DE1414326A1 - Semiconductor arrangement for rectification and / or amplification - Google Patents

Semiconductor arrangement for rectification and / or amplification

Info

Publication number
DE1414326A1
DE1414326A1 DE19551414326 DE1414326A DE1414326A1 DE 1414326 A1 DE1414326 A1 DE 1414326A1 DE 19551414326 DE19551414326 DE 19551414326 DE 1414326 A DE1414326 A DE 1414326A DE 1414326 A1 DE1414326 A1 DE 1414326A1
Authority
DE
Germany
Prior art keywords
rectification
amplification
semiconductor arrangement
semiconductor
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19551414326
Other languages
German (de)
Inventor
Groschwitz Dr Eberhard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of DE1414326A1 publication Critical patent/DE1414326A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Thyristors (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)

Description

Claims (1)

a t e n t a n s p r ü c h e
patent claims
DE19551414326 1955-08-25 1955-08-25 Semiconductor arrangement for rectification and / or amplification Pending DE1414326A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0045286 1955-08-25

Publications (1)

Publication Number Publication Date
DE1414326A1 true DE1414326A1 (en) 1968-12-12

Family

ID=7485489

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19551414326 Pending DE1414326A1 (en) 1955-08-25 1955-08-25 Semiconductor arrangement for rectification and / or amplification

Country Status (1)

Country Link
DE (1) DE1414326A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058336A2 (en) * 1981-02-13 1982-08-25 General Electric Company Zinc oxide varistor with reduced fringe current effects

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058336A2 (en) * 1981-02-13 1982-08-25 General Electric Company Zinc oxide varistor with reduced fringe current effects
EP0058336A3 (en) * 1981-02-13 1983-05-11 General Electric Company Zinc oxide varistor with reduced fringe current effects

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971