DE202018006678U1 - Projection device for a motor vehicle headlight light module - Google Patents

Abstract

Projection device (1, 100) for a motor vehicle headlight module, which projection device (1, 100) comprises:
- at least one substrate layer (2, 2a, 2b, 2c);
- At least one micro-optics array (3, 3a, 3b) consisting of a plurality of micro-optics (30, 30a, 30b), and
- At least one micro-aperture array (4, 4a, 4b) consisting of a plurality of micro-apertures (40, 40a, 40b), wherein
the at least one micro-optics array (3, 3a, 3b) is formed on a first surface (20, 20a, 20b, 20c) of the at least one substrate layer (2, 2a, 2b, 2c) and on the first surface (20, 20a , 20b) of the at least one substrate layer (2, 2a, 2b, 2c) adheres;
the at least one micro-aperture array (4, 4a, 4b) is arranged on a second surface (21, 21a, 21b, 21c) of the at least one substrate layer (2, 2a, 2b, 2c) such that each micro-aperture (40, 40a, 40b) at least one micro-optics (30, 30a, 30b) is assigned,
characterized in that
the projection device (1, 100) has three substrate layers (2a, 2b, 2c), two micro-optics arrays (3a, 3b) and at least two micro-aperture arrays (4, 4a, 4b), each micro-optics array (3a , 3b) is made of transparent silicone (5) and each substrate layer (2a, 2b, 2c) is transparent and more dimensionally stable than the transparent silicone (5), with a middle substrate layer (2c) between a first substrate layer (2a) and a second Substrate layer (2b) is arranged, with a first surface (20a) of the first substrate layer (2a), on which a first microoptics array (3a) is formed and adheres, and a first surface (20b) of the second substrate layer (2b), on which a second micro-optics array (3b) is formed and adheres, facing away from the middle substrate layer (2c), a first micro-aperture array (4a) on a second surface (21a) of the first substrate layer (2a) or on a first surface (20c) of the middle substrate layer (2c) is arranged, wherein a second micro-aperture array (4b) is arranged on a second surface (21b) of the second substrate layer (2b) or on a second surface (21c) of the middle substrate layer (2c), wherein the first micro-aperture array (4a) is designed to form a low-beam light distribution and/or a partial high-beam light distribution or a high-beam light distribution and the second micro-aperture array (4b) is provided for correcting aberrations, the three substrate layers (2a, 2b, 2c) being made of glass, which is preferably a thickness of about 0.5 mm to about 4 mm, preferably about 1.1 mm.

Description

The invention relates to a projection device for a motor vehicle headlight module, which projection device comprises at least one substrate layer, at least one micro-optics array consisting of a plurality of micro-optics and at least one micro-aperture array consisting of a plurality of micro-apertures, the at least one micro-optics array is formed or arranged on a first surface of the at least one substrate layer and adheres to the first surface of the at least one substrate layer; the at least one micro-aperture array is arranged on a second surface of the at least one substrate layer in such a way that at least one micro-optic is assigned to each micro-aperture.

In addition, the invention relates to a motor vehicle headlight module or a motor vehicle headlight with at least one such projection device.

The projection devices of the type mentioned above are known from the prior art (see for example AT514967B1 , WO 2017066817 A1 or WO 2017066818 A1 ). The micro-optics in such projection devices usually have a flat side and are designed, for example, as plano-convex or plano-concave lenses. In this case, the micro-optics array has a continuous flat surface which is formed by the flat sides of the individual micro-optics. Both the micro-apertures and the micro-optics are arranged in a matrix-like array in the aforementioned projection device. When such a projection device is built into an automotive headlight module, it is normally positioned such that the matrix-like array is substantially perpendicular to the optical axis of the automotive headlight module. With the aid of such projection devices, light distributions are formed which are formed as a superimposition of a plurality of micro light distributions, each micro light distribution being formed by a micro diaphragm and at least one micro-optical system assigned to it.

From the EP 3 282 181 A1 a projection device for a vehicle headlight is known, the projection device having a microlens array.

the DE 10 2012 008 639 A1 discloses a method for manufacturing an optical module with silicon optics.

In conventional projection devices, the microoptics arrays are made of UV polymers. The UV polymers are very expensive and also have a low thermal load capacity. This usually becomes a major disadvantage when such a projection device is used in a motor vehicle headlight. It is known that high temperature differences can arise in motor vehicle headlights, since the operating temperature of motor vehicle headlights is much higher than the temperature of the ambient air. These temperature differences lead to stresses between the substrate layer and the micro-optics array. This in turn can lead to warping and loss of shape of both the substrate layer and the microoptics array, which ultimately means that the light distribution loses quality and possibly no longer meets the legal requirements. An example of an unfavorable composition is a metallic micro-aperture array, a plastic substrate layer and a UV polymer micro-optics array. The use of a metallic micro-aperture array in the combination of plastic and UV polymer leads to increased heat absorption when the projection device is exposed to light. The substrate layer and the micro-optics array expand and lose their original shape. This affects the assignment of micro-apertures to the micro-optics. The micro-apertures are preferably positioned relative to the micro-optics with an accuracy of approximately 0.01 mm, in particular even in the micrometer range. With the above-mentioned thermal expansion and loss of shape of the components of the projection device, this accuracy is lost very quickly. The optical alignment of the entire projection device is no longer available and the desired light distribution, for example low beam distribution, can no longer be generated.

The object of the present invention is to eliminate the disadvantages of the prior art.

The object is achieved according to the invention by a projection device of the type mentioned above in that the microoptics array is made of transparent silicone and the at least one substrate layer is transparent and more dimensionally stable than the transparent silicone.

In connection with the present invention, the term “optically transparent” or “light-transmitting material” means a material with a transmittance T greater than 0.88, preferably greater than 0.999. In this case, the specified degree of transmittance preferably relates to light in a wavelength range between approximately 400 nm and approximately 700 nm (ie visible light).

By using transparent silicone, a higher operating temperature and thus a higher light density can be achieved. In addition, the use of transparent silicone increases the robustness of the projection device. Robust refers to the permanent connection between the micro-optics array and the substrate layer or permanent adhesion of the at least one micro-optics array to the at least one substrate layer.

According to the invention, the substrate layer should therefore be made of a material that has good light transparency and is dimensionally stable enough. In this context, dimensionally stable enough means that the substrate layer carries the micro-optics array made of (soft) silicone and does not lose its shape both during the formation of the micro-optics array on the first surface of the substrate layer and during the use of the projection device in a motor vehicle headlight, ie against heat or similar. is resilient in shape.

The at least one substrate layer, the at least one micro-optics array and the at least one micro-aperture array are preferably arranged in parallel to one another and perpendicular to the optical axis of the projection device. The optical axis of the projection device preferably coincides with the main emission direction of the motor vehicle headlight module if the projection device is professionally installed in such a module.

It can advantageously be provided that the first microoptics array is formed by means of a thermal molding process and is made to adhere to the first surface of the first substrate layer and the second microoptics array is formed by means of a thermal molding process and is made to adhere to the first surface of the second Substrate layer is brought, and / or applied and sealed, for example glued, the micro-aperture arrays on the second surfaces of the first and second substrate layer or on the first or second surface of the middle substrate layer.

As a result, the at least one micro-aperture array arranged/positioned with respect to the micro-optics array is permanently connected to the at least one substrate layer, so that subsequent adjustment is no longer necessary. The individual micro-optic systems (micro-aperture, micro-optics and substrate layer in between) have typical dimensions of approx. 2 mm x 2 mm (length and width) and a depth of approx. 6 mm - 10 mm. Especially in the case of such small projection devices (micro-optics and micro-apertures in millimeters if not micrometers in size), an adjustment accuracy in the μm range is desirable. With individual components that are not connected to one another, it is difficult to adjust them and to fix them without distortion. Due to the above-mentioned direct connection and sealing, for example gluing, readjustment is no longer necessary.

It is envisaged that the three substrate layers will be of glass having a thickness of from about 0.5mm to about 4mm, preferably about 1.1mm. A glass substrate layer increases the stability and strength of the projection device, making automated manufacturing processes possible, for example. In addition, a glass substrate layer offers high transparency and increases the chemical and thermal resistance of the projection device.

In an embodiment that has been tried and tested in practice, it can be provided that the transparent silicone has a Shore A hardness of about 30 to about 100, in particular from about 40 to about 90, preferably transparent two-component silicone, which two-component silicone is preferred has a Shore A hardness in the above ranges. Such silicones can better compensate for different coefficients of thermal expansion in the event of temperature fluctuations.

Provision can also advantageously be made for the micro-apertures of the first micro-aperture array to be designed in such a way and for the first micro-aperture array to be arranged in the projection device in such a way that the projection device forms a low-beam light distribution and/or a partial high-beam light distribution or a high beam distribution is set up. The micro-apertures can have correspondingly shaped, optically effective edges.

A particularly compact projection device results when the micro-optics of the two micro-optics arrays have the same height, for example in a range between about 0.01 mm and about 2 mm, preferably between about 0.1 mm and about 1.5 mm, in particular a height of about 1 .1mm.

The projection device has three substrate layers, two micro-optics arrays and at least two micro-aperture arrays, with a middle substrate layer being arranged between a first substrate layer and a second substrate layer, with a first surface of the first substrate layer on which a first micro-optics array is formed and adhered, and a first surface of the second substrate layer to which a second micro-optic array is formed and adhered, facing away from the middle substrate layer, with a first micro-aperture array on a second surface of the first Substrate layer or on a first surface of the middle substrate layer is arranged, wherein a second micro-aperture array is arranged on a second surface of the second substrate layer or on a second surface of the middle substrate layer.

It is provided that the first micro-aperture array is designed to form a low-beam light distribution and/or a partial high-beam light distribution or a high-beam light distribution and the second micro-aperture array is provided to correct aberrations.

Particular advantages result when the three substrate layers are connected to one another, preferably glued. This reduces the risk of dirt getting into optically relevant areas of the projection device and at the same time increases stability. For example, dust can no longer get between the first and the second substrate layer.

In order to be suitable for use in a motor vehicle headlight, the projection devices must pass a series of environmental requirements and tests (temperature, humidity, dust, vibration, lighting values, aging and much more). In the case of conventional projection devices in which, for example, plastic injection-molded parts and beam shields made of sheet metal, contamination within the light path can occur as a result of atmospheric humidity and dust. This is no longer possible with a direct connection, such as gluing.

The object of the invention is also achieved with a motor vehicle headlight light module or motor vehicle headlight. The motor vehicle headlight light module according to the invention or the motor vehicle headlight according to the invention comprises at least one projection device according to the invention and at least one light source, preferably a semiconductor-based light source, in particular an LED light source, the at least one projection device being located downstream of the at least one light source in the direction of emission in such a way that the at least one light source in the substantially radiates all of its light into the at least one projection device and the at least one projection device projects the light radiated into it into an area in front of the motor vehicle headlight module or in front of the motor vehicle headlight in the form of a low beam distribution and/or a partial high beam distribution or a high beam distribution.

The light source is preferably positioned close enough to the projection device. In the present context, "close enough" means that the light source is arranged with respect to the projection device in such a way that essentially all of the light emitted by the light source is fed into the projection device and the light source is essentially the entire light entry side of the projection device, for example the entire second surface 21 in 3a or the entire first micro-optics array 3a in 3b , illuminated.

• - Bereitstellen von
  • * transparentem Silikon;
  • * zumindest einer Substratschicht aus einem transparenten, formstabilen Material, beispielsweise aus Glas, wobei die Substratschichaufdruckent formstabiler als das transparente Silikon ist, und
  • * zumindest einem aus einer Mehrzahl von Mikro-Blenden bestehenden Mikro-Blenden-Arrays;
• - Ausbilden zumindest eines aus einer Mehrzahl von Mikrooptiken bestehenden Mikrooptik-Arrays aus dem transparenten Silikon an einer ersten Fläche der zumindest einen Substratschicht und
• - Anordnen des zumindest einen Mikro-Blenden-Arrays an einer zweiten Fläche der zumindest einen Substratschicht, wobei das zumindest eine Mikrooptik-Array und das zumindest eine Mikro-Blenden-Array derart zueinander angeordnet sind, dass jeder Mikro-Blende zumindest eine Mikrooptik zugeordnet ist, und das transparente Silikon vorzugsweise eine Shore-A-Härte von etwa 30 bis etwa 100, insbesondere von etwa 40 bis etwa 90 aufweist, insbesondere ein Zwei-Komponenten-Silikon ist.

A method for producing a projection device, in particular an aforementioned projection device according to the invention, can be provided, the method having the following steps:

• - Deploy from
  • * transparent silicone;
  • * at least one substrate layer made of a transparent, dimensionally stable material, for example glass, the substrate layer being printed more dimensionally stable than the transparent silicone, and
  • * at least one micro-aperture array consisting of a plurality of micro-apertures;
• - forming at least one micro-optic array consisting of a plurality of micro-optics from the transparent silicone on a first surface of the at least one substrate layer and
• - Arranging the at least one micro-aperture array on a second surface of the at least one substrate layer, wherein the at least one micro-optics array and the at least one micro-aperture array are arranged relative to one another such that each micro-aperture is assigned at least one micro-optics , and the transparent silicone preferably has a Shore A hardness of about 30 to about 100, in particular from about 40 to about 90, in particular a two-component silicone.

It should be noted here that arranging/positioning the micro-aperture array with respect to the micro-optics array can be done before or after the micro-optics array is formed in the negative mold.

• - Bereitstellen zumindest einer Negativform mit einer formgebenden Oberfläche, die dem zumindest einen Mikrooptik-Array entspricht;
• - Gießen des transpatenten Silikons in die zumindest eine Negativform;
• - Aufsetzten/Auflegen der zumindest einen Substratschicht auf die zumindest eine Negativform;
• - Aushärten des Silikons in der zumindest einen Negativform, und
• - Entformen des Mikrooptik-Arrays aus der zumindest einen Negativform.

In a preferred embodiment, it can be provided that the formation of at least one micro-optic array consisting of a plurality of micro-optics from the transparent silicone on a first surface of the at least one substrate layer comprises the following sub-steps:

• - Providing at least one negative mold with a shaping surface that corresponds to the at least one micro-optics array;
• - Pouring the transparent silicone into the at least one negative mold;
• - Placing / placing the at least one substrate layer on the at least one negative mold;
• - curing of the silicone in the at least one negative mold, and
• - Demolding the micro-optics array from the at least one negative mold.

It can be expedient if, during the curing of the silicone, heat is supplied to the at least one negative mold, in particular the shaping surface, and the at least one negative mold is cooled before demoulding. This significantly reduces the time needed to manufacture a projection device. The negative mold can be made of brass, for example—brass body. In an embodiment that has been tried and tested in practice, it can be provided that the at least one negative mold is heated to a predetermined first temperature during the curing of the silicone, the first temperature being, for example, in a range between approximately 90° C. and approximately 200° C., preferably between approximately 100° C and about 150° C., in particular between about 100° C. and about 120° C. or about 120° C. and about 150° C., and is maintained at the predetermined first temperature for a period that is preferably dependent on the predetermined first temperature, wherein the duration is, for example, between about 0.5 minutes and 6 minutes, preferably between 1 minute and 5 minutes.

In addition, it can be useful if the at least one negative mold is cooled to a predetermined second temperature, the second temperature being in a range between approximately 40° C. and approximately 70° C., preferably between approximately 50° C. and approximately 60° C lies.

A corresponding cooling device can be provided for this purpose, which can be assigned to the negative mold or arranged on or in the negative mold, for example. It is conceivable that the cooling device cools with compressed air and/or coolant.

With regard to adhesive properties, it can be expedient if the first surface of the at least one substrate layer is pretreated before the at least one substrate layer is placed on the at least one negative mold.

The pre-treatment can be done with SurASil® technology, for example. SurASil® technology is a process for treating surfaces to influence the adhesion of adhesives, coatings and print media by means of flaming is a process that has been established for years in numerous industrial areas (such as screen, pad, digital and textile printing ). Another significant improvement in bond strength can be achieved by cutting off a reactive silicate layer produced by flame pyrolysis.

• - Reinigen zumindest der ersten Fläche;
• - Oberflächenvorbehandlung der ersten Fläche durch Flammensilikatisierung.

It can advantageously be provided that the pre-treatment comprises the following sub-steps:

• - cleaning at least the first surface;
• - Surface preparation of the first surface by flame silication.

The surface treatment by flame silicate formation can, for example, firstly result in the generation of a high-energy silicate layer (layer thickness max. 40 nm) on the material surfaces by flame pyrolysis (surface silicate formation) and secondly in the application of an adhesion promoter with adapted functionality to the adhesive, the coating or the printing medium and in the context of the present invention to the first surface of the at least one substrate layer.

• - Aufbringen des zumindest einen Mikro-Blenden-Arrays auf die zweite Fläche der zumindest einen Substratschicht;
• - Positionieren des zumindest einen Mikro-Blenden-Array hinsichtlich des zumindest einen Mikrooptik-Arrays derart, dass jeder Mikro-Blende zumindest eine Mikrooptik zugeordnet ist.

In addition, it can advantageously be provided that the arrangement of the at least one micro-aperture array on a second surface of the at least one substrate layer comprises the following sub-steps:

• - applying the at least one micro-aperture array to the second surface of the at least one substrate layer;
• - Positioning the at least one micro-aperture array with respect to the at least one micro-optics array such that each micro-aperture is assigned at least one micro-optics.

It can be applied, for example, by printing, in particular by means of a lithographic process, or by gluing.

• - ein erstes aus einer Mehrzahl von Mikrooptiken bestehendes Mikrooptik-Array aus transparentem Silikon an der ersten Fläche der ersten Substratschicht ausgebildet wird,
• - ein zweites aus einer Mehrzahl von Mikrooptiken bestehendes Mikrooptik-Array aus transparentem Silikon an der ersten Fläche der zweiten Substratschicht ausgebildet wird,
• - das zumindest eine Mikro-Blenden-Array an einer zweiten Fläche der ersten Substratschicht oder an einer zweiten Fläche der zweiten Substratschicht oder an einer der zwei Flächen der mittleren Substratschicht derart angeordnet wird, dass jeder Mikro-Blende zumindest eine, vorzugsweise genau eine Mikrooptik des ersten Mikrooptik-Arrays und zumindest eine, vorzugsweise genau eine Mikrooptik des zweiten Mikrooptik-Arrays zugeordnet ist und vorzugsweise ein Mikro-Optiksystem bilden. Dabei, wenn die Projektionseinrichtung mit Licht durchstrahlt wird, formt jedes Mikro-Optiksystem eine so genannte Mikro-Lichtverteilung. Durch eine Überlagerung mehrerer Mikro-Lichtverteilung wird typischerweise eine Teil-Lichtverteilung oder eine Gesamtlichtverteilung erzeugt.

It should be noted at this point that the order of the application and positioning steps can be interchanged. It is therefore possible to apply the at least one micro-aperture array to the second surface and then position it (with the at least one substrate layer) with respect to the not yet cured micro-optics array, for example with respect to the shaping surface of the negative mold, in such a way that each Micro-aperture is assigned at least one micro-optics when the silicone has cured. Furthermore, it is conceivable that the at least one micro-aperture array only after the curing of the silicone in the negative mold with regard to the micro-opti k-arrays positioned and then, as described above, applied to the second surface. In addition, it can be provided that at least three substrate layers made of a transparent, dimensionally stable material, for example glass, are provided, with a middle substrate layer being arranged between a first substrate layer and a second substrate layer in such a way that a first surface of the first substrate layer and a first surface the second substrate layer faces away from the middle substrate layer,

• - a first micro-optic array consisting of a plurality of micro-optics is formed from transparent silicon on the first surface of the first substrate layer,
• - a second micro-optic array consisting of a plurality of micro-optics is formed from transparent silicon on the first surface of the second substrate layer,
• - the at least one micro-aperture array is arranged on a second surface of the first substrate layer or on a second surface of the second substrate layer or on one of the two surfaces of the middle substrate layer in such a way that each micro-aperture has at least one, preferably precisely one, micro-optic of the first micro-optics array and at least one, preferably exactly one micro-optics of the second micro-optics array is assigned and preferably form a micro-optics system. When the projection device is irradiated with light, each micro-optical system forms a so-called micro-light distribution. A partial light distribution or a total light distribution is typically generated by superimposing several micro light distributions.

It can also be expedient to use different transparent silicones to form the first micro-optics array and the second micro-optics array.

Referring to the aforementioned preferred embodiment of the method, in which a negative mold was used, it should be noted that different negative molds, preferably negative molds with differently designed shaping surfaces, can be used to form the first and the second microoptics array. This creates micro-optic arrays with different optical effects.

It can also advantageously be provided that the three substrate layers are connected, preferably glued.

In addition, it is conceivable to automate the aforementioned method and thereby speed it up if the negative mold and the at least one substrate layer with the at least one micro-aperture array arranged on it are introduced into a conveyor system.

• 1a eine Projektionseinrichtung mit einer Substratschicht in Explosionsdarstellung;
• 1b ein vertikaler Schnitt der Projektionseinrichtung der 1a;
• 2 eine Projektionseinrichtung mit drei Substratschichten;
• 3a ein Kraftfahrzeugscheinwerferlichtmodul mit der Projektionseinrichtung der 1a beziehungsweise 1b;
• 3b ein Kraftfahrzeugscheinwerferlichtmodul mit der Projektionseinrichtung der 2;
• 4 ein mit schematischen Zeichnungen versehenes Ablaufdiagramm eines Herstellungsverfahrens einer Projektionseinrichtung;
• 5 ein mit schematischen Zeichnungen versehenes Ablaufdiagramm eines Herstellungsverfahrenseiner Projektionseinrichtung;
• 6 eine Anlage zum Herstellen von Projektionseinrichtungen, und
• 7a bis 7d lithographisches Druckverfahren zum Aufbringen eines Mikro-Blenden-Arrays auf eine transparente Substratschicht.

The invention is explained in more detail below on the basis of exemplary and non-limiting embodiments which are illustrated in the figures. In it shows

• 1a a projection device with a substrate layer in an exploded view;
• 1b a vertical section of the projection device 1a ;
• 2 a projection device with three substrate layers;
• 3a a motor vehicle headlight light module with the projection device of 1a respectively 1b;
• 3b a motor vehicle headlight light module with the projection device of 2 ;
• 4 a flowchart, provided with schematic drawings, of a manufacturing method of a projection device;
• 5 a flowchart, provided with schematic drawings, of a manufacturing method of a projection device;
• 6 a plant for the production of projection devices, and
• 7a until 7d lithographic printing process for applying a micro-aperture array to a transparent substrate layer.

First up 1a and 1b referenced. 1a shows an exploded view of a projection device 1, which can correspond to a projection device according to the invention. 1b shows a vertical section of the in 1a Projection device shown 1. The projection device 1 comprises a substrate layer 2, a micro-optics array consisting of a plurality of micro-optics 30 3 and a micro-aperture array 4 consisting of a plurality of micro-apertures 40. Preferably, the micro-optics 30, such as 1a and 1b can be seen, a flat side and are designed, for example, as plano-convex lenses. The micro-optics 30 can also be plano-concave or other micro-lenses, for example micro-lenses with a free-form light exit surface. The micro-optics array 3 thus preferably has a continuous flat surface which is formed by the flat sides of the individual micro-optics 30 . The micro-optics can be arranged in a matrix-like manner, preferably in one plane, which plane forms a main beam Direction X of a motor vehicle headlight light module 1000, 1001 (see 3a , 3b ) when the projection device 1 is arranged therein. Such micro-optical arrays are well known from the prior art (see, for example, AT514967B1 ). The substrate layer 2 and the microoptics array 3 are made of different materials and have different dimensional stability, strength and stability. The nature of the substrate layer 2 and the microoptics array 3 will be discussed later.

The microoptics array 3 is formed on a first surface 20 of the substrate layer 2 and adheres to this surface, for example due to cohesion and/or adhesion.

The micro-aperture array 4 is arranged on a second surface 21 of the substrate layer 2 in such a way that each micro-aperture 40 can be assigned exactly one micro-optics 30 . This is especially good in the 1a to recognize. Each micro-aperture 40 can also be assigned a plurality of micro-optics (not shown). An optical system made up of a micro-aperture and micro-optics is thus adjusted. When the projection device 1 is illuminated, light beams passing through a micro-aperture 40 and at least one micro-optics 30 assigned to it form a micro-light distribution. A light distribution that can be formed using the projection device 1 is created as a superimposition of all micro light distributions (see AT514967B1 ).

As already mentioned, the substrate layer 2 and the microoptics array 3 are made of different materials. According to the invention, the microoptics array 3 is made of a transparent silicone 5 (see 4 and 5 ) is formed, the substrate layer 2 being formed from a transparent material which is more dimensionally stable than the transparent silicone 5 .

The substrate layer 2 should be made of a material that has good light transparency and at the same time is dimensionally stable enough. In this context, dimensionally stable enough means that the substrate layer 2 carries the micro-optics array 3 made of (soft, light-transparent) silicone 5 and both during the formation of the micro-optics array 3 on the first surface 20 of the substrate layer 2 and during the attachment of the micro -Aperture arrays 4 to the second surface 21 does not lose its shape even during use of the projection device 1 in a motor vehicle headlight.

The dimensionally stable substrate layer 2 can therefore serve as a carrier for the microoptics array 3 . The dimensionally stable substrate layer 2 can also be used as a carrier for micro-aperture arrays 4. It is expedient if the micro-aperture array 4 and the micro-optical array 3 are precisely matched or adjusted to one another so that a light image can be generated without distortion. The shape of the silicone layer 2 essentially determines the optical properties of the entire projection device 1, such as its focal length. The dimensional stability of the substrate layer 2 is intended in particular to ensure that the finished projection device 1 meets the standard mechanical requirements of main headlight systems and, in particular, satisfies the shock and vibration requirements of the respective motor vehicle manufacturer. With regard to vibration and shock requirements, there are various tests that are well known to those skilled in the art. Shock requirements can vary from 18g to 50g (depending on the axle). In principle, the substrate layer 2 can be made of any optically transparent material that meets the stability and the headlight requirements (Q requirements and legal regulations, such as the EU end-of-life vehicle regulation).

The micro-optics array 3 is preferably formed and adhered to the first surface 20 of the substrate layer 2 by means of a thermal molding process, which will be discussed later. In addition, it is entirely conceivable that the microoptics array 3 and the substrate layer 2 have different refractive indices.

The substrate layer 2 is preferably made of glass. The substrate layer 2 can have a thickness in the millimeter range, for example about 1.1 mm thick. The silicone layer 3 can also have a thickness in the millimeter range, for example about 0.1 mm to 1.1 mm thick.

The transparent silicone 5 preferably has a Shore A hardness of about 30 to about 100, in particular from about 40 to about 90. The use of transparent two-component silicone with such a Shore A hardness is particularly advantageous.

The micro-apertures 40 are preferably designed in such a way and the micro-aperture array 4 is preferably arranged in the projection device 1 such that the projection device 1 is set up to form a low beam distribution and/or a partial high beam distribution or a high beam distribution. For example, the micro-apertures 40 can have correspondingly shaped, optically effective edges.

The microoptics 30 of the microoptics array 3 can have the same height and, for example, a height in a range between approximately 0.01 mm and approximately 2 mm, preferably between approximately 0.1 mm and about 1.5 mm, in particular a height of about 1.1 mm.

2 shows a further projection device 100, which can correspond to a projection device according to the invention. The projection device 100 comprises three substrate layers 2a, 2b, 2c, two micro-optical arrays 3a, 3b and two micro-aperture arrays 4a, 4b. 2 shows that the projection device 100 consists essentially of two projection devices 1 of 1a or 1b is composed and also has an additional substrate layer 2c. For this reason, in relation to the projection device 1 of 1a or 1b said on the projection device 100 of 2 - possibly with appropriate modifications - application. For example, all substrate layers can be made of glass. Different substrate layers 2a, 2b, 2c and different microoptical arrays 3a, 3b can each have different refractive indices.

2 shows that a middle substrate layer 2c can be arranged between a first substrate layer 2a and a second substrate layer 2b. A first surface 20a faces away from the first substrate layer 2a and a first surface 20b faces away from the second substrate layer 2b of the middle substrate layer 2c. A first micro-optics array 3a is formed and adhered to the first surface 20a of the first substrate layer 2a. A second micro-optics array 3b is formed and adhered to the first surface 20b of the second substrate layer 2b.

2 It can be seen that a first micro-aperture array 4a is arranged on a second surface 21a of the first substrate layer 2a and a second micro-aperture array 4b is arranged on a second surface 21b of the second substrate layer 2b. Both micro-aperture arrays 4a and 4b can be applied to the corresponding areas 20c, 21c of the middle substrate layer 2c or printed, for example by a lithographic printing method. The middle substrate layer 2c can thus serve as a carrier for the micro-aperture arrays 4a, 4b. Lithographic printing can also be used to attach the micro-aperture array 4 to the substrate layer 2 of the aforesaid projection device 1.

For example, the first micro-aperture array 4a can be designed to form a low-beam light distribution and/or a partial high-beam light distribution or a high-beam light distribution and the second micro-aperture array 4b can be provided to correct aberrations.

Furthermore, the three substrate layers 2a, 2b, 2c can be connected to one another, preferably glued, in order to improve the stability of the projection device 100 and to seal the micro-aperture arrays 4a and 4b in the adjusted position.

3a and 3b each show motor vehicle headlight modules 1000 and 1001, each with a light source 2000, for example a semiconductor-based light source, and a corresponding projection device 1, 100 described above, which is downstream of the respective light source in the main emission direction X. The at least one light source 2000 radiates its entire light into the projection device 1, 100, for example. Projection device 1, 100 can project the light radiated into it into an area in front of motor vehicle headlight module 1000, 1001 or in front of the motor vehicle headlight in the form of a low beam distribution and/or a partial high beam distribution or a high beam distribution.

In the further course, with reference to 4 and 5 a method of manufacturing the projection devices 1, 100 described above will be outlined. 4 and 5 show such a procedure.

First up 4 referenced. In a first step S1 of the method, transparent silicone 5, a substrate layer 2, 2a, 2b made of a transparent, dimensionally stable material, for example glass, the substrate layer 2, 2a, 2b being more dimensionally stable than the transparent silicone 5, and a A plurality of micro-apertures 40, 40a, 40b provided micro-aperture array 4, 4a, 4b. This step is a first step - S01 - of the in 5 procedure shown is identical. The transparent silicone 5 preferably has a Shore A hardness of about 30 to about 100, in particular from about 40 to about 90. A two-component silicone is preferred.

Subsequently, a micro-optic array 3, 3a, 3b consisting of a plurality of micro-optics 30, 30a, 30b is formed from the transparent silicone 5 on a first surface 20, 20a, 20b of the substrate layer 2, 2a, 2b, preferably as follows.

In a second step S2, a negative mold 6, 6a, 6b, for example made of brass (a brass body), with a shaping surface 60, 60a, 60b, which corresponds to the microoptics array 3, 3a, 3b, is provided and the transparent silicone 5 cast therein or metered into the negative mold 6, 6a, 6b. This step is a second step - S02 - of the in 5 procedure shown is identical.

In a third step S3, the substrate layer 2, 2a, 2b is placed or placed on the negative mold 6, 6a, 6b.

Subsequently, in a fourth step—S4—the silicone 5 is cured in the negative mold 6, 6a, 6b. The cross-linked silicone 5 cured in the negative mold 6, 6a, 6b becomes the microoptics array 3, 3a, 3b.

The microoptics array 3, 3a, 3b can then be removed from the negative mold 6, 6a, 6b—fifth step S5.

It goes without saying that several negative molds 6, 6a, 6b with differently shaped shaping surfaces 60, 60a, 60b can be provided in order to produce different microoptical arrays 3, 3a, 3b. For example, the micro-optics array 3a can be located in 2 , 3a , 3b , which is used as micro entry optics, differ from the micro optics array 3b, which is used as micro exit optics. As a result, for example, projection devices with micro-optical arrays can be produced which have differently curved micro-entry optics and micro-exit optics. Such projection devices allow a particularly fine adjustment of a light distribution to be generated. As already mentioned, the micro-optics arrays 3a, 3b and the micro-optics 30a, 30b of the projection device 100 of the 2 and the micro-optics array 3 and the micro-optics 30 of the projection device 1 of FIG 1a or 1b not be identical.

4 shows that heat is supplied to the negative mold 6, 6a, 6b and in particular to its shaping surface 60, 60a, 60b during the curing of the silicone 5 (step S4) and that the negative mold 6, 6a, 6b is cooled before demoulding (step S5). can. The at least one negative mold 6, 6a, 6b can be heated to a predetermined first temperature, the first temperature being, for example, in a range between about 90° C. and about 200° C., preferably between about 100° C. and about 150° C. in particular between about 100° C. and about 120° C. or about 120° C. and about 150° C., and can be maintained at the predetermined first temperature for a period that is preferably dependent on the predetermined first temperature, the period for example being between about 0 .5 minutes and 6 minutes, preferably between 1 minute and 5 minutes. During cooling, the negative mold 6, 6a, 6b is cooled to a predetermined second temperature, preferably by means of compressed air and/or cooling liquid, the second temperature being, for example, in a range between about 40° C. and about 70° C., preferably between about 50° C. and is around 60°C.

The micro-aperture array 4, 4a, 4b is then arranged on a second surface 21, 21a, 21b of the at least one substrate layer 2, 2a, 2b, the at least one micro-optics array 3, 3a, 3b and the at least one micro -Aperture array 4, 4a, 4b are arranged relative to one another in such a way that each micro-aperture 40, 40a, 40b is assigned at least one micro-optics 30, 30a, 30b in such a way that the micro-aperture 40, 40a, 40b has the at least one associated micro-optics 30, 30a, 30b form an adjusted optical projection system. The arrangement of the micro-aperture array 4, 4a, 4b on the second surface 21, 21a, 21b of the substrate layer 2, 2a, 2b preferably has the following partial steps. Step S6 - the so-called alignment - consists in positioning the at least one micro-aperture array 4, 4a, 4b with respect to the at least one micro-optics array 3, 3a, 3b such that each micro-aperture 40, 40a, 40b has at least one micro-optics 30, 30a, 30b. Then--in a seventh step S7--the micro-aperture array 4, 4a, 4b is applied to the second surface 21, 21a, 21b of the substrate layer 2, 2a, 2b, for example glued or printed, in particular applied using a lithographic printing process. It should be noted at this point that the micro-aperture array 4, 4a, 4b on a further substrate layer, such as the middle substrate layer 2c in the 2 and 3b , may already be upset.

The application and alignment of the micro-aperture array 4, 4a, 4b on the substrate layer 2, 2a, 2b can take place at different stages of the process with regard to the micro-optics array can take place before or after the formation of the micro-optics array in the negative mold ( Exposing, curing, demoulding). 5 shows an embodiment of the method in which the micro-aperture array 4, 4a, 4b is already applied in a third step S03 to the second surface 21, 21a, 21b of the substrate layer 2, 2a, 2b, preferably glued or printed, in particular is applied by means of a lithographic printing process. It should be noted at this point that the micro-aperture array 4, 4a, 4b on a further substrate layer, such as the middle substrate layer 2c in the 2 and 3b , may already be upset. The subsequent alignment/positioning—fourth step S04—then takes place before the substrate layer 2, 2a, 2b is placed on the negative mold 6, 6a, 6b (fifth step S05). The micro-aperture array 4, 4a, 4b is already applied to the second surface 21, 21a, 21b of the substrate layer 2, 2a, 2b. In a sixth step S06 of in 5 illustrated method, the silicone 5 in the negative mold 6, 6a, 6b, essentially as with reference to FIG 4 described to be cured. Then - in step S07, the finished projection device 1 is made from the negative mold 6, 6a, 6b demolded, the demolding also as with reference to FIG 4 already described, can take place.

Using the methods described above, the previously described, in 2 Projection device 100 shown can be produced. For this purpose, three substrate layers 2a, 2b, 2c made of a transparent, dimensionally stable material, such as glass, are provided. Then, for example, as described above, a first micro-optics array 3a made of transparent silicon 5 is formed on the first surface 20a of a first substrate layer 2a and a second micro-optics array 3b made of transparent silicon 5 is formed on the first surface 20b of a first substrate layer 2b. In principle, it is conceivable that different transparent silicones with, for example, different refractive indices are used to form the first microoptics array 3a and the second microoptics array 3b.

Subsequently, the first and the second substrate layer 2a, 2b can each be provided with a micro-aperture array 4a, 4b, also as described above (method of 4 and 5 ). Alternatively, the micro-aperture arrays 4a, 4b can be applied to the respective surfaces 20c, 21c of a third substrate layer 2c - a first micro-aperture array 4a is applied to a first surface 20c and a second micro-aperture array 4b is applied a second surface 21c of the third substrate layer 2c is applied.

The third (or the middle) substrate layer 2c is arranged between the first substrate layer 2a and the second substrate layer 2b in such a way that the first surface 20a of the first substrate layer 2a and the first surface 20b of the second substrate layer 2b face away from the middle substrate layer 2c (see Fig 2 and 3b ).

Furthermore, the micro-aperture arrays 4a, 4b and the micro-optical arrays 3a, 3b are positioned relative to one another in such a way that each micro-aperture 40a, 40b has at least one, preferably precisely one, micro-optical system 30a of the first micro-optical array 3a and at least one, preferably exactly one micro-optics 30b of the second micro-optics array 3b is assigned. A micro-optical system is also formed in this way. Subsequently, all three substrate layers 2a, 2b, 2c can be connected, preferably glued, to a projection device 100 of the 2 to build.

In order to improve the adhesion of the microoptics array 3a, 3b, the first surface 20, 20a, 20b of the substrate layer 2, 2a, 2b can be pretreated before the substrate layer 2, 2a, 2b is placed on the negative mold 6, 6a, 6b will. In this case, the pretreatment can be carried out by cleaning the first surface 20, 20a, 20b and by subsequently pretreating the surface of the first surface 20, 20a, 20b by means of flame siliconization.

Now let's refer to 6 a manufacturing device 7 can be outlined, which corresponds to a system by means of which a projection device, for example the projection device 1 or 100, can be manufactured.

The production device 7 comprises the aforementioned negative mold 6, 6a, 6b with a shaping surface 60, 60a, 60b corresponding to the microoptics array 3, 3a, 3b to be formed. In addition, the production device has a holding means 70, which is preferably equipped with a vacuum suction cup 701, which is set up to hold the substrate layer (not shown here) with the surface facing the negative mold 6, 6a, 6b.

In addition, the production device 7 includes a positioning means, preferably a linear actuator 71. The linear actuator 71 ensures clean placement/placement (without tilting). The positioning means 71 is set up to position the substrate layer above the negative mold 6, 6a, 6b and to place the substrate layer on the negative mold 6, 6a, 6b and, in the course of demoulding, to remove it from the negative mold 6, 6a, 6b. If a micro-aperture array 4, 4a, 4b has already been applied to the substrate layer, the substrate layer is positioned above the negative mold 6, 6a, 6b, as described above, in such a way that each micro-aperture 40, 40a, 40b at least one micro-optics 30, 30a, 30b is assigned. In addition, it is expedient to position the substrate layer in such a way that it can completely cover the shaping surface 60, 60a, 60b of the negative mold 6, 6a, 6b when it is placed on/placed on.

Furthermore, the production device 7 can comprise a heating means 8 which is set up to heat the negative mold 6, 6a, 6b, and a cooling device (not shown here) which is set up to cool the negative mold 6, 6a, 6b.

The heating means 8 can comprise one or more heating cartridges 80, 81, which are arranged on or in the negative mold 6, 6a, 6b, preferably close to the shaping surface 60, 60a, 60b of the negative mold 6, 6a, 6b, i.e. so that they can give off their heat directly to the shaping surface 60, 60a, 60b without significant heat losses. The negative mold 6, 6a, 6b can have recesses 800, 810 for receiving the heating cartridges 80, 81. 6 shows that the heating cartridges 80, 81 in the recesses 800, 810 are included so that they are close to the forming surface 60, 60a, 60b and, in use, can give off their heat directly to the forming surface 60, 60a, 60b. The heating means 8 can be set up to heat the negative mold 6, 6a, 6b to a predetermined first temperature, the first temperature being, for example, in a range between approximately 90° C. and approximately 200° C., preferably between approximately 100° C. and approximately 150 ° C, in particular between about 100 ° C and about 120 ° C or about 120 ° C and about 150 ° C.

In addition, the production device 7 can have a cooling device 9 . The cooling device 9 is set up to cool the negative mold 6, 6a, 6b, which has been heated to the predetermined first temperature, to a predetermined second temperature, the second temperature being, for example, in a range between approximately 40° C. and approximately 70° C., preferably between approximately 50 ° C and about 60 ° C. For this purpose, for example, compressed air or coolant can be used as a coolant. The one in the 6 The cooling device shown provides that cooling channels (shown with dashed lines) are formed in the negative mold 6, 6a, 6b, through which a coolant, for example a cooling liquid, can be carried out. The cooling device can also have other elements, such as supply means, for supplying the coolant to the negative mould.

7a until 7d show an example of a aforementioned lithographic printing process which can be used for depositing micro-aperture arrays on light-transmissive substrate layers. 7a 1 shows a transparent substrate layer 2, 2a, 2b, which is used to apply a micro-aperture array 4, 4a, 4b comprising two partial layers and is processed as follows: According to FIG 7a the second surface 21, 21a, 21b of the substrate layer 2, 2a, 2b is coated with a reflective metallic first partial layer 4', 4a', 4b'.

The first partial layer 4', 4a', 4b' is then covered over the entire surface with a second partial layer 4", 4a", 4b" consisting of black, light-absorbing photoresist ( 7b ). The next step is to expose and develop the second partial layer 4", 4a", 4b" to form transparent windows 40", 40a", 40b" within the second partial layer 4", 4a", 4b" ( 7c ), through which corresponding areas of the first partial layer 4'', 4a'', 4b'' are uncovered. Thereafter, transparent windows 40', 40a', 40b' are formed in the first sub-layer 4', 4a', 4b' by removing the corresponding areas of the reflective metallic first sub-layer 4', 4a', 4b' by means of an etching process (see Fig 7d ). The light-permeable windows 40', 40a', 40b' corresponding to one another in the first partial layer 4', 4a', 4b' and the light-permeable windows 40", 40a", 40b" form within the second partial layer 4", 4a", 4b". transparent windows of micro-shutters 40, 40a, 40b. The contours of these light-transmitting windows can be designed as desired and form optically effective edges of the micro-screens 40, 40a, 40b; the embodiment shown as an example corresponds to a low beam distribution with an increase in asymmetry.

It goes without saying that the application of the micro-aperture arrays to substrate layers is not limited to the above example. Micro-aperture arrays can also consist of a metallic, opaque layer, for example, which has a plurality of openings, with the contours of the openings forming optically effective edges of the individual micro-apertures (see e.g WO 2017066817 A1 and WO 2017066818 A1 ). Such a micro-aperture array can be applied to a substrate layer, for example by means of gluing.

The foregoing discussion of the invention has been presented for purposes of illustration and description. The foregoing is not intended to limit the invention to the form or forms disclosed herein. For example, in the foregoing Detailed Description, various features of the invention are summarized in one or more embodiments for the purpose of streamlining the disclosure. This type of disclosure should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single embodiment described above.

In addition, while the description of the invention includes description of one or more embodiments and certain variations and modifications, other variations and modifications are within the scope of the invention, e.g. B. within the skills and knowledge of those skilled in the art, after understanding the present disclosure.

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• AT 514967 B1 [0003, 0043, 0045]
• WO 2017066817 A1 [0003, 0084]
• WO 2017066818 A1 [0003, 0084]
• EP 3282181 A1 [0004]
• DE 102012008639 A1 [0005]

Claims (7)

Projection device (1, 100) for a motor vehicle headlight module, which projection device (1, 100) comprises: - at least one substrate layer (2, 2a, 2b, 2c); - at least one micro-optics array (3, 3a, 3b) consisting of a plurality of micro-optics (30, 30a, 30b), and - at least one micro-aperture consisting of a plurality of micro-apertures (40, 40a, 40b) Array (4, 4a, 4b), wherein the at least one micro-optics array (3, 3a, 3b) is formed on a first surface (20, 20a, 20b, 20c) of the at least one substrate layer (2, 2a, 2b, 2c). and is adhered to the first surface (20, 20a, 20b) of the at least one substrate layer (2, 2a, 2b, 2c); the at least one micro-aperture array (4, 4a, 4b) is arranged on a second surface (21, 21a, 21b, 21c) of the at least one substrate layer (2, 2a, 2b, 2c) such that each micro-aperture (40, 40a, 40b) is assigned at least one micro-optics (30, 30a, 30b), characterized in that the projection device (1, 100) has three substrate layers (2a, 2b, 2c), two micro-optics arrays (3a, 3b) and has at least two micro-aperture arrays (4, 4a, 4b), each micro-optics array (3a, 3b) made of transparent silicone (5) and each substrate layer (2a, 2b, 2c) being transparent and more dimensionally stable than that is transparent silicone (5), a middle substrate layer (2c) being arranged between a first substrate layer (2a) and a second substrate layer (2b), a first surface (20a) of the first substrate layer (2a) on which a first micro-optics -Array (3a) is formed and adheres, and a first surface (20b) of the second substrate layer (2b) on which a second micro robotic array (3b) is formed and adheres, facing away from the middle substrate layer (2c), wherein a first micro-aperture array (4a) on a second surface (21a) of the first substrate layer (2a) or on a first surface ( 20c) of the middle substrate layer (2c), a second micro-aperture array (4b) being arranged on a second surface (21b) of the second substrate layer (2b) or on a second surface (21c) of the middle substrate layer (2c). is, wherein the first micro-aperture array (4a) is designed for shaping a low-beam light distribution and / or a partial high-beam distribution or a high-beam distribution and the second micro-aperture array (4b) is provided for correcting aberrations, wherein the three substrate layers ( 2a, 2b, 2c) are made of glass, which preferably has a thickness of about 0.5 mm to about 4 mm, preferably about 1.1 mm. projection device claim 1 , characterized in that the first micro-optics array (3a) is formed by a thermal molding process and adhered to the first surface (20a) of the first substrate layer (2a) and the second micro-optics array (3b) is formed by a thermal molding process and is made to adhere to the first face (20b) of the second substrate layer (2b), and/or that the micro-aperture arrays (4a, 4b) are bonded to the second faces (21a, 21b) of the first and second substrate layers (2a , 2b) or on the first or second surface (20c, 21c) of the middle substrate layer (2c) and sealed. Projection device according to one of Claims 1 until 2 , characterized in that the transparent silicone (5) has a Shore A hardness of about 30 to about 100, in particular from about 40 to about 90, preferably transparent two-component silicone. Projection device according to one of Claims 1 until 3 , characterized in that the micro-apertures (40a) of the first micro-aperture array (4a) are formed such and the first micro-aperture array (4a) is arranged in the projection device (1) such that the projection device ( 1) is set up to form a low beam distribution and/or a partial high beam distribution or a high beam distribution. Projection device according to one of Claims 1 until 4 , characterized in that the micro-optics (30a, 30b) of the two micro-optics arrays (3a, 3b) have the same height, for example in a range between about 0.01 mm and about 2 mm, preferably between about 0.1 mm and about 1 5 mm, in particular have a height of about 1.1 mm. Projection device according to one of Claims 1 until 5 , characterized in that the three substrate layers (2a, 2b, 2c) are connected to one another, preferably glued. Motor vehicle headlight light module (1000, 1001) or motor vehicle headlight comprising at least one projection device (1, 100) according to one of Claims 1 until 6 , and at least one light source (2000), preferably a semiconductor-based light source, in particular an LED light source, wherein the at least one projection device (1, 100) is located downstream of the at least one light source (2000) in the emission direction in such a way that the at least one light source (2000 ) Substantially all of its light is radiated into the at least one projection device (1, 100) and the at least one projection device Device (1, 100) projects the light radiated into it into an area in front of the motor vehicle headlight module (1000, 1001) or in front of the motor vehicle headlight in the form of a low beam distribution and/or a partial high beam distribution or a high beam distribution.

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