DE202005018890U1 - Wärmeableiteinheit - Google Patents

Wärmeableiteinheit Download PDF

Info

Publication number
DE202005018890U1
DE202005018890U1 DE200520018890 DE202005018890U DE202005018890U1 DE 202005018890 U1 DE202005018890 U1 DE 202005018890U1 DE 200520018890 DE200520018890 DE 200520018890 DE 202005018890 U DE202005018890 U DE 202005018890U DE 202005018890 U1 DE202005018890 U1 DE 202005018890U1
Authority
DE
Germany
Prior art keywords
fluid inlet
outlet
heat discharge
coolant
connected together
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE200520018890
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Man Zai Industrial Co Ltd
Original Assignee
Man Zai Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Man Zai Industrial Co Ltd filed Critical Man Zai Industrial Co Ltd
Priority to DE200520018890 priority Critical patent/DE202005018890U1/de
Publication of DE202005018890U1 publication Critical patent/DE202005018890U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE200520018890 2005-12-02 2005-12-02 Wärmeableiteinheit Expired - Lifetime DE202005018890U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE200520018890 DE202005018890U1 (de) 2005-12-02 2005-12-02 Wärmeableiteinheit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200520018890 DE202005018890U1 (de) 2005-12-02 2005-12-02 Wärmeableiteinheit

Publications (1)

Publication Number Publication Date
DE202005018890U1 true DE202005018890U1 (de) 2007-04-12

Family

ID=37982984

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200520018890 Expired - Lifetime DE202005018890U1 (de) 2005-12-02 2005-12-02 Wärmeableiteinheit

Country Status (1)

Country Link
DE (1) DE202005018890U1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019212372A1 (de) * 2019-08-19 2021-02-25 Zf Friedrichshafen Ag Kühlung eines elektrischen Steuergeräts
WO2022025250A1 (ja) * 2020-07-31 2022-02-03 日本電産株式会社 冷却部材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019212372A1 (de) * 2019-08-19 2021-02-25 Zf Friedrichshafen Ag Kühlung eines elektrischen Steuergeräts
WO2022025250A1 (ja) * 2020-07-31 2022-02-03 日本電産株式会社 冷却部材

Similar Documents

Publication Publication Date Title
US8066057B2 (en) Flow distributing unit and cooling unit
US7694723B2 (en) Water block
RU2527505C2 (ru) Система управления температурой жидкости
US20060137863A1 (en) Liquid cooling device
WO2006111941A3 (en) High efficiency fluid heat exchanger and method of manufacture
US20070119574A1 (en) Flow distributing unit and cooling unit having bypass flow
RU2009141723A (ru) Термоэлектрическое устройство для поддержания температурного режима
EP1770775A3 (de) Kühler
KR20140098017A (ko) 정수기용 열전소자를 이용한 직냉 타입 모듈
CA2627182A1 (en) A heat dissipating device for a battery pack, and a battery pack using the same
TW200601954A (en) Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit
TW200847901A (en) Water-cooling heat-dissipation system
US20050183848A1 (en) Coolant tray of liquid based cooling device
US20090040723A1 (en) Heat-dissipating device with high heat-dissipating efficiency
ATE553349T1 (de) Wärmetauscher
DE202005018890U1 (de) Wärmeableiteinheit
TWI262992B (en) Housing structure for an axial-blowing heat-dissipating fan
US8230903B2 (en) Low profile heat sink for semiconductor devices
KR20130014113A (ko) 전력공급장치의 냉각구조 및 이를 구비한 정수기
TW200506300A (en) Cooling device
ATE426905T1 (de) Hochleistungswiderstand mit kuhlmedium
US20070044948A1 (en) Water-cooled cooler for CPU of PC
CA2383310A1 (en) Device and method for absorbing and radiating heat in very small space by alternately pushing two fluids
US20050092468A1 (en) Water tray of liquid based cooling device
RU166461U1 (ru) Радиоэлектронный блок

Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20070516

R150 Term of protection extended to 6 years

Effective date: 20081127

R151 Term of protection extended to 8 years
R151 Term of protection extended to 8 years

Effective date: 20110727

R158 Lapse of ip right after 8 years
R158 Lapse of ip right after 8 years

Effective date: 20140701