DE20019557U1 - Device for gluing together first and second plate elements in the production of a DVD - Google Patents
Device for gluing together first and second plate elements in the production of a DVDInfo
- Publication number
- DE20019557U1 DE20019557U1 DE20019557U DE20019557U DE20019557U1 DE 20019557 U1 DE20019557 U1 DE 20019557U1 DE 20019557 U DE20019557 U DE 20019557U DE 20019557 U DE20019557 U DE 20019557U DE 20019557 U1 DE20019557 U1 DE 20019557U1
- Authority
- DE
- Germany
- Prior art keywords
- adhesive
- plate element
- pin
- ring
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004026 adhesive bonding Methods 0.000 title description 2
- 238000004519 manufacturing process Methods 0.000 title description 2
- 239000000853 adhesive Substances 0.000 claims description 93
- 230000001070 adhesive effect Effects 0.000 claims description 93
- 239000000463 material Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 239000013013 elastic material Substances 0.000 claims description 2
- 238000003892 spreading Methods 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 3
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 60
- 238000000034 method Methods 0.000 description 10
- 238000003825 pressing Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1464—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators
- B29C65/1467—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
- B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of light guides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
- B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
- B29C65/7808—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
- B29C65/7811—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots for centring purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
- B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8141—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
- B29C66/81431—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined comprising a single cavity, e.g. a groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1406—Ultraviolet [UV] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Optical Record Carriers (AREA)
Description
• · I· I
M2 ENGINEERING ABM2 ENGINEERING AB
Unser Az:G 1795 DE 8. November 2000Our Az:G 1795 DE November 8, 2000
Vorrichtung zum Zusammenkleben erster und zweiter Plattenelemente bei der Herstellung einer DVD Device for gluing first and second plate elements together in the manufacture of a DVD
Die vorliegende Erfindung betrifft eine Vorrichtung zum Zusammenkleben erster und zweiter Plattenelemente, um eine zusammengesetzte Platte zu bilden gemäß dem Oberbegriff von Anspruch 1.The present invention relates to an apparatus for bonding together first and second plate elements to form a composite plate according to the preamble of claim 1.
Es gibt zur Zeit vier verschiedene Typen von DVDs, welche als DVD5, DVD9, DVD10 und DVD18 bezeichnet werden. Alle vier Formate bestehen aus zwei 0,6 mm Plattenelementen, sogenannten Substraten, welche mit einem sogenannten Bindemittel miteinander verbunden werden, welches meistens ein transparenter UV-ausgehärteter Klebstoff ist. Das Bindematerial, welches bei den Formaten DVD9 und DVD18 verwendet wird, muß transparent sein.There are currently four different types of DVDs, called DVD5, DVD9, DVD10 and DVD18. All four formats consist of two 0.6 mm plate elements, called substrates, which are bonded together with a so-called binder, which is usually a transparent UV-cured adhesive. The binding material used in the DVD9 and DVD18 formats must be transparent.
Das gebräuchlichste Verfahren zum Verbinden der Substrate miteinander ist, das Bodensubstrat auf einen drehbaren Tisch zu legen und auf das Substrat Klebstoff aufzutragen. Eine lineare Strömungskolbenpume liefert eine vorbestimmte Klebstoffmenge, ungefähr 0,5 ml, durch eine Kanüle, deren Spitze auf einen Radius von ungefähr 30 mm vom Mittelpunkt des Substrats plaziert wird. Das Substrat wird um eine oder mehrere Umdrehungen gedreht, während gleichzeitig dem Substrat Klebstoff zugeführt wird. So wird auf demThe most common method for bonding the substrates together is to place the bottom substrate on a rotating table and apply adhesive to the substrate. A linear flow piston pump delivers a predetermined amount of adhesive, approximately 0.5 ml, through a cannula, the tip of which is placed at a radius of approximately 30 mm from the center of the substrate. The substrate is rotated one or more revolutions while simultaneously applying adhesive to the substrate. Thus, on the
Bodensubstrat ein Klebstoffring geschaffen, welcher einen äußeren Durchmesser von ungefähr 60 mm aufweist.An adhesive ring is created on the soil substrate, which has an outer diameter of approximately 60 mm.
Das obere Substrat wird dann langsam nach unten auf den Klebstoffring gedrückt und bewirkt, daß der Klebstoffsich zwischen den Substraten ausbreitet, teilweise als Folge des ausgeübten Druckes und teilweise durch Kapillarwirkung.The upper substrate is then slowly pressed down onto the adhesive ring, causing the adhesive to spread between the substrates, partly as a result of the pressure applied and partly by capillary action.
Die bekannte Technik, welche in der Praxis verwendet wird, beinhaltet so Mittel zum Auftragen einer vorbestimmten Menge von Klebstoff auf ein erstes Plattenelement in Form eines konzentrischen Ringes, und Mittel zum Verschieben eines zweiten Plattenelements, welches planparallel mit dem ersten Plattenelement angeordnet ist, parallel zu dem Element, so daß der Klebstoff sich ausbreitet, teilweise als Folge des angelegten Druckes durch das Verschiebemittel und teilweise als Folge von Kapillarwirkung. Der Klebstoff wird vorzugsweise aufgetragen während das erste Plattenelement rotiert, und das erste Plattenelement ist vorzugsweise horizontal ausgerichtet. Die Plattenelemente/Substrate enthalten Kunststoffplatten, welche eine Informations-tragende Schicht haben, zum Beispiel eine Aluminiumschicht.The known technique used in practice thus includes means for applying a predetermined amount of adhesive to a first plate element in the form of a concentric ring, and means for displacing a second plate element, which is arranged plane-parallel with the first plate element, parallel to the element so that the adhesive spreads out, partly as a result of the pressure applied by the displacing means and partly as a result of capillary action. The adhesive is preferably applied while the first plate element is rotating, and the first plate element is preferably oriented horizontally. The plate elements/substrates comprise plastic plates having an information-carrying layer, for example an aluminium layer.
Die zuvorbeschriebene Klebevorrichtung und das Verfahren sind jedoch mit ernsten Nachteilen behaftet aufgrund der Bildung von Luftblasen im Klebstoff, wenn das obereSubstrat in Kontakt gedrückt wird mit dem Klebstoff auf dem Bodensubstrat. Diese Bildung von Luftblasen wird durch eine Kombination der Oberflächenspannung des Klebstoffes, der Kapillarwirkung und der statischen elektrischen Ladung auf den Substraten verursacht und verursacht dabei ein unkontrolliertes Springen des Klebstoffes auf das obere Substrat, wenn die Substrate miteinander in Kontakt kommen, was zu einer Schaumbildung führt. Wenn die Substrate stark geladen sind, neigen die Klebstoffteilchen dazu, aufHowever, the bonding apparatus and method described above suffer from serious drawbacks due to the formation of air bubbles in the adhesive when the upper substrate is pressed into contact with the adhesive on the bottom substrate. This formation of air bubbles is caused by a combination of the surface tension of the adhesive, capillary action and the static electrical charge on the substrates, thereby causing uncontrolled jumping of the adhesive onto the upper substrate when the substrates come into contact with each other, resulting in foaming. When the substrates are highly charged, the adhesive particles tend to
das obere Substrat zu springen, bevor ein Kontakt mit dem Klebstoff zustande kommt.the upper substrate before contact with the adhesive is made.
Obwohl diese Blasen nicht die gleiche Bedeutung in bezug auf die Formate DVD5 und DVD10 haben, können sie in bestimmten Fällen eine Oxidation der Aluminiumschicht auf der Platte verursachen, was zu Betriebstörungen führt.Although these bubbles do not have the same significance with regard to the DVD5 and DVD10 formats, in certain cases they can cause oxidation of the aluminum layer on the disk, leading to operational problems.
Andererseits ist es erforderlich, daß im Klebstoff keine Luftblasen gebildet werden, wenn die Formate DVD9 und DVD18 hergestellt werden, da im Falle dieser Formate der Laser durch die Klebstoffbeschichtung liest; selbst Mikroblasen erzeugen eine Lesestörung.On the other hand, it is necessary that no air bubbles are formed in the adhesive when producing the DVD9 and DVD18 formats, since in the case of these formats the laser reads through the adhesive coating; even microbubbles cause reading interference.
Das Ziel der vorliegenden Erfindung ist, sich zu bemühen, die zuvorgenannten Nachteile zu beseitigen und eine Klebevorrichtung zu schaffen, welche einen einheitlichen Klebstoffilm liefert und einen Klebstoffilm, welcher sich bis zum Mittelloch des Substrates erstreckt und welchem Luftblasen völlig fehlen.The object of the present invention is to endeavor to eliminate the aforementioned disadvantages and to provide an adhesive device which provides a uniform adhesive film and an adhesive film which extends to the center hole of the substrate and which is completely free of air bubbles.
Dieses Ziel wird gemäß der Erfindung durch die in Anspruch 1 angegebenen Merkmale erreicht.This object is achieved according to the invention by the features specified in claim 1.
Weitere Ausführungsformen der Erfindung sind in den beiliegenden abhängigen Ansprüchen angegeben.Further embodiments of the invention are set out in the appended dependent claims.
Ein wichtiges Merkmal der Erfindung liegt darin, daß die Vorrichtung einen Stift enthält, welcher im Mittelloch des ersten Plattenelements angebracht werden kann und welcher so ausgebildet ist, daß er einen Dichtungskontakt mit dem Rand des Loches herstellt. Das Klebstoffauftragsmittel wird so angeordnet, daß es den Klebstoffring nahe und in geeignetem Kontakt mit dem Stift aufträgt, umAn important feature of the invention is that the device includes a pin which can be mounted in the central hole of the first plate element and which is designed to make sealing contact with the edge of the hole. The adhesive application means is arranged to apply the adhesive ring close to and in suitable contact with the pin in order to
es so zu ermöglichen, daß die größte Dicke des Klebstoffringes in nächster Nähe zur Oberfläche des Stiftes eingerichtet wird.to enable the greatest thickness of the adhesive ring to be established in close proximity to the surface of the pin.
Der Klebstoff und/oder der Stift wird/werden in geeigneter Weise ausgewählt, so daß der Klebstoff längs des vertikal ausgerichteten Stiftes durch das Medium der Oberflächenspannung hochgezogen wird und so, daß der Klebstoffring eine Querschnittsform erhält, welche im allgemeinen einem rechtwinkligen Dreieck ähnlich ist. Der Klebstoffring, welcher auf das erste Plattenelement aufgetragen wird, wird geeigneterweise durch eine vorbestimmte Klebstoffmenge gebildet, welche gleichmäßig um den Plattenumfang verteilt wird. Nachdem der Klebstoff ausgebreitet wurde, kann er in geeigneter Weise im Bereich, welcher nächsten zum Mittelloch der Platte ist, ausgehärtet werden.The adhesive and/or the pin is/are suitably selected so that the adhesive is drawn up along the vertically oriented pin by the medium of surface tension and so that the adhesive ring acquires a cross-sectional shape generally resembling a right-angled triangle. The adhesive ring which is applied to the first plate member is suitably formed by a predetermined amount of adhesive which is evenly distributed around the plate periphery. After the adhesive has been spread, it can be suitably cured in the region nearest to the central hole of the plate.
Die Erfindung wird im folgenden detaillierter mit Bezug auf die beiliegende Zeichnung beschrieben.The invention is described in more detail below with reference to the accompanying drawings.
Fig. 1Fig.1
zeigt ein Bodensubstrat und Klebstoff-Zufuhrvorrichtungen.shows a soil substrate and adhesive delivery devices.
Fig. 2 zeigt das Bodensubstrat mit darauf aufgetragenem Klebstoff undFig. 2 shows the floor substrate with adhesive applied to it and
auch ein oberes Substrat genau in dem Moment, wenn der Verbindungsprozess beginnt, undalso an upper substrate at the exact moment when the bonding process begins, and
Fig. 3Fig.3
zeigt die Situation am Ende des Prozesses.shows the situation at the end of the process.
Fig. 4Fig.4
stellt eine UV-Bestrahlungsvorrichtung dar.represents a UV irradiation device.
Die Erfindung wird mit Bezug auf das Verbinden und Aushärten von zwei 0,6 mm DVD-Substraten beschrieben.The invention is described with reference to the bonding and curing of two 0.6 mm DVD substrates.
Bei der Ausführungsform gemäß Fig. 1 wird ein flexibler Mittelstift 14, welcher eine vertikale Ausdehnung von ungefähr 15 mm aufweist, im Mittelloch eines drehbaren Tisches 11 angeordnet. Das Bodensubstrat 1 wird auf den Mittelstift in Anlage mit dem Tisch 11 heruntergedrückt; der Stift 14 dichtet dabei gegen den Rand des Substrat-Mittelloches ab. Der Stift 14 ist als aus einem steifen Kern und einer elastomerischen Mantelschicht bestehend dargestellt, deren Oberfläche gegen den Rand des Mittelloches des Scheibensubstrates abdichtet. Eine vorbestimmte Menge des Klebstoffes wird durch eine Kanüle 13, welche mit einer Kolbenpumpe 12 verbunden ist und auf den flexiblen Mittelstift 14 hin öffnet, zugeführt; der Tisch 11, welcher das Bodensubstrat 1 trägt, wird gleichzeitig mit einer Geschwindigkeit von ungefähr 100 U/min und im Gleichlauf mit dem Fluss von der Kolbenpumpe 12 gedreht. Die Kolbenpumpe ist geeigneterweise von solch einem Typ, welcher einen linearen Fluss liefert, was bedeutet, daß der Klebstoff durch die Klebstoff auftragende Kanüle vom Anfang bis zum Ende mit der gleichen Strömungsgeschwindigkeit fließt, d.h. bis zu der Zeit, wenn die ganze vorbestimmte Menge des Klebstoffes auf das Substrat abgegeben wurde. Der Pumpenmotor wird geeigneterweise vor Abgabe des Klebstoffes auf eine geeignete Geschwindigkeit eingestellt, und die Motorgeschwindigkeit wird dann konstant gehalten. Die Rotationsgeschwindigkeit des Tisches wird richtig eingestellt, so daß der Klebstoffluss startet und bei einer oder mehreren kompletten Umdrehungen stoppt. Der Klebstoff kann, wenn sich der Tisch dreht, durch eine volle Umdrehung aufgetragen werden, oder durch zwei voll Umdrehungen usw. Dies führt zu einem gleichmäßigen Auftrag des Klebstoffes um die Scheibe. Der Klebstoff bildet so einen gleichmäßigen Ring, welcher den Mittelstift im Zentrum des Substrates umgibt und einen äußeren Durchmesser von zum Beispiel ungefähr 25 mm hat.In the embodiment of Fig. 1, a flexible center pin 14 having a vertical dimension of approximately 15 mm is placed in the center hole of a rotating table 11. The bottom substrate 1 is pressed down onto the center pin in engagement with the table 11; the pin 14 thereby seals against the edge of the substrate center hole. The pin 14 is shown as consisting of a rigid core and an elastomeric covering layer, the surface of which seals against the edge of the center hole of the disk substrate. A predetermined amount of adhesive is supplied through a cannula 13 which is connected to a piston pump 12 and opens onto the flexible center pin 14; the table 11, which supports the bottom substrate 1, is simultaneously rotated at a speed of approximately 100 rpm and in synchronism with the flow from the piston pump 12. The piston pump is suitably of a type which provides a linear flow, which means that the adhesive flows through the adhesive-applying cannula at the same flow rate from start to finish, i.e. until the time when all the predetermined amount of adhesive has been dispensed onto the substrate. The pump motor is suitably set at a suitable speed before dispensing the adhesive, and the motor speed is then kept constant. The speed of rotation of the table is properly set so that the flow of adhesive starts and stops at one or more complete revolutions. The adhesive may be applied through one full revolution as the table rotates, or through two full revolutions, etc. This results in a uniform application of the adhesive around the disc. The adhesive thus forms a uniform ring which surrounds the central pin in the centre of the substrate and has an external diameter of, for example, about 25 mm.
Vor dem Auftragen des Klebstoffes kann ein Stahlring 30 (in Fig. 1 schraffiert) vorübergehend auf dem Bodensubstrat 1 koaxial mit dem flexiblen Mittelstift plaziert werden, wobei sich der Ring 30 zusammen mit dem Tisch und dem Bodensubstrat dreht, während eine vorbestimmte Klebstoffmenge zum flexiblen Mittelstift 14 zugeführt wird. Der Stahlring bewirkt, daß der Klebstoff zu einem perfekten kreisförmigen Ring ausgebildet wird, welcher einen äußeren Durchmesser von ungefähr 25 mm um den Stift 14 hat, wonach der Ring vom Substrat abgehoben wird. Aufgrund der Oberflächenspannung des Klebstoffes wird der Klebstoff teilweise längs des Stiftes 14 in einer keilförmigen Ausbildung teilweise nach oben gezogen, so daß die größte Dicke des Klebstoffringes senkrecht zur Oberfläche des Substrates nahe des Stiftes liegt.Prior to application of the adhesive, a steel ring 30 (hatched in Fig. 1) may be temporarily placed on the floor substrate 1 coaxially with the flexible center pin, the ring 30 rotating together with the table and the floor substrate while a predetermined amount of adhesive is supplied to the flexible center pin 14. The steel ring causes the adhesive to be formed into a perfect circular ring having an outer diameter of approximately 25 mm around the pin 14, after which the ring is lifted off the substrate. Due to the surface tension of the adhesive, the adhesive is partially drawn upwards along the pin 14 in a wedge-shaped configuration so that the greatest thickness of the adhesive ring is perpendicular to the surface of the substrate near the pin.
Nachdem auf dem Bodensubstrat 1 ein Klebstoffring 10 gebildet wurde, werden das obere Substrat 2 und ein kreisförmiger Pressfuß 21 koaxial dazu auf dem Bodensubstrat 1 plaziert, wie in Fig. 2 dargestellt. Der Pressfuß 21 wird vertikal nach unten zum oberen Substrat 2 hin bewegt, anfänglich mit einer relativ hohen Geschwindigkeit, bis das obere Substrat mit dem darunterliegenden Klebstoffring 10 in Kontakt kommt, und danach mit einer relativ geringen Geschwindigkeit, wenn sich der Klebstoff zwischen den zwei Substraten als Folge des ausgeübten Druckes und der Kapillarwirkung ausbreitet.After an adhesive ring 10 has been formed on the bottom substrate 1, the upper substrate 2 and a circular presser foot 21 are placed coaxially therewith on the bottom substrate 1, as shown in Fig. 2. The presser foot 21 is moved vertically downwards towards the upper substrate 2, initially at a relatively high speed until the upper substrate comes into contact with the underlying adhesive ring 10, and thereafter at a relatively low speed as the adhesive spreads between the two substrates as a result of the applied pressure and capillary action.
Daher wird beim Verbinden der Substrate miteinander das obere Substrat 2 langsam über den flexiblen Mittelstift 14 mit Hilfe des Pressfußes 21 hinuntergepresst, wobei das Substrat zuerst den Klebstoffring nahe des Mittelstifes trifft und dann nacheinander den Rest des Klebstoffes kontaktiert. Die Substrate werden zentrifugiert, um das Ausbreiten des Klebstoffes bis zur Peripherie der verbundenen Platte zu beschleunigen, und auch um die Dicke des Klebstoffilmes zu beeinflussen.Therefore, when bonding the substrates together, the upper substrate 2 is slowly pressed down over the flexible center pin 14 by means of the press foot 21, whereby the substrate first hits the ring of adhesive near the center pin and then successively contacts the rest of the adhesive. The substrates are centrifuged to accelerate the spreading of the adhesive to the periphery of the bonded plate and also to influence the thickness of the adhesive film.
Die Kapillarwirkung, welche zwischen dem Klebstoff und dem oberen Substrat auftritt, wenn sie in Kontakt kommen, nimmt ab wegen der Keilbildung des Klebstoffes um den Stift 14. Dies ermöglicht, daß die Wirkung der Kapillarwirkung des Klebstoffes durch Variieren der Geschwindigkeit, mit welcher das obere Substrat in Kontakt mit dem Bodensubstrat gepresst wird, gesteuert wird. Da der Substrat- und Klebstoff-kontaktierende Prozess gesteuert werden kann, existiert das mit der Bildung von Luftblasen verbundene Problem nicht länger.The capillary action which occurs between the adhesive and the upper substrate when they come into contact decreases due to the wedging of the adhesive around the pin 14. This allows the effect of the capillary action of the adhesive to be controlled by varying the rate at which the upper substrate is pressed into contact with the bottom substrate. Since the substrate and adhesive contacting process can be controlled, the problem associated with the formation of air bubbles no longer exists.
Wenn das obere Substrat mit dem Klebstoff und dem Bodensubstrat in Kontakt gekommen ist, bildet der Klebstoff einen expandierenden Ring zwischen den Substraten. Dies bedeutet, daß der Klebstoff gleichmäßig zwischen den Substraten verteilt wird, wenn sie zusammengepresst werden.When the top substrate has come into contact with the adhesive and the bottom substrate, the adhesive forms an expanding ring between the substrates. This means that the adhesive is evenly distributed between the substrates when they are pressed together.
Der Klebstoff wirkt so als ein Elektrizitätsleiter, so daß, wenn die zusammengesetzte Platte mit statischer Elektrizität geladen werden sollte, der geladene Zustand der Platte durch den Klebstoff neutralisiert wird. Der Klebstoff ist in der Lage, eine elektrische Ladung über den Stift zur Erde abzuleiten.The adhesive acts as a conductor of electricity so that if the assembled board should become charged with static electricity, the charged state of the board will be neutralized by the adhesive. The adhesive is able to conduct an electrical charge through the pin to earth.
Der Pressfuß 21 besteht aus einer einstellbaren Stahlhülse von ungefähr 30 mm Durchmesser. Bei einem Substrat-Pressvorgang bewegt sich der Pressfuß vertikal nach unten und presst das obere Substrat in völliger Parallelität zum Bodensubstrat. Wenn der Pressfuß sich nach unten bewegt, kommen die Substrate im Zentrum in mechanischen Kontakt mteinander, was bedeutet, daß der Klebstoff sofort vom Mittelstift zur Peripherie nach außen gepresst wird, auf einen Durchmesser von ungefähr 60 mm. Dies beschleunigt den Vorgang und verringert die Maschinen-Taktdauer.The press foot 21 consists of an adjustable steel sleeve of approximately 30 mm diameter. During a substrate pressing operation, the press foot moves vertically downwards and presses the upper substrate in complete parallelism with the bottom substrate. As the press foot moves downwards, the substrates come into mechanical contact with each other in the center, which means that the adhesive is immediately pressed outward from the center pin to the periphery, to a diameter of approximately 60 mm. This speeds up the operation and reduces the machine cycle time.
Fig. 3 zeigt die Situation am Ende des Pressvorganges, in einem Zustand, wenn der Pressfuß 21 von der zusammengesetzten Platte gerade nach oben wegbewegt werden soll.Fig. 3 shows the situation at the end of the pressing process, in a state when the pressing foot 21 is to be moved straight upwards away from the assembled plate.
Auf das Zusammenpressen der Substrate folgend wird der Klebstoff um den Mittelstift 14 mit Hilfe von UV-Licht ausgehärtet, welches von einer zentralen UV-Lampe 40 durch eine Vielzahl von Lichtleitern 41, welche in einem ringförmigen Halter 42 (Fig. 4) um den Stift 14 herum befestigt sind, geliefert wird. Dieser zentrale Aushärtungsprozess ermöglicht es, daß der Klebstoff so aufgetragen wird, daß er die ganze Oberfläche zwischen den Substraten genau bis zum Mittelloch bedeckt, ohne daß der Klebstoff im Zentrum ausläuft. Die zusammengesetzte Platte kann auch bearbeitet werden, ohne daß die Substrate im Verhältnis zueinander gleiten, wenn die Platte zu einem abschließenden Aushärtungsprozess transportiert wird. Die Oberflächenbearbeitung des Mittelloches wird mittels des Mittelstiftes verbessert, welcher als ein Formteil für das Bindematerial wirkt, welches dann solche Oberflächenunregelmäßigkeiten ausfüllt, welche entstanden sein konnten, als das Mittelloch in den Substraten gebildet wurde. Die Platte wird auch um das Mittelloch herum stärker sein.Following pressing the substrates together, the adhesive around the center pin 14 is cured by means of UV light supplied from a central UV lamp 40 through a plurality of light guides 41 mounted in an annular holder 42 (Fig. 4) around the pin 14. This central curing process enables the adhesive to be applied to cover the entire surface between the substrates right up to the center hole without the adhesive running out at the center. The assembled panel can also be machined without the substrates sliding relative to each other as the panel is transported to a final curing process. The surface finish of the center hole is enhanced by the center pin acting as a mold for the bonding material which then fills in any surface irregularities which may have been created when the center hole was formed in the substrates. The panel will also be stronger around the center hole.
Der flexible Mittelstift wird aus der Platte zurückgezogen, wenn der Zentrums-Aushärtungsprozess und die Zentrifugation beendet wurden, wonach die Platte abschließend während einer Rotation in einem UV-Trockner (nicht dargestellt) ausgehärtet wird.The flexible center pin is retracted from the plate when the center curing process and centrifugation are complete, after which the plate is finally cured during rotation in a UV dryer (not shown).
Der Klebstoff wird so aufgetragen, daß erden Winkel, welcher zwischen dem Stift und dem ersten Substrat begrenzt wird, füllt, wobei der Klebstoffring vorzugsweise so aufgetragen wird, daß seine größte Dicke unmittelbar nebenThe adhesive is applied so as to fill the angle defined between the pin and the first substrate, the adhesive ring preferably being applied so that its greatest thickness is immediately adjacent to
dem Stift liegt. Der Stift kann eine flexible, elastomere äußere Schicht oder Abdeckung und einen stabilen Kern enthalten, oder kann vorständig aus einem federnden, elastischen Material bestehen, welches es dem Stift ermöglicht, die Ränder der Löcher in entsprechenden Plattenelementen zu verbinden oder abzudichten, selbst wenn die Randflächen nicht glatt sind, und welches es dem Stift ermöglicht, in die Löcher geschoben oder aus ihnen herausgezogen zu werden, ohne die Ränder oder die Ränder der Löcher zu beschädigen. Der Stift zentriert die Substrate relativ zueinander und auch relativ zum Tisch.the pin. The pin may include a flexible, elastomeric outer layer or cover and a rigid core, or may be made primarily of a resilient, elastic material which enables the pin to bond or seal the edges of holes in corresponding plate members even when the edge surfaces are not smooth, and which enables the pin to be pushed into or pulled out of the holes without damaging the edges or the edges of the holes. The pin centers the substrates relative to each other and also relative to the table.
Der Klebstoff und die Manteloberfläche des Stiftes sind geeigneterweise ausgewählt, so daß der Klebstoff längs des Stiftes durch Oberflächenspannungs-Wirkung hochgezogen wird, so daß der Klebstoffstreifen seine größte Dicke in der Nähe des Stiftes hat.The adhesive and the mantle surface of the pin are suitably selected so that the adhesive is pulled up along the pin by surface tension action so that the adhesive strip has its greatest thickness near the pin.
Claims (12)
Priority Applications (1)
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DE20019557U DE20019557U1 (en) | 2000-11-17 | 2000-11-17 | Device for gluing together first and second plate elements in the production of a DVD |
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DE20019557U DE20019557U1 (en) | 2000-11-17 | 2000-11-17 | Device for gluing together first and second plate elements in the production of a DVD |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002077985A1 (en) * | 2001-03-21 | 2002-10-03 | Steag Hamatech Ag | Device for joining substrates |
DE10122667C1 (en) * | 2001-05-10 | 2002-11-07 | Steag Hamatech Ag | Device for gluing substrates |
FR2906503A1 (en) * | 2006-09-28 | 2008-04-04 | Inergy Automotive Systems Res | Film fixing device for use in vehicle, has laser heads supplied by secondary laser beams, where heads are arranged so as to direct beams on film for fixing film on fuel reservoir by soldering, and optical decoupling device |
-
2000
- 2000-11-17 DE DE20019557U patent/DE20019557U1/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002077985A1 (en) * | 2001-03-21 | 2002-10-03 | Steag Hamatech Ag | Device for joining substrates |
US7182116B2 (en) | 2001-03-21 | 2007-02-27 | Steag Hamatech Ag | Device for joining substrates |
DE10122667C1 (en) * | 2001-05-10 | 2002-11-07 | Steag Hamatech Ag | Device for gluing substrates |
FR2906503A1 (en) * | 2006-09-28 | 2008-04-04 | Inergy Automotive Systems Res | Film fixing device for use in vehicle, has laser heads supplied by secondary laser beams, where heads are arranged so as to direct beams on film for fixing film on fuel reservoir by soldering, and optical decoupling device |
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