DE202014010573U1 - A plastic encapsulated electronic assembly for a capacitive sensor - Google Patents

A plastic encapsulated electronic assembly for a capacitive sensor Download PDF

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Publication number
DE202014010573U1
DE202014010573U1 DE202014010573.1U DE202014010573U DE202014010573U1 DE 202014010573 U1 DE202014010573 U1 DE 202014010573U1 DE 202014010573 U DE202014010573 U DE 202014010573U DE 202014010573 U1 DE202014010573 U1 DE 202014010573U1
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Germany
Prior art keywords
circuit board
printed circuit
protective
electronic assembly
microns
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Expired - Lifetime
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DE202014010573.1U
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German (de)
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IFM Electronic GmbH
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IFM Electronic GmbH
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Filing date
Publication date
Application filed by IFM Electronic GmbH filed Critical IFM Electronic GmbH
Priority to DE202014010573.1U priority Critical patent/DE202014010573U1/en
Priority to DE102015223668.4A priority patent/DE102015223668B8/en
Publication of DE202014010573U1 publication Critical patent/DE202014010573U1/en
Expired - Lifetime legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/945—Proximity switches
    • H03K17/955—Proximity switches using a capacitive detector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B29C2045/14844—Layers protecting the insert from injected material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Mit Kunststoff umspritzte Elektronikbaugruppe mit einer Leiterplatte, die gemäß den folgenden Verfahrensschritten hergestellt ist: a) Bestückung der Leiterplatte mit Elektronikbauteilen b) Aufbringen eines Schutzlacks auf die bestückte Leiterplatte a. wobei in einem ersten Arbeitsschritt der Schutzlack im Randbereich der Leiterplatte mit einer Dispenserdüse strichförmig aufgebracht wird, um einen Damm zu bilden b. wobei in einem zweiten Arbeitsschritt der Schutzlack im Innenbereich der Leiterplatte mit einer Flachdüse mit einer Schichtdicke kleiner 200 µm aufgebracht wird c) Aushärten des Lacks bei Temperaturen zwischen 70 °C und 110°C d) Umspritzen der bestückten Leiterplatte in einer herkömmlichen Kunststoffspritzgussanlage e) Wobei der Schutzlack bei 20° C eine Viskosität nach DIN EN ISO 3219 kleiner 1300 mPas was einem Wert kleiner 80 s nach DIN EN ISO 2431 entspricht f) So dass der Lack unter die Elektronikbauteile und/oder in den Kabelmantel kriecht.Plastic encapsulated electronic assembly with a printed circuit board, which is manufactured according to the following process steps: a) assembly of the printed circuit board with electronic components b) application of a protective varnish on the assembled printed circuit board a. wherein in a first step, the protective lacquer is applied in the edge region of the circuit board with a dispensing nozzle in a line to form a dam b. wherein in a second step, the protective coating is applied in the interior of the circuit board with a flat nozzle with a layer thickness less than 200 microns c) curing of the paint at temperatures between 70 ° C and 110 ° C d) encapsulation of the assembled printed circuit board in a conventional plastic injection molding e) the protective varnish at 20 ° C has a viscosity according to DIN EN ISO 3219 smaller than 1300 mPas which corresponds to a value less than 80 s according to DIN EN ISO 2431 f) So that the varnish creeps under the electronic components and / or into the cable jacket.

Description

Die Erfindung betrifft eine im konventionellen Spritzgussverfahren mit thermoplastischen Kunststoff umspritzten Elektronikbaugruppe, sowie einen kapazitiven Sensor mit einer solchen Elektronikbaugruppe, der vorwiegend in der Automatisierungstechnik Anwendung findet. The invention relates to an encapsulated in the conventional injection molding process with thermoplastic plastic electronics assembly, and a capacitive sensor with such an electronic assembly, which is mainly used in automation technology.

Aus DE 10 2007 045 535 A1 ist ein Winkelsensor bekannt, der ohne umgebendes Gehäuse lediglich durch einen Vergusskörper geschützt ist. Der Vergusskörper ist vorzugsweise zweilagig mit einem weicheren Innenteil und einer äußeren harten Schicht ausgeführt.Out DE 10 2007 045 535 A1 an angle sensor is known, which is protected without surrounding housing only by a potting. The potting body is preferably made of two layers with a softer inner part and an outer hard layer.

Aus der Schrift ist weiterhin bekannt, definierte Bereiche der Oberseite der kombinierten Träger/Leiterplatte mit Lötstoppmasken-Schutzlack zu beschichten. From the document is also known to coat defined areas of the top of the combined carrier / circuit board with solder mask protective lacquer.

Um das Eindringen von Wasser zwischen Vergusskörper und Leiterplatte, ins besondere über Anschlusskabel zu verhindern, wird eine Längswassersperre vorgeschlagen, die zunächst aus aufgerauter, nicht metallisierter Leiterplattenoberfläche und optional aus einer in die Leiterplatte eingearbeitete Rinne besteht. In order to prevent the ingress of water between potting and PCB, in particular via connection cable, a longitudinal water barrier is proposed, which consists of roughened first, not metallized PCB surface and optionally from a built-in circuit board groove.

Als nachteilig werden sowohl der Bearbeitungsaufwand der Leiterplatte als auch der Flächenbedarf der Längswassersperre empfunden.As a disadvantage, both the processing cost of the circuit board and the space requirement of the longitudinal water barrier are felt.

Nachteilig ist weiterhin, dass bei hohen Spritzdrücken hohl liegende elektronische Bauteile zerbrechen können.A further disadvantage is that at high injection pressures hollow electronic components can break.

Die Aufgabe der Erfindung besteht darin, diese Nachteile wenigsten zumindest teilweise zu überwinden und eine mit thermoplastischen Kunststoff umspritzte Elektronikleiterplatte anzugeben. The object of the invention is to at least partially overcome these disadvantages and to specify a plastic circuit board overmolded with thermoplastic material.

Diese Aufgabe wird gemäß dem Patentanspruch 1 gelöst. Die Unteransprüche betreffen die Ausgestaltung der Erfindung, ins besondere einen kapazitiven Sensor mit der erfindungsgemäß hergestellten Elektronikbaugruppe.This object is achieved according to claim 1. The dependent claims relate to the embodiment of the invention, in particular a capacitive sensor with the electronic assembly according to the invention.

Die Erfindung wird nachfolgend näher erläutert. The invention will be explained in more detail below.

Der wesentliche Erfindungsgedanke besteht darin, die mit Elektronikbauteilen bestückte Leiterplatte mit einem Schutzlack zu überziehen, der wegen seiner Viskosität sowohl unter die Elektronikbauteile als auch in einen vorhanden Kabelmantel oder eine Litzenisolierung kriecht. The essential idea of the invention consists in covering the printed circuit board equipped with electronic components with a protective lacquer which because of its viscosity creeps under both the electronic components and into an existing cable sheath or strand insulation.

Zu diesem Zweck wird der Schutzlack erfindungsgemäß in einem ersten Schritt im Randbereich R der Leiterplatte mit einer Dispenserdüse strichförmig aufgebracht, so das ein Damm entsteht, und in einem zweiten Schritt mit einer Flachdüse mit einer Schichtdicke von weniger als 200 µm, vorzugsweise mit einer Dicke zwischen 100 µm und 120 µm aufgebracht. For this purpose, the protective coating according to the invention in a first step in the edge region R of the circuit board with a dispensing nozzle applied in a line, so that a dam is formed, and in a second step with a flat die with a layer thickness of less than 200 microns, preferably with a thickness between 100 .mu.m and 120 .mu.m applied.

Der Lack wird anschließend in einem Ofen bei Temperaturen zwischen 70°C und 110 °C ausgehärtet und die Leiterplatte danach in einer konventionellen Spritzgussanlage einlagig oder mehrlagig umspritzt. The paint is then cured in an oven at temperatures between 70 ° C and 110 ° C and then the circuit board in a conventional injection molding single-layer or multi-layer encapsulated.

Der Schutzlack ist vorzugsweise ein Lack auf Acrylbasis. Er weist bei 20° C eine Viskosität nach DIN EN ISO 3219 von typischerweise kleiner 1300 mPas auf, was einem Wert kleiner 80 s nach DIN EN ISO 2431 entspricht. The protective lacquer is preferably an acrylic-based lacquer. It detects a viscosity at 20 ° C DIN EN ISO 3219 typically less than 1300 mPas, which is less than 80 s after DIN EN ISO 2431 equivalent.

Die gewünschte Kapillarwirkung und damit auch der erfindungsgemäße Hermetisierungseffekt, wobei der Lack unter die Elektronikbauteile und/oder in den Kabelmantel kriecht, treten bis zu einer Viskosität von ca. 2000 mPas ein. The desired capillary action and thus also the hermetic effect of the invention, wherein the lacquer creeps under the electronic components and / or in the cable sheath, occur up to a viscosity of about 2000 mPas.

Die Erfindung ist prinzipiell für alle konventionell umspritzten Leiterplatten, die mit relativ hohen Spritzdrücken bis zu 1200 Bar oder auch mit niedrigen Spritzdrücken umspritzt werden, und für Temperaturen bis zu 240 °C geeignet. In principle, the invention is suitable for all conventionally overmolded printed circuit boards which are overmoulded with relatively high injection pressures of up to 1200 bar or else with low injection pressures and for temperatures of up to 240.degree.

Sie ist nicht auf Leiterplatten mit Kabelanschluss beschränkt, denn die insbesondere bei hohen Spritzdrücken größer 250 Bar bestehende Bruchgefahr für hohl liegend elektronische Bauteile wird durch die oben beschriebene Unterwanderung der Bauelemente durch den Schutzlack deutlich verringert, so dass die Lehre der Erfindung für umspritzte Leiterplatten jeglicher Art anwendbar ist. It is not limited to printed circuit boards with cable connection, because the particular at high injection pressures greater than 250 bar breakage risk for hollow electronic components is significantly reduced by the infiltration of the components described above by the protective coating, so that the teaching of the invention for overmolded circuit boards of any kind is applicable.

Die erfindungsgemäße Elektronikbaugruppe ist prinzipiell für alle Sensortypen geeignet, besonders jedoch für kapazitive Sensoren, weil hier keine Sensorbauelemente wie z. B. Fotodioden bei optischen Sensoren oder scharfkantige Schalenkerne bei induktiven Sensoren vorhanden sind. The electronic assembly according to the invention is in principle suitable for all types of sensors, but especially for capacitive sensors, because no sensor components such. B. photodiodes in optical sensors or sharp-edged shell cores in inductive sensors are present.

Die 1 zeigt eine mit Elektronikbauteilen bestückte Leiterplatte vor der erfindungsgemäßen Umspritzung.The 1 shows a stocked with electronic components circuit board before the encapsulation according to the invention.

ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION

Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Zitierte PatentliteraturCited patent literature

  • DE 102007045535 A1 [0002] DE 102007045535 A1 [0002]

Zitierte Nicht-PatentliteraturCited non-patent literature

  • DIN EN ISO 3219 [0013] DIN EN ISO 3219 [0013]
  • DIN EN ISO 2431 [0013] DIN EN ISO 2431 [0013]

Claims (5)

Mit Kunststoff umspritzte Elektronikbaugruppe mit einer Leiterplatte, die gemäß den folgenden Verfahrensschritten hergestellt ist: a) Bestückung der Leiterplatte mit Elektronikbauteilen b) Aufbringen eines Schutzlacks auf die bestückte Leiterplatte a. wobei in einem ersten Arbeitsschritt der Schutzlack im Randbereich der Leiterplatte mit einer Dispenserdüse strichförmig aufgebracht wird, um einen Damm zu bilden b. wobei in einem zweiten Arbeitsschritt der Schutzlack im Innenbereich der Leiterplatte mit einer Flachdüse mit einer Schichtdicke kleiner 200 µm aufgebracht wird c) Aushärten des Lacks bei Temperaturen zwischen 70 °C und 110°C d) Umspritzen der bestückten Leiterplatte in einer herkömmlichen Kunststoffspritzgussanlage e) Wobei der Schutzlack bei 20° C eine Viskosität nach DIN EN ISO 3219 kleiner 1300 mPas was einem Wert kleiner 80 s nach DIN EN ISO 2431 entspricht f) So dass der Lack unter die Elektronikbauteile und/oder in den Kabelmantel kriecht.Plastic overmolded electronic assembly comprising a printed circuit board fabricated according to the following process steps: a) Assembly of the printed circuit board with electronic components b) Applying a protective coating on the printed circuit board a. wherein in a first step, the protective varnish in the edge region of the printed circuit board with a dispensing nozzle is applied in a line shape to form a dam b. wherein in a second step, the protective coating is applied in the interior of the circuit board with a flat nozzle with a layer thickness less than 200 microns c) curing the paint at temperatures between 70 ° C and 110 ° C d) encapsulation of the printed circuit board in a conventional plastic injection molding system e) Where the protective lacquer at 20 ° C a viscosity according to DIN EN ISO 3219 smaller 1300 mPas which corresponds to a value less than 80 s according to DIN EN ISO 2431 f) so that the paint creeps under the electronic components and / or in the cable sheath. Elektronikbaugruppe gemäß Anspruch 1 mit einer Leiterplatte, die mit einer viskosen Lackschicht überzogen ist. Electronic assembly according to claim 1 with a printed circuit board, which is coated with a viscous lacquer layer. Elektronikbaugruppe nach Anspruch 2 mit einem Schutzlack auf Acrylbasis.Electronic assembly according to claim 2 with an acrylic-based protective lacquer. Elektronikbaugruppe nach Anspruch 3, wobei die Schichtdicke des Schutzlacks weniger als 200 µm beträgt, vorzugsweise zwischen 100µm und 120 µm liegt.Electronics module according to claim 3, wherein the layer thickness of the protective lacquer is less than 200 microns, preferably between 100 microns and 120 microns. Kapazitiver Näherungsschalter mit einer Elektronikbaugruppe nach Anspruch 4.Capacitive proximity switch with an electronic assembly according to claim 4.
DE202014010573.1U 2014-12-02 2014-12-02 A plastic encapsulated electronic assembly for a capacitive sensor Expired - Lifetime DE202014010573U1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE202014010573.1U DE202014010573U1 (en) 2014-12-02 2014-12-02 A plastic encapsulated electronic assembly for a capacitive sensor
DE102015223668.4A DE102015223668B8 (en) 2014-12-02 2015-11-30 Method for producing an electronic assembly encapsulated with plastic, such an electronic assembly, and a capacitive sensor

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Application Number Priority Date Filing Date Title
DE202014010573.1U DE202014010573U1 (en) 2014-12-02 2014-12-02 A plastic encapsulated electronic assembly for a capacitive sensor

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DE102015223668.4A Active DE102015223668B8 (en) 2014-12-02 2015-11-30 Method for producing an electronic assembly encapsulated with plastic, such an electronic assembly, and a capacitive sensor

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017217815A1 (en) * 2017-10-06 2019-04-11 Conti Temic Microelectronic Gmbh Method for manufacturing an electronic component, electronic component and solder mask
DE102017217985B4 (en) * 2017-10-10 2019-06-13 Conti Temic Microelectronic Gmbh Method for producing an electronic component
DE102022204366A1 (en) 2022-05-03 2023-11-09 Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg Method for applying a protective layer to a printed circuit board assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007045535A1 (en) 2007-09-24 2009-04-02 Asm Automation Sensorik Messtechnik Gmbh angle sensor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2295722B (en) 1994-11-30 1997-12-17 Motorola Ltd Method of packaging integrated circuits
EP1779421A1 (en) 2004-08-06 2007-05-02 Hitek Power Corporation Selective encapsulation of electronic components
DE202012008508U1 (en) 2012-09-06 2012-10-24 Rechner Industrie-Elektronik Gmbh distance sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007045535A1 (en) 2007-09-24 2009-04-02 Asm Automation Sensorik Messtechnik Gmbh angle sensor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DIN EN ISO 2431
DIN EN ISO 3219

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DE102015223668B4 (en) 2022-07-14
DE102015223668B8 (en) 2022-09-29
DE102015223668A1 (en) 2016-07-21

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