DE202011102973U1 - heatsink - Google Patents
heatsink Download PDFInfo
- Publication number
- DE202011102973U1 DE202011102973U1 DE201120102973 DE202011102973U DE202011102973U1 DE 202011102973 U1 DE202011102973 U1 DE 202011102973U1 DE 201120102973 DE201120102973 DE 201120102973 DE 202011102973 U DE202011102973 U DE 202011102973U DE 202011102973 U1 DE202011102973 U1 DE 202011102973U1
- Authority
- DE
- Germany
- Prior art keywords
- heat
- conducting layer
- cooling fins
- long side
- convection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
nglicher Gestalt, in deren Zentrum die Wärmequelle (20) angeordnet ist, und mit ovalen Konvektionsöffnungen (21), die mit gleichmäßigen Abständen peripher verteilt sind, und mit Kühlrippen (3), die unter der wärmeleitenden Schicht (2) abstehen, die parallel zum langen Seite der wärmeleitenden Schicht 2 verlaufen und von gleicher Länge wie diese sind, dadurch gekennzeichnet, daß jede Konvektionsöffnung (21) parallel zur langen Seite der wärmeleitenden Schicht (2) und den Kühlrippen (3) verläuft.of a similar shape, in the center of which the heat source (20) is arranged, and with oval convection openings (21), which are distributed evenly around the periphery, and with cooling fins (3) that protrude under the heat-conducting layer (2) that are parallel to the long side of the thermally conductive layer 2 and are of the same length as this, characterized in that each convection opening (21) runs parallel to the long side of the thermally conductive layer (2) and the cooling fins (3).
Description
Die vorliegende Neuerung betrifft einen Kühlkörper wie er zur Kühlung von sich im Betrieb erwärmenden elektronischen Bauteilen Verwendung findet.The present innovation relates to a heat sink as used for cooling of warming in operation electronic components.
Bekannt sind Kühlkörper, wie in
Solche Kühlkörper finden breite Anwendung in verschiedenen elektronischen Geräten und ermöglichen eine schnelle Hitzeabfuhr über die Kombination aus wärmeleitender Schicht und Kühlrippen; dennoch wird im Gebrauch nicht die optimale Wirksamkeit erzielt.Such heat sinks are widely used in various electronic devices and allow rapid heat dissipation through the combination of heat conducting layer and cooling fins; however, the optimal effectiveness is not achieved in use.
Die Neuerung zeigt eine verbesserte Struktur für Kühlkörper auf, die deren Wirksamkeit signifikant verbessert.The innovation shows an improved structure for heat sinks, which significantly improves their effectiveness.
Die Erfindung stellt eine verbesserte Struktur für Kühlkörper bereit, mit der eine weitere Steigerung der Kühlwirkung durch verbesserte Wärmeableitung und -abgabe erzielt wird, und zwar durch eine Änderung der Hitzetransferrichtung von wärmeleitender Schicht und Kühlrippen.The invention provides an improved structure for heatsinks that achieves a further increase in cooling efficiency through improved heat dissipation and release by changing the heat transfer direction of the heat conducting layer and cooling fins.
Der Kühlkörper gemäß der vorliegenden Neuerung umfaßt eine wärmeleitende Schicht und Kühlrippen, wobei die langgestreckte wärmeleitende Schicht so eingerichtet ist, daß die Wärmequelle sich im zentralen Bereich befindet und Konvektionsöffnungen in gleichmäßigen Abständen um diese peripher verteilt sind. Jede Konvektionsöffnung ist von ovaler Form und erstreckt sich parallel zur langen Seite der wärmeleitenden Schicht. Die Kühlrippen sind plattenweise arrangiert und unter der wärmeleitenden Schicht angeordnet, wobei ihre Länge der der langen Seite der wärmeleitenden Schicht entspricht; die Kühlrippen verlaufen also parallel zur langen Seite der wärmeleitenden Schicht. Mit dieser Ausbildung, bei der die Öffnungsrichtung aller Konvektionsöffnungen in der wärmeleitenden Schicht die gleiche ist wie die der unten abstehenden Kühlrippen ergibt sich eine bessere Hitzetransferwirksamkeit und die Hitzeabgabe kann erhöht werden, da der Wärmestrom nicht von den Konvektionsöffnungen blockiert wird, wenn dieser zur Seite und nach unten fließt.The heat sink according to the present invention comprises a heat-conducting layer and cooling fins, wherein the elongated heat-conducting layer is arranged so that the heat source is in the central region and convection openings are distributed at equal intervals around these peripherally. Each convection opening is oval in shape and extends parallel to the long side of the heat-conducting layer. The cooling fins are arranged plate-by-plate and arranged under the heat-conducting layer, their length corresponding to that of the long side of the heat-conducting layer; the cooling fins thus extend parallel to the long side of the heat-conducting layer. With this configuration, in which the opening direction of all the convection openings in the heat-conducting layer is the same as that of the cooling fins projecting below, there is a better heat transfer efficiency and the heat emission can be increased because the heat flow is not blocked by the convection openings when it is to the side and flows down.
Die Neuerung wird nachfolgendd durch die Beschreibung eines Ausführungsbeispiels anhand der beigegebenen Zeichnungen weiter erläutert. Es zeigtThe innovation will be explained in more detail by the description of an embodiment with reference to the accompanying drawings. It shows
Der neuerungsgemäße Kühlkörper
Das beschriebene Bauteil stellt einen verbesserten Kühlkörper dar und, unter Bezugnahme auf
Zusammenfassend kann die vorliegende verbesserte Struktur des Kühlkörpers tatsächlich die Hitzeableitung und die Hitzeabgabe mit großen industriellen Vorteilen und Anwendbarkeit wirksamer gestalten und keine gleichwertigen oder ähnlichen Ausbildungen sind gegenwärtig auf dem Markt.In summary, the present improved structure of the heat sink can actually make heat dissipation and heat output more efficient with great industrial advantages and applicability, and no equivalent or similar embodiments are currently on the market.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201120102973 DE202011102973U1 (en) | 2011-07-07 | 2011-07-07 | heatsink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201120102973 DE202011102973U1 (en) | 2011-07-07 | 2011-07-07 | heatsink |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202011102973U1 true DE202011102973U1 (en) | 2011-10-17 |
Family
ID=44974318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE201120102973 Expired - Lifetime DE202011102973U1 (en) | 2011-07-07 | 2011-07-07 | heatsink |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202011102973U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160323938A1 (en) * | 2015-04-28 | 2016-11-03 | Whirlpool Corporation | Cooling system for an induction hob |
-
2011
- 2011-07-07 DE DE201120102973 patent/DE202011102973U1/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160323938A1 (en) * | 2015-04-28 | 2016-11-03 | Whirlpool Corporation | Cooling system for an induction hob |
US10805990B2 (en) * | 2015-04-28 | 2020-10-13 | Whirlpool Corporation | Cooling system for an induction hob |
US11483904B2 (en) | 2015-04-28 | 2022-10-25 | Whirlpool Corporation | Cooling system for an induction hob |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R082 | Change of representative |
Representative=s name: MEHLER ACHLER PATENTANWAELTE, DE Representative=s name: MEHLER ACHLER PATENTANWAELTE, 65185 WIESBADEN, DE |
|
R207 | Utility model specification |
Effective date: 20111208 |
|
R156 | Lapse of ip right after 3 years | ||
R156 | Lapse of ip right after 3 years |
Effective date: 20150203 |