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The stress state of BGA solder joints influenced by the grain orientations of neighboring joints
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A method for the determination of the cyclic stress‐strain curve of presistent slip bands in fatigued single crystals
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Assessment of Electrical, Electronic, and Electromechanical (EEE) Parts Copper Wire Bonds for Space Programs
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Thermo-mechanical durability assessment and microstructural characterization study of 95.5 Pb2Sn2. 5Ag high temperature solder
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From CAPA-Workflows to PQR in one Database
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