germany
Prior art keywords
cooling
wall
heat
cooling wall
computer case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20218209U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Richard Woehr GmbH
Original Assignee
Richard Woehr GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Richard Woehr GmbH filed Critical Richard Woehr GmbH
Priority to DE20218209U priority Critical patent/DE20218209U1/en
Publication of DE20218209U1 publication Critical patent/DE20218209U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The cooling wall (1) is arranged such that the motherboard (4) and/or all-in-one board and/or slot CPU can be fastened to the wall. The wall has one or more raised portions (2) and/or recesses in the region of the processor or other components whose heat must be dispersed. The height and/or depth of these is such that when the board is mounted, the processor or other component surface lies directly on the surface (3) of the raised portion and/or recess in direct contact. The heat generated can thus be conveyed by heat transfer to the cooling wall. Cooling ribs (11) are arranged on the outer side of the wall, across which cooling air is conveyed by a fan. The cooling air disperses the heat to the surroundings by convection.

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (11)

1. Kühlwand für Computergehäuse mit integrierter externer Kühlung, dadurch gekennzeichnet, dass die Wand so gestaltet ist, dass an der Wand das Motherboard und/oder All-in-one Board und/oder die Slot-CPU befestigt werden kann und dass die Wand im Bereich des Prozessors und/oder zusätzlicher Komponenten, deren Wärme abgeführt werden muß, eine und/oder mehrere Erhöhungen und/oder Vertiefungen aufweist, deren Höhen und/oder Tiefen so festgelegt sind, dass bei festmontiertem Board die Prozessoroberfläche und/oder die Oberfläche der zusätzlichen Komponenten direkt auf den Oberflächen der Erhöhungen und/oder Vertiefungen aufliegen und so in direktem Berührungskontakt mit dieser Flache sind, so dass die entstehende Wärme über Wärmeleitung auf die Kühlwand übertragen wird und das auf der Außenseite der Wand Kühlrippen angeordnet sind über die Kühlluft mittels Lüfter geführt wird, wobei die Kühlluft die entstehende Wärme durch Konvektion an die Umgebung abführt.1. cooling wall for computer case with integrated external cooling, characterized in that the wall is designed so that the motherboard and / or all-in-one board and / or the slot CPU can be attached to the wall and that the wall in Area of the processor and / or additional components, the heat of which has to be dissipated, has one and / or more elevations and / or depressions, the heights and / or depths of which are determined such that the processor surface and / or the surface of the additional ones when the board is permanently mounted Components rest directly on the surfaces of the elevations and / or depressions and are thus in direct contact with this surface, so that the heat generated is transferred to the cooling wall via heat conduction and the cooling fins are arranged on the outside of the wall and are guided by means of fans to the cooling air is, the cooling air dissipates the heat generated by convection to the environment. 2. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach Anspruch 1, dadurch gekennzeichnet, dass die Höhe der Vertiefung so gestaltet ist, dass bei montiertem Motherboard und/oder All-in-one-Board auf der Seite mit der Vertiefung die Oberfläche des Prozessors direkt auf der Oberfläche der Innenseite der Vertiefung aufliegt, so dass die im Prozessor entstehende Wärme durch Wärmeleitung auf die Vertiefung übertragen wird.2. cooling wall for computer housing with integrated external cooling according to claim 1, characterized in that the height of the recess is designed so that when mounted Motherboard and / or all-in-one board on the side with the depression of the surface of the Processor rests directly on the surface of the inside of the recess, so that the im Processor generated heat is transferred to the recess by heat conduction. 3. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Vertiefung und/oder Erhöhung einen Durchbruch aufweist, in den ein separater Kühlkörper montiert wird, so dass sich die Kühlrippen des Kühlkörpers auf der Außenseite der Vertiefung und/oder Erhöhung befinden, wobei die Höhe der Vertiefung so gestaltet ist, dass bei montiertem Motherboard und/oder All-in-one-Board auf der Seite mit der Vertiefung die Oberfläche des Prozessors direkt auf der Oberfläche der Innenseite des Kühlkörpers aufliegt, so dass die im Prozessor entstehende Wärme durch Wärmeleitung auf den Kühlkörper übertragen wird.3. Cooling wall for computer case with integrated external cooling according to one of the preceding claims, characterized in that the recess and / or Increase has a breakthrough in which a separate heat sink is mounted, so that the cooling fins of the heat sink on the outside of the recess and / or Increase, the height of the recess is designed so that when mounted Motherboard and / or all-in-one board on the side with the depression of the surface of the Processor rests directly on the surface of the inside of the heat sink, so that the Heat generated in the processor is transferred to the heat sink by heat conduction. 4. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Kühlluft zum Abführen der entstehenden Wärme mittels Axial- und/oder Radiallüfter und/oder Querstromgebläse über die Kühlrippen der Kühlwand und/oder Kühlrippen der Kühlkörper geführt wird.4. Cooling wall for computer case with integrated external cooling according to one of the preceding claims, characterized in that the cooling air for removing the heat generated by means of axial and / or radial fans and / or cross-flow fans the cooling fins of the cooling wall and / or cooling fins of the heat sink is guided. 5. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Lüfter an den Kühlrippen befestigt sind.5. Cooling wall for computer case with integrated external cooling according to one of the preceding claims, characterized in that the fans on the cooling fins are attached. 6. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Lüfter an der Kühlwand befestigt sind.6. Cooling wall for computer case with integrated external cooling according to one of the preceding claims, characterized in that the fan on the cooling wall are attached. 7. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Kühlwand mit der Vertiefung und/oder Erhöhung als Sand- und/oder Druckgussteil hergestellt ist und/oder aus dem Vollen gearbeitet wird.7. Cooling wall for computer case with integrated external cooling according to one of the preceding claims, characterized in that the cooling wall with the recess and / or raised as a sand and / or die-cast part and / or from which Full work is done. 8. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass zur besseren Wärmeleitung vom Prozessor zur Oberfläche der Vertiefung und/oder Erhöhung eine Wärmeleitpaste und/oder Wärmeleitfolie integriert wird.8. Cooling wall for computer case with integrated external cooling according to one of the preceding claims, characterized in that for better heat conduction a thermal paste from the processor to the surface of the recess and / or elevation and / or heat-conducting film is integrated. 9. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Kühlwand integrierte Luftführungskanale für Zu- und Abluft aufweist.9. Cooling wall for computer case with integrated external cooling according to one of the preceding claims, characterized in that the cooling wall integrated Has air duct for supply and exhaust air. 10. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass in den Luftführungskanälen Lüfter integriert sind.10. Cooling wall for computer case with integrated external cooling according to one of the preceding claims, characterized in that in the air duct Fans are integrated. 11. Kühlwand für Computergehäuse mit integrierter externer Kühlung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Kühlwand so gestaltet ist, dass sie an herkömmlichen Computergehäusen integriert werden kann.11. Cooling wall for computer case with integrated external cooling according to one of the preceding claims, characterized in that the cooling wall is designed so that it can be integrated into conventional computer housings.
DE20218209U 2002-11-22 2002-11-22 Cooling wall for a computer housing with integral external cooling which disperses heat to the surroundings by convection Expired - Lifetime DE20218209U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20218209U DE20218209U1 (en) 2002-11-22 2002-11-22 Cooling wall for a computer housing with integral external cooling which disperses heat to the surroundings by convection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20218209U DE20218209U1 (en) 2002-11-22 2002-11-22 Cooling wall for a computer housing with integral external cooling which disperses heat to the surroundings by convection

Publications (1)

Publication Number Publication Date
DE20218209U1 true DE20218209U1 (en) 2003-02-20

Family

ID=7977298

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20218209U Expired - Lifetime DE20218209U1 (en) 2002-11-22 2002-11-22 Cooling wall for a computer housing with integral external cooling which disperses heat to the surroundings by convection

Country Status (1)

Country Link
DE (1) DE20218209U1 (en)

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030327

R150 Term of protection extended to 6 years

Effective date: 20051213

R151 Term of protection extended to 8 years

Effective date: 20090109

R152 Term of protection extended to 10 years

Effective date: 20101215

R071 Expiry of right
R071 Expiry of right