DE19829724A1 - Making smart card by pressure injection molding using mold slide plate - Google Patents

Abstract

Plastic injected into the first part of the molding cavity (6) has already shrunk, before a second plastic material is injected into the second part of the molding cavity (7). Independent claims are included for the equipment carrying out the process and for the smart card made. Preferred features: Following injection, the second plastic shrinks, coming to rest with its edges against and interlocking with the body formed by the first plastic. Injections (8, 9) take place at right angles. As the slide is moved out, a further mold section is moved towards the cavity. The second plastic is injected in correspondence with the direction of motion of the slide. The slide is brought to a first position, in which it fully closes-off the first part-cavity from the second. It is then moved to a second position, where the slide forms a recess.

Description

The invention relates to a method for producing a Chip card according to the preamble of claim 1, a Device for carrying out the method according to the Oberbe handle of claim 7 and a chip card after Preamble of claim 13.

WO 92/20506 A1 describes a method and a device known for producing a chip card, the chip card is made from a single plastic material. The Mold includes a mold part that is in the transverse direction of the mold space is designed to be movable, so that the mold space can be reduced to embed a chip module in the card body after the plastic material in the mold space has been injected. By means of a transversely movable Punching tool is a Mi embedded in the card body nichipkarte produced with the formation of a punching gap. A disadvantage of the known method is that the materia Properties of the plastic material are decisive for the Stress on the card body on the one hand and the mini chip card on the other hand.

From the patent application 197 36 082.3 it is known a Manufacture chip card from several plastic materials.  

The card body is made of a different plastic material than the minichipkar held in a recess thereof te.

The object of the invention is a method for manufacturing a chip card and a device for carrying out the Specify procedure so that a mini chip card and a same surrounding and from a different plastic material standing card body can be produced in a simple manner.

To achieve this object, the invention has the features of claim 1 and claim 6.

According to the invention, the edge surfaces of a mini chip carrier lie on the one hand and the edge surfaces of a card body on the other loosely to each other, forming a narrow gap becomes. This is preferably done without subsequent punching of the Gap, but by harnessing the shrinkage of the Plastic material allows. The basic idea here is that the second plastic material is only injected after the first plastic material has already shrunk. Due to the subsequent shrinkage of the second plastic material terials, this second plastic material the Mi forms the non-chip-enclosing card body, press the Edge areas of the card body against the edge surfaces of the Mi nichip carrier, so that a clamping bracket of the mini chip Carrier guaranteed in a recess in the card body is. The mini chip card is thus form-fitting with the card body connected. It can be used by a user without much Force removed from the card body recess and be used again.  

The contours of a stamp are preferably designed in this way tet that the mini chip card by means of a snap or rest closure held in the recess of the card body is. For this purpose, the stamp has inclined surfaces, so that the Narrow sides of the mini chip card as different orientations te and corresponding to the narrow sides of the recess Inclined surfaces are formed.

According to one embodiment of the invention, the chip card by injecting a first plastic material into one first part mold space and by subsequent injection egg nes second plastic material in a second mold part manufactured, one enclosing the second mold part the slider is moved out so that the second art material at an interface of the first plastic material rials connects to or abuts the same. Before A chip card can thus be partially created, the Mini chip carrier is made of a different material than that the same surrounding map body. For example, the Card body made of a recyclate and the mini chip carrier a high quality PC. Alternatively, by adding different colorants of the card body another Have color than the mini chip carrier.

According to a development of the invention, the injection nozzles sen arranged perpendicular to each other. One in the mold room orderly slide separates the first from the second part form space. This will safely inject the art material materials in a given shape space richly enabled.  

According to a development of the invention, the slide is transverse shifted to the longitudinal plane of the mold space, so that subsequently the second plastic material in the fully released NEN second part mold space can be injected. Preferential the slider is turned away from one of the second nozzles Side of the mold space moved out.

The plastic materials preferably consist of material that cannot be chemically combined. The combination of materials would be, for example, PS and PC in Fra ge.

According to a development of the invention, the slide instructs a cavity former on one side, the contour of which with a corresponds to the cavity to be mounted in the mini chip carrier. The slide is only so far out of the partial mold space moves until the cavity former in the desired cavity fills out the second partial mold space. After the second has cooled Plastic material, the slide is completely out of the Removed molding space, the predetermined cavity being formed is. The slider advantageously has a double function. To the one separates the first part mold space from the second part form space. On the other hand, it enables special training of its contour the production of a cavity.

According to a development of the invention, the slide is hollow shaped. This makes the introduction advantageous of a stamp, which with an end face Presses the chip module into the second mold cavity. The Stamp is coaxial to the slide with the chip module by an opening  The same moves after the slide from the second Part mold space has been moved out. Alternatively, the Slider can also be moved in the direction of the second nozzle.

According to a development of the invention, the slide is hollow shaped and has one of the out-moving towards the side facing away from at least one trough. In egg ner first position of the slide is the first of the second part mold space completely separated, so that the first Plastic material injected into the first part of the mold can be without the plastic material in the second. Part mold space can penetrate. In a second position the slider moved out so far that the trough or Einker exercise a connection between the first and second part form space enables. After injecting the second plastic materials, a connection nose is created at this point which is severed before using the mini chip card.

The invention is also based on the object of a chip to create cards with variable material properties.

To solve this problem, the Chipkar invention te the features of claim 13.

The advantage of the chip card according to the invention is in particular the fact that the mini chip card is made of a different material can exist with different material properties than the Kar body. For example, the mini chip card can be made from one very solid material and the card body from a tough or flexible material. Alternatively, the cards consist of an inexpensive recyclate.  

According to a preferred embodiment of the chip card these made of materials that do not chemically ver are bindable, so that a form-fitting in a mini chip card held in a recess in the card body is producible with a subsequent punching a gap can be dispensed with.

Several embodiments of the invention are as follows explained in more detail with reference to drawings.

Show it:

Fig. 1 is a schematic partial section of a device for manufacturing a chip card with-mini chip card with egg nem shifter according to a first embodiment;

Fig. 2 is a schematic partial section of a device for manufacturing a chip card with mini chip card with egg nem slider according to a second embodiment;

Fig. 3 is a schematic partial section of a device for manufacturing a chip card with mini chip card with egg nem slider according to a third embodiment;

Fig. 4 is a schematic partial section of a device for manufacturing a chip card with mini chip card with egg nem slider according to a fourth embodiment,

Fig. 5 is a plan view of a chip card having an embed ter mini chip card,

Fig. 6 is a plan view of a chip card according to a white direct embodiment and

FIG. 7 shows an enlarged illustration of a detail X from FIG. 6.

In Fig. 1 illustrates an apparatus for manufacturing a chip card with a slide 1 according to a first embodiment. The slide 1 is movably mounted in an upper mold half 2 . It can be designed as a movable stamp with egg ner flat end face 3 .

In a starting position of the slide 1, it lies flat against a surface of two lower mold parts 4 and 5 . The molding space now consists of a first molding space 6 and a molding space 7 filled by the slide 1 , which is completely enclosed by the first molding space 6 . In a first step, a first plastic material is injected through a first nozzle 8 into the first partial mold space 6 . The material can be, for example, polyvinyl chloride (PVC), polypropylene (PP), acrylonitrite-butadiene-styrene copolymer (ABS) or a recyclate from these materials.

In a second step, the slide 1 . removed from the mold space with exposure of the second Tellformraums 7 , so that by means of a second nozzle 9 , which is arranged perpendicular to the first Dü se 8 , a second plastic material can be injected into the second mold part 7 . The second plastic material can consist of a PC, ABS, PP, PVC or recycled material, possibly containing certain color pigments, so that a different coloring of a mini chip carrier 10 thus formed in the partial mold space 7 is produced. Alternatively, the second plastic material can be chosen so that the mini chip carrier 10 has a better flexural strength, dimensional stability or temperature resistance than the card body 11 consisting of the first plastic material. In example, the card body 11 can consist of a particularly elastic first plastic material.

After welding or chemical connection at the interfaces of the first and second plastic materials present as a melt, in a further processing step, a cavity for receiving a chip module 12 is milled into the mini chip carrier 11 and at least one gap 13 is produced by stamping.

According to a second exemplary embodiment according to FIG. 2, the device has a slide 15 , the lower side of which is step-shaped in accordance with the cavity and forms a cavity former 16 . The other components of this exemplary embodiment correspond to the components of the first exemplary embodiment and bear the same reference numbers.

In accordance with the manufacturing process described in the first embodiment, the first plastic material is injected into the first partial mold space 6 . Since after the slide 15 is moved only as far out of the second part of the mold space 7 as the cavity shaper 16 of the slide bers 15 is still within the partial mold space 7 , ie the protruding cavity shaper 16 is positioned completely inside the partial mold space 7 . Only after the second plastic material has been injected by means of the nozzle 9 is the cavity former 16 removed from the molding space, so that a cavity is formed in the chip card. Subsequently, only a punching needs to be carried out to form the gap 13 .

According to a further exemplary embodiment according to FIG. 3, a slide 20 is hollow or frame-shaped, the frame sides 21 separating an inner partial mold space 22 as a second partial mold space 22 from an outer first partial mold space 23 . The opening of the slide 20 enables a punch 24 to be moved in the opposite direction to the slide movement to a partial area of the second partial mold space 22 . The stamp 24 detects a run perpendicular to the direction of movement of the stamp 24 on an endless belt of the chip module 12th and presses it with its end face in the direction of the molding space. The stamp 24 comes to a standstill as soon as the lower edge of the chip module 12 ends with the upper edge of the two-part mold space 22 . Only now is the second plastic material injected into the second mold cavity 22 and then the stamp 24 is lowered further, so that the top of the chip module 12 is flush with the top of the second mold cavity 22 or the mini chip carrier 10 . After a sufficient cooling time, the mold is opened, the chip module 12 being firmly integrated in the chip card. In a subsequent step, the gap 13 is punched out at the part shape boundaries in a known manner by punching.

If the slide 21 is not moved simultaneously with the downward because of the stamp 24 upwards, this can only be removed after injecting the second plastic material, so that a subsequent punching to produce the gap 13 can be omitted. This variant is preferably applicable when the two plastic materials have different shrinkage properties, so that the Mi nichip card is held clamped in the card body. The utilization of the shrinkage behavior is described further below in the description.

According to a further embodiment shown in FIG. 4, a slider is formed in a hollow shape 25 and has, in a modification to the previous embodiment, in addition range as on the lower sides of the frame sides 27 notches 28. In a first position of the slide 25 , a notches 28 are arranged below the mold space 22 in a groove 29 of the mold parts 4 , 5 , so that the first plastic material can be injected into the first mold part space 23 , the second inner mold part space 22 being completely through the Slider 25 is blocked. In a subsequent second position of the slider 25 , the bottom of the slider is essentially flush with the undersides of the partial mold space 22 , the notches 28 each creating a connecting seam 30 between the first and second partial mold spaces 23 and 22 . After injecting the second plastic material into the second partial mold space 22 , this material is distributed under welding in the areas of the notch 28 in the second partial mold space 22 . The slide 25 is subsequently removed from the molding space. Through the frame sides 27 of the slide bers 25 , the gap 13 between the Kar tenkkörper 11th and the mini chip carrier 10 created. Through the opening of the slider 25 can - as in the previous example, Ausfüh approximately - engage a stamp 31 for inserting the chip module 12 , so that after removing the slide 25 and He cold the plastic material, the stamp 31 can eject the finished chip card.

According to an embodiment shown in FIG. 6 and FIG. 7 a- be smart cards 40 from a mini chip card 41 in a first plastic material and a card body 42 made of a second plastic material is. The two plastic materials are selected such that they cannot be chemically bonded to one another. This has the effect that, at elevated temperature, that is to say at the operating temperature during the injection molding of the card 40 , no chemical connecting forces act, so that the mini chip card 41 loosely comes into contact with a corresponding edge surface 44 of the card body 42 after it has cooled with an edge surface 43 . The production of the card 40 is preferably carried out in such a way that a stamp fills out the partial mold space provided for the card body 42 , the first plastic material being injected into the other partial mold space in order to produce the mini chip card 41 . After the stamp has been removed, the first plastic material having cooled down with shrinkage, the second plastic material is injected into the partial mold space provided for the card body 42 . Due to the subsequent shrinkage of the second plastic material, the edge surface 44 of the card body 42 presses onto the edge surface 43 of the Mi chip card 43 , so that it is held in a form-fitting manner. Punching out a gap for separation between mini chip card 31 and card body 42 is not necessary.

Alternatively, materials can also be selected which have a different shrinking behavior, in particular the plastic material assigned to the card body 42 has a greater tendency to shrink than the plastic material assigned to the mini chip card 41 . As a result, the manufacturing process can be accelerated.

As is particularly clear from FIG. 7, the mini chip card 41 has on one short side a dovetail-shaped extension 45 which engages in a receptacle 46 of the card body 42 . This is realized in terms of manufacturing technology by a correspondingly contoured stamp. Through the training of the extension 45 an improved clamping holding tion of the mini chip card 41 is created within the recess of the card body 42 .

Examples are the first and second plastic materials, art that cannot be chemically combined material PA on one side and POM on the other To name page. Furthermore PS and PBT or PC or PMMA on the other hand.

Alternatively, the second plastic material can first be injected into the second partial mold space and then the first plastic material into the first partial mold space. It is essential that a chip card according to FIG. 5 is formed, the Mi nichipträger 10 consists of a different plastic material than the card body 11 surrounding it.

Claims (16)

1. A method for producing a chip card by injecting a molten plastic material into a molding space and then cooling the plastic material,

• - That a first plastic material is injected into a first part of the mold space ( 6 , 23 ),
• - That a second partial mold space ( 7 , 22 ) from which he most partial mold space ( 6 , 23 ) final slide ( 1 , 15 , 20 , 25 ) is moved out of the mold space and
• - That a second plastic material is injected into the second part of the mold space ( 7 , 22 ) according to patent application 197 36 082.3, characterized in that
• - That in the first mold part ( 6 , 23 ) injected first plastic material has already shrunk before the second plastic material is injected into the second mold part ( 7 , 22 ).

2. The method according to claim 1, characterized in that the second plastic material after the injection of the the same with its edge surfaces on the one by the first plastic material formed shrunk body is, so that the body through one second body-forming second plastic material ge hold is. 3. The method according to claim 1 or 2, characterized in that the first plastic material and the second plastic material are injected at right angles to each other in the cor responding first mold cavity ( 6 , 23 ) or the second mold cavity ( 7 , 22 ). 4. The method according to any one of claims 1 to 3, characterized in that at the same time as the slide ( 20 , 25 ) is moved out at least one further tool part ( 24 , 31 ) is moved in the direction of the molding space. 5. The method according to any one of claims 1 to 4, characterized in that the second plastic material is injected corre sponding to the direction of movement of the slide ( 1 , 15 , 20 , 25 ) in the second partial mold space ( 7 , 22 ). 6. The method according to any one of claims 1 to 5, characterized in that the slide ( 15 ) is brought into a first position, in which it completely closes the first mold cavity ( 6 ) from the second mold cavity ( 7 ), and is then moved into a second position in which the slide ( 15 ) forms a recess in the mini chip carrier ( 10 ) to be formed with a cavity former ( 16 ). 7. Apparatus for carrying out the method according to claim 1, with a mold which includes at least one mold space and which has mold parts which are movable relative to one another, characterized in that

• - That a first injection nozzle ( 8 ) is provided for injecting a first plastic material into a he most partial mold space ( 6 , 23 ),
• - That a second injection nozzle ( 9 ) is provided for injecting a second plastic material into a second partial mold space ( 7 , 22 ) and
• - That the first injector ( 8 ) is arranged perpendicular to the second injector ( 9 ).

8. The device according to claim 7, characterized in that a slide ( 1 , 15 , 20 , 25 ) is provided which in egg ner starting position closes the second mold cavity ( 7 , 22 ) from the first mold cavity ( 6 , 23 ) and in a second position releases the second partial mold space ( 7 , 22 ). 9. Apparatus according to claim 7 or 8, characterized in that the slide ( 1 , 15 , 20 , 25 ) is designed to be movable perpendicular to a longitudinal plane of the molding space. 10. Device according to one of claims 7 to 9, characterized in that the slide ( 1 , 15 , 20 , 25 ) is arranged such that the second partial mold space ( 7 , 22 ) is designed as an inner partial mold space which of the first partial mold space ( 6 , 23 ) is surrounded as an outer partial mold space. 11. The device according to any one of claims 7 to 10, characterized in that the slide ( 20 , 25 ) is hollow and that the slide ( 20 , 25 ) insignificantly or in opposite directions movable to another movable mold part ( 24 , 31 ) is. 12. Device according to one of claims 7 to 11, characterized in that the slide ( 25 ) has frame sides ( 27 ) which has at least one notch ( 28 ) on one side, such that in a first position of the slide ( 25 ) the first mold part ( 23 ) from the two part mold space ( 22 ) is separated and in a second position of the slide ( 25 ) the same is pushed ver one way, so that when injecting a second plastic material a connecting arm ( 30 ) between egg nem first plastic material corresponding card body ( 11 ) and a corresponding to the second plastic material mini chip card carrier ( 10 ) ge is formed. 13. Chip card, consisting of a mini chip card and a card body surrounding it, characterized in that the mini chip card from a first plastic material and the card body ( 11 ) can be produced from a second plastic material. 14. Chip card according to claim 13, characterized in that the plastic materials have such a chemical property show that the first and the second art material in a the operating temperature of the Injection molding process does not contain temperature range are interconnectable. 15. Chip card according to claim 13 or 14, characterized net that the first plastic material made of polyamide (PA) and the second plastic material made of polyacetal (POM) or vice versa.   16. Chip card according to claim 13 or 14, characterized net that the first plastic material made of polystyrene (PS) and the second plastic material made of polybutylene therephthalate (PBT) or polycarbonate (PC) or Polyme methyl methacrylate (PMMA) exists.