DE19915836C2 - Modular housing system for the installation of control and power electronics - Google Patents

Description

The invention relates to a plastic housing system for the Installation of electrical and electronic modules for high elect performance and / or large switching currents. In essence Chen these devices are used to control motors. at The following are mentioned in a playful manner: start-up controls, equal power judges, frequency converters, semiconductor switches etc.

Such are in EP 0 631 463 B1 and EP 0 506 288 B1 Applications and types described in more detail.

DE 92 10 221 U1 is a construction principle for devices of the Power electronics described. There are performance components elements adjacent to a heat sink outside a housing arranged, the power components by means of conductors plates are wired inside the housing.

DE 43 33 387 A1 describes a power converter Components that are arranged on a circuit board are, the circuit board adjacent to a heat sink is arranged.

Finally, DE 43 23 827 C1 is a pluggable construction Group known, which has a circuit board, the form part is made of plastic. In this circuit board are conductor tracks formed by lead frames in one or more embedded levels.

The prior art, as also in the above-mentioned document ten described, but leaves only a low modularity know. Consequently, on the one hand, there are relatively complex work steps  necessary to manufacture the devices and devices to create riants, on the other hand, economic ser vice possibilities difficult, so that in the event of an error only the exchange of the complete device remains and no consideration take care of the ecological use of resources can.

The invention is therefore based on the object of a housing system create that has an advantageous modularity, and thus a easy variation and expandability, as well as an easy exchange Ability of the functional elements allowed, and in this context further improvement in the ratio of construction volume to performance set of the terminal is made possible.

According to the solution to the problem according to the invention, they are a devices mentioned above are divided into functional modules.

These are essentially:
housing parts
terminals
control electronics
Power electronics (frame with connection elements)
heatsink

In the following the innovation is described in detail and is based on exemplary drawings made clear. Show it:

Fig. 1 is an exploded view of a housing system according to the invention

Fig. 2 composite housing system of Fig. 1

Fig. 3 shows a smallest device type, based on the housing system according to the invention

Fig. 4 shows an expanded device structure, by means of the housing system according to the invention

Fig. 5 shows another device variant with an internal heat sink

description

Compared to the prior art, the housing according to the invention enables system the construction of the devices mentioned at the outset without complex strands wiring. The modular structure also favors the flexible Combine device functions as well as economical creation of device variants.

As shown by way of example in FIG. 1, the individual modules can be dismantled without loosening solder connections. They are held only by plug and screw connections.

The housing cover ( 1 ) acts as a load-bearing component for all other modules and is used to fasten the device during installation.

The core of the housing system is the power module ( 4 ). The power module ( 4 ) consists of an insulating frame ( 45 ) which carries the solid connecting wires ( 41 ), ( 42 ). Inserted in the Isolierstoffrah men is the cooling plate ( 44 ), which closes the insulating frame on one side and thus forms a flat, trough-like component. The heat sink ( 44 ) is also the carrier of the semiconductor components.

Due to the inventive design, the side surface of the Iso lierstoffrahmens ( 45 ) by the cooling plate ( 44 ) is used to a maximum, where is advantageously solved by the essential task, namely the removal of the heat loss me.

On the large-area cooling plate ( 44 ), the power semiconductors can now also be applied in an advantageous, flat design, so that because of the large heat transfer cross-sections the heat loss from the semiconductors can be dissipated as quickly as possible.

Through an opening ( 12 ) in the side wall of the hood ( 1 ), depending on the version of the device, the heat sink ( 5 ) by means of fastening screws ( 53 ) at the fastening points ( 47 ) of the power module ( 4 ) can be attached. This results in direct contact of the heat sink surface ( 54 ) with the heat sink ( 44 ), which ensures optimally adapted heat dissipation.

About the flat power semiconductors within the Iso lierstoffrahmens, similar to "guitar strings", the connecting wires ( 41 ) for the control stretched. The control connections of the semiconductors can thus be connected to the connecting wires ( 41 ) of the power module ( 4 ) at a freely selectable location within the frame. The connecting wires ( 41 ) are bent at least at one end in an L-shape and are inserted into the insulating frame ( 45 ) in such a way that a pluggable, electrical connection can be made to the control module ( 3 ).

The connecting wires ( 42 ) required for the power transmission are embedded in the outside of the insulating frame. Each Rahmensei te carries a maximum of 3 connecting wires ( 42 ) with a preferably circular cross-section. The wire ends ( 42 a), ( 42 b) are flattened. Suitable shaping of the connecting wires ( 42 ) ensures that the flattened ends ( 42 a) can be guided through the corresponding openings ( 46 ) in the frame wall into the interior of the power module ( 4 ). There they form the electrical connection points to the power connections of the corresponding semiconductor elements ( 43 ).

For tapping electrical quantities for the control module ( 3 ), the flattened wire ends ( 42 a) can also be provided with further solid connection wires.

In the preferred design, the power module ( 4 ) is cast with a hardenable insulating resin, resulting in a compact, mechanically stable and very effectively electrically insulated module. In the advantageous embodiment, the height of the cast resin filling is selected so that the control module ( 3 ) can also be inserted into the insulating frame ( 45 ) parallel to the plane of the cooling plate.

The control module ( 3 ) is preferably a printed circuit board in a known design. Depending on the circuit applied, different device functions can be implemented.

The pluggable electrical connection to the power module ( 4 ) form sleeves ( 31 ), which are placed in the control module ( 3 ) so that they releasably contact the L-shaped angled ends of the connecting wires ( 41 a) of the power module ( 4 ).

The electrical connection to the control periphery of the device is formed by the control terminals ( 22 ). They are arranged on the control module ( 3 ) so that they are accessible from the front of the device, whereby a large insulation distance from the power module ( 4 ) and its connections is achieved.

In order to be able to properly connect the two modules ( 3 ) and ( 4 ), both the control terminals ( 22 ) mentioned above and the flattened ends of the connecting wires ( 42 b) are to be equipped with insulating terminal bodies ( 23 ).

The flattened ends of the connecting wires ( 42 b) are therefore shaped so that the terminal body ( 23 ) can be plugged in and thus the complete power terminal ( 21 ) is formed.

The control terminals ( 22 ) are enclosed with the terminal body ( 24 ) and at the same time the complete device front is formed.

If it requires the power conversion of the device that the resulting heat must be dissipated faster and more effectively, the modular housing system according to the invention offers the possibility of screwing the heat sink to ( 5 ) the large cooling plate ( 44 ) of the power module ( 4 ).

Depending on the power conversion, different sizes of heat sinks can be used be used.

To protect against accidental contact with the heated heat sink ( 5 ) during operation, the front is provided with the cover plate ( 51 ).

Fig. 2 shows an example of the modules of the new Ge housing system just described in composite form.

Other figures show the variability of the designs due to of the modular housing system according to the invention simple and for everyone Application can be optimally realized.

For example, Fig. 3 represents the smallest type of device without a heat sink ( 5 ). This eliminates the side opening ( 12 ) in this embodiment, whereby the hood ( 1 ) is completely closed. If no control terminals are necessary due to the simple device function, the terminal body ( 24 ) is replaced by the front panel ( 26 ).

NEN Figs. 4 and 5 show further embodiments of devices that are implemented in a simplest manner by the modular housing system Kgs.

As an example, the size of the heat sink ( 5 ) with cover plate ( 51 ) in FIG. 4 is adapted to an increased power conversion. The control module ( 3 ) can also be expanded if additional functions are required. The control terminal block ( 25 ) can then be mounted for a larger number of control connections.

If it allows the implemented power loss, or if it requires a uniform design, Fig. 5 shows an embodiment with the heat sink inside. The necessary convection is ensured by cooling slots ( 11 ) in the top and bottom of the hood. A terminal cover ( 52 ) in combination with the front cover ( 26 ) then fulfills the requirement for a uniform design.

Figure Legend

1

Hood

11

cooling slots

12

side opening of the hood

2

jam

21

power terminals

22

control terminals

23

clamping bodies

24

clamping bodies

25

Control terminal block

26

front panel

3

control module

31

shell

4

power module

41

connecting wire

41

a end of the connecting wire

42

connecting wire

42

a end of the connecting wire

42

b End of the connecting wire

43

Power semiconductor

44

heatsink

45

Isolierstoffrahmen

46

Openings in the frame wall

47

attachment point

5

heatsink

51

cover

52

terminal panel

53

mounting screws

54

Heatsink surface

Claims (8)

1. Housing system for the installation of electrical and / or electronic modules, which has the following features:

• - A housing hood ( 1 );
• - an insertable into the housing hood (1) power module (4) for receiving power devices (43);
• - A control module ( 3 ) for controlling the power components ( 43 ) of the power module;
• - The control module ( 3 ) and the power module ( 4 ) are connected by means of a pluggable electrical connection;
• - The power module ( 4 ) has an insulating frame ( 45 ) which is closed on one side by a cooling plate ( 44 ), the cooling plate ( 44 ) receiving the power components ( 43 ).
• - In the power module ( 4 ) connecting wires ( 41 ) for connecting the power components ( 43 ) are tensioned.

2. Housing system according to claim 1, characterized in that the connecting wires ( 41 ) are angled at at least one end. 3. Housing system according to claim 2, characterized in that the control module ( 3 ) sleeves ( 31 ) for contacting the angled ends of the connecting wires ( 41 ) of the power module ( 4 ). 4. Housing system according to one of the preceding claims, characterized in that the power module ( 4 ) required for a power transmission connection wires ( 42 ) with flattened wire ends ( 42 a, 42 b) which can be connected to power connections of the power components ( 43 ), and are embedded in an outside of the insulating frame ( 45 ). 5. Housing system according to one of the preceding claims, characterized in that the power module has a cast resin filling. 6. Housing system according to one of the preceding claims, characterized in that the control module ( 3 ) has control terminals ( 22 ) for connection to a control peripheral, which are accessible from a front of the housing system. 7. Housing system according to claim 6, characterized in that on the control terminals ( 22 ) and the flattened wire ends ( 42 a, 42 b) insulating terminal body ( 23 and 24 ) are pluggable. 8. Housing system according to one of the preceding claims, characterized in that the housing hood ( 1 ) has a lateral opening ( 12 ) for fastening heat sinks of different sizes ( 5 ) to the cooling plate ( 44 ) of the power module ( 4 ).