DE19748173A1 - Biodegradable electronic components - Google Patents
Biodegradable electronic componentsInfo
- Publication number
- DE19748173A1 DE19748173A1 DE1997148173 DE19748173A DE19748173A1 DE 19748173 A1 DE19748173 A1 DE 19748173A1 DE 1997148173 DE1997148173 DE 1997148173 DE 19748173 A DE19748173 A DE 19748173A DE 19748173 A1 DE19748173 A1 DE 19748173A1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- phb
- hydroxybutyric acid
- poly
- shows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C05—FERTILISERS; MANUFACTURE THEREOF
- C05F—ORGANIC FERTILISERS NOT COVERED BY SUBCLASSES C05B, C05C, e.g. FERTILISERS FROM WASTE OR REFUSE
- C05F17/00—Preparation of fertilisers characterised by biological or biochemical treatment steps, e.g. composting or fermentation
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- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12Q—MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
- C12Q1/00—Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
- C12Q1/001—Enzyme electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/141—Feedstock
- Y02P20/145—Feedstock the feedstock being materials of biological origin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/40—Bio-organic fraction processing; Production of fertilisers from the organic fraction of waste or refuse
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Zoology (AREA)
- Proteomics, Peptides & Aminoacids (AREA)
- Wood Science & Technology (AREA)
- Biotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microbiology (AREA)
- Molecular Biology (AREA)
- Immunology (AREA)
- Biophysics (AREA)
- Analytical Chemistry (AREA)
- Bioinformatics & Cheminformatics (AREA)
- General Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Genetics & Genomics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
Die Erfindung ist in der gesamten Elektronik einsetzbar.The invention can be used in all electronics.
Bekannt sind elektronische Bauelemente, die von der Funktion her mit unterschiedlichsten Materialien aufgebaut sind. Die Entwicklungsziele orientieren auf die Erfüllung der Funktion in hoher Qualität, eine möglichst große Lebensdauer und eine preiswerte Herstellung.Electronic components are known which function very differently Materials are built. The development goals focus on the fulfillment of the function in high quality, the longest possible lifespan and inexpensive manufacture.
Erreicht ein damit aufgebautes Gerät das Ende seiner Lebensdauer oder soll es entsorgt werden, so ist der anfallende Elektronikschrott schwer zu vernichten, zu recyclen oder sonst wie zu verwenden.If a device assembled with it reaches the end of its life or should be disposed of electronic waste is difficult to destroy, recycle or otherwise how to use.
Aufgabe der Erfindung ist, Elektronikbauelemente zu finden, die die Entsorgung einfach gestalten.The object of the invention is to find electronic components that make disposal easy shape.
Die Erfindung ist dadurch gekennzeichnet, daß elektronische Bauelemente einschließlich dazugehörender physikalischer, chemischer, biologischer Sensoren auf der Grundlage biologisch abbaubarer Biopolymere wie Poly-β-Hydroxybuttersäure (PHB) oder ihren Copoly meren oder Mischungen mit diesen oder weiteren Vertretern der Poly-β-Hydroxyfettsäuren realisiert sind. Diese sind biologisch mit Mikroorganismen oder Pflanzen herstellbar und werden auch durch Mikroorganismen und Enzyme abgebaut. Von den elektronischen Bau elementen bleiben nach dem biologischen Abbauprozeß nur Dotierungs-, Legierungs-, Mischungs- und/oder Beschichtungsmaterialien übrig. Deren Anteil am elektronischen Bau element ist in der Regel verschwindend klein.The invention is characterized in that including electronic components associated physical, chemical, biological sensors based on biodegradable biopolymers such as poly-β-hydroxybutyric acid (PHB) or their copoly mers or mixtures with these or other representatives of poly-β-hydroxy fatty acids are realized. These can be produced biologically with microorganisms or plants are also broken down by microorganisms and enzymes. From the electronic construction After the biodegradation process, elements remain only doping, alloying, Mixing and / or coating materials left. Their share in electronic construction element is usually vanishingly small.
Der biologische Abbauprozeß für eine Verschrottung kann auf dem Komposthaufen erfolgen oder aber in einer dafür eingerichteten Anlage. Es können auch Depots in den Elektronik bauelementen oder in ihrer Nähe eingerichtet sein, die den Abbau nach Initialisierung in Gang bringen. Die Initialisierung kann sowohl durch einen Wärmeimpuls als auch durch einen kombinierten Wärme-Feuchte-Impuls ausgelöst werden. Die Feuchte kann dabei durch Einstellen des Taupunktes oder durch eine chemische Reaktion mit Wasserabspal tung besorgt sein.The biodegradation process for scrapping can take place on the compost heap or in a facility set up for this. There can also be depots in the electronics Components or be set up in their vicinity, the degradation after initialization in Get going. The initialization can be done either by a heat pulse or by a combined heat-humidity pulse can be triggered. The moisture can by setting the dew point or by a chemical reaction with water release be concerned.
Die Erfindung soll nachfolgend an Beispielen erläutert werden.The invention will be explained below using examples.
Fig. 1 zeigt den Aufbau und den Abbau von PHB, wobei die Enzyme β-Ketothiolase (1), NADPH-abhängige Acetoacetyl-CoA-Reduktase (2), NADH-abhängige Acetoacetyl-CoA- Reduktase (3), P(3HB)/PHF-Synthase (4), P(3HB)/PHF-Depolymerase (5), D-(-)-β-Hydroxy buttersäure-Dimer-Hydrolase (6), D-(-)-β-Hydroxybuttersäure-Dehydrogenase (7) und Aceto acetyl-CoA-Synthase (8) wirksam sind. Fig. 1 shows the structure and degradation of PHB, wherein the enzymes β-ketothiolase (1), NADPH-dependent acetoacetyl-CoA reductase (2), NADH-dependent acetoacetyl-CoA reductase (3), P (3HB) / PHF synthase ( 4 ), P (3HB) / PHF depolymerase ( 5 ), D - (-) - β-hydroxybutyric acid dimer hydrolase ( 6 ), D - (-) - β-hydroxybutyric acid dehydrogenase ( 7 ) and Aceto acetyl-CoA synthase ( 8 ) are effective.
Fig. 2 zeigt ein allgemeines Substrat (9) aus PHB. In dieses Substrat sind durch Laser Löcher gebohrt, die durch Verkupferung, Graphitierung oder Laserumwandlung leitend ge macht wurden (10). Der Abbau erfolgt zunächst durch eine Depolymerase, die das Makro molekül in Monomere und einen gewissen Anteil (15-20%) von Dimeren der Hydroxy buttersäure zerlegt. Durch eine spezifische D-(-)-β-Hydroxybuttersäure-Dimer-Hydrolase wird die Spaltung des Hydroxybuttersäure-Dimers katalysiert. Die entstandenen Monomere, d. h. Hydroxybuttersäure-Moleküle fließen über eine ATP-verbrauchende, durch die Acetyl- CoA-Synthase katalysierte Reaktion wieder in den Acetyl-CoA-pool der Zelle ein. Damit steht dieses Molekül dem zentralen C-Metabolismus der Mikroorganismuszelle zur Verfügung und kann zum Aufbau von zelleigenen Strukturen (Biomasse) oder zur Energiegewinnung ge nutzt werden. Fig. 2 shows a general substrate ( 9 ) made of PHB. Holes are drilled into this substrate by lasers, which have been made conductive by copper plating, graphitization or laser conversion ( 10 ). The degradation takes place first by a depolymerase, which breaks down the macro molecule into monomers and a certain proportion (15-20%) of dimers of hydroxybutyric acid. The cleavage of the hydroxybutyric acid dimer is catalyzed by a specific D - (-) - β-hydroxybutyric acid dimer hydrolase. The resulting monomers, ie, hydroxybutyric acid molecules, flow back into the cell's acetyl-CoA pool via an ATP-consuming reaction catalyzed by the acetyl-CoA synthase. This molecule is thus available to the central C metabolism of the microorganism cell and can be used to build up cell structures (biomass) or to generate energy.
In letzterem Fall erfolgt letztlich über den Tricarbonsäure-Zyklus (TCA-Zyklus) und die Atmungskette der Abbau zu Kohlendioxid (CO2) und Wasser. Da das PHB-Molekül nur aus den Atomen C, O und H besteht, können beim vollständigen Abbau nur CO2 und Wasser entstehen. Übrig bleiben minimale Mengen der leitenden Bahnen (10).In the latter case, the tricarboxylic acid cycle (TCA cycle) and the respiratory chain ultimately break down to carbon dioxide (CO 2 ) and water. Since the PHB molecule only consists of the atoms C, O and H, only CO 2 and water can be formed when it is completely broken down. Minimal quantities of the conductive tracks ( 10 ) remain.
Fig. 3 zeigt ein Substrat wie in Fig. 2 aber mit einer Schicht aus einem leitenden Polymer (11), z. B. Poly(2,5-furylen-vinylen) (PFV). Dieses regiert auf bestimmte Gase durch eine Leitfähigkeitsänderung und ist damit ein Gassensor. Fig. 3 shows a substrate as in Fig. 2 but with a layer of a conductive polymer ( 11 ), for. B. Poly (2,5-furylen-vinylene) (PFV). This reacts to certain gases by a change in conductivity and is therefore a gas sensor.
Fig. 4 zeigt schematisch auf einem Substrat nach Fig. 2 eine mäandrierende Widerstands bahn (12) und eine laterale Kapazität (13). Fig. 4 shows schematically on a substrate according to Fig. 2, a meandering resistance track ( 12 ) and a lateral capacitance ( 13 ).
Fig. 5 zeigt ein Substrat nach Fig. 2 mit zwei verschiedenen ionensensitiven Elektroden (14) und (15). FIG. 5 shows a substrate according to FIG. 2 with two different ion-sensitive electrodes ( 14 ) and ( 15 ).
Fig. 6 zeigt ein Substrat aus PHB mit eingelagerten Farbpigmenten (16) einer enantioselek tiven Farbe z. B. zur Detektion eines pH-Wertes mittels Durchstrahlung durch eine Licht quelle. Fig. 6 shows a substrate made of PHB with embedded color pigments ( 16 ) of an enantioselective color z. B. for the detection of a pH by means of radiation through a light source.
Fig. 7 zeigt ein Substrat aus PHB wie in Fig. 6 mit eingelagerten Farbreaktionen zeigenden Enzymen (17). Bei Durchstrahlung und Einwirkung einer zu messenden Konzentration ändert sich das Spektrum. Das kann für einen Sensor genutzt werden. FIG. 7 shows a substrate made of PHB as in FIG. 6 with enzymes ( 17 ) showing embedded color reactions. The spectrum changes as a result of radiation and exposure to a concentration to be measured. This can be used for a sensor.
Fig. 8 zeigt auf einem PHB-Substrat aufgebrachte Leiterbahnen (18) aus Kupfer und Lötbums (19) aus leitfähigem Kleber. Fig. 8 shows a PHB substrate applied conductor tracks (18) of copper and Lötbums (19) of conductive adhesive.
Fig. 9 zeigt die Ausgestaltung eines PHB-Substrats als Gehäuse (20) mit innen geführten Leiterbahnen (21) und nach außen geführten Verbindungen (22). Fig. 9 shows the configuration of a PHB-substrate as a housing (20) having inwardly directed conductor tracks (21) and guided outwardly compounds (22).
Alle in Fig. 2 bis Fig. 9 gezeigten elektronischen Bauelemente bestehen aus dem Material PHB, welches biologisch in Wasser und Kohlendioxid abgebaut wird, wenn die entspre chenden Bedingungen geschafft werden.All of the electronic components shown in Fig. 2 to Fig. 9 consist of the material PHB, which is biodegraded in water and carbon dioxide if the appropriate conditions are created.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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DE1997148173 DE19748173A1 (en) | 1997-10-31 | 1997-10-31 | Biodegradable electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE1997148173 DE19748173A1 (en) | 1997-10-31 | 1997-10-31 | Biodegradable electronic components |
Publications (1)
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DE19748173A1 true DE19748173A1 (en) | 1999-05-06 |
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Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008085904A1 (en) * | 2007-01-05 | 2008-07-17 | Charles Stark Draper Laboratory, Inc. | Biodegradable electronic devices |
US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
US8440546B2 (en) | 2004-06-04 | 2013-05-14 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US8536667B2 (en) | 2008-10-07 | 2013-09-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
US8666471B2 (en) | 2010-03-17 | 2014-03-04 | The Board Of Trustees Of The University Of Illinois | Implantable biomedical devices on bioresorbable substrates |
US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
US8934965B2 (en) | 2011-06-03 | 2015-01-13 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
US8975073B2 (en) | 2006-11-21 | 2015-03-10 | The Charles Stark Draper Laboratory, Inc. | Microfluidic device comprising silk films coupled to form a microchannel |
US9024394B2 (en) | 2013-05-22 | 2015-05-05 | Transient Electronics, Inc. | Controlled transformation of non-transient electronics |
US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
US9554484B2 (en) | 2012-03-30 | 2017-01-24 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
US9691873B2 (en) | 2011-12-01 | 2017-06-27 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
US9765934B2 (en) | 2011-05-16 | 2017-09-19 | The Board Of Trustees Of The University Of Illinois | Thermally managed LED arrays assembled by printing |
US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
US10918298B2 (en) | 2009-12-16 | 2021-02-16 | The Board Of Trustees Of The University Of Illinois | High-speed, high-resolution electrophysiology in-vivo using conformal electronics |
US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
US11670165B2 (en) | 2015-10-20 | 2023-06-06 | Stc, Inc. | Systems and methods for roadway management including feedback |
US11758579B2 (en) | 2018-10-09 | 2023-09-12 | Stc, Inc. | Systems and methods for traffic priority systems |
US11756421B2 (en) | 2019-03-13 | 2023-09-12 | Stc, Inc. | Protected turns |
-
1997
- 1997-10-31 DE DE1997148173 patent/DE19748173A1/en not_active Withdrawn
Cited By (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9450043B2 (en) | 2004-06-04 | 2016-09-20 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US12074213B2 (en) | 2004-06-04 | 2024-08-27 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US11088268B2 (en) | 2004-06-04 | 2021-08-10 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US8440546B2 (en) | 2004-06-04 | 2013-05-14 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US10374072B2 (en) | 2004-06-04 | 2019-08-06 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US8664699B2 (en) | 2004-06-04 | 2014-03-04 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US9768086B2 (en) | 2004-06-04 | 2017-09-19 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US9761444B2 (en) | 2004-06-04 | 2017-09-12 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US8975073B2 (en) | 2006-11-21 | 2015-03-10 | The Charles Stark Draper Laboratory, Inc. | Microfluidic device comprising silk films coupled to form a microchannel |
WO2008085904A1 (en) * | 2007-01-05 | 2008-07-17 | Charles Stark Draper Laboratory, Inc. | Biodegradable electronic devices |
US9012784B2 (en) | 2008-10-07 | 2015-04-21 | Mc10, Inc. | Extremely stretchable electronics |
US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
US8536667B2 (en) | 2008-10-07 | 2013-09-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
US11057991B2 (en) | 2009-12-16 | 2021-07-06 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
US10918298B2 (en) | 2009-12-16 | 2021-02-16 | The Board Of Trustees Of The University Of Illinois | High-speed, high-resolution electrophysiology in-vivo using conformal electronics |
US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
US9986924B2 (en) | 2010-03-17 | 2018-06-05 | The Board Of Trustees Of The University Of Illinois | Implantable biomedical devices on bioresorbable substrates |
US8666471B2 (en) | 2010-03-17 | 2014-03-04 | The Board Of Trustees Of The University Of Illinois | Implantable biomedical devices on bioresorbable substrates |
US9765934B2 (en) | 2011-05-16 | 2017-09-19 | The Board Of Trustees Of The University Of Illinois | Thermally managed LED arrays assembled by printing |
US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
US8934965B2 (en) | 2011-06-03 | 2015-01-13 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
US10349860B2 (en) | 2011-06-03 | 2019-07-16 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
US9691873B2 (en) | 2011-12-01 | 2017-06-27 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
US10396173B2 (en) | 2011-12-01 | 2019-08-27 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
US10357201B2 (en) | 2012-03-30 | 2019-07-23 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
US9554484B2 (en) | 2012-03-30 | 2017-01-24 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
US10052066B2 (en) | 2012-03-30 | 2018-08-21 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
US9024394B2 (en) | 2013-05-22 | 2015-05-05 | Transient Electronics, Inc. | Controlled transformation of non-transient electronics |
US11670165B2 (en) | 2015-10-20 | 2023-06-06 | Stc, Inc. | Systems and methods for roadway management including feedback |
US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
US11758579B2 (en) | 2018-10-09 | 2023-09-12 | Stc, Inc. | Systems and methods for traffic priority systems |
US11756421B2 (en) | 2019-03-13 | 2023-09-12 | Stc, Inc. | Protected turns |
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