DE1521006A1 - Process for preparing a base made of a non-conductive material for receiving electrolytically deposited copper - Google Patents

Process for preparing a base made of a non-conductive material for receiving electrolytically deposited copper

Info

Publication number
DE1521006A1
DE1521006A1 DE19661521006 DE1521006A DE1521006A1 DE 1521006 A1 DE1521006 A1 DE 1521006A1 DE 19661521006 DE19661521006 DE 19661521006 DE 1521006 A DE1521006 A DE 1521006A DE 1521006 A1 DE1521006 A1 DE 1521006A1
Authority
DE
Germany
Prior art keywords
copper
vapor
deposited
layer
preparing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19661521006
Other languages
German (de)
Other versions
DE1521006B2 (en
Inventor
Adomines Alfred A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sperry Corp
Original Assignee
Sperry Rand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sperry Rand Corp filed Critical Sperry Rand Corp
Publication of DE1521006A1 publication Critical patent/DE1521006A1/en
Publication of DE1521006B2 publication Critical patent/DE1521006B2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
    • H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/928—Magnetic property
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/938—Vapor deposition or gas diffusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Description

. nxpl. . nxpl.

PATENTANWALTPATENT ADVOCATE

H. F. E L L M E R 1521008H. F. E L L M E R 1521008

FRANKFURT/MAIN WElERSTRASSEtFRANKFURT / MAIN WElERSTRASSEt

fmfm

SPERRY RAND CORPORATION*, Hew Toric 19, M. I., USASPERRY RAND CORPORATION *, Hew Toric 19, M.I., USA

Verfahren zur Vorbereitung einer Unterlag« aus eines nichtleitenden Material für di« Aufnahme von elektrolytisch aufgebrachte· KupferProcess for preparing a base made of a non-conductive material for the reception of electrolytically applied copper

Die Erfindung betrifft ein Verfahren lur Vorbereitung einer Unterlage aus einen nichtleitenden Material, s. B. Glas, Tonerde« Keraaik, organischem Kunststoff wie Mylar, das ein slher, durchsichtiger, kaibebeständiger Polyesterfil« aus Xthylenglykol und Terephthalsäure ist, für die Aufnahme einer Schicht aus elektrolytisch aufgebrachte«, also gaIranisch fefilltea Kupfer.The invention relates to a method for preparing a base made of a non-conductive material, see e.g. glass, clay " Keraaik, organic plastic like Mylar, which is a slher, transparent, chalk-resistant polyester film made of ethylene glycol and terephthalic acid, for the absorption of a layer from electrolytically applied «, so Gaelic fefilltea Copper.

Um eine einwandfreie Haftung des galvanisch gefällten Kupfers auf de« Material der nichtleitenden Unterlage zu erzielen, «uö diese intensiv gereinigt werden, Mas zeitraubend und kostapie-To ensure perfect adhesion of the electroplated copper to achieve on the "material of the non-conductive base," uö these are intensively cleaned, mas time-consuming and costotherapy

009834/133·009834/133

BADBATH

lig ist. Trotzdem ist die Adhäsion des elektrolytisch aufgebrachten Kupfers in vielen Fallen unzureichend.lig is. Even so, the adhesion of the electrolytically applied copper is insufficient in many cases.

Der Erfindung liegt die Aufgabe zugrunde, diese intensive Reinigung der Flächen der Unterlage vor dam clsktrolytischen Aufbringen des Kupfers nahezu auszuschalten oder wesentlich herabzusetzen und dabei eine gute Adhäsion zu erreichen.The invention is based on the object of almost eliminating or substantially reducing this intensive cleaning of the surfaces of the substrate before the electrolytic application of the copper and thereby achieving good adhesion.

Diese Aufgabe wird erfindungsgemäfi dadurch gelöst, daß auf der Unterlage vor dem Aufbringen des Elektrolytkupfers eine Schicht aus einem Material, dessen chemische Eigenschaften denen des Kupfers ähnlich sind, durch Vakuumaufdampfung aufgebracht wird.This object is achieved according to the invention in that on the Before applying the electrolytic copper, put a layer of a material whose chemical properties are those of the Similar to copper, is applied by vacuum evaporation.

Beispiele für die aufzudampfenden Materialien sind verschiedene Kupferlegierungen, insbesondere Bronzen, ι. B. Aluminiumbronze und Chrombronse. Kupferlegierungen, die verflüchtigt und als Dampf niedergeschlagen werden können, enthalten 20 -Examples of the materials to be vapor-deposited are various copper alloys, in particular bronzes, ι. B. aluminum bronze and chrome bronze. Copper alloys that volatilize and can be precipitated as vapor contain 20 - 95 % oder etwas mehr Kupfer und 80 - 5 % eines oder mehrerer Legierungsmetalle, z. B. Aluminium und Chrom.95 % or a little more copper and 80-5 % of one or more alloy metals, e.g. B. aluminum and chrome.

Wie man herausgefunden hat, laßt sich die AdhSsion durch die Aufbringung des aufgedampften Materials, z. B, der kupferbaltigen Legierung, auf einer erwärmten Unterlage z. B. aus Glas, Keramik und dgl. verbessern, wenn während der Aufdämpfung eine erhöhte Temperatur im Bereich von 200 - 400° C oder efr/as mehr oder weniger beibehalten wird. Ein orhait jedoch auch einwandfreie Eigebni vse „ wonn die Auf dämpfung bei RaumtBrapetviwur de«It has been found that the adhesion can be achieved by applying the vapor-deposited material, e.g. B, the copper-containing alloy, on a heated surface z. B. made of glass, ceramic and the like. Improve if an increased temperature in the range of 200-400 ° C or efr / as is more or less maintained during the damping. An orhait, however, also flawless self- assessment " gained the attenuation with RaumtBrapetviwur de"

00983A/133900983A / 1339

BADBATH

Materials der Unterlage erfolgt. Dieser Arbeitsgang ist besonders brauchbar, falls dae reaktionjmnffihige, nichtleitende Material der Unterlage einen durch Viöree sersetabaren Stoff, s. B. ein organisches Polymerisationsprodukt wie Mylar, PolyÄthylen, Polypropylen, Zellglas und dgl. darstellt.Material of the document takes place. This operation is particularly useful if the reactive, non-conductive material of the base is a substance that can be separated by Viöree, see Sect. B. is an organic polymerisation product such as Mylar, polyethylene, polypropylene, cellulose glass and the like.

Nun sei ein typisches AusfUhrungsbeiepinl für das erfindungsgemäße Verfahren erläutert.A typical embodiment example for the method according to the invention will now be explained.

Ein Schiffchen aus Wolfram, dae mit einer Mischung aus etwa 75 - 80 Gewichteprozent Kupfer und 20 - 25 Gewichtsprozent Alunlnium gefüllt ist, wird in ein Vakuumsystem gebracht. Außerdem wird die Unterlage, ι. B. eine Glasplatte in das System eingeführt, die durch eine Blende vom Schiffchen getrennt wird.A boat made of tungsten, which is filled with a mixture of about 75-80 percent by weight copper and 20-25 percent by weight aluminum, is placed in a vacuum system. In addition, the document, ι. B. introduced a glass plate into the system, which is separated from the boat by a screen.

Dann wird das Syste» bis auf einen geringen Druck von etwa 10 ma Hg evakuiert. Das Kupfer und Aluminium la Wolframechiffehen werden bis zu* Schmelzpunkt erwärmt, während die Glaeunterlage irgendwie auf etwa 300° C gebracht wird. VAhrend einer gewissen Zeltspanne wird die Blende «wischen dem Wolframschiffchen und der Glasunterlage entfernt, so daß sich eine Schicht aua einer Aluminium-Kupfer-Legierung von annähernd 4000 X Dick« als Dampf auf der Unterlage niederschlagt. Dieses auf dom Glas aufgedampft*· Material enthalt 92 Gewichtsprozent Kupfer und β Gewichtsprozent Aluminium.Then the system is "up to a low pressure of about 10 ma Hg evacuated. The copper and aluminum la tungsten ship are heated up to * melting point while the glass underlay is somehow brought to about 300 ° C. During a certain span of the tent, the screen will wipe the tungsten boat and the glass base removed so that a layer aua an aluminum-copper alloy of approximately 4000 X thick «precipitates as vapor on the substrate. This on dom glass vapor-deposited * · Material contains 92 percent by weight copper and β Weight percent aluminum.

" 3 " 00983A/1339" 3 " 00983A / 1339

BADBATH

Harhdη« dl« gewünschte Menge? diener Aluminiumbronze aufgedampft ist-,, wird dif» Blende f/'srhl« nnvn und dns iJynton abgeschaltet, und nun Iftfit lic Anordnunr, wtthrond i-t.w.i 4 h bis auf R<ii>ii:teBjp<·· rai ui abkühlen. Da?.; Mau-ii.-l dor (il.iiunt -crl..··/^, *i^ * ici< Ku j.·-- ff ι AluHnimi überzogen lot , wird nwn dom ilyateti hniaiiiMi^mwnnr'i, und v.n i''rri t»in' T 'irifr t n< hiclit von a. H. olwa ü,Οί'ίί β»ί IH I «ι darauf !<Ί<1Γ' ϊ lat.tiort.Harhdη «dl« desired amount? The aluminum bronze is vapor-deposited- ,, the "diaphragm f / 'srhl" nnvn and dns iJynton is switched off, and now Iftfit lic arrangement, wtthrond it.wi 4 h to cool down to R <ii> ii: teBjp <·· rai ui. There?.; Mau ii.-l dor (il.iiunt -crl .. ·· / ^ * i ^ * ici <Ku j * -. Ff ι AluHnimi lot plated, is nwn dom ilyateti hniaiiiMi ^ mwnnr'i, and vn i''rri t »in ' T ' irifr t n <hiclit from a. H. olwa ü, Οί'ίί β» ί IH I «ι on it! <Ί <1Γ 'ϊ lat.tiort.

t j ορΙ.ΊΛΐί'ΐ "1 c Kupfer weint tine ütxirlogcnfl, au n Adhftniou «π Ί( ι reit A1u*lniufii~Kupfpr Ut>erscßcnon (!]*«.in trrlage auf. ΠΙρηο FunOrnchicht Ifiinn nicht nach den üblichen PrUfiMthodtn entfernt oder abgepellt werden; hlcmu «fihlen iloe Teilen als Band rwh Scotch, das Abschaben oder daa Am elften an den HAndorn uit cinmr n«eli'rklini^p. Fernerhin worden dir Schichten, dl«· auf diene Meine auf der Qlasunterlage aufgebracht oind, aJeo -lie aufgedampft« Ifuj fer-Aluminius^chi ( ht und di*^ elektr<lyt,iöch nieder'gi'tchlaRen*' Kupferachicht leirht eit einet* Ublirhrn Κυτ f orSt alfrimg, κ. B. Eisenohloridlßeung βί»- fitzt; di(iF.r Kombination der Srhichton zeigt keinen erl «"nnbarc-r Unterschied zu reinen Kupfer, wenn man ron der überlegenen, ausgeseiebneten Adhfleion des elektrolytisch aufgebrachten Kupfers an dem darunterliegendes Material absieht.t j ορΙ.ΊΛΐί'ΐ "1 c copper weeps tine ütxirlogcnfl, au n Adhftniou« π Ί (ι reit A1u * lniufii ~ Kupfpr Ut> erscßcnon (!] * « be removed or peeled off; you should feel the parts as a tape rwh scotch, scraping or daa on the eleventh on the thorn uit cinmr n'eli'rklini ^ p. Furthermore, you have layers that are applied to your mine on the glass base , aJeo -lie vaporized "Ifuj fer-Aluminius ^ chi (ht and di * ^ elektr <lyt, iöch Nieder'gi'tchlaRen * 'Kupferachicht eit einet * Ublirhrn Κυτ f orSt alfrimg, κ. B. Eisenohloridlßeung βί" - fitzt ; di ( i For the combination of the syllable clay shows no real difference to pure copper, if one disregards the superior, sieved adhesion of the electrolytically applied copper to the underlying material.

Oute Ergebnisse hin*i-htlich der Adhäsion des galyanir.cn geflllten Kupfevs werien auch mit anderen aufgedampften Kupfer-Al ri;iniu3 filmen .. ίι ι '-hifhtn, sogjr mit "jo^ehen *»rh:3ten, die bis ?u etwa i") Oewirhtnpf.^i-nt AJualnlum »mth^ten.Oute results regarding the adhesion of the galyanir.cn filled copper can also be filmed with other vapor-deposited copper alloys. u about i ") Oewirhtnpf. ^ i-nt AJualnlum» mth ^ th.

-H--H-

0 Γ 9 8 3 μ / 1 3 1 $0 Γ 9 8 3 μ / 1 3 1 $

be gilt für aufgedampfte KupPer-Chromnchichten, insbesondere für eine mit etwa 10 Gewichtsprozent Chrom- Dlj angeführten Prüfungen zeig.-m auch, daß die Vorteile tier Erfindung auch ait Unterlagen erzielt werden, die während der Aufdämpfung etwa auf der Raum- oder Umgebungstemperatur gehalten warden.be applies to vapor-deposited copper chromium layers, in particular for one listed with about 10 weight percent chromium-Dlj Tests also show that the advantages of the invention also apply Documents can be achieved during the attenuation about be kept at room or ambient temperature.

Die Vorteile b i der Anwendung dea aufgedampften Films ii. B. aua Aluminiumbronze, Chrombronae oder anderen dem Kupfer chemisch ähnlichen, metallischen Stoffen hinsichtlich der verbesserten Adhäsion des elektrolytisch aufgebrachten Kupfers umfaasen auch die Tatsache, daß das aufgedampfte Material wahrend der elektrolytischen Aufbringung des Kupfers nicht das der Kupferplattierung dienende Bad verunreinigt. Weiterhin ist der galvanisch gefällte Kupferfilm flu&erst glänzend und eignet sich tür Aufnahme eines susfit suchen, galvanisch gefällten Metall files, β. B. eines magnetischen Nickeleisenfilms. Daher kann insbesondere eine feste, gut haftende Kupferbasisschicht gemäß der Erfindung vorbereitet werden, auf der zusammenhängende Schaltungen angebracht werden, und d;.e als miteie Schicht in einem elektroplattieren Speicherelement für datenverarbeitende Vorrichtungen dient.The advantages b i of the application of vapor-deposited film ii. B. also aluminum bronze, chrome bronze or other metallic substances chemically similar to copper with regard to the improved Surround the adhesion of the electrolytically applied copper also the fact that the vapor deposited material while electrolytic deposition of copper is not that of copper plating serving bath contaminated. Furthermore, the galvanically precipitated copper film is only shiny and suitable looking up door intake of a susfit, electroplated metal files, β. B. a magnetic nickel iron film. Therefore In particular, a solid, well-adhering copper base layer according to the invention can be prepared on the coherent Circuits are attached, and d; .e as a middle layer in an electroplated storage element for data processing devices.

009834/131«009834/131 «

8AD ORIGINAL8AD ORIGINAL

Claims (1)

PATKM TAHSPR ÜC HIPATKM TAHSPR ÜC HI (^ 1} Verfahren zur Vorbereitung einer Unterlage aus eine» nichtleitenden Material zur Aufnahme einer Schicht elektrolytisch aufsubringendon Kupfers , dadurch gekennzeichnet, UaB auf der Unterlage eine Schicht aus eines Material aufgedampft wird, dessen chemische Eigenschaften denen des Kupfers ahnlieh sind.(^ 1} Procedure for preparing a document from a »non-conductive Material for receiving a layer of electrolytically deposited copper, characterized in that UaB a layer of a material is vapor-deposited on the base, the chemical properties of which are similar to copper. 2, Verfahren nach Anspruch !,dadurch gekennneiehnet, dad das aufgedampfte Material Alueiniuebronse ist.2, method according to claim!, Characterized thereby, dad the vapor-deposited material Alueiniuebronse is. 3> Verfahren nach Anspruch 1, dadurch gekennzeichnet , daft das aufgedampft« Material eine Chromtbronse ist.3> Method according to claim 1, characterized because the vapor-deposited material is a chrome bronze is. 4. Verfahren nach Anspruch 1 , d a d u r c h g e k e η η ε e i c h η e t , daß die Unterlage vor der Aufdampfung des Materials auf eine erhöhte Temperatur gebracht wird.4. The method according to claim 1, d a d u r c h g e k e η η ε e i c h η e t that the substrate before the vapor deposition of the Material is brought to an elevated temperature. 5. Verfahren nach Anspruch 1 , dadurch g e k e η η -5. The method according to claim 1, characterized in that g e k e η η - % e ic h net, daß das aufgedampfte Material durch Verflüchtigung einer Kupferlegierung erhalten wird. It is not certain that the evaporated material is obtained by volatilization of a copper alloy. 6 ■■-.■6 ■■ -. ■ ■ 009834/t339■ 009834 / t339 6. Verfahren nach Anspruch 2 , d ad u r c h g e k · η η -ι e i c h π e t , dall die Alusdniuahronae 5 - 80 % Aluainiuw und 95 - 20 % Kupfer enthalt. .6. The method according to claim 2, d ad urchgek · η η -ι eich π et, dall the Alusdniuahronae 5 - 80 % Aluainiuw and 95-20 % copper. . 7. Verfahren nach Ansprach 2 , d a d u r c h g β k e η η -β β i c h η β t , daß die lupftrleglerunf. 92 % Kupfur und 0 f AlVHinium enthalt.7. The method according spoke 2, dadurchg β ke η η -β β I η β t that the lupftrleglerunf. Contains 92% Kupfur and 0 f AlVHinium. 8. Verfahren nach Anspruch 3 ,dadurch gekennzeichnet , daft die lupferlegienmg etwa 90 £ Kupfer und 10 % Ohr« enthält,8. The method according to claim 3, characterized in that the lupferlegienmg contains about 90 pounds of copper and 10 % ear «, 9. Verfahren nach Ansprach !,dadurch gekennzeichnet., da B die Dicke der Met« rial schicht alt den dte Kupfer ähnlichen ligenschaften la Bereich von 500 -50.000 Ϊ liegt,9. The method according to spoke!, Characterized., Since B is the thickness of the metal layer alt the dte Copper-like oil properties la range of 500 -50,000 Ϊ lies, 10. Verfahren nach Anspruch I1 dadurch ge kenn- !•Ichnet, daft die Schicht aus dee Material alt den de« Köpfer ähnlichen Eigenschaften eine Dicke ron et«· 4.000 A aufweist.10. The method according to claim I 1 characterized in that the layer made of the material has a thickness of about 4,000 Å with properties similar to those of the head. 11. Verfahren nach aJupHlehe« 1 - 10 , d « d » r ο h f · ♦ k e η η ι e i chft«t , da· die Ooterlacs auf einer11. Procedure according to aJupHlehe «1 - 10, d« d »r ο h f · ♦ k e η η ι e i chft «t, that · the ooterlacs on one tor ii Bereich von 200 - 400° C gehalten wird.tor ii range of 200 - 400 ° C is maintained. - 7. - ■■- 7th - ■■ 00 983 4/133100 983 4/1331 BADBATH 12. Terfahrea na ^h Ansprüchen 1-11 ,dadurch (t. k'e-anselefisiet , dad die Aufdampfimg bei eine« Druck ▼on 10 nm Hg srfolgt.12. Terfahrea na ^ h claims 1-11, thereby (t. k'e-anselefisiet, because the vapor deposition at a «pressure ▼ on 10 nm Hg s follows. BAD ORIGINAL - 8 -BATHROOM ORIGINAL - 8 - ÖÜ834/1339ÖÜ834 / 1339
DE19661521006 1965-04-01 1966-03-26 PROCESS FOR PRE-TREATMENT OF NON-CONDUCTIVE SUBSTRATES FOR THE GALVANIC APPLICATION OF GOOD COPPER LAYERS FOR ELECTRICAL CIRCUITS Withdrawn DE1521006B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US444849A US3360349A (en) 1965-04-01 1965-04-01 Copper layer bonded to a non-conductive layer by means of a copper alloy

Publications (2)

Publication Number Publication Date
DE1521006A1 true DE1521006A1 (en) 1970-08-20
DE1521006B2 DE1521006B2 (en) 1971-03-18

Family

ID=23766608

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19661521006 Withdrawn DE1521006B2 (en) 1965-04-01 1966-03-26 PROCESS FOR PRE-TREATMENT OF NON-CONDUCTIVE SUBSTRATES FOR THE GALVANIC APPLICATION OF GOOD COPPER LAYERS FOR ELECTRICAL CIRCUITS

Country Status (6)

Country Link
US (1) US3360349A (en)
BE (1) BE678387A (en)
CH (1) CH468475A (en)
DE (1) DE1521006B2 (en)
GB (1) GB1095080A (en)
NL (1) NL6604397A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512946A (en) * 1967-04-17 1970-05-19 Lash Mfg Inc Composite material for shielding electrical and magnetic energy
NL87258C (en) * 1969-01-15
US3852148A (en) * 1970-10-07 1974-12-03 Olin Corp Architectural products formed of glass or ceramic-to-metal composites
US4500383A (en) * 1982-02-18 1985-02-19 Kabushiki Kaisha Meidensha Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
US4863808A (en) * 1985-09-13 1989-09-05 Gould Inc. Copper-chromium-polyimide composite
CH675323A5 (en) * 1987-12-24 1990-09-14 Contraves Ag
US4910077A (en) * 1988-08-04 1990-03-20 B.F. Goodrich Company Polynorbornene laminates and method of making the same
US6171714B1 (en) 1996-04-18 2001-01-09 Gould Electronics Inc. Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
JP5032430B2 (en) * 2008-09-26 2012-09-26 株式会社東芝 Magnetoresistive element manufacturing method, magnetoresistive element, magnetic head assembly, and magnetic recording / reproducing apparatus
JP5460375B2 (en) * 2010-02-22 2014-04-02 株式会社東芝 Method for manufacturing magnetoresistive element

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482178A (en) * 1944-02-29 1949-09-20 Western Electric Co Composite structure for forming a seal with glass
US2988630A (en) * 1957-09-06 1961-06-13 Ici Ltd Method of inert-gas metal arc-welding
US2966427A (en) * 1958-11-07 1960-12-27 Union Carbide Corp Gas plating of alloys
US3206325A (en) * 1961-09-14 1965-09-14 Alloyd Corp Process for producing magnetic product
US3294654A (en) * 1965-07-28 1966-12-27 Ethyl Corp Metal plating process

Also Published As

Publication number Publication date
NL6604397A (en) 1966-10-03
BE678387A (en) 1966-09-01
DE1521006B2 (en) 1971-03-18
GB1095080A (en) 1967-12-13
US3360349A (en) 1967-12-26
CH468475A (en) 1969-02-15

Similar Documents

Publication Publication Date Title
DE1521006A1 (en) Process for preparing a base made of a non-conductive material for receiving electrolytically deposited copper
DE19502129C2 (en) Process for producing an electrically conductive cermet
DE4410055A1 (en) Electrical bushing/capacitor combination
DE3637447C2 (en)
DE1558897A1 (en) Process for joining metals to metals
DE1440907A1 (en) Electrical circuit design
DE2430363C3 (en) Process for forming a metallic coating on a surface of at least one highly heat-resistant metal
DE1796088A1 (en) BURNING PRECIOUS METALS ON CLAY SUBSTRATES AT HIGH TEMPERATURE
DE755294C (en) Process for the production of peel-off embossing films
EP0018432B1 (en) Metallic article provided with a wear and corrosion resistant protective coating of tungsten carbide
DE2406891B2 (en) Corrosion-resistant mirror
DE2114543A1 (en) Process for the production of electrodes and their use
DE1521006C (en) Process for the pretreatment of non-conductive substrates for the galvanic application of well-adhering copper layers for electrical circuits
DE3727279C2 (en) Black-silver-colored coating for articles, process for producing such a coating and its application
DE1665372A1 (en) Method of making an electrical resistor
EP1675974A2 (en) Workpieces coated with an aluminum/magnesium alloy
DE812379C (en) Process for the production of thin coherent surface layers made of precious metal, especially silver and gold
DE2145905A1 (en) Electroless metallisation of insulators and poor conductors - by mixing with fine quartz sand and roughening before metallisation
DE722287C (en) Electric capacitor
DE251056C (en)
DE102005053344A1 (en) Trim part e.g. trim strip or surround, for use in motor vehicle, has carrier sandwich that is provided on substrate, and chromophoric cover layer that is applied by vapor deposition on outer surface of carrier sandwich
DE2108730A1 (en) Integrated hybrid circuit
DE899774C (en) Process for the vacuum-tight connection of ceramic bodies with metallic or ceramic bodies
AT313979B (en) Coating for resistance welding of the housing of semiconductor components
DE1590786C (en) Process for the production of micro miniature circuits or Schaltungsbauele elements

Legal Events

Date Code Title Description
E77 Valid patent as to the heymanns-index 1977
EGA New person/name/address of the applicant
EHJ Ceased/non-payment of the annual fee