DE202015105741U1 - LED encapsulation arrangement and display system and driver unit therefor - Google Patents
LED encapsulation arrangement and display system and driver unit therefor Download PDFInfo
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- DE202015105741U1 DE202015105741U1 DE202015105741.5U DE202015105741U DE202015105741U1 DE 202015105741 U1 DE202015105741 U1 DE 202015105741U1 DE 202015105741 U DE202015105741 U DE 202015105741U DE 202015105741 U1 DE202015105741 U1 DE 202015105741U1
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 46
- 239000008393 encapsulating agent Substances 0.000 claims abstract description 3
- 230000008859 change Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000004971 Cross linker Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/32—Pulse-control circuits
- H05B45/325—Pulse-width modulation [PWM]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
LED-Verkapselungsanordnung, die mit einem Rotlicht-, einem Grünlicht- und einem Blaulicht-LED-Würfel (11, 12, 13) versehen ist, wobei auf jedem dieser LED-Würfel (11, 12, 13) jeweils eine erste Elektrode und eine zweite Elektrode angeordnet sind, dadurch gekennzeichnet, dass die LED (10) ferner Folgendes umfasst: – eine Vielzahl von Anschlussstiften, von denen jeder einen Stromeingang (VDD) und ein Schaltkreisende (VSS) aufweist, wobei der Anschlussstfit ferner ein Erstreckungsteil besitzt; und – eine Treibereinheit (30), wobei die Treibereinheit (30) und der Rotlicht-, der Grünlicht- und der Blaulicht-LED-Würfel (11, 12, 13) am Inneren der LED-Verkapselung verklebt sind, wobei die jeweilige erste Elektrode des Rotlicht-, des Grünlicht- und des Blaulicht-LED-Würfels (11, 12, 13) an den Stromeingang (VDD) elektrisch angeschlossen ist, wobei die Treibereinheit (30) nach Empfang eines Betriebsstroms und eines Trägerwellensignals (Data) den Rotlicht-, den Grünlicht- und den Blaulicht-LED-Würfel (11, 12, 13) steuert und weiter den Betriebsstrom und das Trägerwellensignal (Data) über das Schaltkreisende (VSS) ausgibt, wobei die Treibereinheit (30) ferner mittels eines Drahtes an die jeweilige zweite Elektrode des Rotlicht-, des Grünlicht- und des Blaulicht-LED-Würfels (11, 12, 13) angeschlossen ist.LED encapsulation arrangement, which is provided with a red light, a green light and a blue light LED cube (11, 12, 13), wherein on each of these LED cubes (11, 12, 13) each have a first electrode and a second electrode, characterized in that the LED (10) further comprises: - a plurality of pins each having a power input (VDD) and a circuit end (VSS), the connector further having an extension portion; and - a driver unit (30), wherein the driver unit (30) and the red light, the green light and the blue light LED cubes (11, 12, 13) are glued to the interior of the LED encapsulant, the respective first electrode the red light, the green light and the blue light LED cube (11, 12, 13) is electrically connected to the power input (VDD), the drive unit (30) receiving the red light signal after receiving an operating current and a carrier wave signal (Data). , the green light and the blue light LED cubes (11, 12, 13) controls and further outputs the operating current and the carrier wave signal (Data) via the circuit end (VSS), wherein the drive unit (30) further by means of a wire to the respective second electrode of the red light, the green light and the blue light LED cube (11, 12, 13) is connected.
Description
Technisches Gebiet Technical area
Die Erfindung betrifft eine Leuchtdioden-(LED)-Verkapselungsanordnung, insbesondere eine RGB-LED-Verkapselungsanordnung, die im Inneren einen Treiber aufweist und bei LED-Anzeigen oder LED-Lichtketten aller Art und zur Erzeugung spezieller Lichteffekte anwendbar ist. The invention relates to a light-emitting diode (LED) encapsulation arrangement, in particular an RGB LED encapsulation arrangement, which has a driver inside and is applicable to LED displays or LED light chains of all kinds and for generating special lighting effects.
Stand der Technik State of the art
Herkömmlich wird eine Vollfarb-LED dadurch gefertigt, dass eine Treibereinheit, ein Rotlicht-, ein Grünlicht- und ein Blaulicht-LED-Würfel zu einer Vollfarb-LED-Anordnung, i.e. einer RGB-LED-Anordnung, verkapselt wird, wobei der Abstand zwischen zwei benachbarten RGB-LEDs durch die Verkapselungsanordnung erheblich verkleinert werden kann. Eine derartige RGB-LED-Anordnung muss jedoch einen Stromeingang, einen Stromausgang, einen Taktsignaleingang, einen Taktsignalausgang, einen Steuersignaleingang und einen Steuersignalausgang umfassen, wobei viele Anschlussstifte dafür an der beengten RGB-LED-Anordnung angebracht werden müssen, was die Produktion hinsichtlich der Gutmenge und den Betrieb der LEDs beeinträchtigen wird. Daher ist es wünschenswert, die RGB-LED und die Treibereinheit weiter ineinander so zu integrieren, dass der gesamte Raum effektiv genutzt wird, um eine kompakte RGB-LED-Anordnung zu realisieren. Conventionally, a full color LED is fabricated by providing a driver unit, a red light, a green light and a blue light LED cube into a full color LED array, i. an RGB LED array is encapsulated, wherein the distance between two adjacent RGB LEDs can be significantly reduced by the encapsulation arrangement. Such an RGB LED array, however, must include a current input, a current output, a clock signal input, a clock signal output, a control signal input and a control signal output, many pins for which must be attached to the narrow RGB LED array, which reduces production in terms of yield and affect the operation of the LEDs. Therefore, it is desirable to further integrate the RGB LED and the driving unit into one another so that the entire space is effectively utilized to realize a compact RGB LED array.
Aufgabe der Erfindung Object of the invention
Der Erfindung liegt die Aufgabe zugrunde, eine LED-Verkapselungsanordnung zu schaffen, mit der das Problem mit einer übergroßen Anzahl von Bauelementen und Anschlussstiften bei der herkömmlichen RGB-LED-Verkapselungsanordnung gelöst wird, wobei die LED über eine Vielfalt von Lichtfarbmischungen verfügt und automatisiert massenproduzierbar ist, wobei eine Stromleiting zugleich zur synchronen Signalübertragung eingesetzt wird, wobei ein spezielles De- und Kodierverfahren eingesetzt wird, um eine Steuerung der Lichteffekte durch eine Signalübertragung zu realisieren. The invention has for its object to provide an LED encapsulation arrangement, which solves the problem with an excessive number of components and pins in the conventional RGB LED encapsulation arrangement, the LED has a variety of light color mixtures and automated mass production is , wherein a current conductor is used at the same time for synchronous signal transmission, wherein a special decoding and coding method is used to realize a control of the light effects by a signal transmission.
Technische Lösung Technical solution
Diese Aufgabe wird erfindungsgemäß durch eine LED-Verkapselungsanordnung mit den Merkmalen der Ansprüche 1 und 5 gelöst. Vorteilhafte Ausgestaltungen sind Gegenstand der abhängigen Ansprüche. This object is achieved by an LED encapsulation arrangement with the features of
Die erfindungsgemäße LED-Verkapselungsanordnung ist derart ausgebildet, dass an der Außenseite des Gehäuses nur Anschlussstifte für den Stromeingang bzw. Stromausgang und für das Stromkreisende vorgesehen sind, wobei sich die Anschlussstifte ins Innere des Gehäuses erstrecken, wodurch Erstreckungsteile im Gehäuse entstehen, wobei im Gehäuse eine Treibereinheit, ein Rotlicht-, ein Grünlicht- und ein Blaulicht-LED-Würfel angeordnet sind, wobei die LED-Würfel unmittelbar im Gehäuse gebondet werden können, wobei der Rotlicht-, der Grünlicht- und der Blaulicht-LED-Würfel unmittelbar an eine externe Stromquelle angeschlossen werden können, wobei die Treibereinheit mit einem Antriebsmechanismus versehen ist, um den Rotlicht-, den Grünlicht- und den Blaulicht-LED-Würfel zu steuern; gleichzeitig können durch eine Anordnung der internen Bautelemente LEDs ausgebildet werden, die dicht beieinander angeordnet sind, einen optimalen Lichtfarbmischungseffekt hervorbringen und über eine hohe Auflösung verfügen, wobei der Raumbedarf für die Verkapselung wirksam reduziert ist und die Anzahl der Anschlussstifte verringert ist, was zur Senkung der Herstellungskosten beiträgt. The LED encapsulation arrangement according to the invention is designed such that only pins for the current input or current output and for the circuit end are provided on the outside of the housing, wherein the pins extend into the interior of the housing, whereby extension parts are formed in the housing, wherein in the housing Driver unit, a red light, a green light and a blue light LED cubes are arranged, wherein the LED cubes can be bonded directly in the housing, the red light, the green light and the blue light LED cube directly to an external Power source can be connected, wherein the drive unit is provided with a drive mechanism to control the red light, the green light and the blue light LED cube; at the same time, by arranging the internal building elements, LEDs can be formed, which are arranged close to each other, produce an optimum light color mixing effect and have a high resolution, the space required for the encapsulation is effectively reduced and the number of pins is reduced, which leads to the reduction of Cost of production contributes.
Ferner stellt die Erfindung ein LED-Anzeigesystem bereit, das nur ein Hauptsteuerende benötigt, um den Stromeingang bzw. Stromausgang und die Erdung aneinander zu einem Stromkreis anzuschließen und alle LEDs neben- bzw. hintereinander zu schalten. Eine weitere Aufgabe der Erfindung besteht darin, mit einer einzigen Leitung einen externen Strom und Trägerwellensignale zu übertragen, um die Verkabelung des LED-Anzeigesystems weiter zu vereinfachen. Further, the invention provides an LED display system that requires only one main control end to connect the power input and ground together to a circuit and to switch all LEDs on and off each other. Another object of the invention is to transfer external power and carrier wave signals with a single line to further simplify the wiring of the LED display system.
Kurze Beschreibung der Zeichnung Short description of the drawing
Ausführungsbeispiels eines erfindungsgemäßen LED-Anzeigesystems. Embodiment of an LED display system according to the invention.
Wege der Ausführung der Erfindung Ways of carrying out the invention
Im Folgenden werden Aufgaben, Merkmale und Vorteile der vorliegenden Erfindung anhand der detaillierten Beschreibung von Ausführungsbeispielen und der beigefügten Zeichnung näher erläutert werden. Die Erfindung soll nicht auf die Beschreibung und die beigefügte Zeichnung beschränkt werden. In the following, objects, features and advantages of the present invention will become more apparent from the detailed description of embodiments and the accompanying drawings. The invention should not be limited to the description and the accompanying drawings.
Wie aus
Wie in
Die Verkapselungsanordnung umfasst einen Rotlicht-, einen Grünlicht- und einen Blaulicht-LED-Würfel
Bei den vorhergehenden zwei abgewandelten Ausführungsformen handelt es sich um eine planare LED-Verkapselungsanordnung, die ebenfalls bei einer kugelförmigen LED-Verkapselung ausführbar ist.
In der Ausführungsform aus
Der Rotlicht-, der Grünlicht- und der Blaulicht-LED-Würfel
Für eine genauere Ansicht der Konfiguration des Anzeigesystems nach dem zweiten Ausführungsbeispiel wird auf
Der Rotlicht-, der Grünlicht- und der Blaulicht-LED-Würfel
Die Treibereinheit
Dabei kann der Codierer
Durch Reihenschaltung der erfindungsgemäßen LEDs kann ein großformatiger LED-Bildschirm oder eine LED-Kette ausgebildet werden, wobei LEDs erden durch Kaskadenreglung miteinander verbunden werden, wobei die LEDs nach Bedarf parallel- oder reihengeschaltet werden können. Das Trägerwellensignal kann durch Anschluss an ein externes großformatiges Hauptsteuerende erzeugt werden. Das Trägerwellensignal enthält die Seriendaten SD für die Steuerung der LED-Würfel
Es ist darauf hinzuweisen, dass die LEDs rund, ovalförmig, zylinderförmig, rechteckig oder oberflächenmontiert ausgebildet sein können; die Lichtfarbe der LEDs ist auf eine Vollfarbe eingeschränkt, wobei einfarbige LEDs auch zur Realisierung der Verkapselung und zum Aufbau des Anzeigesystems denkbar sind; die Anzahl der Anschlussstifte der LED kann auf zwei eingeschränkt werden, ist aber nicht auf zwei beschränkt. It should be noted that the LEDs may be round, oval, cylindrical, rectangular or surface mounted; the light color of the LEDs is limited to a full color, with single-color LEDs are also conceivable for the realization of the encapsulation and for the construction of the display system; the number of pins of the LED can be limited to two, but is not limited to two.
Die Erfindung betrifft somit eine LED-Verkapselungsanordnung, wobei die LED hier eine RGB-LED ist, wobei an der Außenseite des Gehäuses (
Obwohl die vorliegende Erfindung anhand der Ausführungsbeispiele detailliert beschrieben worden ist, ist für den Fachmann selbstverständlich, dass die Erfindung nicht auf diese Ausführungsbeispiele beschränkt ist, sondern dass vielmehr Abwandlungen in der Weise möglich sind, dass einzelne Merkmale weggelassen oder andersartige Kombinationen von Merkmalen verwirklicht werden können, solange der Schutzbereich der beigefügten Ansprüche nicht verlassen wird. Die Offenbarung der vorliegenden Erfindung schließt sämtliche Kombinationen der vorgestellten Einzelmerkmale mit ein. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that the invention is not limited to these embodiments, but rather modifications are possible in the manner that individual features omitted or other combinations of features can be realized as long as the scope of protection of the appended claims is not abandoned. The disclosure of the present invention includes all combinations of the featured individual features.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
- 11
- Hauptsteuerende Main control end
- 10(A–C)10 (A-C)
- LED LED
- 11 11
- Rotlicht-LED-Würfel Red-light LED cube
- 12 12
- Grünlicht-LED-Würfel Green Light LED Cube
- 13 13
- Blaulicht-LED-Würfel Blue-light LED cube
- 20 20
- Gehäuse casing
- 30 30
- Treibereinheit driver unit
- 31 31
- Betriebshauptkörper Operating main body
- 32 32
- Codierer encoder
- 33 33
- Speicher Storage
- 34 34
- Taktgeber clock
- 35 35
- Spannungsregler voltage regulators
- VDD+ VDD +
- Stromeingang current input
- VDD– VDD
- Stromausgang current output
- VSS VSS
- Stromkreisende Circuit end
- Data Data
- Trägerwellensignal Carrier wave signal
Claims (13)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3258748A1 (en) * | 2016-06-13 | 2017-12-20 | Melexis Technologies NV | Package of light emitting diodes |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3258748A1 (en) * | 2016-06-13 | 2017-12-20 | Melexis Technologies NV | Package of light emitting diodes |
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