DE20216065U1 - Heat sink for cooling an apparatus where heat is generated with cooling projections - Google Patents

Heat sink for cooling an apparatus where heat is generated with cooling projections

Info

Publication number
DE20216065U1
DE20216065U1 DE20216065U DE20216065U DE20216065U1 DE 20216065 U1 DE20216065 U1 DE 20216065U1 DE 20216065 U DE20216065 U DE 20216065U DE 20216065 U DE20216065 U DE 20216065U DE 20216065 U1 DE20216065 U1 DE 20216065U1
Authority
DE
Germany
Prior art keywords
heat
heat sink
cooling projections
projections
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20216065U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LIAU IAN FU
Original Assignee
LIAU IAN FU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LIAU IAN FU filed Critical LIAU IAN FU
Priority to DE20216065U priority Critical patent/DE20216065U1/en
Publication of DE20216065U1 publication Critical patent/DE20216065U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/06—Hollow fins; fins with internal circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

The heat sink has a heat absorbing base plate (11) to which several cooling projections (12) are attached spaced uniformly apart. These projections have a hollow interior to lower the internal heat storage. The heat energy generated by a heat generating component (3) is transmitted quickly to the upper end of the projection (12) to enable rapid heat dispersion. The inside of the projections can contain a vacuum to increase the rate of heat dispersion. Alternatively the projections may be filled with a heat conducting material.

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (10)

1. Wärmesenke, die eine wärmeabsorbierende Grundplatte (11) aufweist, an der eine Vielzahl von Kühlvorsprüngen (12) in regelmäßigen Abständen angebracht sind, die innen als Hohlkörper ausgebildet sind, um die innere Wärmehaltung zu erniedrigen, wobei die von einem wärmeerzeugenden Bauteil (3) erzeugte Wärmeenergie schnell auf das obere Ende der Kühlvorsprünge (12) übertragen wird, um eine schnelle Wärmeableitung zu ermöglichen.1. Heat sink, which has a heat-absorbing base plate ( 11 ), on which a plurality of cooling projections ( 12 ) are attached at regular intervals, which are designed as hollow bodies on the inside in order to lower the internal heat retention, the heat sink being provided by a heat-generating component ( 3 ) generated heat energy is quickly transferred to the upper end of the cooling projections ( 12 ) to allow rapid heat dissipation. 2. Wärmesenke nach Anspruch 1, dadurch gekennzeichnet, dass das Innere der Kühlvorsprünge (12) entlüftet werden kann, um eine noch niedrigere Wärmehaltung darin zu gewährleisten, sodass die vom Bauteil (3) erzeugte Wärmeenergie noch schneller auf das obere Ende der Kühlvorsprünge (12) übertragen wird, um eine noch schnellere Wärmeableitung zu erzielen.2. Heat sink according to claim 1, characterized in that the interior of the cooling projections ( 12 ) can be vented to ensure an even lower heat retention therein, so that the thermal energy generated by the component ( 3 ) even faster on the upper end of the cooling projections ( 12 ) is transferred to achieve even faster heat dissipation. 3. Wärmesenke nach Anspruch 1, dadurch gekennzeichnet, dass die hohlen Kühlvorsprünge (12) innen mit wärmeleitendem Material (4) befüllt sind, durch das die aufgenommene Wärmeenergie schnell auf die Oberfläche und das obere Ende (121) der Kühlvorsprüngen (12) übertragen wird, sodass die Wärmeenergie durch die Kühlvorsprünge (12) schnell abgeleitet werden kann.3. Heat sink according to claim 1, characterized in that the hollow cooling projections ( 12 ) are filled on the inside with heat-conducting material ( 4 ), through which the absorbed thermal energy is quickly transferred to the surface and the upper end ( 121 ) of the cooling projections ( 12 ) , so that the thermal energy can be dissipated quickly through the cooling projections ( 12 ). 4. Wärmesenke nach Anspruch 1, dadurch gekennzeichnet, dass die Kühlvorsprüngen (12) oben an beiden Seiten mit je einem Ableitwinkel (122) versehen sind, der die Wirkung zur Führung der Windrichtung erzielt.4. Heat sink according to claim 1, characterized in that the cooling projections ( 12 ) are provided on both sides at the top with a discharge angle ( 122 ) which achieves the effect of guiding the wind direction. 5. Wärmesenke nach Anspruch 1, dadurch gekennzeichnet, dass die Kühlvorsprünge (12) konisch ausgebildet sind und die Wirkung zur Führung der Windrichtung haben.5. Heat sink according to claim 1, characterized in that the cooling projections ( 12 ) are conical and have the effect of guiding the wind direction. 6. Wärmesenke nach Anspruch 1, dadurch gekennzeichnet, dass die Kühlvorsprünge (12) halbkreisförmig ausgebildet sind und die Wirkung zur Führung der Windrichtung haben.6. Heat sink according to claim 1, characterized in that the cooling projections ( 12 ) are semicircular and have the effect of guiding the wind direction. 7. Wärmesenke nach Anspruch 1, dadurch gekennzeichnet, dass die Kühlvorsprünge (12) zylindrisch ausgebildet sind und die Wirkung zur Führung der Windrichtung haben.7. Heat sink according to claim 1, characterized in that the cooling projections ( 12 ) are cylindrical and have the effect of guiding the wind direction. 8. Wärmesenke nach Anspruch 1, dadurch gekennzeichnet, dass die Kühlvorsprünge (12) in Form einer Pyramide ausgebildet sind und die Wirkung zur Führung der Windrichtung haben.8. Heat sink according to claim 1, characterized in that the cooling projections ( 12 ) are designed in the form of a pyramid and have the effect of guiding the wind direction. 9. Wärmesenke nach Anspruch 1, dadurch gekennzeichnet, dass die Kühlvorsprünge (12) oval ausgebildet sind und die Wirkung zur Führung der Windrichtung haben.9. Heat sink according to claim 1, characterized in that the cooling projections ( 12 ) are oval and have the effect of guiding the wind direction. 10. Wärmesenke nach Anspruch 1, dadurch gekennzeichnet, dass die Kühlvorsprünge (12) in gemischter Form ausgebildet sind und die Wirkung zur Führung der Windrichtung haben.10. Heat sink according to claim 1, characterized in that the cooling projections ( 12 ) are formed in a mixed form and have the effect of guiding the wind direction.
DE20216065U 2002-10-18 2002-10-18 Heat sink for cooling an apparatus where heat is generated with cooling projections Expired - Lifetime DE20216065U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20216065U DE20216065U1 (en) 2002-10-18 2002-10-18 Heat sink for cooling an apparatus where heat is generated with cooling projections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20216065U DE20216065U1 (en) 2002-10-18 2002-10-18 Heat sink for cooling an apparatus where heat is generated with cooling projections

Publications (1)

Publication Number Publication Date
DE20216065U1 true DE20216065U1 (en) 2003-04-03

Family

ID=7976111

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20216065U Expired - Lifetime DE20216065U1 (en) 2002-10-18 2002-10-18 Heat sink for cooling an apparatus where heat is generated with cooling projections

Country Status (1)

Country Link
DE (1) DE20216065U1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016062577A1 (en) * 2014-10-20 2016-04-28 Philips Lighting Holding B.V. Low weight tube fin heat sink
DE102008045827B4 (en) * 2007-09-14 2017-04-20 Sew-Eurodrive Gmbh & Co Kg Housing and device
EP3848662A1 (en) * 2020-01-13 2021-07-14 Cooler Master Co., Ltd. Heat exchanger fin and manufacturing mehtod of the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008045827B4 (en) * 2007-09-14 2017-04-20 Sew-Eurodrive Gmbh & Co Kg Housing and device
WO2016062577A1 (en) * 2014-10-20 2016-04-28 Philips Lighting Holding B.V. Low weight tube fin heat sink
CN107076527A (en) * 2014-10-20 2017-08-18 飞利浦照明控股有限公司 Low weight pipe fin radiator
JP2017531908A (en) * 2014-10-20 2017-10-26 フィリップス ライティング ホールディング ビー ヴィ Lightweight tubular fin heat sink
US10302371B2 (en) 2014-10-20 2019-05-28 Signify Holding B.V. Low weight tube fin heat sink
CN107076527B (en) * 2014-10-20 2020-01-21 飞利浦照明控股有限公司 Low-weight tube fin radiator
EP3848662A1 (en) * 2020-01-13 2021-07-14 Cooler Master Co., Ltd. Heat exchanger fin and manufacturing mehtod of the same

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030508

R156 Lapse of ip right after 3 years

Effective date: 20060503