DE19502862B4 - FET-based sensor - Google Patents
FET-based sensor Download PDFInfo
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- DE19502862B4 DE19502862B4 DE1995102862 DE19502862A DE19502862B4 DE 19502862 B4 DE19502862 B4 DE 19502862B4 DE 1995102862 DE1995102862 DE 1995102862 DE 19502862 A DE19502862 A DE 19502862A DE 19502862 B4 DE19502862 B4 DE 19502862B4
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- 239000000758 substrate Substances 0.000 claims abstract description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 8
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- 239000008139 complexing agent Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
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- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
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- 150000003841 chloride salts Chemical class 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12Q—MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
- C12Q1/00—Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
- C12Q1/001—Enzyme electrodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
- G01N27/4145—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS specially adapted for biomolecules, e.g. gate electrode with immobilised receptors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
- G01N33/50—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
- G01N33/53—Immunoassay; Biospecific binding assay; Materials therefor
- G01N33/543—Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals
- G01N33/54366—Apparatus specially adapted for solid-phase testing
- G01N33/54373—Apparatus specially adapted for solid-phase testing involving physiochemical end-point determination, e.g. wave-guides, FETS, gratings
Abstract
Sensor auf der Basis eines Feldeffekttransistors mit einem durch ein Gatedielektrikum von einem Substrat isolierten Gatekontakt, dadurch gekennzeichnet, dass das Gatedielektrikum eine Schicht aus amorphem wasserstoffhaltigem Kohlenstoff (a-C:H) mit einer Grenzflächenzustandsdichte ≤ 5·1011 cm–2·eV–1 ist, und dass an die Oberfläche der a-C:H-Schicht für biochemisch aktive Substanzen sensitive Gruppen gebunden sind.Sensor based on a field effect transistor with a gate contact isolated from a substrate by a gate dielectric, characterized in that the gate dielectric is a layer of amorphous hydrogen-containing carbon (aC: H) with an interface state density ≤ 5 · 10 11 cm −2 · eV −1 , and that sensitive groups for biochemically active substances are bound to the surface of the aC: H layer.
Description
Die Erfindung betrifft einen Sensor auf FET-Basis (FET = Feldeffekttransistor).The The invention relates to a sensor based on FET (FET = field effect transistor).
In MOSFET-Bauelementen (MOSFET = Metal Oxide Semiconductor-Feldeffekttransistor) wird der Stromfluß zwischen Drain und Source durch Anlegen einer Steuerspannung am Gate gesteuert. Das Potential am Gatekontakt beeinflußt die Ausbildung oder die Aufhebung eines leitfähigen Kanals (Inversionsschicht) im Halbleitergrundmaterial (Silizium) unterhalb des Gatekontaktes: Transistoren vom Anreicherungs- bzw. Verarmungstyp (siehe dazu: G. Bohle, E. Hofmeister "Halbleiterbauelemente für die Elektronik", Siemens Aktiengesellschaft, Seiten 34 und 35, sowie: R. Müller "Bauelemente der Halbleiter-Elektronik", 3. Auflage, Springer-Verlag Berlin, Heidelberg 1987, Seiten 158 bis 161).In MOSFET devices (MOSFET = Metal Oxide Semiconductor field effect transistor) the current flow between Drain and source controlled by applying a control voltage to the gate. The potential at the gate contact influences the training or the Lifting a conductive Channel (inversion layer) in the semiconductor base material (silicon) below the gate contact: transistors from the enrichment or Depletion type (see: G. Bohle, E. Hofmeister "Semiconductor Components for the Electronics ", Siemens Aktiengesellschaft, pages 34 and 35, as well as: R. Müller "Components of semiconductor electronics", 3rd edition, Springer-Verlag Berlin, Heidelberg 1987, pages 158 to 161).
Um einen elektrischen Kurzschluß zwischen dem Gatekontakt und dem Siliziumsubstrat zu vermeiden, wird der Gatekontakt durch eine Isolatorschicht (Gateoxid) vom Substrat isoliert. An diese Schicht wird eine Reihe von Anforderungen gestellt, damit das von außen wirkende elektrische Feld durch den Isolator auf das Halbleitermaterial durchgreifen kann. So muß die Isolatorschicht dünn (ca. 100 nm) und durchschlagsfest sein, sie darf keine Pinholes aufweisen und muß eine niedrige Grenzflächenzustandsdichte besitzen (ca. 1011 cm–2·eV–1). Das Gateoxid wird im allgemeinen durch thermische Oxidation des Siliziumsubstrats erzeugt (siehe dazu: I. Ruge "Halbleiter-Technologie", 2. Auflage, Springer-Verlag Berlin, Heidelberg 1984, Seiten 352 bis 357).In order to avoid an electrical short circuit between the gate contact and the silicon substrate, the gate contact is insulated from the substrate by an insulator layer (gate oxide). This layer is subject to a number of requirements so that the external electrical field can penetrate through the insulator to the semiconductor material. For example, the insulator layer must be thin (approx. 100 nm) and puncture-proof, it must not have any pinholes and it must have a low density of interfaces (approx. 10 11 cm -2 · eV –1 ). The gate oxide is generally produced by thermal oxidation of the silicon substrate (see: I. Ruge "Semiconductor Technology", 2nd edition, Springer-Verlag Berlin, Heidelberg 1984, pages 352 to 357).
Das Prinzip der Stromsteuerung durch Anlegen eines entsprechenden Steuerpotentials am Gate kann auch genutzt werden, um Sensoren zu realisieren. Hierzu wird das Gate – anstelle eines Metallkontaktes – mit einer leitfähigen Flüssigkeit in Berührung gebracht, d.h. kontaktiert, wobei in der Flüssigkeit eine Bezugselektrode angeordnet ist. Auf diese Weise liegt am Gate ein Potential an, welches im wesentlichen vom Potentialunterschied zwischen der Gateisolatoroberfläche und dem Halbleitermaterial, d.h. dem Siliziumsubstrat, abhängt (siehe dazu: P. Bergveld, A. Sibbald "Analytical and Biomedical Applications of Ion-Sensitive Field-Effect Transistors", Elsevier Science Publishers B.V., Amsterdam 1988, Seiten 39 bis 49).The Principle of current control by applying a corresponding control potential at the gate can also be used to implement sensors. For this will be the gate - instead a metal contact - with a conductive liquid brought into contact i.e. contacted, a reference electrode in the liquid is arranged. In this way there is a potential at the gate which essentially depends on the potential difference between the gate insulator surface and the semiconductor material, i.e. the silicon substrate (see in addition: P. Bergveld, A. Sibbald "Analytical and Biomedical Applications of Ion-Sensitive Field-Effect Transistors ", Elsevier Science Publishers B.V., Amsterdam 1988, pages 39 to 49).
Der Drain-Source-Strom eines auf diese Weise realisierten ionenselektiven Feldeffekttransistors, kurz ISFET, ist abhängig vom Oberflächenpotential der Gateisolatoroberfläche und damit beispielsweise von der Ionenkonzentration in der Flüssigkeit. Nach diesem Prinzip lassen sich sowohl ionen- als auch pH-sensitive Feldeffekttransistoren realisieren. Ein wesentlicher Punkt ist dabei, daß die Flüssigkeit nicht direkt mit dem Halbleitermaterial in Kontakt kommt, d.h. daß das Gatematerial dicht gegen das zu untersuchende Medium ist.The Drain-source current of an ion-selective realized in this way Field effect transistor, ISFET for short, depends on the surface potential the gate insulator surface and thus, for example, of the ion concentration in the liquid. According to this principle, both ion and pH sensitive field effect transistors can be realized. An important point is that the liquid is not directly with the Semiconductor material comes into contact, i.e. that the gate material is tight against is the medium to be examined.
Derzeit werden die Gatebereiche von in herkömmlicher Technologie hergestellten Feldeffekttransistoren, bei denen das Gatematerial ein – gegebenenfalls mit Si3N4 versehenes – thermisches Oxid ist, mit geeigneten elektroaktiven Membranmaterialien versehen (siehe P. Bergveld et al., a.a.O., Seiten 46 bis 48). Zu diesem Zweck dienen Schichtaufbauten der Art SiO2/Membran oder SiO2/Parylen/Membran (Parylen ist ein plasmapolymerisiertes aromatisches Polymer). Auch eine organische Parylenschicht kann verwendet werden, um ionenselektive Moleküle kovalent an der Oberfläche zu fixieren; hierbei sind jedoch umständliche Mehrschichtaufbauten, wie SiO2/Si3N4/Parylen, notwendig, um die geforderte Dichtigkeit gegen die Analysenlösung zu erreichen (siehe P. Bergveld et al., a.a.O., Seite 43). Die damit zwangsläufig verbundene relativ große Schichtdicke beeinträchtigt aber die Empfindlichkeit des Sensorelementes.Currently, the gate regions of field-effect transistors manufactured using conventional technology, in which the gate material is a thermal oxide, optionally provided with Si 3 N 4 , are provided with suitable electroactive membrane materials (see P. Bergveld et al., Op. Cit., Pages 46 to 48). , Layer structures of the type SiO 2 / membrane or SiO 2 / parylene / membrane (parylene is a plasma-polymerized aromatic polymer) are used for this purpose. An organic parylene layer can also be used to fix ion-selective molecules covalently to the surface; However, cumbersome multilayer structures, such as SiO 2 / Si 3 N 4 / parylene, are necessary to achieve the required tightness against the analytical solution (see P. Bergveld et al., op. cit., page 43). However, the inevitably associated relatively large layer thickness affects the sensitivity of the sensor element.
Aufgabe der Erfindung ist es, einen Sensor auf FET-Basis derart auszugestalten, daß das Gatematerial – auch in dünner Schicht – eine kovalente Ankopplung von Sensormolekülen erlaubt und gleichzeitig die elektrische bzw. elektronische Funktion mit den gestellten Anforderungen erfüllt, so daß die Funktionsfähigkeit des Sensors gewährleistet ist.task the invention is to design a sensor based on FET in such a way that this Gate material - too in thinner Layer - one covalent coupling of sensor molecules allowed and at the same time the electrical or electronic function with the requirements Fulfills, So that the operability of the sensor guaranteed is.
Dies wird erfindungsgemäß dadurch erreicht, daß das Gatedielektrikum eine Schicht aus amorphem wasserstoffhaltigem Kohlenstoff (a-C:H) ist, der eine Grenzflächenzustandsdichte ≤ 5·1011 cm–2·eV–1 aufweist, und daß an die Oberfläche der a-C:H-Schicht Gruppen gebunden sind, welche für biochemisch aktive Substanzen sensitiv sind.This is achieved according to the invention in that the gate dielectric is a layer of amorphous hydrogen-containing carbon (aC: H) which has an interface state density ≤ 5 · 10 11 cm −2 · eV −1 , and that on the surface of the aC: H layer Groups are bound which are sensitive to biochemically active substances.
Beim Sensor nach der Erfindung wird durch die biochemisch aktiven Substanzen das Gatepotential beeinflußt, und damit ist eine Detektion dieser Substanzen möglich. Wichtig ist dabei, daß die Reaktion zwischen den biochemisch aktiven Substanzen und den sensitiven Gruppen des Sensors reversibel ist.At the Sensor according to the invention is by the biochemically active substances affects the gate potential, and this enables detection of these substances. It is important that the reaction between the biochemically active substances and the sensitive groups of the sensor is reversible.
Die sensitiven Gruppen sind insbesondere Enzyme, wie Glucoseoxidase, und Komplexbildner, beispielsweise in Form geeigneter Käfigverbindungen. Die zu detektierenden biochemisch aktiven Substanzen sind beispielsweise Glucose, Fructose, Lactat, Harnstoff und Kaliumionen (K+).The sensitive groups are in particular enzymes, such as glucose oxidase, and complexing agents, for example in the form of suitable cage compounds. The biochemically active substances to be detected are, for example, glucose, fructose, lactate, urea and potassium ions (K + ).
Die sensitiven Gruppen sind vorzugsweise über Haftvermittler an die a-C:H-Schicht gekoppelt; es kann aber auch eine direkte Anbindung an die a-C:H-Oberfläche erfolgen, d.h. ohne Verwendung eines Haftvermittlers. Als Haftvermittler dienen beispielsweise Aminoalkyl-alkoxysilane, die zur Anbindung der sensitiven Gruppen mit aliphatischen Dialdehyden behandelt werden. Weitere geeignete Haftvermittler sind Glycidoxypropyl-alkoxysilane sowie reaktive aliphatische und aromatische Carbonsäurederivate, wie Säurechloride und Anhydride.The sensitive groups are preferred coupled to the aC: H layer via adhesion promoters; however, a direct connection to the aC: H surface can also take place, ie without using an adhesion promoter. Aminoalkyl alkoxysilanes, for example, serve as adhesion promoters and are treated with aliphatic dialdehydes to bind the sensitive groups. Other suitable adhesion promoters are glycidoxypropyl alkoxysilanes and reactive aliphatic and aromatic carboxylic acid derivatives, such as acid chlorides and anhydrides.
Ein
besonderes Merkmal des beim Sensor nach der Erfindung eingesetzten
amorphen wasserstoffhaltigen Kohlenstoffs ist seine niedrige Grenzflächenzustandsdichte,
die ≤ 5·1011 cm–2·eV–1 beträgt. Ein
derartiges Material ist bekannt und wird durch eine Wasserstoffbehandlung
von a-C:H bei erhöhter Temperatur
und erhöhtem
Druck erhalten (siehe dazu
Die a-C:H-Schicht, die vorteilhaft strukturiert ist, besitzt im allgemeinen einen optischen Bandabstand zwischen 0,8 und 2,7 eV. Zur Erzielung guter Isoliereigenschaften beträgt der optische Bandabstand vorzugsweise 0,9 bis 1,7 eV. Die a-C:H-Schicht weist an ihrer Oberfläche vorteilhaft sauerstoffhaltige Gruppen auf, wobei die Sauerstoffkonzentration vorzugsweise zwischen 1 und 20 Atom-% liegt.The a-C: H layer, which is advantageously structured, generally has an optical bandgap between 0.8 and 2.7 eV. To achieve good insulation properties the optical bandgap preferably 0.9 to 1.7 eV. The a-C: H layer instructs their surface advantageous oxygen-containing groups, the oxygen concentration is preferably between 1 and 20 atomic%.
Die
Herstellung des Gatedielektrikums erfolgt durch plasmachemische
Abscheidung von a-C:H-Schichten. Diese Schichten lassen sich auf
Siliziumsubstraten in dünner
Schicht (ca. 100 bis 500 nm) stoffschlüssig aus einem Kohlenwasserstoffplasma
abscheiden (RF-Anregung, kapazitive Ankopplung, Selfbias-Spannung zwischen –200 und –900 V);
sie besitzen eine ausreichende Dichtigkeit gegen Wasser bzw. wäßrige Medien
und sind photostrukturierbar (siehe dazu: H. Reichl (Editor) "Micro Systems Technologies
90", Springer-Verlag
Berlin, Heidelberg 1990, Seiten 307 bis 312). Durch eine geeignete Wasserstoffhochdruckhandlung
wird eine ausreichend niedrige Grenzflächenzustandsdichte erzielt (siehe
In einem nachfolgenden Ätzschritt mit einem Sauerstoffplasma werden auf den a-C:H-Schichten oberflächlich sauerstoffhaltige Anknüpfungsstellen erzeugt (OH, COOH, CO), an welche – gegebenenfalls über zusätzliche Kopplungsmoleküle, wie Aminoalkyl-alkoxysilane, Glycidoxypropyl-alkoxysilane und reaktive Carbonsäurederivate – die Sensormoleküle, beispielsweise Enzyme, angekoppelt werden können. An derartige Schichten angekoppelte Enzyme zeigen im fixierten Zustand eine ausreichende Enzymaktivität, welche zur Detektion entsprechender Moleküle bei einem ChemFET dienen kann.In a subsequent etching step With an oxygen plasma, the a-C: H layers become superficially oxygen-containing Links created (OH, COOH, CO), to which - if necessary via additional Coupling molecules, such as aminoalkyl alkoxysilanes, glycidoxypropyl alkoxysilanes and reactive ones Carboxylic acid derivatives - the sensor molecules, for example Enzymes that can be coupled. Enzymes coupled to such layers show in the fixed state sufficient enzyme activity, which are used to detect corresponding molecules in a ChemFET can.
Anhand von Ausführungsbeispielen soll die Erfindung noch näher erläutert werden.Based of embodiments the invention is intended to be closer explained become.
Eine
Siliziumscheibe (p-dotiertes Si; Widerstand: 60 Ω·cm) wird – nach einer Vorbehandlung (Sputtern
in Argon für
2 min bei 0,2 mbar und einer Selfbias-Spannung von –900 V) – in einem
RF-angeregten (RF = Radiofrequenz, d.h. 0,1 bis 100 MHz), kapazitiv
angekoppelten CH4-Plasma (siehe dazu beispielsweise
Eine Probe des auf die vorstehend genannte Weise hergestellten Substrats mit den Abmessungen 2,5 cm × 1 cm wird in einen Exsikkator eingebracht und dort gehaltert. Bei einem Druck von ca. 15 mbar werden durch ein Septum 0,1 ml 3-Aminopropyltriethoxysilan unter die Probe eingespritzt. Nach einer Einwirkungsdauer von 5 min wird der Exsikkator belüftet. Der auf die Probe aufgedampfte Haftvermittler wird anschließend 15 min bei 150°C eingebrannt. Anschließend wird die Probe in einer 5%igen Glutardialdehydlösung 2 h bei Raumtemperatur auf einem Schütteltisch geschüttelt (50 min–1). Nach gründlichem Spülen mit einem Puffer (pH 7,2) wird die Probe in 40 ml einer Glucoseoxidaselösung (120 mg Glucoseoxidase mit einer Aktivität von 252 U/mg in 40 ml eines Puffers mit pH 7,2) eingebracht und 24 h bei Raumtemperatur auf dem Schütteltisch geschüttelt (50 min–1). Anschließend wird 5 min mit einer 1 M NaCl-Lösung extrahiert und gründlich mit einem Puffer (pH 7,2) gespült; die Probe wird dann in diesem Puffer gelagert. Zur Bestimmung der Enzymaktivität wird die Probe in 4 ml einer 1,25%igen D-(+)-Glucoselösung eingebracht. Bei 25°C wird 30 min kräftig mit gereinigter Preßluft begast. Danach wird mit einem enzymatischen Glucosetest (Granutest 100, Diagnostica Merck Nr. 12193) der Restzuckergehalt bestimmt. Aus dem gemessenen D-(+)-Glucoseabbau errechnet sich für die Probe eine Enzymaktivität von 0,4 μmol/min; nach drei Tagen beträgt die Enzymaktivität 0,22 μmol/min.A sample of the substrate with the dimensions 2.5 cm × 1 cm produced in the above-mentioned manner is placed in a desiccator and held there. At a pressure of approx. 15 mbar, 0.1 ml of 3-aminopropyltriethoxysilane is injected into the sample through a septum. After 5 minutes of exposure, the desiccator is aerated. The adhesion promoter evaporated onto the sample is then baked at 150 ° C. for 15 minutes. The sample is then shaken in a 5% glutardialdehyde solution for 2 hours at room temperature on a shaking table (50 min -1 ). After thorough rinsing with a buffer (pH 7.2), the sample is introduced into 40 ml of a glucose oxidase solution (120 mg glucose oxidase with an activity of 252 U / mg in 40 ml of a buffer with pH 7.2) and applied for 24 hours at room temperature shaken the shaking table (50 min –1 ). The mixture is then extracted for 5 min with a 1 M NaCl solution and rinsed thoroughly with a buffer (pH 7.2); the sample is then stored in this buffer. To determine the enzyme activity, the sample is placed in 4 ml of a 1.25% D - (+) - glucose solution. At 25 ° C, gassing with purified compressed air is vigorous for 30 min. The residual sugar content is then determined using an enzymatic glucose test (Granutest 100, Diagnostica Merck No. 12193) certainly. From the measured D - (+) - glucose breakdown, an enzyme activity of 0.4 μmol / min is calculated for the sample; after three days the enzyme activity is 0.22 μmol / min.
Claims (7)
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Citations (2)
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DE3725700A1 (en) * | 1987-08-03 | 1989-02-16 | Siemens Ag | NEW SEMICONDUCTOR BASE MATERIAL |
EP0617462A2 (en) * | 1993-03-09 | 1994-09-28 | Siemens Aktiengesellschaft | Hydrogen containing amorphous carbon |
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1995
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Patent Citations (3)
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DE3725700A1 (en) * | 1987-08-03 | 1989-02-16 | Siemens Ag | NEW SEMICONDUCTOR BASE MATERIAL |
US5055421A (en) * | 1987-08-03 | 1991-10-08 | Siemens Aktiengesellschaft | Method for the plasma deposition of hydrogenated, amorphous carbon using predetermined retention times of gaseous hydrocarbons |
EP0617462A2 (en) * | 1993-03-09 | 1994-09-28 | Siemens Aktiengesellschaft | Hydrogen containing amorphous carbon |
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Title |
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BERGVELD, P., SIBBALD, A.: Analytical and Biome- dical Application of Ion-Sensiitive Field-Effect- Transistors, Elsevier Science Pub. 1988, S. 39-49 * |
BOHLE, G., HOFMEISTER, E.: Halbleiterbauelemente für die Elektronik, Siemens AG, S. 34/35 * |
ICOLLIAN, E.H., DREWS, J.R.: MOS Physics and Technology, John Wiley 1982, S. 325-328 * |
MÜLLER, R.: Bauelemente der Halbleiter-Elektronik, 3. Aufl., Springer-Verlag 1987, S. 158-161 |
MÜLLER, R.: Bauelemente der Halbleiter-Elektronik,3. Aufl., Springer-Verlag 1987, S. 158-161 * |
NICOLLIAN, E.H., DREWS, J.R.: MOS Physics and Technology, John Wiley 1982, S. 325-328 |
RUGE, I.: Halbleiter-Technologie, 2. Aufl., Springer-Verlag 1984, S. 352-357 * |
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