DE19812471A1 - Method and device for the two-layer coating of copper foils with meltable coating agents - Google Patents

Method and device for the two-layer coating of copper foils with meltable coating agents

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Publication number
DE19812471A1
DE19812471A1 DE1998112471 DE19812471A DE19812471A1 DE 19812471 A1 DE19812471 A1 DE 19812471A1 DE 1998112471 DE1998112471 DE 1998112471 DE 19812471 A DE19812471 A DE 19812471A DE 19812471 A1 DE19812471 A1 DE 19812471A1
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Germany
Prior art keywords
coating
roller
film
diameter
meltable
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Withdrawn
Application number
DE1998112471
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German (de)
Inventor
Hans-Juergen Schaefer
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to DE1998112471 priority Critical patent/DE19812471A1/en
Priority to CN 99804206 priority patent/CN1297384A/en
Priority to PCT/EP1999/001936 priority patent/WO1999048619A1/en
Priority to AU35977/99A priority patent/AU3597799A/en
Priority to EP99917836A priority patent/EP1068029A1/en
Publication of DE19812471A1 publication Critical patent/DE19812471A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
    • B05C1/083—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets being passed between the coating roller and one or more backing rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
    • B05C1/0834—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets the coating roller co-operating with other rollers, e.g. dosing, transfer rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/52—Two layers
    • B05D7/54—No clear coat specified
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/06—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying two different liquids or other fluent materials, or the same liquid or other fluent material twice, to the same side of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/40—Metallic substrate based on other transition elements
    • B05D2202/45—Metallic substrate based on other transition elements based on Cu
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

A method is described which is characterised in that copper foils are twice-coated with meltable coating means in such a way that the copper foil (19) is guided approximately half encirclingly about a heatable roll (1), and coated by means of two heatable roll-type coating units (2, 4 & 3, 5) in such a way that in a first coating operation, there is applied from the melt an ultravioletly and thermally hardenable solvent-free coating means and in a second coating operation, a solvent-free, only thermally hardenable, meltable coating means is applied over the first coating means, and in that the first binding agent layer is cross-linked by radiation by ultraviolet radiators disposed downstream. There is furthermore described an apparatus for execution of the method.

Description

Zur Herstellung von sequenziellen Multilayer ist es erforderlich, mit dielektrischen Harzen beschichtete Kupferfolien auf Leiter­ platten auf zu pressen oder zu laminieren. Hierbei muß das Harz eine sehr gute Fließfähigkeit besitzen, um die Leiterzwischenräume luftbla­ senfrei ausfüllen zu können. Eine gegenläufige Forderung besteht darin, daß der vertikale Abstand zwischen den Leiterebenen konstant sein muß, um einen gleichen Isolatinsabstand zu gewährleisten. Um diese Forderung erfüllen zu können, muß das Harz eine möglichst geringe Fließfähigkeit haben. Es sollte vorzugsweise nicht mehr unter Einwirkung von Tempera­ tur und Druck seine auf der Kupferfolie erzielte Schichtdicke verändern. Um diese gegensätzlichen Forderungen erfüllen zu können, wurden Beschich­ tungsverfahren beschrieben, bei denen lösungsmittelhaltiges Harz in einem ersten Beschichtungsprozeß auf die Kupferfolie aufgetragen, das Lösungs­ mittel getrocknet und das Harz unter Temperatureinwirkung bis zum C-Zu­ stand vorgehärtet wurde. Der C-Zustand bedeutet bei Epoxidharzen, daß alle Epoxidgruppen vernetzt sind und keine freien Epoxidgruppen mehr nachweisbar sind. Die so beschichtete Folie wird anschließend ein zwei­ tes mal mit der gleichen Epoxidharzlösung beschichtet. Diese zweite Schicht muß unter Druck- und Temperaturanwendung fließfähig sein. Daher wird sie nur getrocknet und falls erforderlich bis in den nahen B-Zustand vor­ gehärtet. Die erste Beschichtung erfordert bei einer Trocknertempe­ ratur von 160°C und einer Trocknerlänge von 10 m bei einer Gelierzeit von 180 sek. bei 160°C eine Beschichtungsgeschwindigkeit von drei Metern pro Minute.To produce sequential multilayers, it is necessary Copper foils coated on conductors with dielectric resins to press or laminate panels. Here, the resin must have very good flowability to airblue the interspace between the conductors to be able to fill out without any need. An opposite requirement is that the vertical distance between the conductor levels must be constant, to ensure an equal isolation distance. To this requirement To be able to meet, the resin must have the lowest possible fluidity to have. It should preferably no longer be under the influence of tempera ture and pressure change the layer thickness achieved on the copper foil. In order to be able to meet these conflicting requirements, Beschich tion process described in which solvent-containing resin in one first coating process applied to the copper foil, the solution medium dried and the resin under the influence of temperature up to the C-Zu was precured. In the case of epoxy resins, the C state means that all epoxy groups are cross-linked and no more free epoxy groups are detectable. The film coated in this way then becomes a two tes times coated with the same epoxy resin solution. This second layer must be flowable under pressure and temperature. Hence it will only dried and if necessary up to the near B state hardened. The first coating requires a dryer temperature temperature of 160 ° C and a dryer length of 10 m with a gel time from 180 sec. at 160 ° C a coating speed of three meters per minute.

Aufgabe der vorliegenden Erfindung ist es daher, ein Verfahren und eine Vorrichtung verfügbar zu machen, bei dem eine Trocknung und Vor­ härtung nach der ersten Beschichtung nicht erforderlich ist, und das somit Beschichtungsgeschwindigkeiten von größer 10 m/min erreicht. The object of the present invention is therefore a method and to make available a device in which a drying and pre curing after the first coating is not necessary, and that coating speeds of greater than 10 m / min are thus achieved.  

Beschrieben wurde derartiges Verfahren in der P 195 39 193.4 Hier hat man Pulverharze mit unterschiedlichem Schmelzpunkt benutzt und eine erste Schicht mit einem hohen Schmelzpunkt sowie eine zwei­ te Schicht mit einem niedrigeren Schmelzpunkt aufgetragen.Such a process was described in P 195 39 193.4 Here powder resins with different melting points have been used and a first layer with a high melting point and a two layer with a lower melting point.

Dieses Verfahren ist insbesondere wegen der hohen Schmelz- und Beschich­ tungstemperaturen sehr schwer zu beherrschen, da die Härtungsreaktion einsetzt und es zu unakzeptablen Verarbeitungszeiten kommt.This process is particularly due to the high melting and coating tempering temperatures very difficult to control because of the hardening reaction uses and there are unacceptable processing times.

Bei der vorliegenden Erfindung wird daher für die erste Beschichtung ein UV- und thermisch härtbares Epoxidharz verwendet, weiches bei Temperaturen unter 100°C aufgeschmolzen werden kann.In the present invention, therefore, for the first coating uses a UV and thermally curable epoxy resin, soft at Temperatures below 100 ° C can be melted.

Eine Härtungsreaktion findet bei dieser Temperatur nur so langsam statt, daß der Beschichtungsprozeß nicht beeinträchtigt wird. Zur Beschichtung wird die Kupferfolie um eine beheizte Walze gelegt, die sie halb umschlingt. Diese Walze (1) sollte einen möglichst großen Durch­ messer haben. Vorteilhaft ist ein Durchmesser, der etwa dem doppelten Durchmesser der Auftragswalzen (2) u. (3) entspricht.A curing reaction takes place at this temperature only so slowly that the coating process is not impaired. For the coating, the copper foil is placed around a heated roller that half wraps around it. This roller ( 1 ) should have the largest possible diameter. A diameter that is approximately twice the diameter of the application rollers ( 2 ) and. ( 3 ) corresponds.

Auf der Oberfläche dieser beheizten Folienwalze (1) sind auf der horizontalen Achse und der vertikalen Achse je eine Walzenbeschich­ tungseinheit angebracht. Die erste beheizbare Walzenbeschichtungsein­ heit besteht aus der Dosierwalze (4) und der Auftragswalze (2).On the surface of this heated film roll ( 1 ) are each a roll coating unit attached to the horizontal axis and the vertical axis. The first heatable roller coating unit consists of the metering roller ( 4 ) and the application roller ( 2 ).

Dieses Walzenpaar bildet einen Spalt aus, in den aus einem darüber an­ geordneten beheiztem Harzvorratsgefäß (6) das geschmolzen Harz dosiert wird.This pair of rollers forms a gap into which the molten resin is metered from a heated resin reservoir ( 6 ) arranged above it.

Auf der vertikalen Achse der Folienwalze (1) ist eine zweite Walzen­ beschichtungseinheit bestehend aus der Auftragswalze (3) und der Dosierwalze (5) angeordnet. Über diesem Walzenpaar ist ein zweites beheiztes Harzvorratsgefäß (7) angeordnet, aus dem ein zweites ge­ schmolzenes nur thermisch härtbares Harz dem Walzenpaar (5, 3) zugeführt wird. Die zweite Beschichtung wird naß in naß auf die erste Schicht aufgetragen. Nach erfolgter Beschichtung wird die Folie (9) im Winkel von 45°C tangential von der Folienwalze (1) abgezogen und die Lackschicht (8) mit einem UV-Strahler (10) bestrahlt.On the vertical axis of the film roller ( 1 ), a second roller coating unit consisting of the application roller ( 3 ) and the metering roller ( 5 ) is arranged. Above this pair of rollers, a second heated resin reservoir ( 7 ) is arranged, from which a second ge melted only thermally curable resin is fed to the pair of rollers ( 5 , 3 ). The second coating is applied wet on wet to the first layer. After coating, the film ( 9 ) is drawn off tangentially from the film roller ( 1 ) at an angle of 45 ° C. and the lacquer layer ( 8 ) is irradiated with a UV lamp ( 10 ).

Diese Bestrahlung kann auch noch durch eine vertikale Umlenkung der Folie (9) intensiviert werden. Hierzu werden gekühlte Umlenkwalzen (11) (12) u. (13) benötigt. Zwischen den Walzen (11) u. (12) ist ein UV-Strahler u. zwischen (12) u. (13) ein IR-Strahler angeordnet. Nach der Abkühlung auf Raumtemperatur wird die Folie (9) auf einer Wickelstation (14) aufgewickelt. This radiation can also be intensified by a vertical deflection of the film ( 9 ). For this purpose, cooled deflection rollers ( 11 ) ( 12 ) and. ( 13 ) needed. Between the rollers ( 11 ) u. ( 12 ) is a UV lamp u. between ( 12 ) u. ( 13 ) an IR radiator is arranged. After cooling to room temperature, the film ( 9 ) is wound on a winding station ( 14 ).

Die Temperaturen der Auftagswalzen (2) u. (3) werden so gewählt, daß sich aus dem Mittel aus der Auftragswalzentemperatur (2) u. (3) und der Temperatur der Folienwalze (1) mittlere Beschichtungs­ temperatur ergibt, bei der das zu beschichtende Epoxidharz eine Schmelz­ viskosität von ca. 5000 bis 15 000 mPa.s aufweist.The temperatures of the application rollers ( 2 ) u. ( 3 ) are chosen so that from the average of the application roller temperature ( 2 ) u. ( 3 ) and the temperature of the film roller ( 1 ) results in an average coating temperature at which the epoxy resin to be coated has a melt viscosity of approximately 5000 to 15,000 mPa.s.

Die UV-Strahlung nach der Zweifachbeschichtung sorgt dafür, daß die erste Lackschicht (17) strahlenvernetzt wird. Die zweite Lackschicht (8) glättet sich durch die Erwärmung, härtet jedoch nicht. Ein definierte Vorhärtung der zweiten Schicht (8) wird durch den IR-Strahler (16) er zielt.The UV radiation after the double coating ensures that the first lacquer layer ( 17 ) is crosslinked by radiation. The second layer of paint ( 8 ) smoothes out due to the heating, but does not harden. A defined pre-curing of the second layer ( 8 ) is aimed by the IR radiator ( 16 ).

Die vorliegende Erfindung soll an nachfolgendem Beispiel erläutert werden.The present invention will be explained using the following example.

Beispielexample Beschichtungsmittel 1Coating agent 1

 45,00 Gew.Tl. Rütapox VE 4704 R Fa. Bakelite
 36,00 Gew.Tl. Mg (OH)2
45.00 parts by weight Rütapox VE 4704 R Bakelite
36.00 parts by weight Mg (OH) 2

 15,00 Gew.Tl. Kresolnovolak
  3,00 Gew.Tl. 2-Ethylanthrachinon BASF
  0,50 Gew.Tl. 2 Ethyl 4 Methylimidazol BASF
  0,50 Gew.Tl. Helioechtgrün
100,00 Gew.Tl. 100 Gew.-%15.00 parts by weight Kresolnovolak
3.00 parts by weight 2-ethylanthraquinone BASF
0.50 part by weight 2 ethyl 4 methylimidazole BASF
0.50 part by weight Helio real green
100.00 parts by weight 100% by weight

Beschichtungsmittel 2Coating agent 2

 53,00 Gew.Tl. Rütapox 0400 Fa. Bakelite
 18,00 Gew.Tl. Rütapox 0164 Fa. Bakelite
 28,00 Gew.Tl. Kresolnovolak
  0,50 Gew.Tl. 2 Ethyl-4 Methylimidazol
  0,50 Gew.Tl. Helioechtgrün
100,00 Gew.Tl. 100 Gew.-%
53.00 parts by weight Rütapox 0400 from Bakelite
18.00 parts by weight Rütapox 0164 from Bakelite
28.00 parts by weight Kresolnovolak
0.50 part by weight 2 ethyl-4 methylimidazole
0.50 part by weight Helio real green
100.00 parts by weight 100% by weight

Elektrolytische Kupferfolie Dicke 17,5 µm Electrolytic copper foil thickness 17.5 µm

Das Beschichtungsmittel 1 wird in das auf 60°C vorgeheizte Vorrats­ gefäß (6) gegeben. Die Auftragswalze (2) und die Dosierwalze (4) werden 60°C temperiert. Die Folienwalze (1) wird auf auf 70°C temperiert.The coating agent 1 is placed in the storage tank preheated to 60 ° C. ( 6 ). The application roller ( 2 ) and the metering roller ( 4 ) are heated to 60 ° C. The film roller ( 1 ) is heated to 70 ° C.

Das Beschichtungsmittel 2 wird in den auf 100°C temperierten Lackvor­ ratsbehälter (7) gegeben.The coating agent 2 is placed in the lacquer storage container ( 7 ) tempered to 100 ° C.

Die Auftragswalze (3) und die Dosierwalze (5) werden auf 100°C erwärmt.The application roller ( 3 ) and the metering roller ( 5 ) are heated to 100 ° C.

Die Auftragswalzen (2) u. (3) sind mit einer 3 µm dicken Gummierung versehen, die profiliert ist. Die Profilierung beträgt 125 Rillen pro 25 mm. Der Lackfilm spaltet sich in der Mitte. Es werden 25 µm Schicht­ dicke pro Beschichtungsvorgang aufgetragen.The application rollers ( 2 ) u. ( 3 ) are provided with a 3 µm thick rubber coating that is profiled. The profile is 125 grooves per 25 mm. The paint film splits in the middle. 25 µm layer thickness is applied per coating process.

Die Beschichtungsgeschwindigkeit beträgt 15 m/min.The coating speed is 15 m / min.

Die UV Härtung der ersten Schicht wird in 2 × 10 sek. durchgeführt.The UV curing of the first layer is in 2 × 10 sec. carried out.

Die UV-Strahler (10) u. (15) haben eine Länge von je 2500 mm.The UV lamps ( 10 ) u. ( 15 ) have a length of 2500 mm each.

Die Umlenkwalzen (11) (12) u. (13) werden auf 5°C gekühlt.The guide rollers ( 11 ) ( 12 ) u. ( 13 ) are cooled to 5 ° C.

Die Walzenoberfläche ist teflonisiert.The roller surface is Teflonized.

BeschichtungsanlageCoating system

Folienwalze Durchmesser 500 mm verchromt (1)
Dosierwalzen (4, 5) Durchmesser 250 mm
Auftragswalzen gummiert 3 mm LÜRA 2105 40 shore A Fa. Lüraflex
Durchmesser 250 mm
Strahler UV 10 KW Wellenlänge 350 nm Länge 2500 mm (10, 15).Foil roller diameter 500 mm chrome ( 1 )
Metering rollers ( 4 , 5 ) diameter 250 mm
Application rollers rubberized 3 mm LÜRA 2105 40 shore A from Lüraflex
Diameter 250 mm
Emitter UV 10 KW wavelength 350 nm length 2500 mm ( 10 , 15 ).

Claims (5)

1. Verfahren zur zweischichtigen Beschichtung von Kupferfolien mit schmelzbaren Beschichtungsmitteln dadurch gekennzeichnet, daß eine Kupferfolie (19) mit ungefähr halber Umschlingung um eine beheizbare Walze (1) geführt wird, und mittels zwei be­ heizbarer Walzenbeschichtungseinheiten (2, 4) u. (3, 5) derart beschichtet wird, daß in einem ersten Beschichtungsvorgang ein UV- und thermisch härtbares lösungsmittelfreies Beschichtungs­ mittel aus der Schmelze aufgetragen und in einem zweiten Beschich­ tungsvorgang ein lösungsmittelfreies nur thermisch härtbares schmelzbares Beschichtungsmittel über das erste Beschichtungs­ mittel aufgetragen wird, und daß durch nachgeordnete UV-Strahler die erste Bindemittelschicht strahlenvernetzt wird.1. A method for the two-layer coating of copper foils with fusible coating agents, characterized in that a copper foil ( 19 ) with approximately half the wrap around a heated roller ( 1 ), and by means of two heatable roller coating units ( 2 , 4 ) and. ( 3 , 5 ) is coated in such a way that a UV and thermally curable solvent-free coating agent is applied from the melt in a first coating process and a solvent-free, only thermally curable, meltable coating agent is applied in a second coating process, and that the first binder layer is crosslinked by means of downstream UV lamps. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der Mittel­ wert aus den Temperaturen der Auftragswalzen (2 u. 3) und der Folienwalze (1) eine Temperatur ergibt, bei der das Beschichtungs­ mittel eine Viskosität von 5000 bis 15 000 mPa.s erreicht.2. The method according to claim 1, characterized in that the average value from the temperatures of the application rollers ( 2 and 3 ) and the film roller ( 1 ) results in a temperature at which the coating medium has a viscosity of 5000 to 15 000 mPa.s reached. 3. Vorrichtung zur Durchführung des Verfahrens nach Anspruch 1, dadurch gekennzeichnet, daß auf einer beheizten Walze mit einem bevorzugtem Durchmesser von 200 bis 600 mm zwei Walzenbeschichtungs­ einheiten bestehend aus beheizbarer Auftragswalze (2) (3) mit einem bevorzugten Durchmesser von 100 bis 300 mm derart angeordnet sind, daß die erste Auftragswalze (2) die Folie (19) auf der horizontalen Achse und die zweite Auftragswalze (3) auf der vertikalen Achse der Folienwalze (1) berührt.3. Device for carrying out the method according to claim 1, characterized in that on a heated roller with a preferred diameter of 200 to 600 mm two roller coating units consisting of heatable application roller ( 2 ) ( 3 ) with a preferred diameter of 100 to 300 mm are arranged such that the first applicator roller (2) contacts the film (19) on the horizontal axis and the second applicator roll (3) on the vertical axis of the film roll (1). 4. Vorrichtung nach Anspruch 3, dadurch gekennzeichnet, daß der Durch­ messer der Folienwalze (1) in etwa doppelt so groß ist wie der Durch­ messer der Auftragswalzen (2 u. 3.) 4. The device according to claim 3, characterized in that the diameter of the film roller ( 1 ) is approximately twice as large as the diameter of the application rollers ( 2 and 3rd ) 5. Vorrichtung nach Anspruch 3, dadurch gekennzeichnet, daß im Anschluß an die Walzenbeschichtungseinheit (3, 5) UV-Strahler (10, 15) angeordnet sind.5. Apparatus according to claim 3, characterized in that UV lamps ( 10 , 15 ) are arranged following the roll coating unit ( 3 , 5 ).
DE1998112471 1998-03-23 1998-03-23 Method and device for the two-layer coating of copper foils with meltable coating agents Withdrawn DE19812471A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE1998112471 DE19812471A1 (en) 1998-03-23 1998-03-23 Method and device for the two-layer coating of copper foils with meltable coating agents
CN 99804206 CN1297384A (en) 1998-03-23 1999-03-22 Method and apparatus for two-layered coating of copper foils with meltable coating
PCT/EP1999/001936 WO1999048619A1 (en) 1998-03-23 1999-03-22 Method and apparatus for two-layered coating of copper foils with meltable coating
AU35977/99A AU3597799A (en) 1998-03-23 1999-03-22 Method and apparatus for two-layered coating of copper foils with meltable coating
EP99917836A EP1068029A1 (en) 1998-03-23 1999-03-22 Method and apparatus for two layered coating of copper foils with meltable coating

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Application Number Priority Date Filing Date Title
DE1998112471 DE19812471A1 (en) 1998-03-23 1998-03-23 Method and device for the two-layer coating of copper foils with meltable coating agents

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DE19812471A1 true DE19812471A1 (en) 1999-09-30

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CN (1) CN1297384A (en)
AU (1) AU3597799A (en)
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WO (1) WO1999048619A1 (en)

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ITMI20121242A1 (en) * 2012-07-17 2014-01-18 C M R Machineries S R L APPARATUS FOR THE COATING OF STICKERS ON CONTINUOUS FILMS.
CN105499060A (en) * 2016-01-08 2016-04-20 北京东方雨虹防水技术股份有限公司 Waterproof coating production device

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WO2001089718A2 (en) * 2000-05-23 2001-11-29 Pulverit S.P.A. Process and apparatus for the application of a solid photopolymerizable paint to the flat surfaces of products, and product obtained thereby
WO2001089718A3 (en) * 2000-05-23 2002-04-25 Cesare Montesano Process and apparatus for the application of a solid photopolymerizable paint to the flat surfaces of products, and product obtained thereby
ITMI20121242A1 (en) * 2012-07-17 2014-01-18 C M R Machineries S R L APPARATUS FOR THE COATING OF STICKERS ON CONTINUOUS FILMS.
CN105499060A (en) * 2016-01-08 2016-04-20 北京东方雨虹防水技术股份有限公司 Waterproof coating production device

Also Published As

Publication number Publication date
CN1297384A (en) 2001-05-30
EP1068029A1 (en) 2001-01-17
WO1999048619A1 (en) 1999-09-30
AU3597799A (en) 1999-10-18

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