DE1812187B2 - PROCESS FOR CUTTING GROOVES IN THIN LAYERS APPLIED ON A SUPPORT BODY FOR ELECTROTECHNICAL APPLICATIONS USING CONCENTRATED LASER RADIATION - Google Patents

PROCESS FOR CUTTING GROOVES IN THIN LAYERS APPLIED ON A SUPPORT BODY FOR ELECTROTECHNICAL APPLICATIONS USING CONCENTRATED LASER RADIATION

Info

Publication number
DE1812187B2
DE1812187B2 DE19681812187 DE1812187A DE1812187B2 DE 1812187 B2 DE1812187 B2 DE 1812187B2 DE 19681812187 DE19681812187 DE 19681812187 DE 1812187 A DE1812187 A DE 1812187A DE 1812187 B2 DE1812187 B2 DE 1812187B2
Authority
DE
Germany
Prior art keywords
support body
laser radiation
thin layers
cutting grooves
layers applied
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19681812187
Other languages
German (de)
Other versions
DE1812187A1 (en
DE1812187C3 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to DE19681812187 priority Critical patent/DE1812187B2/en
Priority to NL6915018A priority patent/NL6915018A/xx
Priority to ES373952A priority patent/ES373952A1/en
Priority to LU59908D priority patent/LU59908A1/xx
Priority to AT1111769A priority patent/AT297153B/en
Priority to BE742403D priority patent/BE742403A/xx
Priority to FR6941163A priority patent/FR2024557A1/fr
Priority to JP44095402A priority patent/JPS5022278B1/ja
Priority to GB58562/69A priority patent/GB1255373A/en
Publication of DE1812187A1 publication Critical patent/DE1812187A1/en
Publication of DE1812187B2 publication Critical patent/DE1812187B2/en
Application granted granted Critical
Publication of DE1812187C3 publication Critical patent/DE1812187C3/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
DE19681812187 1968-11-29 1968-12-02 PROCESS FOR CUTTING GROOVES IN THIN LAYERS APPLIED ON A SUPPORT BODY FOR ELECTROTECHNICAL APPLICATIONS USING CONCENTRATED LASER RADIATION Granted DE1812187B2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE19681812187 DE1812187B2 (en) 1968-12-02 1968-12-02 PROCESS FOR CUTTING GROOVES IN THIN LAYERS APPLIED ON A SUPPORT BODY FOR ELECTROTECHNICAL APPLICATIONS USING CONCENTRATED LASER RADIATION
NL6915018A NL6915018A (en) 1968-11-29 1969-10-03
ES373952A ES373952A1 (en) 1968-11-29 1969-11-26 Improvements in or relating to methods of manufacturing components employing a high-energy beam of electromagnetic radiation
AT1111769A AT297153B (en) 1968-11-29 1969-11-27 Process for removing surface layers of electrical and / or electronic components by means of bundled laser radiation
LU59908D LU59908A1 (en) 1968-11-29 1969-11-27
BE742403D BE742403A (en) 1968-11-29 1969-11-28
FR6941163A FR2024557A1 (en) 1968-11-29 1969-11-28
JP44095402A JPS5022278B1 (en) 1968-11-29 1969-11-29
GB58562/69A GB1255373A (en) 1968-11-29 1969-12-01 Improvements in or relating to methods of manufacturing components employing a high-energy beam of electromagnetic radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681812187 DE1812187B2 (en) 1968-12-02 1968-12-02 PROCESS FOR CUTTING GROOVES IN THIN LAYERS APPLIED ON A SUPPORT BODY FOR ELECTROTECHNICAL APPLICATIONS USING CONCENTRATED LASER RADIATION

Publications (3)

Publication Number Publication Date
DE1812187A1 DE1812187A1 (en) 1970-06-18
DE1812187B2 true DE1812187B2 (en) 1973-03-01
DE1812187C3 DE1812187C3 (en) 1975-02-27

Family

ID=5714965

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681812187 Granted DE1812187B2 (en) 1968-11-29 1968-12-02 PROCESS FOR CUTTING GROOVES IN THIN LAYERS APPLIED ON A SUPPORT BODY FOR ELECTROTECHNICAL APPLICATIONS USING CONCENTRATED LASER RADIATION

Country Status (1)

Country Link
DE (1) DE1812187B2 (en)

Also Published As

Publication number Publication date
DE1812187A1 (en) 1970-06-18
DE1812187C3 (en) 1975-02-27

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
EHJ Ceased/non-payment of the annual fee