DE1521353A1 - Arrangement for the production of surface protection for solids - Google Patents
Arrangement for the production of surface protection for solidsInfo
- Publication number
- DE1521353A1 DE1521353A1 DE19631521353 DE1521353A DE1521353A1 DE 1521353 A1 DE1521353 A1 DE 1521353A1 DE 19631521353 DE19631521353 DE 19631521353 DE 1521353 A DE1521353 A DE 1521353A DE 1521353 A1 DE1521353 A1 DE 1521353A1
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- 239000007787 solid Substances 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000000463 material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 150000002927 oxygen compounds Chemical class 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 claims 1
- 235000011613 Pinus brutia Nutrition 0.000 claims 1
- 241000018646 Pinus brutia Species 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 229940126086 compound 21 Drugs 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 229910017464 nitrogen compound Inorganic materials 0.000 claims 1
- 150000002830 nitrogen compounds Chemical class 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000001590 oxidative effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 206010035148 Plague Diseases 0.000 description 1
- 241000607479 Yersinia pestis Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J19/088—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
- H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
- H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Ceramic Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
Description
11. 10, 1963 P 94 00111.10.1963 P 94 001
Anordnung zur Herateilung eines Oberflächensohutzes bei FestkörpernArrangement for the division of a surface protection for solids
In der Technik tritt häufig die Forderung auf, Festkörper an ihrer Oberfläche mit einer dünnen bcuieht zum üehutze gegen Korrosion, zur mechanik dien Oberflächenstabilisierung oder auch zur elektrischen Isolierung oder speziellen Kontaktierung zu überziehen.In technology there is often the requirement that solids on its surface with a thin cover to cover it against corrosion, surface stabilization is used for mechanics or for electrical insulation or special contacting to cover.
Eine entsprechende Oberflächenbehandlung ist besonders bei Halbleiterkörpern von groüer Bedeutung. Beispielsweise wirkt ein Oxydüberzug in vorteilhafter Weise konservierend und mechanisch festigend, und eine mit einer Oxydhaut überzogene Siliziumoberflache zeigt konstante elektrische uigenschaften und große Korrosionsbeständigkeit.Appropriate surface treatment is particularly important Semiconductor bodies of great importance. For example, an oxide coating has an advantageous preservative and mechanically strengthening, and a silicon surface coated with an oxide skin shows constant electrical properties and great corrosion resistance.
Zur herstellung vorteilhafter üchichten auf Festkörpern, beispielBweibe einer Oxydschicht auf einem UuIbleiterelernent* sind bereite viele Verfauren bekannt geworden. Besonderen Raum nimmt unter anderen Verfahren die thermische Oxydation ein, die sowohl unter bestimmten uruck als auch unter bestimmten Atmosphärenverhältnistsen, nämlich in f eucuter oder trockener Sauerstoffatmosphäre, ausgeführt wird. Bekanat ist außerdem die anodische Oxydation in einem Elektrolyten. Yiela Oxydschichten, die nach diesen bekannten Verfahren aufgebracht wurden^ weisen jedoch noch unerwünschte Mängel, witi beispielsweise eine ungenügende Haftfestigkeit, Reinheit und Diohfce auf * -Diese Mängel bewirken in den meisten lallen, daß der Überzug selbst und der überzogene Festkörper gegenüber äußerm Einwirkungen unbeständig ist. Bei Halbleiteroberflachen werden auch häufig ungünstige Veränderungen der elektrischen fcIgenschaften, beispielsweise eine Versehlechteiung der Bperr-.charakteristik bei einer Diode, festgestellt.For the production of advantageous layers on solids, For example, there is an oxide layer on a UuIconductor element * many writers have already become known. Special ones Thermal oxidation takes up space among other processes, both under certain pressure and under certain conditions Atmospheric conditions, namely in f eucuter or dry oxygen atmosphere. Bekanat is also the anodic oxidation in an electrolyte. Yiela Oxide layers applied according to these known methods were ^ however still have undesirable defects, witi for example insufficient adhesive strength, purity and diohfce on * -These deficiencies cause in most of the slurps that the Coating itself and the coated solid opposite extremely Influences is impermanent. In the case of semiconductor surfaces also often unfavorable changes in the electrical properties, for example a misrepresentation of the barrier characteristic at a diode.
BAD ORIGtNAtORIGINAL BATHROOM
909830/0566909830/0566
- 2 - P 94 001- 2 - P 94 001
Mit Hilfe der in der vorliegenden Erfindung beschriebenen Anordnung und des damit durchführbaren Verfahrens kann nicht nur eine Oxydierung sondern auch eine Nietrierung in kürzestst Zeit vorgenommen werden. Vor allem werden durch eine Oxydschichtbildung, beispielsweise auf einer Halbleiteroberfläche, überraschend vorteilhafte Eigenschaften erzielteWith the help of those described in the present invention Arrangement and the process that can be carried out with it cannot only an oxidation but also a riveting in the shortest possible time Time to be made. Above all, the formation of an oxide layer for example on a semiconductor surface, achieved surprisingly advantageous properties
Die Erfindung betrifft eine Anordnung zur Herstellung eines Oberflächenschutzes bei Pestkörpern, vorzugsweise bei Halbleiterfestkörpern mit oder ohne einem oder mehreren pn-Über-" gangen und besteht darin, daß ein Oberflächenüberzug mittels einem durch Funkenentladung hervorgerufenen, hochionisierten Plasma, in einem evakuierbaren Entladungsgefäß εit vakuumdicht durchgeführten Elektroden, von denen mindestens eine aus gleichem Material ist, wie der zu behandelnde Festkörper, unter einem für die Behandlung notwendigen Medium, erzeugt wird.The invention relates to an arrangement for producing a Surface protection for plague bodies, preferably for semiconductor solids with or without one or more pn over- " and consists in that a surface coating by means of a caused by spark discharge, highly ionized Plasma, in a discharge vessel that can be evacuated, is vacuum-tight electrodes carried out, at least one of which is made of the same material as the solid body to be treated, under a medium necessary for the treatment.
In einer evakuierbaren Anordnung, beispielsweise aus zwei in Glas eingeschmolzenen Elektroden bestehend, wird ein auf sei in; Oberfläche zu behandelnder Festkörper in einer gewünschten Atmosphäre, in bestimmter i/eise einer Funkenentladung auage- setzt. Der zu behandelnde Festkörper wird in das durch die Funkenentladung hervorgerufene, stark ionisierte Ga&plasna gebracht und damit der Einwirkung dieses Plasmas voll ausgesetzt. Da die Plusmaeinwirkung bei periodischem Funkenüterschlag nur kurzzeitig erfolgt, findet nur an der Oberfläche des zu behandelnden Festkörpers eine wesentliche rfärmeeinwirkung statt. Die Beschränkung der Wärmeeinwirkung aul' die Oberfläche gewährleistet bei Halbleitern die Erhaltung der leber. 3 ~ dauer und die Erhaltung der guten Sperreigenscfc.£.ften der pxx-Ubergänge« In an evacuable arrangement, for example consisting of two electrodes fused in glass, an on be in; Surface of the solid body to be treated in a desired atmosphere, subject to a spark discharge in a certain way . The solid body to be treated is brought into the strongly ionized Ga & plasna caused by the spark discharge and thus fully exposed to the action of this plasma. Since the plus-measure effect occurs only briefly in the case of periodic sparks, a significant thermal effect only takes place on the surface of the solid body to be treated. The limitation of the effect of heat on the surface ensures that the liver is preserved in the case of semiconductors. 3 duration and the maintenance of the good blocking properties of the pxx transitions "
Mindestens eine der Elektroden ist in vorteilhafter weise aus dem Material des mit einem Oberflächenschutz zu vergehenden Festkörpers.Die Elektroden selbst können zur .Erzielung ge-At least one of the electrodes is advantageously made of the material of the solid body to be passed with a surface protection. The electrodes themselves can be used to.
909830/0566909830/0566
8AD ORIGINAL8AD ORIGINAL
- :·* ■ ρ 94 οοι-: · * ■ ρ 94 οοι
wünschter günstiger Effekte auch besonders ausgebildet sein« Beispielsweise können eine oder mehrere der Elektroden eine düsenfürmige Durchbohrung in Längsrichtung aufweisen,, durch die ein bestimmtes strömendes Medium, beispielsweise ein Sauerstoffstrom, auf das zu behandelnde, beispielsweise zu oxydierende Materialstück gerichtet, geblasen werden kann.desired beneficial effects also be specially designed " For example, one or more of the electrodes can have a nozzle-shaped perforation in the longitudinal direction that a certain flowing medium, for example a stream of oxygen, towards the to be treated, for example towards oxidizing piece of material directed, can be blown.
Besonders vorteilhaft kann durch eine spezielle Ausbildung der einzelnen Elektroden bewirkt werden, daß die Funkenentladung und der Verfahrensablauf bei einer Oxydierung oder Nitrierung günstig vor sich geht« So weist die Ausgangs» elektrode einer Funkenentladung am äußeren Ende vorzugsweise eine relativ geringe räumliche Ausdehnung, beispielsweise eine spitzen- oder kugelförmige Ausbildung und die Gegenelektrode eine relativ große räumliche Ausdehnung, 'oeispielf weise eine kegelstumpf-, teller- oder hohlkugelförmige Ausbildung auf.A special training can be particularly advantageous of the individual electrodes are effected that the spark discharge and the process sequence in an oxidation or Nitriding works favorably "This is how the output" electrode preferably exhibits a spark discharge at the outer end a relatively small spatial extent, for example a pointed or spherical design and the counter electrode a relatively large spatial expansion, for example a truncated cone, plate or hollow spherical formation.
Die räumlich relativ große Ausdehnung ist besonders als Halterung des zu behandelnden Gegenstandes, der sowohl isoliert als auch in besonderen Fällen elektrisch !Leiteftd ftUf die Gegenelektrode angebracht werden kann, geeignet· AUßerdi m kann ein im Plaema der Funkenentladung zu behandelnder P«et körper auch mittels einer besonderen HalterungeVorrichtung im Raum vor der Gegenelektrode, vorteilhafterweisβ mittels einer Saughalterung, angebracht sein. Der Recipient,, in dem die Funkenentladung abläuft, ist entweder aus einem vakuumdichten elektrisch isolierenden Material, wie Glue oder Qua '?·<aufgebaut oder auf der Innenseite elektrisch isoliert. Die •Elektroden sind dann entweder in vakuumdichter tSinaohmelzun : oder mit einer zusätzlichen isolierenden Durchführung im Rezipienten angeordnet.The relatively large spatial expansion is particularly than Holder of the object to be treated, which is both insulated and, in special cases, electrically! Leiteftd ftUf the counter electrode can be attached, suitable · outside di m can a P «et to be treated in the area of the spark discharge body also by means of a special holding device in the space in front of the counter electrode, advantageously by means of a suction holder. The recipient, in which the spark discharge is either made of a vacuum-tight, electrically insulating material such as glue or Qua '? · < or electrically insulated on the inside. the • Electrodes are then either in vacuum-tight tSinaohmelzun: or arranged in the recipient with an additional insulating bushing.
Eine weiter bildung der erfindungsgemäßen Anordnung beisteht darin, daß jeweils zwei oder mehr gleichartige Elektroden parallel angeordnet sind und entweder gemeinsam über eine Durchführung oder jede für sich elektrisch eingespeist werö *:/iA further development of the arrangement according to the invention is available in that there are two or more electrodes of the same type are arranged in parallel and either jointly via a Implementation or each individually electrically fed werö *: / i
909830/0566909830/0566
BAD ORIGINALBATH ORIGINAL
■1 P 94 001■ 1 P 94 001
Au'*h in einer B0.loh.cn .Anordnung können die ISJ ex I ro den in vo χ ti il haJ'te ν Weise alt» Jiliilaiiduaen ausgebildet a «in. Zur Verstärkung oer IMc ht ν/ϊ.'.'!<■ ung deu strömenden Mediums v/erden die JSinXaj; düsen zylindcirrüraig, vorzugsweise konisch auu^ebiJ det«Also in a B0.loh.cn. Arrangement, the ISJ ex I ro den in vo χ ti il haJ'te ν way old "Jiliilaiiduaen trained a" in. To reinforce the flowing medium, the JSinXaj; nozzles cylindrical, preferably conical
Mit dieser erfindungsgemäßon Anordnung kann in überraschend einfacher Weise, beispielsweise ein Halbleiterkörper mit oder ohne einem oder mehreren pn-Übürgängen oxydiert werden, lter Halbleiterkörper, beispielsweise Silizium, wird also isoliert auf die Gegenelektrode aufgebracht« Die Funkenentladung» die in einem strömenden Medium, vorzugsweise in trockenem oder feuchtem Sauerstoff, stattfindet ν bewirkt eine Oxydschicht.-bildung in einem Zeitraum von einigen Sekunden, Eine so erzielte Oxidschicht ist den in bisher bekannten Verfahren herhergesteilten, an Güte und Beständigkeit überlegen und gewährleistet außerdem noch die Erhaltung von elektrischen Daten& With this arrangement according to the invention, for example, a semiconductor body with or without one or more pn transitions can be oxidized in a surprisingly simple manner dry or moist oxygen, ν causes an oxide layer to be formed in a period of a few seconds, an oxide layer obtained in this way is superior in quality and durability to those produced in previously known processes and also guarantees the preservation of electrical data &
Durch mechanische Abdeckungen ist es möglich, eine Qxydsahialit bildung zu. begrenzen und an vorbestimmten Stellen zu verhindsrj Wird der zu oxydierende Halbleiterkörper in elektrisch leitender Verbindung auf die Gegenelektrode gebracht, dann ist d&ü Material und die Ausbildung dieser Gegenelektrode dafür bestimmend, ob der Fimkenübersohlag auf dem au oxydierende! Körper oder auf der Elektrode stattfindet. Der durch den Übe.v-Bchiag des Funkens auftretende Abtrag des M&terials kann in besonderen Fällen an bestimmten Stellen eines zu oxydierenden Körpers vorteilhaft sein und deshalb gewünscht warden» Die Schwierigkeit dabei liegt aber in der normalerweise gegebenen Unbestimmtheit des örtlichen FunkenübersciJageß. tfenn dl** Gegenelektrode und der zu oxydierende Körper aus gleichen Material, beispielsweise aus Silizium* besteht und in beutium™ ter Entfernung vor den zu oxydierenden Körper eine isolierte Blende, beispielsweise eine Ringblende, angebracht.wirdf danu kann die Funkenentladung nur in einem dur«h die .!!ende bi;-stimiuten Bereich auf der Oberfläche des zu oxydierenden Körn» r.ci Mechanical covers make it possible to form a Qxydsahialit . If the semiconductor body to be oxidized is brought to the counter electrode in an electrically conductive connection, then the material and the design of this counter electrode determine whether the oversole on the oxidizing! Body or on the electrode. The erosion of the material caused by the practice of the spark can in special cases be advantageous at certain points of a body to be oxidized and therefore desired. tfenn dl ** counter electrode and the distance to oxidative body made of the same material, for example made of silicon * and ter in beutium ™ before to oxidizing body an insulated aperture, for example, a ring diaphragm, angebracht.wird f danu, the spark discharge in only one major "H the. !! end bi; -stimute area on the surface of the grain to be oxidized" r. ci
909830/0566 BADOR1G1NAL 909830/0566 BADOR 1 G 1 NAL
stattfinden« Die Entladungsenergie beatimmt die Abtragun der Materie an der iStelle des Überschlags o An diener üt&lle tritt demnach keine Oxydhaut bildung auf, während an der· übri gen Oberfläche, aufgrund der Einwirkung des hochionitiei+an Plasmas eine entsprechende Oxydierung erfolgt."held the discharge energy beatimmt the Abtragun of matter at the I site of the rollover o An servant ut & lle thus occurs no oxide skin education, while gen at the · übri surface, a corresponding oxidation occurs due to the action of hochionitiei + in plasma.
Bei der Oxydation über Funkenentladung ißt ein sauorstoffhaltiges Medium erforderlich, das ruhend oder strömend sein kann. Die Vorteile einee strömenden Medium« liegen uul der Hand» Als Medium kann beispielsweise sowohl Kauerstuff als auch ein sauerstoffhaltigea Gas oder eine gasförmig».: Sauerstoffverbindung verwendet werden*In the case of oxidation via spark discharge, an oxygen-containing one eats Medium required, which must be static or flowing can. The advantages of a flowing medium lie below Hand »As a medium, for example, both Kauerstuff and also an oxygen-containing gas or a gaseous ».: oxygen compound be used*
Des weiteren kann durch eine als Elektrode ausgebuchte Düat: oder eine separate Düse ein den Prozeü begünstigende« fms«'! ges Medium eingespritzt werden und zwar vorteilhaft dor&rtj. daß der zu oxydierende Gegenstand an seiner Oberfläche benetzt wird οIn addition, a Düat that is booked out as an electrode can: or a separate nozzle for an "fms" that promotes the process! ges medium are injected and indeed advantageously dor & rtj. that the object to be oxidized is wetted on its surface ο
iHir eine Nitrierung bieten sich die gleichen überraschend vorteilhaften, technischen Lösungen an, wie sie für die Oxydierung ausführlich beschrieben sind» Das ruher.ce oder strömende, zum Verfahren notwendige Medium 1st dabei übicketoff, bzw ο ein stickstoffhaltiges Gaa oder eine &asfeinige stickst off verbindung«,iHir nitration to provide the same surprisingly advantageous, technical solutions, as described in detail for the oxidation "That ruher.ce or flowing, necessary for the process medium 1st this übicketof f, or ο a nitrogen-containing Gaa or & asfeinige embroider off connection «,
9 0 9 8 3 0/0566 bad9 0 9 8 3 0/0566 bad
Claims (23)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEL0046086 | 1963-10-15 |
Publications (1)
Publication Number | Publication Date |
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DE1521353A1 true DE1521353A1 (en) | 1969-07-24 |
Family
ID=7271442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19631521353 Pending DE1521353A1 (en) | 1963-10-15 | 1963-10-15 | Arrangement for the production of surface protection for solids |
Country Status (5)
Country | Link |
---|---|
CH (1) | CH440906A (en) |
DE (1) | DE1521353A1 (en) |
FR (1) | FR1411517A (en) |
GB (1) | GB1093815A (en) |
NL (1) | NL6411951A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0015694A2 (en) * | 1979-03-09 | 1980-09-17 | Fujitsu Limited | Method for forming an insulating film on a semiconductor substrate surface |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4420497A (en) * | 1981-08-24 | 1983-12-13 | Fairchild Camera And Instrument Corporation | Method of detecting and repairing latent defects in a semiconductor dielectric layer |
CH684831A5 (en) * | 1991-12-11 | 1995-01-13 | Alusuisse Lonza Services Ag | Device for producing extrusion-coated laminates. |
-
1963
- 1963-10-15 DE DE19631521353 patent/DE1521353A1/en active Pending
- 1963-10-15 FR FR991435A patent/FR1411517A/en not_active Expired
-
1964
- 1964-10-05 CH CH1286964A patent/CH440906A/en unknown
- 1964-10-14 NL NL6411951A patent/NL6411951A/xx unknown
- 1964-10-14 GB GB41911/64A patent/GB1093815A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0015694A2 (en) * | 1979-03-09 | 1980-09-17 | Fujitsu Limited | Method for forming an insulating film on a semiconductor substrate surface |
EP0015694A3 (en) * | 1979-03-09 | 1980-11-12 | Fujitsu Limited | Method for forming an insulating film on a semiconductor substrate surface |
Also Published As
Publication number | Publication date |
---|---|
GB1093815A (en) | 1967-12-06 |
FR1411517A (en) | 1965-09-17 |
CH440906A (en) | 1967-07-31 |
NL6411951A (en) | 1965-04-20 |
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SH | Request for examination between 03.10.1968 and 22.04.1971 |