DE19712749A1 - PCB for high current or high voltage applications - Google Patents
PCB for high current or high voltage applicationsInfo
- Publication number
- DE19712749A1 DE19712749A1 DE19712749A DE19712749A DE19712749A1 DE 19712749 A1 DE19712749 A1 DE 19712749A1 DE 19712749 A DE19712749 A DE 19712749A DE 19712749 A DE19712749 A DE 19712749A DE 19712749 A1 DE19712749 A1 DE 19712749A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- board
- ceramic
- base plate
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10454—Vertically mounted
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Die Erfindung betrifft eine Platine mit auf ihrer Lötseite montierten Bauelementen.The invention relates to a circuit board with on its solder side assembled components.
Der Einsatz von Schaltungsplatinen ist in der Elektro trotechnik, insbesondere in der Elektronik hinlänglich be kannt. Bedarf besteht jedoch hinsichtlich einer Platine als Netzteil für Hochstrom- , Hochspannungsapplikationen mit großer Leistung wie z. B. für Lasernetzteile, für Blitz technik und Reglertechnik, um Kabelanschlüsse und parasi täre Induktivitäten zu vermeiden, die EMV-Problematik ge ring zu halten, durch kompakte Bauweise den Platzbedarf zu reduzieren und für eine optimale Wärmeabfuhr über Luft- oder Wasserkühlung zu sorgen.The use of circuit boards is in electronics trotechnik, especially in electronics knows. However, there is a need for a circuit board as a power supply for high-current, high-voltage applications with great performance such. B. for laser power supplies, for flash technology and controller technology to make cable connections and parasi Avoid tary inductances, the EMC problem ring to keep the space required due to compact design reduce and for optimal heat dissipation via air or To provide water cooling.
Der Erfindung liegt daher die Aufgabe zugrunde, eine Pla tine der eingangs genannten Art so zu gestalten, daß die zuvor genannten Anforderungen bei ihrer Anwendung für Hochstrom- , Hochspannungsapplikation mit großer Leistung erfüllt werden.The invention is therefore based on the object, a pla tine of the type mentioned in such a way that the aforementioned requirements in their application for High current, high voltage application with great performance be fulfilled.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Platine als eine Hybrid-Power-Platine für Hochstrom- und/oder Hochspannungsapplikationen ausgelegt ist, die alle Kontroll- und Steuerfunktionalitäten aufweist, wobei un terhalb der Platine eine Aluminiumgrundplatte vorgesehen ist, aus der kühlturmartig Alu-Profile senkrecht heraus stehen, die die Platine durchsetzen und über deren obere Fläche hinausragen und an denen Leistungshalbleiter wärme kontaktiert sind, wobei eine den Zwischenraum zwischen der Aluminiumgrundplatte und der Platine ausfüllende,keramisch gefüllte Kunststoffschicht vorgesehen ist, durch die eine Wärmeableitung direkt aus der Platine gegenüber der Alumi niumgrundplatte und den auf der unteren Fläche der Platine montierten Bauelementen gegeben ist und deren Keramik schicht auf ihrer Ober- und Unterseite zugleich eine ver hältnismäßig hohe Spannungsfestigkeit der Platine bedingt, und wobei auf der unteren Fläche der Platine durch die ke ramisch gefüllte Kunststoffschicht isolierte Hochstrombe reiche vorgesehen sind.This object is achieved in that the Board as a hybrid power board for high current and / or High voltage applications is designed, all Control and control functionalities, wherein un an aluminum base plate is provided below the circuit board is from the cooling tower-like aluminum profiles vertically stand that penetrate the board and over the top Project surface and where power semiconductors heat are contacted, one of the spaces between the Aluminum base plate and the circuit board filling, ceramic filled plastic layer is provided through one Heat dissipation directly from the board opposite the aluminum nium base plate and on the lower surface of the board assembled components and their ceramics layer on its top and bottom at the same time relatively high dielectric strength of the board, and being on the lower surface of the board by the ke ramisch filled plastic layer insulated Hochstrombe rich are provided.
Vorzugsweise sind die Hochstrombereiche von Kupferstäben gebildet, die auf der unteren Fläche der Platine aufgelö tet und in der Keramikfüllmasse gelagert sind. Die Hoch strombereiche können auch von Kupferflächen gebildet sein, die galvanisch in Multilayer-Technik auf der unteren Flä che aufgebracht und in der isolierenden Keramikfüllmasse eingebettet sind.Preferably the high current areas are copper bars formed which resolved on the lower surface of the board tet and stored in the ceramic filling compound. The high current areas can also be formed by copper surfaces, the galvanic in multilayer technology on the lower surface che applied and in the insulating ceramic filling compound are embedded.
Die keramisch gefüllte Kunststoffschicht hat die Struktur einer hochgefüllten anorganischen Matrix und besteht vor zugsweise zu etwa 80% aus Keramikpartikeln.The ceramic-filled plastic layer has the structure a highly filled inorganic matrix and exists preferably about 80% ceramic particles.
Die Alu-Profile sind bevorzugt Vierkantprofile, die ca. 25 mm über die obere Fläche der Platine ragen können, wobei ihre freien Enden Kühlfahnen bilden.The aluminum profiles are preferably square profiles that are approx. 25 mm may protrude above the top surface of the board, with its free ends form cooling fins.
Da die Leistungshalbleiter an den kühlturmartigen Alu-Profi len wärmekontaktiert sind, ist über den verhältnismäßig gro ßen Querschnitt der jeweiligen Alu-Vierkantprofile eine opti male Kühlung gegenüber der Aluminiumgrundplatte möglich. Die erfindungsgemäße Hybrid-Power-Platine zeichnet sich durch ei ne kompakte Bauweise aus,wodurch ein geringer Platzbedarf ge geben ist. Da sich auf der Platine Kontroll- und Steuerfunk tionalitäten befinden, kann auf störanfällige und arbeitsin tensive Verkabelung verzichtet werden und parasitäre Indukti vitäten werden zugleich vermieden. Außerdem sorgt die Kera mikschicht auf der Ober- und Unterseite für eine hohe Span nungsfestigkeit der Platine, die deren Verwendung für Hoch strom- , Hochspannungsapplikation mit großer Leistung wie z. B. als Lasernetzteil, für die Blitztechnik und Reglertechnik bestens geeignet macht.Because the power semiconductors on the cooling tower-like aluminum professional len are in contact with heat is relatively large ß cross section of the respective aluminum square profiles an opti Male cooling possible compared to the aluminum base plate. The Hybrid power board according to the invention is characterized by egg ne compact design, resulting in a small footprint give is. Since there is control and control radio on the board functionalities, can be prone to malfunction and work tensive wiring and parasitic inductance vities are avoided at the same time. The Kera also ensures Mic layer on the top and bottom for a high chip resistance of the board, its use for high Current, high voltage application with great performance such as B. as a laser power supply, for flash technology and controller technology ideally suited.
Eine bevorzugte Ausführungsform der erfindungsgemäßen Hybrid- Platine wird nun anhand der einzigen Figur der Zeichnung be schrieben, die eine Schnittansicht des Aufbaus dieser Ausfüh rungsform zeigt.A preferred embodiment of the hybrid Circuit board will now be based on the single figure of the drawing who wrote a sectional view of the construction of this embodiment form shows.
Wie die Figur verdeutlicht, sind auf der Lötseite bzw. un teren Fläche 8 der Platine 1 in herkömmlicher Weise Bauele mente 9 wie z. B. Leistungskondensatoren montiert. Unterhalb der Platine 1 ist im Abstand eine Aluminiumgrundplatte 2 vor gesehen, die auf dem Boden 16 eines die Hybrid-Platine auf nehmenden Gehäuses 17 gelagert ist. Aus der Aluminiumgrund platte 2 stehen bei der dargestellten Ausführungsform drei im Abstand zueinander angeordnete kühlturmartige Alu-Vier kantprofile 3 senkrecht heraus, durchsetzen die Platine 1 und ragen über die obere Fläche 4 der Platine 1 etwa 25 mm hinaus. An den freien oberen Enden 14 der kühlturmartigen Alu-Vier kantprofile 3 sind Leistungshalbleiter 5 wärmekontaktiert, so daß die von letzteren ab gegebene Wärme über die Kühlfahnen 14 der Alu-Vierkantprofile 3 zu deren unteren Enden 15 und damit zur Aluminiumgrundplatte 2 abgeführt werden kann. Der Zwischenraum 6 zwischen der Aluminiumgrundplatte 2 und der Platine 1 ist mit einer isolierenden keramisch gefüllten Kunststoffschicht 7 ausgefüllt, die zu etwa 80% aus Keramik partikeln besteht. Diese Keramikfüllmasse 7 ermöglicht die Wärmeableitung direkt aus der Platine 1 gegenüber der Alumi niumgrundplatte 2 und den auf der unteren Fläche 8 der Plati ne 1 montierten Bauelementen 9 und sorgt mit ihrer Keramik schicht auf der Ober- und Unterseite 11 bzw. 12 zugleich für eine hohe Spannungsfestigkeit der Platine 1, auf der sich al le Kontroll- und Steuerfunktionalitäten befinden. Weiterhin sind auf der unteren Fläche 8 der Platine 1 Hochstrombereiche 13 vorgesehen, die in Form von Kupferstäben in der isolieren den Keramikfüllmasse 7 eingebettet sind.As the figure shows, are on the solder side or un lower surface 8 of the circuit board 1 in a conventional manner, elements 9 such as. B. power capacitors mounted. Below the circuit board 1 , an aluminum base plate 2 is seen at a distance, which is mounted on the bottom 16 of a housing 17 which takes the hybrid circuit board. From the aluminum base plate 2 in the illustrated embodiment, three spaced-apart cooling tower-like aluminum square profiles 3 stand out vertically, penetrate the board 1 and protrude beyond the upper surface 4 of the board 1 by about 25 mm. At the free upper ends 14 of the cooling tower-like aluminum four-section profiles 3 , power semiconductors 5 are heat-contacted, so that the heat given off by the latter can be dissipated via the cooling vanes 14 of the aluminum square sections 3 to their lower ends 15 and thus to the aluminum base plate 2 . The space 6 between the aluminum base plate 2 and the circuit board 1 is filled with an insulating ceramic-filled plastic layer 7 , which consists of approximately 80% ceramic particles. This Keramikfüllmasse 7 allows the heat dissipation directly from the board 1 with respect to the Alumi niumgrundplatte 2 and on the lower surface 8 of the Plati ne 1 mounted components 9 and, with its ceramic layer on the top and bottom 11 and 12 respectively at the same time a high level of Dielectric strength of the circuit board 1 , on which all control and control functionalities are located. Furthermore, high current areas 13 are provided on the lower surface 8 of the circuit board 1 , which are embedded in the form of copper rods in the insulating ceramic filling compound 7 .
Bei der Herstellung der den Zwischenraum 6 ausfüllenden kera misch gefüllten Kunststoffschicht, die bei der dargestellten Ausführungsform der Hybrid-Platine etwa eine Stärke von 25 mm aufweist, werden in flüssigen Kunststoff Keramikpartikel un ter Bildung einer anorganischen Matrix mit 80% Keramikan teil eingefüllt In the manufacture of the space 6 filling the ceramic-filled plastic layer, which in the illustrated embodiment of the hybrid circuit board has a thickness of approximately 25 mm, ceramic particles are filled in liquid plastic to form an inorganic matrix with 80% ceramic
11
Platine
circuit board
22nd
Aluminiumgrundplatte
Aluminum base plate
33rd
Alu-Profil, Alu-Vierkantprofil
Aluminum profile, aluminum square profile
44th
obere Fläche der Platine
top surface of the board
55
Leistungshalbleiter
Power semiconductors
66
Zwischenraum
Space
77
keramisch gefüllte Kunststoffschicht
ceramic filled plastic layer
88th
untere Fläche der Platine
lower surface of the board
99
Bauelement
Component
1010th
Keramikschicht
Ceramic layer
1111
Oberseite der Kunststoffschicht
Top of the plastic layer
1212th
Unterseite der Kunststoffschicht
Bottom of the plastic layer
1313
Hochstrombereich, Kupferstäbe, Kupferflächen
High current area, copper rods, copper surfaces
1414
obere freie Enden der Alu-Profile
upper free ends of the aluminum profiles
1515
untere Enden der Alu-Profile
lower ends of the aluminum profiles
1616
Boden des Gehäuses
Bottom of the case
1717th
Gehäuse
casing
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19712749A DE19712749A1 (en) | 1997-03-26 | 1997-03-26 | PCB for high current or high voltage applications |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19712749A DE19712749A1 (en) | 1997-03-26 | 1997-03-26 | PCB for high current or high voltage applications |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19712749A1 true DE19712749A1 (en) | 1998-10-01 |
Family
ID=7824721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19712749A Ceased DE19712749A1 (en) | 1997-03-26 | 1997-03-26 | PCB for high current or high voltage applications |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE19712749A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1100294A2 (en) * | 1999-11-09 | 2001-05-16 | Agile Systems Inc | Bus bar heat sink |
DE202018102586U1 (en) | 2018-01-23 | 2018-08-09 | MEGWARE Computer Vertrieb und Service GmbH | Housing arrangement for a loss of heat developing electronic assembly, in particular a switching power supply for data processing equipment |
-
1997
- 1997-03-26 DE DE19712749A patent/DE19712749A1/en not_active Ceased
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1100294A2 (en) * | 1999-11-09 | 2001-05-16 | Agile Systems Inc | Bus bar heat sink |
EP1100294A3 (en) * | 1999-11-09 | 2003-06-18 | Agile Systems Inc | Bus bar heat sink |
DE202018102586U1 (en) | 2018-01-23 | 2018-08-09 | MEGWARE Computer Vertrieb und Service GmbH | Housing arrangement for a loss of heat developing electronic assembly, in particular a switching power supply for data processing equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8131 | Rejection |