DE202021103958U1 - Helix duct cooler unit - Google Patents

Abstract

Having a helix channel cooler unit (1) for electronic assemblies with three-dimensional channel routing
- A radiator body (10);
- a media access (30);
- A media outlet (31);
- a helical channel shape (50);
- At least one power loss generating component;
whereby
- The cooler body (10) contains the helical channel shape (50) and there is media access (30)
and
Media outlet (31) are located on the surface of the cooler body;
and
- A medium reaches the helix channel shape (50) via the media access (30) and this
leaves again via the media outlet (31);
characterized in that
- At least one power loss generating component is mounted on at least one surface of the heat sink (10);
- The helical channel shape (50) has channel sections combined to form a helix;
and
- The three-dimensional channel routing creates a forced helical flow movement of the medium and thus a better heat transfer along the channel walls.

Description

The invention relates to a helix channel cooler unit for electronic assemblies with three-dimensional channel routing having a cooler body, a media inlet, a media outlet, a helix channel shape and at least one power loss generating component, the cooler body containing the helix channel shape and media access and Media outlet are located on the surface of the cooler body and a medium enters the helix channel shape via the media inlet and leaves it again via the media outlet.

A medium in the sense of the invention is understood to mean a fluid in the physical sense.

A three-dimensional helical flow of a medium in space, within the meaning of the invention, is understood to mean a helical turbulence enforced by a three-dimensional channel geometry as a spiral secondary flow which is superimposed in a main flow direction in the channel.

Two-dimensional flow baffles, such as ShowerPower and 3D-ShowerPower from Danfoss Silicon Power, are generally known from the prior art.

The known state of the art in liquid cooling shows a two-dimensional guidance of the liquid medium in meandering form, which generates a rotation of the otherwise laminar flow filaments (flow) through periodic change of direction (meander channel) in one plane. The effect of the liquid cooling consists in the desired reduction of the essentially stationary boundary layer of the cooling liquid on the boundary surface to be cooled. The heat supply on the boundary surface, for example a power semiconductor substrate, is usually arranged on one side parallel to the flow threads DE 10 2005 058 780 A1 discloses a micro heat exchanger and the use of the same as a fluid cooler for electronic components with a planar comb-like or groove-like structure.

The publication WO 2018/134 031 A1 shows a power electronics system and a method for its production. The power electronics are arranged on a first side of a base plate and a cooling structure is arranged on one side on the second side of the base plate.

The problems in the prior art are essentially that with liquid cooling, a swirl flow is generated by two-dimensional guidance of the liquid medium with a forced change of direction on the meandering curves lying in a surface, which is created from a main direction and a cross flow. These laminar flow filaments only have a moderate property of minimizing the boundary surface for the heat transfer from the boundary surface to the liquid medium, since there is no component in the direction of the wall to destroy the boundary layer.

The flat meandering of the channels leads to the rotation of the stream filaments, as a kind of helical flow, but this is exclusively directed almost parallel to the channel walls. These streamlines thus have the classic Bernoulli flow profiles, which have a pronounced and stable boundary layer at the edges / boundaries. These boundary layers have little or no flow and reduce or prevent the interaction of the coolant with the wall.

The present invention is based on the object of reducing the disadvantageous, almost stationary boundary layers by means of a further forced change in direction by means of further swirl currents and of reducing them by means of impingement currents. The dismantled boundary layers enable a significantly improved heat transfer from the boundary surface into the medium (the cooling liquid). For this purpose, according to the invention, a further change in direction in the z direction is imposed on the two-dimensional meandering by means of an x-y channel guide. This creates a further cross flow through changes in direction of the medium and thus a three-dimensional real helical flow in space. This further flow component, together with the additional baffle surfaces of the flow guide, has a reducing effect on the interface thickness and extension and thus has an increasing effect on the heat transfer. In this way, for example, improved cooling for power electronic semiconductor assemblies is possible.

This object is achieved with a helix channel cooler unit according to the invention.

• - der Kühlerkörper (10) die Helix-Kanalform (50) beinhaltet und sich Medienzugang (30) und Medienabgang (31) auf der Oberfläche des Kühlerkörpers befinden; und
• - das Medium über den Medienzugang (30) in die Helix-Kanalform (50) gelangt und diese über den Medienabgang (31) wieder verlässt; und ist dadurch gekennzeichnet, dass
• - auf mindestens einer Oberfläche des Kühlkörpers (10) mindestens eine Verlustleistung erzeugende Komponente montiert ist;
• - die Helix-Kanalform (50) zu einer Helix kombinierte Kanalabschnitte aufweist; und
• - durch die dreidimensionale Kanalführung eine erzwungene helikale Strömungsbewegung des Mediums und somit ein besserer Wärmeübergang entlang der Kanalwände erzeugt wird.

The helix channel cooler unit for electronic assemblies with three-dimensional channel routing has: a cooler body, a media inlet, a media outlet, a helix channel shape ( 50 ), at least one power loss generating component, wherein

• - the radiator ( 10 ) the helix canal shape ( 50 ) and media access ( 30th ) and media exit ( 31 ) are located on the surface of the radiator body; and
• - the medium via the media access ( 30th ) into the helix canal shape ( 50 ) and this via the media outlet ( 31 ) leaves again; and is characterized in that
• - on at least one surface of the heat sink ( 10 ) at least one power loss generating component is mounted;
• - the helix canal shape ( 50 ) has channel sections combined to form a helix; and
• - The three-dimensional channel routing creates a forced helical flow movement of the medium and thus a better heat transfer along the channel walls.

Furthermore, the cooler body can be designed in the shape of a cuboid.

The cooler body can be designed in one piece or in two parts with a first half-shell and a second half-shell.

The various surfaces of the cooler body can be equipped with components that generate power loss independently of one another.

The components generating power loss can include semiconductor components and / or capacitors.

The cooler body can be formed from a metal, a metal alloy and / or ceramic materials, preferably copper alloys, aluminum alloys, silicon nitride, aluminum nitride, zirconium dioxide, nickel, stainless steels.

In the case of a two-part design, the first half-shell and the second half-shell can be designed to be functionally expandable to form a first cooling-body half-shell and a second cooling-body half-shell.

In the case of a two-part design, the helical channel shape can be obtained by forming depressions in the half-shells with subsequent pairing of the half-shells on top of one another, the half-shells having the channel sections on different levels between the coordinate axes in the Cartesian coordinate system and the channel sections overlapping so that a helical course is trained.

The helix channel cooler unit is designed in particular for electronic assemblies with three-dimensional channel routing. It has a cooler body, a media inlet, a media outlet, a helical channel shape and at least one component that generates power loss, the cooler body containing the helical channel shape and the media inlet and media outlet being on the surface of the cooler body and the medium via the media inlet into the Helix channel shape arrives and leaves it again via the media outlet, characterized in that at least one power loss generating component is mounted on at least one surface of the heat sink, the helix channel shape has channel sections combined to form a helix and the three-dimensional channel routing creates a forced helical flow movement of the Medium and thus a better heat transfer along the channel walls is generated.

If the radiator body is cuboid, there are a total of six surfaces which can be given functions. Up to two surfaces each have a liquid inlet and a liquid outlet. The cuboid design of the radiator body is the preferred variant. However, the cooler body can also have other geometries.

The cooler body can be designed in one piece or in two parts with a first half-shell and a second half-shell. The one-piece design has internal helical channels that can currently only be produced by one-piece, additive manufacturing. With this design, the components generating the power loss can be built up on the larger, opposite plane surfaces. A two-part embodiment of the helical channel shape having baffle surfaces can be formed, for example, by a channel geometry that is produced by easy-to-produce depressions in plates and results in the complete medium channel by being placed on top of one another in pairs. The two plates complement each other on the channel side to form the cooler channel and also offer a surface on their two rear sides for the assembly of components that generate power loss, such as power electronic components. The channel design in the two plates can be carried out using a variety of manufacturing processes, such as machining, embossing, deep drawing or additive metal production.

One advantage of the one-piece variant over the two-piece variant is the possibility of compensating for different heat flows with different loads on the power loss (heat) -generating components.

In contrast, the two-part variant is easier and cheaper to manufacture. This variant includes a new process for the production of liquid coolers with a channel guide inside, since the two half-shells are produced separately from one another and are only subsequently assembled on top of one another to form the helical cooler channel. The cooler body can be equipped with electronic assemblies easily and independently on both sides.

The various surfaces of the cooler body can be at least partially or completely and independently of one another equipped with components that generate power loss.

Because the different surfaces of the cooler body can be equipped with components that generate power loss independently of one another, the helix channel cooler unit can be configured variably. The system is also service-friendly and changes can be made relatively easily without the need to completely convert the entire unit.

The components that generate power loss can preferably include electronic assemblies, in particular semiconductor components and / or capacitors.

The cooler body can preferably be made of a metal, a metal alloy and / or ceramic materials, preferably copper alloys, aluminum alloys, silicon nitride, aluminum nitride, zirconium dioxide, nickel, stainless steels, so that there is good heat conduction and corrosion-inhibiting materials may be added are. It is also an advantageous variant if the area of the channel formation consists of aluminum and a heat-spreading copper layer is inserted between the aluminum part and the components that generate power loss.

Because the first half-shell and the second half-shell are functionally expandable to form a first heat-sink half-shell and a second heat-sink half-shell in a two-part design, additional thermal contact surfaces are created on the heat sink for further components that generate power loss. In addition to, for example, semiconductor components on the base and top surface, capacitors or other components can be mounted on two side surfaces.

In the case of a two-part design, the helical channel shape can be obtained by forming depressions in the half-shells with subsequent pairing of the half-shells on top of one another, the half-shells having the channel sections on different levels between the coordinate axes in the Cartesian coordinate system and the channel sections overlapping so that a helical course is trained.

A simple, service-friendly, safe and relatively inexpensive to manufacture liquid cooler system, namely the helix channel cooler unit according to the invention, is provided via the option of building up over two half-shells, with which electronic assemblies can also be independently mounted on heat sinks.

Due to the helical channel shape in the helix channel cooler unit, the medium is guided through the channel in a helical form, i.e. as rotating, wandering streams, in three dimensions, with multiple wall contacts enabling turbulent heat transfers, which significantly improves heat transfer from the boundary surface causes in the coolant. The disadvantageous, almost stationary boundary layers are hereby reduced by the three-dimensional forced changes of direction through further swirl currents and broken down by impingement currents. For this purpose, according to the invention, a further change in direction in the z direction is imposed on the two-dimensional meandering by means of the x-y channel guidance. This creates a further cross flow by changing direction and thus a three-dimensional real helical flow. This further flow component, together with the additional baffle surfaces of the flow guide, has a reducing effect on the interface thickness and extension and thus increases the heat transfer.

• Es zeigen:
  • beispielhaft eine zweiteilige Ausführungsform einer Helix-Kanal-Kühler-Einheit für leistungselektronische Halbleiter-Baugruppen in perspektivischer Darstellung;
  • beispielhaft eine zweiteilige Ausführungsform der Helix-Kanal-Kühler-Einheit für leistungselektronische Halbleiter-Baugruppen aus in perspektivischer Durchsicht-Darstellung (Röntgenbild);
  • beispielhaft eine zweiteilige Ausführungsform der Helix-Kanal-Kühler-Einheit aus in perspektivischer Durchsicht-Darstellung (Röntgenbild), wobei die Strömungsvektoren der Helix dargestellt sind;
  • beispielhaft einen Kanalbereich der Strömungsvektoren aus mit perspektivischer Durchsicht-Darstellung (Röntgenbild) ohne Helix-Kanalform;
  • beispielhafte Kanalgestaltung einer zerlegten, zweiteiligen Ausführungsform einer Helix-Kanal-Kühler-Einheit für leistungselektronische Halbleiter-Baugruppen sowie resultierende mittlere Strömungsvektoren in Durchsicht-Darstellung;
  • beispielhafte gruppierte und verbundene Kanalanordnung einer zerlegten, zweiteiligen Ausführungsform einer Helix-Kanal-Kühler-Einheit für leistungselektronische Halbleiter-Baugruppen sowie resultierende Strömungsvektoren in Durchsicht-Darstellung;
  • eine beispielhafte zweiteilige Ausführungsform einer Helix-Kanal-Kühler-Einheit für leistungselektronische Halbleiter-Baugruppen mit beidseitigem Aufbau der leistungselektronischen Halbleiter-Baugruppen auf dem Kühlerkörper, in Schnittdarstellung;
  • eine beispielhafte zweiteilige Ausführungsform der Helix-Kanal-Kühler-Einheit für leistungselektronische Halbleiter-Baugruppen nach , wobei die Halbschalen zu funktionell erweiterten Kühlkörper-Halbschalen ausgebildet sind, in Schnittdarstellung.

The invention is described below with reference to the accompanying figures in the description of the figures, whereby these are intended to explain the invention and are not necessarily to be regarded as restrictive:

• Show it:
  • by way of example, a two-part embodiment of a helix channel cooler unit for power electronic semiconductor assemblies in a perspective view;
  • an example of a two-part embodiment of the helix channel cooler unit for power electronic semiconductor assemblies in perspective see-through representation (X-ray image);
  • an example of a two-part embodiment of the helix channel cooler unit in perspective see-through representation (X-ray image), the flow vectors of the helix being shown;
  • an example of a channel area of the flow vectors with perspective see-through representation (X-ray image) without helical canal shape;
  • exemplary channel design of a disassembled, two-part embodiment of a helix channel cooler unit for power electronic semiconductor assemblies and resulting mean flow vectors in a see-through representation;
  • exemplary grouped and connected channel arrangement of a disassembled, two-part embodiment of a helix channel cooler unit for power electronic semiconductor assemblies and resulting flow vectors in a see-through representation;
  • an exemplary two-part embodiment of a helix channel cooler unit for power electronic semiconductor assemblies with a bilateral structure of the power electronic semiconductor assemblies on the cooler body, in a sectional view;
  • an exemplary two-part embodiment of the helix channel cooler unit for power electronic semiconductor assemblies according to , wherein the half-shells are designed to functionally expanded heat sink half-shells, in a sectional view.

shows an example of a two-part embodiment of a helix channel cooler unit 1 for power electronic semiconductor assemblies in perspective. The helix duct cooler unit 1 consists of a metallic cooler body 10 constructed from a first half-shell lying on top of one another 11 and a second half-shell 12th as well as above the first half-shell 11 Semiconductor components 40 with power semiconductors 20th . The medium becomes the helix duct cooler unit 1 through a media access 30th in the second half-shell 12th of the radiator 10 and leaves the helix duct cooler unit via a media outlet 31 in the second half-shell 12th . The metallic radiator body 10 consists of a material that is preferably a good heat conductor. The half-shells are plate-shaped. The component that generates power loss (heat source), here the power semiconductors 20th , are built on one side in this example.

In will shown in a see-through representation (X-ray image). After media supply through the media access 30th the medium flows through a helical channel shape 50 consisting of several channel sections, which in combination form a helix before it passes through the media outlet 31 exits again. Through this helical canal shape 50 an optimized 3-dimensional media flow is achieved. In the picture is the helix channel shape 50 designed with baffles for the medium. The helix canal shape 50 is obtained in the figure, for example, by means of easy-to-produce depressions in the half-shells with subsequent stacking in pairs. The first half-shell 11 carries the channel sections in the zx direction and the second half-shell 12th the channel sections in the zy direction. A zx section is overlapped with a zy section. The continued and alternating overlap ensures a helical course for the liquid transport. The two half-shells complement each other on the canal side to form the helix canal shape 50 and also offer a surface on both of their rear sides for the assembly of heat-emitting components such as power semiconductors 20th that are mounted on one side as shown in the illustration, or other power electronic components such as capacitors.

The overlap is selected such that in the example a channel cross section perpendicular to the central flow direction always remains constant (for example 6 mm ² ). Cross-sections from 1 mm ² to more than 100 mm ^{2 are also} conceivable here; this depends on the cooling task and the permitted pressure drop in the ducts and can be adapted to the specific task. On the side of the component that generates power loss, the wall thickness of the cooler up to the inner surface of the duct (heat transfer zone) is not thicker (stronger) than 5 mm in the example.

These geometric variants can be applied to other multi-part radiator bodies with the same basic principle.

shows the extracted, mean flow vectors of the two-part embodiment of the helix channel cooler unit from in perspective see-through representation (X-ray image), with the flow vectors 60 the helix are shown.

In becomes a channel region of the extracted mean flow vectors 60 the end shown without drawn helix channel shape.

shows an example of a possible design of a helix channel shape 50 in a radiator 10 . In the figure, there is a top view of the channel sections in the zx direction 70 of the second half-shell on the left 12th with media access 30th and media exit 31 and in the middle a plan view of the channel sections in the zy direction 71 of the first half-shell 11 . On the right are the resulting (symbolic) mean flow vectors 60 in the helix canal shape 50 in the radiator 10 consisting of the two half-shells shown in a perspective see-through representation (X-ray image). In this example, the channel depth generated is at least the channel width.

The channel sections can be made using a variety of manufacturing processes, including combined ones, such as machining, embossing, deep drawing or additive metal manufacturing.

The radiator 10 consists of at least one, preferably good heat-conducting metal, such as copper alloys, aluminum Alloys or the like. Corrosion-inhibiting materials, such as stainless steel, are advantageous for use in a media / liquid cooler. Another advantageous variant consists of a channel design made of aluminum and a materially connected, heat-spreading insertion of a copper layer between the aluminum part and the components that generate power loss.

There is also an option on the narrow sides of the helix duct cooler unit 1 or its half-shells to provide thermal contact surfaces for other components that generate power loss.

In is an example of a possible design of a grouped and connected channel arrangement of a helical channel shape 50 of a radiator 10 as part of a helix duct cooler unit 1 shown. In the figure, there is a top view of the channel sections in the zx direction 70 of the second half-shell on the left 12th with media access 30th and media exit 31 and in the middle a plan view of the channel sections in the zy direction 71 of the first half-shell 11 . In contrast to here the duct sections are lined up in several ducts. In the middle there are serial connections between the individual ducts. This becomes clear from the partially enlarged channel sections in the zy direction 71 of the first half-shell 11 . On the right are the resulting (symbolic) mean flow vectors 60 in the helix canal shape 50 in the radiator 10 consisting of the two half-shells shown in a perspective see-through representation (X-ray image).

The chaining and sequencing of several ducts shown is particularly suitable for uniformly cooling a flat arrangement of heat-generating components. A serial connection of the ducts, as shown by way of example, can advantageously be implemented in order to reduce temperature gradients. Another possibility here is a parallel flow through individual ducts. Another variant is the placement of the media access 30th and that of the media exit 31 on the same side of the body instead of on different or opposite sides.

shows an exemplary two-part embodiment of a helix channel cooler unit 1 for power electronic semiconductor assemblies with a bilateral structure of the power electronic semiconductor assemblies on the cooler body 10 in sectional view. The helix duct cooler unit 1 consists of a radiator body 10 having a first half-shell 11 and a second half-shell 12th arranged below the first half-shell 11 , being in the first half-shell 11 the media access 30th and the media exit 31 lie at the opposite ends of the half-shell. Media access 30th and media exit 31 are through a helix channel shape 50 connected with each other. On the outward-facing surfaces of the first half-shell 11 and the second half-shell 12th are each semiconductor components 40 with power semiconductors 20th mounted as an example of power loss generating components. These components that generate power loss are preferably materially bound to the cooler metal of the half-shells, for example by soldering or low-temperature sintering.

illustrates an exemplary two-part embodiment of the helix duct cooler unit 1 for power electronic semiconductor assemblies in sectional view, the first half-shell 11 and the second half-shell 12th to the first heat sink half-shell 90 and the second heat sink half-shell 91 functionally expanded.

In the figure, in addition to the components in two capacitors, namely a first capacitor 80 and a second capacitor 81 , pictured. The two capacitors are each next to the media access 30th and the media exit 31 the end faces of the radiator body 10 Installed. This is how the helix duct cooler unit stands 1 in thermal contact with, in this example, the capacitors of the power electronic system and the first half-shell 11 and the second half-shell 12th become the first heat sink half-shell 90 and the second heat sink half-shell 91 functionally expanded. As shown in the picture is the first capacitor 80 partially integrated in the heat sink half-shells and the second capacitor 81 is, for example, fully integrated in the heat sink half-shells. In principle, such contacting of components to be cooled is not limited to semiconductor components.

The cuboid volume of the two-part helix channel cooler unit 1 has a total of up to six surfaces that can be given functions: Up to two surfaces each have a liquid access 30th and a liquid outlet 31 .

In addition to the two-part embodiment shown in the figures, a one-part embodiment is also possible. The one-piece embodiment has internal helical channels such as can only be produced by one-piece, additive manufacturing. In this embodiment, too, the components generating the power loss can be built up on the larger, opposite planar surfaces. The additional advantage of the one-piece variant compared to the two-piece variant is the possibility of compensating for different heat flows with different loads of the heat (power loss) generating components.

List of reference symbols

1

Helix duct cooler unit

10

Radiator

11

first half-shell

12th

second half-shell

20th

Power semiconductors

30th

Media access

31

Media exit

40

Semiconductor components

50

Helix channel shape

60

Flow vectors

70

Channel sections in the z-x direction

71

Channel sections in the z-y direction

80

first capacitor

81

second capacitor

90

first heat sink half-shell

91

second heat sink half-shell

QUOTES INCLUDED IN THE DESCRIPTION

This list of the documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• DE 102005058780 A1 [0005]

Claims (8)

Having a helix channel cooler unit (1) for electronic assemblies with three-dimensional channel routing - a cooler body (10); - a media access (30); - A media outlet (31); - a helical channel shape (50); - At least one power loss generating component; - the cooler body (10) includes the helical channel shape (50) and media inlet (30) and media outlet (31) are located on the surface of the cooler body; and - a medium enters the helical channel shape (50) via the media access (30) and leaves it again via the media outlet (31); characterized in that - at least one power loss generating component is mounted on at least one surface of the heat sink (10); - The helical channel shape (50) has channel sections combined to form a helix; and - the three-dimensional channel guidance creates a forced helical flow movement of the medium and thus a better heat transfer along the channel walls. Helix duct cooler unit (1) after Claim 1 , characterized in that the cooler body (10) is cuboid. Helix duct cooler unit (1) after Claim 1 or 2 , characterized in that the cooler body (10) - is formed in one piece or - in two parts with a first half-shell (11) and a second half-shell (12). Helix channel cooler unit (1) according to one of the preceding claims, characterized in that the various surfaces of the cooler body (10) are at least partially or completely and independently of one another equipped with components which generate power loss. Helix channel cooler unit (1) according to one of the preceding claims, characterized in that components generating power loss comprise semiconductor components (40) and / or capacitors. Helix channel cooler unit (1) according to one of the preceding claims, characterized in that the cooler body (10) is made of a metal, a metal alloy and / or ceramic materials, preferably copper alloys, aluminum alloys, silicon nitride, aluminum nitride, Zirconia, nickel, stainless steels. Helix duct cooler unit (1) after Claim 3 , characterized in that, in the case of a two-part design, the first half-shell (11) and the second half-shell (12) can be functionally expanded to form a first heat-sink half-shell (90) and a second heat-sink half-shell (91). Helix duct cooler unit (1) after Claim 3 , characterized in that, in a two-part design, the helical channel shape (50) is obtained by forming depressions in the half-shells with subsequent pairing of the half-shells, the half-shells having the channel sections on different levels between the coordinate axes in the Cartesian coordinate system and the channel sections overlap so that a helical course is formed.

Images