DE20208276U1 - disk - Google Patents

disk

Info

Publication number
DE20208276U1
DE20208276U1 DE20208276U DE20208276U DE20208276U1 DE 20208276 U1 DE20208276 U1 DE 20208276U1 DE 20208276 U DE20208276 U DE 20208276U DE 20208276 U DE20208276 U DE 20208276U DE 20208276 U1 DE20208276 U1 DE 20208276U1
Authority
DE
Germany
Prior art keywords
data carrier
capacitor
layer
coil
insulation layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20208276U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HID Global AG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE20208276U priority Critical patent/DE20208276U1/en
Publication of DE20208276U1 publication Critical patent/DE20208276U1/en
Priority to PCT/IB2003/002038 priority patent/WO2003100718A2/en
Priority to AU2003232972A priority patent/AU2003232972A1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (8)

1. Datenträger (10), mit einem vorzugsweise kartenför­ migen Körper (12), mit wenigstens einem auf einer Deckschicht des Körpers (12) angeordneten inte­ grierten Schaltkreis (40), mit wenigstens einer auf dieser Deckschicht angeordneten Spule (20), die der Energieversorgung und/oder dem Datenaustausch des integrierten Schaltkreises (40) mit externen Gerä­ ten dient, und mit wenigstens einem Kondensator (30), dadurch gekennzeichnet, daß der Kondensator (30) auf der Deckschicht des Körpers (12) als schichtförmig aufgebauter Plattenkondensator ange­ ordnet ist.1. data carrier ( 10 ), with a preferably kartenför shaped body ( 12 ), with at least one on a cover layer of the body ( 12 ) arranged inte grated circuit ( 40 ), with at least one arranged on this cover layer coil ( 20 ), the Power supply and / or data exchange of the integrated circuit ( 40 ) with external devices th, and with at least one capacitor ( 30 ), characterized in that the capacitor ( 30 ) on the top layer of the body ( 12 ) as a layered plate capacitor is arranged is. 2. Datenträger (10) nach Anspruch 1, dadurch gekenn­ zeichnet, daß der Kondensator (30) aus einer auf der Deckschicht angeordneten ersten Kondensatorflä­ che (31), einer diese überdeckenden Isolations­ schicht und einer auf der Isolationsschicht (62) angeordneten zweiten Kondensatorfläche (73) gebil­ det wird.2. A data carrier ( 10 ) according to claim 1, characterized in that the capacitor ( 30 ) from a arranged on the cover layer first capacitor surface ( 31 ), an overlying insulation layer and a second capacitor surface arranged on the insulation layer ( 62 ) ( 73 ) is formed. 3. Datenträger (10) nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß zur Kontaktierung des dem inte­ grierten Schaltkreis (40) abgelegenen Endes (52) der Spule (20) ein wenigstens einen Teil der Spule überbrückender, isolierender Steg (63) und eine auf diesem angeordnete leitende Verbindung (75) ange­ ordnet sind.3. Data carrier ( 10 ) according to claim 1 or 2, characterized in that for contacting the integrated circuit ( 40 ) remote end ( 52 ) of the coil ( 20 ) at least a part of the coil bridging, insulating web ( 63 ) and an arranged on this conductive connection ( 75 ) are arranged. 4. Datenträger (10) nach Anspruch 2 und 3, dadurch ge­ kennzeichnet, daß die Isolationsschicht (62) des Kondensators und der isolierende Steg (63) jeweils Teil einer in einem ersten Herstellungsschritt auf­ gebrachten Isolationsschicht sind und daß die zwei­ te Kondensatorfläche (73) und die leitende Verbin­ dung (75) jeweils Teil einer in einem weiteren Her­ stellungsschritt aufgebrachten Leitschicht sind.4. Data carrier ( 10 ) according to claim 2 and 3, characterized in that the insulation layer ( 62 ) of the capacitor and the insulating web ( 63 ) are each part of an insulation layer applied in a first manufacturing step and that the two te capacitor surface ( 73 ) and the conductive connection ( 75 ) are each part of a conductive layer applied in a further manufacturing step. 5. Datenträger (10) nach Anspruch 4, dadurch gekenn­ zeichnet, daß die Isolationsschicht eine gedruckte Lackschicht ist.5. A data carrier ( 10 ) according to claim 4, characterized in that the insulation layer is a printed lacquer layer. 6. Datenträger (10) nach Anspruch 4, dadurch gekenn­ zeichnet, daß die Leitschicht eine Silberlack­ schicht ist.6. Data carrier ( 10 ) according to claim 4, characterized in that the conductive layer is a silver lacquer layer. 7. Datenträger (10) nach einem der vorstehenden An­ sprüche, dadurch gekennzeichnet, daß die Spule (20) sich über im wesentlichen die gesamte Deckfläche des Körpers (12) erstreckt.7. Data carrier ( 10 ) according to any one of the preceding claims, characterized in that the coil ( 20 ) extends over substantially the entire top surface of the body ( 12 ). 8. Datenträger (10) nach Anspruch 7, dadurch gekenn­ zeichnet, daß die Spule (20) rechteckförmige oder kreisrunde Gestalt aufweist.8. Data carrier ( 10 ) according to claim 7, characterized in that the coil ( 20 ) has a rectangular or circular shape.
DE20208276U 2002-05-27 2002-05-27 disk Expired - Lifetime DE20208276U1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE20208276U DE20208276U1 (en) 2002-05-27 2002-05-27 disk
PCT/IB2003/002038 WO2003100718A2 (en) 2002-05-27 2003-05-27 Data carrier
AU2003232972A AU2003232972A1 (en) 2002-05-27 2003-05-27 Data carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20208276U DE20208276U1 (en) 2002-05-27 2002-05-27 disk

Publications (1)

Publication Number Publication Date
DE20208276U1 true DE20208276U1 (en) 2002-08-22

Family

ID=7971561

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20208276U Expired - Lifetime DE20208276U1 (en) 2002-05-27 2002-05-27 disk

Country Status (3)

Country Link
AU (1) AU2003232972A1 (en)
DE (1) DE20208276U1 (en)
WO (1) WO2003100718A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2893162B1 (en) * 2005-11-08 2008-02-15 Oberthur Card Syst Sa MICROCIRCUIT CARD COMPRISING A ADVANCED INTERDIGITAL CAPACITOR

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5541399A (en) * 1994-09-30 1996-07-30 Palomar Technologies Corporation RF transponder with resonant crossover antenna coil
US6522308B1 (en) * 2000-01-03 2003-02-18 Ask S.A. Variable capacitance coupling antenna

Also Published As

Publication number Publication date
WO2003100718A2 (en) 2003-12-04
WO2003100718A3 (en) 2004-03-25
AU2003232972A1 (en) 2003-12-12
AU2003232972A8 (en) 2003-12-12

Similar Documents

Publication Publication Date Title
EP0083627B1 (en) Optoelectronic component
DE3347848C2 (en)
DE19544915C2 (en) Low profile electronic component
DE2752438C2 (en) Integrated circuit carrier
DE4225358A1 (en) Add-on control unit
DE19801312A1 (en) Semiconductor element with semiconductor chip for multi-chip module
DE3724703A1 (en) DECOUPLING CAPACITOR FOR CIRCUIT COMPONENTS WITH GRID-SHAPED CONTACT PIN ARRANGEMENTS AND EXISTING DECOUPLING ARRANGEMENTS THEREOF
DE19845316A1 (en) Stackable ball grid array (BGA) semiconductor casing
DE4021871A1 (en) HIGHLY INTEGRATED ELECTRONIC COMPONENT
DE4027072A1 (en) SEMICONDUCTOR ARRANGEMENT
EP0824259A3 (en) Coil bobbin for a flat coil
DE19522172C1 (en) Power semiconductor module with pins
WO2015052117A1 (en) Electronic circuit
WO1997012263A2 (en) Transponder and transponder production method
DE3323463A1 (en) KEY SWITCH
DE2545672C3 (en) Multilayer capacitor and process for its manufacture
DE20208276U1 (en) disk
DE2461624A1 (en) DISPLAY DEVICE
DE4027656C2 (en) Contact element for SMD-equipped circuit boards
DE102019009222A1 (en) Sensor devices with sensor chip and busbar
WO1992010925A1 (en) Electrical device, in particular a switching and control device for motor vehicles
EP0150347A1 (en) Power semiconductor device
DE3430849A1 (en) Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier
DE60201537T2 (en) ELECTRICAL CONNECTION ARRANGEMENT FOR ELECTRONIC COMPONENTS
DE1439349B2 (en) PROCESS FOR SERIES PRODUCTION OF SEMICONDUCTOR COMPONENTS

Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20020926

R081 Change of applicant/patentee

Owner name: INTERLOCK AG, CH

Free format text: FORMER OWNER: VOGT, WERNER, REMETSCHWIL, CH

Effective date: 20030127

R081 Change of applicant/patentee

Owner name: INTERLOCK AG, CH

Free format text: FORMER OWNER: INTERLOCK AG, SCHLIEREN, CH

Effective date: 20030715

R150 Term of protection extended to 6 years

Effective date: 20051109

R151 Term of protection extended to 8 years

Effective date: 20080813

R158 Lapse of ip right after 8 years

Effective date: 20101201