DE20101242U1 - Device to improve heat dissipation and protect against damage to AMD Socket A processors - Google Patents

Device to improve heat dissipation and protect against damage to AMD Socket A processors

Info

Publication number
DE20101242U1
DE20101242U1 DE20101242U DE20101242U DE20101242U1 DE 20101242 U1 DE20101242 U1 DE 20101242U1 DE 20101242 U DE20101242 U DE 20101242U DE 20101242 U DE20101242 U DE 20101242U DE 20101242 U1 DE20101242 U1 DE 20101242U1
Authority
DE
Germany
Prior art keywords
amd
cpu
socket
heat dissipation
processors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20101242U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INNOVATEK OS GmbH
Original Assignee
INNOVATEK OS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INNOVATEK OS GmbH filed Critical INNOVATEK OS GmbH
Priority to DE20101242U priority Critical patent/DE20101242U1/en
Publication of DE20101242U1 publication Critical patent/DE20101242U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

Gebrauchsmusteranmeldung:Utility model application:

Vorrichtung zur Verbesserung der Wärmeableitung und Schutz vor Beschädigungen von AMD Sockel A Prozessoren und anderen Prozessortypen.Device to improve heat dissipation and protect against damage to AMD Socket A processors and other processor types.

Beschreibung:Description:

Die Vorrichtung zur Verbesserung der Wärmeableitung und Schutz vor Beschädigungen von AMD Sockel A Prozessoren und anderen Prozessortypen bei der Montage von Kühlsystemen oder „Kupferspacer" besteht aus einer Kupferplatte oder einer Platte aus einem anderen geeigneten Material, die mit enstprechenden Aussparrungen versehen ist um auf der CPU plaziert werden zu können ! (siehe Zeichnung/Bild)The device for improving heat dissipation and protecting against damage to AMD Socket A processors and other processor types when installing cooling systems or "copper spacers" consists of a copper plate or a plate made of another suitable material, which is provided with corresponding recesses so that it can be placed on the CPU! (see drawing/image)

Der im Schutzanspruch angegebenen Erfindung liegt das Problem zugrunde, dass durch die Montage der zur Prozessorkühlung notwendigen Kühlsysteme der „Core" bzw. der „Die" also der Prozessorkern beschädigt werden kann ! Dieser ist, bedingt durch die kleinen Ausmasse gefährdet! Der „Kupferspacer" vergrössert diese Auflagefläche und verhindert somit eine Beschädigung des Prozessorkerns bei unsachgemässer Montage des Kühlsystems. Durch die dadurch vergrösserte Auflagefläche wird ausserdem die Wärmeableitung von der CPU zum Kühlsystem verbessert. Dies resultiert durch die grössere Fläche mit der die CPU mit dem Kühlsystem in Verbindung steht.The invention specified in the protection claim is based on the problem that the "core" or "die", i.e. the processor core, can be damaged by installing the cooling systems required for processor cooling! This is at risk due to its small dimensions! The "copper spacer" enlarges this contact surface and thus prevents damage to the processor core if the cooling system is installed incorrectly. The increased contact surface also improves heat dissipation from the CPU to the cooling system. This results from the larger surface area with which the CPU is connected to the cooling system.

Der Kupferspacer wird vor der Montage des Kühlsystems auf die CPU gelegt und dannach das Kühlsystem montiert!The copper spacer is placed on the CPU before installing the cooling system and then the cooling system is installed!

Zur Erfüllung des Zwecks sind alle im Schutzanspruch genannten Eigenschaften notwendig !To fulfil the purpose, all properties mentioned in the protection claim are necessary!

Die Skizze zeigt einen Kupferspacer für einen AMD Sockel A Prozessor mit den entsprechenden Aussparungenm, welche jedoch varrieren können !The sketch shows a copper spacer for an AMD Socket A processor with the corresponding recesses, which can vary!

Claims (1)

Vorrichtung zur Verbesserung der Wärmeableitung und zum Schutz vor Beschädigungen von AMD Sockel A Prozessoren und von anderen Prozessortypen, die in der Computerindustrie Verwendung finden, bei der Montage von Kühlsystemen.
Diese aus Kupfer oder einem anderen geeigneten Material bestehende Vorrichtung ist mechanisch so ausgeführt, dass eine optimale Passgenauigkeit auf der CPU gewährleistet ist. Diese ist sowohl in Dicke und Ausmassen der CPU angepasst! - Die Dicke ist mindestens 0,5 mm und maximal 0,9 mm (variiert nach CPU Typ) - Die Ausmasse betragen rechteckig mindestens (l × b) 30 × 30 mm und maximal (l × b) 60 × 60 mm - Die Vorrichtung enthält mehrere Aussparungen die den Sitz auf der CPU gewährleisten - Die Anordnung und Grösse der Aussparungen kann variieren - Weiterhin ist die Vorrichtung plan ausgeführt und besitzt keine Erhebungen - Als Material kann Kupfer eine Legierung oder ein anderes geeignetes Material verwendet werden. Device for improving heat dissipation and protecting against damage to AMD Socket A processors and other processor types used in the computer industry when assembling cooling systems.
This device, made of copper or another suitable material, is mechanically designed to ensure an optimal fit on the CPU. It is adapted to the CPU in terms of both thickness and dimensions! - The thickness is at least 0.5 mm and maximum 0.9 mm (varies according to CPU type) - The rectangular dimensions are at least (l × w) 30 × 30 mm and maximum (l × w) 60 × 60 mm - The device contains several recesses that ensure the fit on the CPU - The arrangement and size of the recesses may vary - Furthermore, the device is flat and has no elevations - The material used can be copper, an alloy or another suitable material.
DE20101242U 2001-01-23 2001-01-23 Device to improve heat dissipation and protect against damage to AMD Socket A processors Expired - Lifetime DE20101242U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20101242U DE20101242U1 (en) 2001-01-23 2001-01-23 Device to improve heat dissipation and protect against damage to AMD Socket A processors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20101242U DE20101242U1 (en) 2001-01-23 2001-01-23 Device to improve heat dissipation and protect against damage to AMD Socket A processors

Publications (1)

Publication Number Publication Date
DE20101242U1 true DE20101242U1 (en) 2001-07-19

Family

ID=7952013

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20101242U Expired - Lifetime DE20101242U1 (en) 2001-01-23 2001-01-23 Device to improve heat dissipation and protect against damage to AMD Socket A processors

Country Status (1)

Country Link
DE (1) DE20101242U1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289337A (en) 1992-02-21 1994-02-22 Intel Corporation Heatspreader for cavity down multi-chip module with flip chip
GB2284937A (en) 1993-12-20 1995-06-21 Thermalloy Inc Heat sink attachment assembly
WO1996028005A1 (en) 1995-03-06 1996-09-12 Ast Research, Inc. A movable heat pipe apparatus for reducing heat build up in electronic devices
DE29820316U1 (en) 1998-11-12 1999-02-25 Liang, Robert, Taoyuan Installation structure of the heat radiator of an integrated circuit chip arrangement
DE19802854C1 (en) 1998-01-07 1999-09-16 Mei Hua Hsu Computer chip heat sink
GB2350480A (en) 1999-05-25 2000-11-29 First Int Computer Inc A mount with heatsink for a central processing unit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289337A (en) 1992-02-21 1994-02-22 Intel Corporation Heatspreader for cavity down multi-chip module with flip chip
GB2284937A (en) 1993-12-20 1995-06-21 Thermalloy Inc Heat sink attachment assembly
WO1996028005A1 (en) 1995-03-06 1996-09-12 Ast Research, Inc. A movable heat pipe apparatus for reducing heat build up in electronic devices
DE19802854C1 (en) 1998-01-07 1999-09-16 Mei Hua Hsu Computer chip heat sink
DE29820316U1 (en) 1998-11-12 1999-02-25 Liang, Robert, Taoyuan Installation structure of the heat radiator of an integrated circuit chip arrangement
GB2350480A (en) 1999-05-25 2000-11-29 First Int Computer Inc A mount with heatsink for a central processing unit

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
09082860 A
2001160608 A
JP Patent Abstracts of Japan: 06140540 A

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Legal Events

Date Code Title Description
R086 Non-binding declaration of licensing interest
R409 Internal rectification of the legal status completed
R207 Utility model specification

Effective date: 20010823

R021 Search request validly filed

Effective date: 20010628

R163 Identified publications notified

Effective date: 20020301

R156 Lapse of ip right after 3 years

Effective date: 20040803

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20041201

R157 Lapse of ip right after 6 years

Effective date: 20070801