DE1590963A1 - Tool for fastening microwire - Google Patents

Description

"Tools for attaching T: tiltro wire" The connection concerns a tool for attaching micro-wire to contact surfaces during manufacture of electrical components, in particular of transistors, in which the microwire Via a wire guide of the pressure surface of a chisel that can be shrunk into a holder to-.Watchable @ is, ..

For: attaching very thin wires to very small ones. The principle of thermo-compression or ultra sonic welding is used on contact surfaces. Using a special tool, the microwire is removed using. Pressure. And increased temperature or pressure and ultrasound mechanically and electrically conductively connected to the contact surface "Such special @; derxLz @ uge, hereinafter referred to as bonding chisels, are subject to different. Stresses. The microwire must not stick to the bonding chisel, for example The wire routing must be designed in such a way that the length of the T_Sikrod.r @; htes against pressure and temperature resistance as well as a gassing of the bonding chisel shape, which enables the contacting process to be observed as unhindered as possible, are additional requirements Such a tool, known are BonJ: pißel in the standard of an I_niles ol-üne any guide for the T "_ro ,, wire, The fixing of the T" _ _ ro wire can be realized here, for example, by a separate guide tube . Separate alignment of bond chisel and guide tube as well as poor control over: the days d-3 o F.Iikrodrihte s after: 'a-7s @, - the exit from the guide tube are the :: @ ptL? t I_i: the greatest disadvantages. Dond chisels with a central bore #; M wire guide are also known. Since the bonhzeirel are made of synthetic stone or hard metal because of the high stress and to avoid the sticking of the resin, the introduction of the p,: likrobohrnng Jur-ihrün of the Iaikro wire very expensive. Especially since the drill hole must have a high level of surface toxicity in order to avoid leakage of the 1: I (ikrodrahtea "" u, but such hairdryers become unusable very quickly, as the T`.ilzrobolirung easily clogged and then can no longer be cleaned, another difficulty results when the microwire is inserted into the guide hole, which often fails in spite of the use of a gas flow. Bel "arlnt are also bonds, which simplify the positioning of the guide hole and improve the insertion area -lix- for the microwire are designed to be narrowly divided along the guide bore. Increased effort when creating the chisel parts, especially the mating surfaces for joining the chisel halves, so there is increased instincting effort when inserting the boncbnci into the: tool @ xg; er question the mentioned advantage, -n: -eck of the invention it is q- to reduce the manufacturing costs for the d ^ r # 2rf? ge Dond chisels 1u13 the handling by -ine, intimate 1, '.onstrul ° "-Gion To simplify. The basic task is to create a tool i B £ '? 7.n11 by T.IiI #: rodrallt, in particular a Bond.-i @cl to en tr @ cl @ eln @ the one that is easy to manufacture i @ eizde wire guide, in which the I Tihroaa @ i oa? _n additional IIilf rmittel. be .P, rfindui? According to viird the task is solved by the fact that on the; = tool for? Attach 1lilz-rodral-iü a wire guide -inc @ rn a groove on the surface of the conical. Part of the - "'ierkzeugschaftes is arranged in the direction of the pressure surface and covered by means of a wire loop firmly connected to the shaft this ",; = derkzeug- °: rird -the -ITikrodraht no longer", # Up to now it was usually filled through a long tube or cannula, but it is only yelled through a short guide line Approx. 10 / um possible without difficulty and a great deal of time. It is impossible to clog the wire guide with dust or torn wire. Furthermore, it is not very necessary to provide the entry and exit of the wire guide with smooth radii.

When using a flat object as a cover "In order to avoid wire abrasion, the aunts who use the. T @ likrodraht- come into contact, only to be rounded off.

When using wire as a cover over the wire guide, a rounded shape is inevitably created. This avoids damaging the Llicro wire when threading it in and while it is being retightened during the bonding process. The invention will be explained with reference to a drawing shown in embodiments, the drawings: Fig. 1 is a TTeißel with incorporated groove, Figure 2 shows a bit with a groove in the wire loop.. The tool shown in FIG. 1 consists of a chisel 1 'in which a groove 3 running on the circumference along the axis in the direction of the pressure surface 4 is incorporated. A wire loop 2 is firmly connected to the chisel 1 to cover the groove 3. In Fig. 2 a Giierkzet.g is shown t that also from the chisel 1 with the wire loop 2 fixedly arranged on it. In this case, the groove 3 is incorporated into the wire loop 2.

The Lleißel shown in the drawing are very. small! the diameter the printing area 4 has a size of cm, 40 / µm.

Claims (1)

Patent claims: -'1. "'Ierkzeug for attaching microwire to contact surfaces in the production of electrical components, in particular of transistors with a wire guide having a conical shape towards a pressure surface, characterized in that the wire guide in the form of a groove on the surface of the conical file of the Tool shank is arranged in the direction of the pressure surface and is covered by means of a wire loop firmly connected to the shank, 2. 'tool according to is, - . : @. 1 1.1e i.ß el 2 Wire loop 3 With 4 pressure area