DE202013007444U1 - Electronic module and modular electronic system - Google Patents

Abstract

A modular medium or high voltage modular electronics system (150) comprising: - a cabinet (160) having a plurality of slots (120) arranged in an array, - at least one electronics module (100) provided in a slot (120) of the cabinet; the module comprises: - a housing (10) having a three-dimensional shape with a housing wall (30) comprising a dielectric material and a field-forming conductive layer (60) adjacent to one side (70) of the housing wall (30) electronic device (20) located in the housing (10); wherein the field-forming conductive layer (60) is electrically connectable to a predefined electrical potential (P) that is present in an operating state of the modular electronic system (150).

Description

TECHNICAL AREA

The present disclosure relates to electronic modules and systems, and more particularly to the isolation of electronic modules. In particular, the invention relates to a modular electrical and / or electronic system with modules having components located in at least one housing.

STATE OF THE ART

Power electronics building blocks (PEBB) are used in a variety of applications, such as voltage conversion. It is a difficult task, in particular in the medium to high voltage range, to integrate the semiconductor-based circuits involved in a space-saving manner while at the same time meeting the requirements with regard to heat dissipation, ie. H. Cooling, and safety to meet the problem of partial discharges.

There have been some attempts to make such PEBBs by solid materials, e.g. B. by using dielectric housings to isolate. Examples of such concepts can be found in Berth M .: "New Main Circuits, HV Design of Submodules", ABB Report, HIP49 / ATP5-3 , and in Steiner M., Reinold, H .: "Medium Frequency Topology in Railway Applications", European Railway Review (EPE), 2007, Aalborg, Denmark , However, none of these approaches has hitherto led to application in marketable PEBB products, in part due to persistent partial discharge problems.

In view of the above, power electronics modules and systems are needed that avoid the disadvantages of the known solutions.

SUMMARY OF THE INVENTION

The above-mentioned problems are at least partially solved by a modular electronic system according to claim 1.

In a first aspect, a modular medium and high voltage electronics system is provided. The system comprises a cabinet having a number of slots arranged in an array, at least one electronic module provided in a slot of the cabinet, the module comprising a housing with a three-dimensional shape having a housing wall comprising a solid dielectric material and a housing field-forming conductive layer adjacent to one side of the housing wall and an electronic device located in the housing, wherein the field-forming conductive layer in an operating state of the modular electronic system is electrically connectable to a predefined electrical potential.

Other aspects, advantages, and features of the present invention will become apparent from the dependent claims, the description, and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Throughout the remainder of the description, a full and enabling disclosure, including the best mode thereof, will be more particularly apparent to those of ordinary skill in the art, with reference to the accompanying drawings.

Show it:

1 schematically a partial cross-sectional view of a housing for a system according to embodiments;

2 schematically a front perspective view of an electronic module for a system according to embodiments;

3 schematically a cross-sectional view of a housing of an electronic module for a system according to embodiments;

4 a front perspective view of a frame-like insulating body for a housing according to embodiments;

5 schematically a front view of a system according to embodiments;

6 schematically a front perspective view of a system according to embodiments;

7 a cross-sectional side view of a system according to embodiments.

8th schematically a simulation of the electric field in an exemplary modular electronic system.

9 schematically a simulation of the electric field in a modular electronic system according to embodiments.

DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made in detail to various embodiments, for which one or more examples are shown in each figure. Each example is given by way of illustration and is not intended to be limiting. For example For example, features illustrated or described as part of one embodiment may be used on or in conjunction with other embodiments to yield still further embodiments. It is intended that the present disclosure include such modifications and variations.

Within the following description of the drawings, the same reference numerals refer to the same components. In general, only the differences will be described with reference to the individual embodiments. If several identical items or parts appear in a figure, not all of the parts bear reference numbers to simplify the appearance.

The systems and methods described herein are not limited to the specific embodiments described, but components of the systems and / or steps of the methods may be used independently and separately from other components and / or steps described herein. Instead, the exemplary embodiment may be implemented and used in conjunction with many other applications.

Although specific features of various embodiments of the invention may be shown in certain drawings and not in others, this is for convenience only. In accordance with the principles of the invention, any feature of a drawing may be mentioned and / or claimed in combination with any feature of any other drawing.

In general, embodiments of the invention relate to modular electronic systems having a plurality of electronic modules. The modules include packages and medium to high voltage electronic circuits, ie, power switches, which together form an electronic module, for example a PEBB. The housings comprise a dielectric material having a conductive layer on either an inside or outside. Multiple packages may be arranged in an array, for example, an m × n matrix (ie, an m by n matrix). In this case, the housings can be arranged so that they can be inserted in each case via attachment elements on the outer sides of the housing attached to each other. In embodiments, the housings may be pullably mounted in a rack or cabinet such that the electrical contacts (power, ground, etc.) are typically provided on the back of the modules. The terms cabinet and rack are used interchangeably herein, and are not necessarily closed bodies; they may also be self-molded elements for inserting electronic modules. The term "medium voltage" referred to above is understood as a rated voltage of about 1000 volts to about 36000 volts (DC or, in the case of AC RMS voltage). A voltage higher than this is hereinafter referred to as "high voltage". It should be noted that the devices must be able to withstand pulse voltages (eg, a lightning pulse) that are typically much larger (eg, over 100 kV), even for MV devices. It is z. B. on IEC 61800-5-1, Tab. 8 , referenced.

The dielectric material of the housing meets the standards with respect to solid insulation with respect to adjacent housings or modules. The thickness of the dielectric is dimensioned according to the thickness of the material, the voltages and the individual configuration of the system. In this case, the side of at least one housing coated with a conductive layer is connected to a defined potential in an operating state of the respective electronic module, so that the conductive layer is effectively a field-forming conductive layer.

Typically, the housing is formed such that the conductive layer located on the inside or outside of the housing has a smooth surface and is substantially free of sharp edges so as to avoid localized peaks that could promote partial discharge. The conductive layer covers either the entire outer or inner surface of the housing wall or, in other cases, covers multiple areas of the housing wall that are around edge portions of the housing, with areas on the sides of the housing not covered by the conductive layer. Therefore, if the housing has a box shape, the conductive layer may cover only areas around the edge portions, so that the conductive layer has an overall shape of a box frame, while the dielectric housing may be substantially a closed box with front and rear ventilation holes. In addition, the dielectric housing may have the same box frame shape as the conductive layer described above, so that any or all sides of the box or cuboid are omitted. In addition, one or more of the side surfaces (ie, all six sides of a cuboid) may be individually coated with a conductive layer such that the conductive layer covers at least a surface area that forms an intermediate portion between edge portions of the dielectric housing wall.

By connecting the conductive layer, for example on the inside of the housing wall, with a potential that matches the potential of the electronic circuit in the module is identical, a homogenization of the electric field in the air gap between adjacent or adjacent modules can be achieved.

Furthermore, due to the homogenized electric field in the air gap, a narrower air gap can be designed than would be possible with a conventional dielectric housing.

Further, a conductive layer on the inside of the housing may be isolated from the electronic circuit and be floating, or the conductive layer may be connected to ground.

In embodiments, the conductive layer (also referred to herein as a field-forming conductive layer) covers at least 30-40% of the total interior surface of the housing wall or at least 30-40% of the overall exterior surface of the housing wall. The field-shaping conductive layer may be applied in the form of a coating which is applied to the housing wall after its formation.

In embodiments, the housing wall may typically be a single body housing wall. The housing wall typically comprises a polymer plastic and / or a fiber reinforced polymer (FRP) and / or a polymer resin and / or a ceramic. With the exception of ceramic as the exclusive material of the housing, it can be integrally formed by a process such as injection molding, molding or pultrusion. In addition, the housing wall can be formed of several pieces, for example of two halves, which together form a box shape. Depending on the requirements and the use of the housing, the housing wall 30 fiber reinforcement, which may include wood or cellulose based materials. If the electrically conductive layer is a polymer, it may also be cast on the housing wall at the time of its manufacture or shortly thereafter.

The housing may have various shapes; it typically has the shape of a cuboid or a box. However, it may also have a hexagonal shape or be a combination of more than one cuboid of different sizes or shapes. Typically, the housing or box has front and rear openings, each on two opposite surfaces, which serve as clearances for cooling air for the electronic circuits inside. Therefore, the housing forms a kind of duct or tube from front to rear for air cooling. This tubular shape does not necessarily have a circular cross-section, but may have a variety of cross-sectional shapes, such as squares, triangles, hexagons, or the like. At the front and rear, where the housing has openings, or around the openings, the conductive layers terminate on the inner wall or outer wall of the housing, for example, to comply with the air clearance and leakage current isolation standards. In embodiments, depending on the individual structure, grooves may also be provided / patterned in the dielectric material of the housing to increase the leakage current surface distance.

In embodiments that may be combined with other embodiments described herein, the apertures may be front and rear provided with a grill or grid structure to protect against contact in accordance with high voltage insulation standards. This structure is typically connected to the field-forming conductive layer. Optionally, the grill can be electrically connected to ground potential.

In embodiments, the housing may be a frame. That is, there are not only openings in the front and rear surfaces as previously described (with the front and rear being referenced to the resulting air duct or also with respect to the direction in which the housing / module is in a rack or Array of other housings / modules), but also have other sides of the cuboid having openings, so that in one embodiment the housing is a box-shaped frame having openings instead of all side surfaces.

As a result, embodiments relate to an electronic system which comprises a multiplicity of the electronic modules described. The modules are typically arranged in an array. Either the housings of the modules have elements in their outer surfaces which serve as attachment means for connecting the various modules together, such as rails and / or grooves. Thereby, in embodiments, the rail members may also be a part integral with the housing, or a part of the housing, such as edges, may be used as a rail member.

In embodiments, an electronics module thus comprises a housing having on its outside at least one rail member or a groove having a guide structure for assisting in inserting the housing into a cabinet or rack to form the modular electronics system and extracting the housing from the modular Electronic system forms. The electronic modules are typically mounted in a frame, cabinet or rack with openings, rails, grooves or other standard means for attachment purposes appropriate. The electronics modules may be plugged in or unplugged from the array and may also include hot-plug devices, for example, in that the electrical contacts are provided on the back of the modules so that they first enter the slot during insertion.

In embodiments, the modules themselves also have a modular structure. Thus, the electronic circuit board is mounted in the housing with removable means, such as rails. For access to the interior of the electronics module and therefore the circuit, a typically front or back surface of the housing is typically configured to be opened to remove the circuit board. Thus, the electronics system comprising the modules comprising packages arranged in an array has a two-stage or double modular structure. On the one hand, the electronic modules comprising the housing and the circuit therein can be detached from the system. This allows the system, for example, to scale quickly and with great flexibility to different performance requirements or cost requirements. At the same time or in addition, the printed circuit boards can be removed or inserted individually into individual housings of modules.

Embodiments according to the invention allow a compact system design due to the field-forming conductive layer on the housing connected to a potential which may be the working potential of the electronic circuit in the module. Hotswapping of modules and / or electronic circuits in the modules is achievable. Due to the effective isolation principle small form factors for the modules are possible, or it is required little air space between the electronic circuits and the housing or between the housings of adjacent modules. Therefore, you can get compact and lightweight small modules and entire systems.

In embodiments, the housing walls of two adjacent electronic modules are separated by an air gap. In this case, the air gap is dimensioned such that V _{peak can be reached} between the at least two adjacent electronic modules. The field strength between the electronic circuit in the module and the conductive layer (at potential) is thus close to zero, depending on the actual potential of the conductive layer, or may be, for example, with reference to the case of the conductive layer of the housing connected to ground, to be greatly minimized. Therefore, a problem of partial discharge in the electronic module is greatly reduced. Since the electronics modules have a relatively smooth or perfectly smooth outer surface free of edges or small radii, the electric field caused by the conductive layer coated housing is relatively homogeneous. The conductive layer at potential is thus a field-forming conductive layer. Even if adjacent modules are at different potentials, the field between their adjacent parallel surfaces is nearly homogeneous and therefore uncritical of partial discharge. Air isolation is thus achievable, thereby reducing the risk of partial discharge, which is otherwise often critical in medium voltage applications in air insulated enclosures.

In certain cases, the conductive layers of adjacent modules may also be at the same potential, so there is no potential difference. In this case, an electrical connector may connect the elements so as to further promote or ensure that they are at the same potential. Therefore, the electrical conductor electrically connects a portion of the field-forming conductive layer of a first of the two adjacent modules to the field-shaping conductive layer of a second of the two adjacent modules.

1 shows a cross-sectional view of a housing 10 according to embodiments. It includes a dielectric material 30 that to one side 50 . 70 with a conductive layer 60 borders. The layers typically comprise a metal or metal alloy, but may also include non-metallic conductive materials such as carbon in its modifications. The metals may be, for example, copper, aluminum, silver, gold, an iron alloy, or alloys of any of the foregoing. The housing wall 30 may comprise a polymer and / or a fiber reinforced plastic, for example polyurethane. In embodiments, the housing may be integrally produced in one piece, for example by injection molding, molding or pultrusion. In embodiments, the conductive layer 60 on the inside or outside of the housing wall 30 be applied, and therefore the surface 50 of the dielectric housing the interior of the housing with the electronic circuit (in 1 not shown, see 2 ) or may face an outside of the housing.

2 shows an electronics module 100 according to embodiments. It has - without restriction - two ventilation openings (only the front opening 80 visible), an electronic circuit 20 and a housing 10 with the above with respect to 1 described properties. The thickness of the dielectric material 30 is dimensioned according to the thickness of penetration of the material and the applied field strengths. This is the conductive layer 60 (here on the outside of the case 10 ) in an operating state of the electronic module 100 connected to a defined potential P. As shown, the connection of the conductive layer 60 with the potential P on a front side or a rear side with respect to the insertion direction in the cabinet. If necessary, the connection means for establishing the electrical connection with the potential P as a plug on the back of the electronic module 100 be formed so that the connection can be plugged in when the module in a rack or a cabinet 160 is pushed.

In embodiments where the conductive layer 60 on the inside of the case 10 (Unlike 2 ), the layer 60 directly through a conductor with the electronic circuit 20 be connected in the housing.

Typically, the housing wall 30 formed so that the conductive layers on the inside or outside have a smooth surface and are substantially free of sharp edges, small radii, etc., so that the electric field in the exterior of the module 100 that is caused by the potential P of the field-shaping conductive layer during operation is substantially free of local peaks that might promote partial discharge. The field-shaping conductive layer 60 can z. B. applied in the form of a coating or a film, or on the housing 10 after forming the housing wall 30 for example, applied as a spray. It can also be applied as a shrink film or shrink tubing. Those skilled in the art will appreciate various techniques for depositing a metal coating or layer on a dielectric surface, which will not be described in more detail here.

In embodiments, there are several ways to apply the field-shaping conductive layer, one of which is in 2 is shown, and therefore the layer in principle covers the entire - inner or outer - surface of the housing wall 30 and thus of the housing 10 from. In other cases, only a fraction or fraction of the surface may pass through the field-forming conductive layer 60 be covered. 3 shows a cross-sectional view through a central part (with respect to an axis from front to back) of a geometric that of 2 similar housing. Unlike this case, the conductive layer covers 60 in 3 only edge parts 11 . 12 . 13 . 14 (see also 2 ) from a front of the housing along its length to the rear. The layer 60 is shown with a big thickness, not the thickness of the wall 30 is true to scale and is for illustrative purposes only.

4 shows a front perspective view of a frame-like insulating body for a housing according to another embodiment. In this case, the field-shaping conductive layer 60 for example, after forming the housing wall 30 on the case 10 be applied. If necessary, the electrically conductive layer is a shrink film or even a shrink tube having a comparatively thin wall thickness, so that the layer is easily around edges of the frame-like insulating body 30 can be bent so that no air bubbles or air bubbles.

The edge parts 11 . 12 . 13 . 14 . 15 . 16 . 17 . 18 the frame-like insulating body 30 , in the 4 can be seen, provide the dielectric housing a substantially box-shaped shape, wherein the windows in the frame can contribute to improved cooling compared to known isolation devices. Depending on the embodiment of the housing 10 becomes the conductive layer 60 on the inside or outside of the housing wall 30 applied to the frame structure.

5 schematically shows an electronic system 150 according to one embodiment. A variety of electronic modules 100 with housings 10 as previously described is arranged in an array defining an x and y plane (drawing plane). The modules 100 can in the system 150 in and out of this by moving them in the z-direction (which extends perpendicular to the plane of the drawing).

6 shows another view of the system of 3 , The modules 100 may typically, but not necessarily, be arranged in a m by n matrix (not limiting 4 x 3 here) as shown. In this case, the housing 10 the modules 100 typically include elements on or in their outer surfaces that serve as attachment means for interconnecting the various modules, such as rail elements 125 and / or grooves (not shown). The electronic modules 100 (eg PEBB) can - in any of the individual constructions described above - in the system 150 be plugged in and out of this and may also include hot-plug options, for example, inasmuch as the electrical contacts are provided on the back of the modules so that they are first inserted into the slot during insertion 120 enter. In 6 For example, a module is shown mid-way during the installation or removal of the module. In embodiments, adjacent modules may be connected by a conductor 135 be connected to make sure they are at the same potential.

7 FIG. 12 is a cross-sectional side view of a system similar to that of FIGS 6 and 7 shown. This is the earlier described interchangeability of an electronic circuit 20 in a module 100 shown. That is, the circuit is via the front ventilation opening 80 from the front of the system (left in the drawing) out of the module 100 pulled out while connecting to the rack 160 is disconnected (see arrow). There is also a design with grooves 90 at the end of the case 10 in the direction of the opening 80 shown to increase the resistance to leakage current.

8th FIG. 12 schematically shows a diagram of a computational simulation of the electric field in an exemplary modular electronic system according to conventional dielectric housing technology around the electronic circuits. FIG 20 around. There are two modules shown, with the electronic circuits 20 in the housings are at the same test potential. It can be seen that the field lines of the electric field have a very irregular spatial distribution (even in the space between the housings), indicating field peaks and creating a significant risk of partial discharges.

9 schematically shows a diagram of an electric field simulation in a modular electronic system 150 according to embodiments. This is shown by the two electronic modules 100 one each on the inside of the housing wall 30 located first conductive layer 60 on, wherein the layers cover only the upper part of the housing. The layers 60 are each with the electrical potential of their respective electronic circuit 20 connected in the housings. As can be seen, the field lines of the electric field are in the air gap between the two modules 100 much more homogeneous than in the 8th Case shown without conductive layer on the housing.

When the electrical circuits 20 in neighboring modules 100 At different operating potentials, the respective conductive layers can also be connected to these different potentials.

The present written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems, and performing any incorporated methods. Although various specific embodiments have been disclosed above, it will be apparent to those skilled in the art that the spirit and scope of the claims permits equally effective modifications. In particular, mutually non-exclusive features of the embodiments described above can be combined. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited non-patent literature

• Berth M .: "New Main Circuits, HV Design of Submodules", ABB Report, HIP49 / ATP5-3 [0003]
• Steiner M., Reinold, H .: "Medium Frequency Topology in Railway Applications", European Railway Review (EPE), 2007, Aalborg, Denmark [0003]
• IEC 61800-5-1, Tab. 8 [0023]

Claims (18)

Modular electronic system ( 150 ) for medium or high voltages, comprising: - a cabinet ( 160 ) with a number of slots arranged in an array ( 120 ), - at least one in a slot ( 120 ) of the cabinet provided electronic module ( 100 ), the module comprising: - a housing ( 10 ) having a three-dimensional shape with a housing wall ( 30 ) comprising a dielectric material and one on one side ( 70 ) the housing wall ( 30 ) adjacent field-forming conductive layer ( 60 ), - an electronic device ( 20 ) located in the housing ( 10 ) is located; wherein the field-shaping conductive layer ( 60 ) is electrically connectable to a predefined electrical potential (P) which in an operating state of the modular electronic system ( 150 ) is present. The system of claim 1, wherein the field-shaping conductive layer ( 60 ) on the housing wall ( 30 ) of the at least one electronic module ( 100 ) fulfills at least one of the following conditions: it covers several areas of the housing wall ( 30 ), which are around edge parts ( 11 . 12 . 13 . 14 . 15 . 16 . 17 . 18 ) of the housing ( 10 ) are around; It covers at least one further surface area, which forms an intermediate part between edge parts ( 11 . 12 . 13 . 14 . 15 . 16 . 17 . 18 ) of the housing ( 10 ). The system of claim 2, wherein the field-shaping conductive layer ( 60 ) covers at least 30% of the entire inner side of the housing wall or at least 30% of the entire outer side of the housing wall. System according to one of the preceding claims, wherein the field-forming conductive layer ( 60 ) is a coating that after forming the housing wall ( 30 ) on the housing ( 10 ) is applied. System according to one of the preceding claims, wherein the housing wall ( 30 ) is a single-body housing wall integrally formed by a process from the following list: injection molding, molding and pultrusion. System according to one of claims 1 to 4, wherein the housing wall ( 30 ) comprises: a polymer plastic and / or a fiber reinforcement and / or a polymer resin and / or a ceramic. System according to one of the preceding claims, wherein the housing ( 10 ) at least two ventilation openings ( 60 . 80 ), which are preferably arranged on opposite surfaces, which in a direction perpendicular to the array, preferably an m × n plane, of the cabinet ( 160 ) demonstrate. System according to one of the preceding claims, wherein the overall shape of the housing ( 10 ) is tubular. System according to one of the preceding claims, wherein the field-forming conductive layer ( 60 ) Metal includes. System according to one of the preceding claims, wherein the field-forming conductive layer ( 60 ) comprises a non-metallic electrically conductive material. A system according to claim 10, wherein the field-shaping conductive layer ( 60 ) is a movie. System according to one of the preceding claims, wherein the housing wall ( 30 ) at least one electronic module ( 100 ) a part with grooves ( 90 ). System according to one of the preceding claims, wherein the housing walls ( 30 ) of two adjacent electronic modules are separated by an air gap and wherein the electric field in the gap through the conductive layers ( 60 ) of the adjacent modules can be homogenized. System according to one of the preceding claims, wherein an electrical conductor means ( 135 ) between two neighboring modules ( 100 ) in such a way that the electrical conductor means forms part of the field-forming conductive layer ( 60 ) of a first of these two adjacent modules is electrically connected to a second part of the field-forming conductive layer ( 60 ) connects a second of these two adjacent modules. System according to one of the preceding claims, comprising at least two electronic modules ( 130 ), wherein one of these two electronic modules ( 130 ) in an operating state of the modular system in a transversely, in particular perpendicular to the xy-plane extending direction against the other electronic module ( 130 ) is displaceable. The system of claim 1, wherein the field-shaping conductive layer ( 60 ) electrically connected to an element of the electronic device ( 20 ) is connectable. System according to one of the preceding claims, wherein the housing ( 10 ) on its outer side comprises: a rail element ( 125 ) and / or a groove, whereby a guide structure for helping in the insertion of the housing ( 10 ) in the modular electronic system ( 150 ) and when pulling out the housing ( 10 ) from the modular electronic system ( 150 ) is formed in a drawer-like manner. System according to one of the preceding claims, wherein during the insertion of a module ( 100 ) in the closet ( 160 ) the conductive layer ( 60 ) via a contact element ( 135 ) automatically with the conductive layer of an adjacent module ( 100 ) is connectable.

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