DE1265801B - Data processing system - Google Patents

Description

FEDERAL REPUBLIC OF GERMANY

GERMAN

PATENT OFFICE

EDITORIAL

Int. Cl .:

Number:
File number:
Registration date:
Display day:

H05k

German class: 21a4-75

S104285IXd / 21a4
June 8, 1966
April 11, 1968

The invention relates to a data processing system with several active and passive circuit components, those for generating and processing digital signals with each other and with a Supply voltage source are connected.

Data processing systems that can process a large number of programs very quickly, have such large spatial dimensions that the signals have to be carried over long lines. Because the various circuit components must be arranged so that they can be easily serviced are accessible, i.e. not too close together.

The individual electrical circuit components (transistors, capacitors, Resistors etc.) in so-called modules, i.e. H. Building blocks in the form of printed circuits housed. The modules are inserted parallel to each other in the frame or chassis and these frames again housed in larger racks. The building blocks are provided with connecting pins and the connecting pins of several building blocks are connected to each other by wires. The wires run on the back of the frame in which the building blocks are housed. Also the middle length these wires inevitably increase with the size of the entire system.

Long lines are undesirable, however, because the delay time of the signals increases as the line length increases, and thus the upper one Limit of data processing speed is reduced. Because data processing systems of this Art have a clock pulse rate that is on the order of megahertz, so the Runtime easily comes in the order of magnitude of the period of the clock pulses. As a result, resemble the conditions are very similar to those of an RF signal transmission. This is also true, although only a few Bits are forwarded within the system. Because the bit signals usually have a pronounced one Rectangular waveform, which is known to contain harmonics with even higher frequencies. The longer the lines, the greater the switching capacities and line inductances, which in turn contributes to increasing the running time, especially at high frequencies, so that also the harmonics of the square-wave pulses are delayed more than the fundamental waves and consequently the pulses be distorted. In addition, electromagnetic interference fields can more easily from long, in particular as long loops routed lines are received. The interference fields mainly cause then significant disruptions when it comes to switching operations, data processing equipment

Applicant:

Scientific Data Systems, Inc.,

Santa Monica, Calif. (V. St. A.)

Representative:

Dr.-Ing. W. Reichel, patent attorney,

6000 Frankfurt, Parkstr. 13th

Named as inventor:

Jones Von Howell Jr., Northridge, Calif .;

Robert Mark Beck,

Los Angeles, Calif. (V. St. A.)

Claimed priority:

V. St. v. America June 9, 1965 (462 482) - -

be it from the same or a different system. In this case, interference pulses are induced which flip-flop circuits, which are often used in such systems, at the wrong moment, so that the entire data processing result can be falsified by a single interference pulse.
The invention is therefore based on the object of reducing the running time of the signals in the system and preventing interference signals from being induced in the circuit of the system.

According to the invention, this object is achieved in that the components with each other and with the one pole of the supply voltage source connecting lines in the vicinity of at least one run conductive plate, which is connected as a return line to the other pole of the supply voltage source is so that the voltages and currents that represent digital signals and between components are transmitted, run in the vicinity of this plate, and that those connections of the components, which are to maintain the potential of the other pole, with the conductive plate by connections that are short in relation to the connecting lines.

The length of the connections is preferably of the order of magnitude of the distance between the connecting lines from the plate.

According to the invention, this measure is applied to each individual building block in such a way that the components on one side of the base plate one

809 538/179

3 4

printed circuit are arranged and their description and the illustrations

Conclusions or feeds through the base plate Details or features for solving the task

can contribute to printed connection lines in the form of within the meaning of the invention and with the

Conductor tracks on the other side of the base plate Willing to be patented in the application

run, the conductive plate under the Bauelemen- 5 were taken. In

ten between the base plate and the components F i g. 1 is an improved one according to the invention

arranged and with the feeds surrounding frame with several interconnected

Openings are provided and that at least a part of the building blocks is shown in a perspective view; in

of the conductor tracks through the base plate F i g. 2 are schematic of the signal transmission

is connected to the conductive plate. io ways of the in Fi g. 1 shown device;

The components are preferably shown in several FIGS. 3 is a cross-sectional view through

these modules are arranged and the modules with an electrical module according to another

a plurality of pins in the vicinity of a conductive embodiment of the invention;

the plate, some of which are pins by F i g. 4 is a perspective view of a part

Wires are connected in addition to the conductive plate 15 of the in F i g. 3 shown module;

run, and other pins connected to the plate F i g. 5 is a perspective view of a part

are. This also brings the connecting wires of a frame to a memory core matrix and

■ - · Feed lines and signal lines - between F i g. 6 shows schematically arranged one above the other

the individual components in the vicinity of a guide frame of the in F i g. 5, which according to the

the, with the other pole of the voltage source are compared to the invention improved.

bound plate to lie, so that their In F i g. 1 is a frame 10 in perspective and

Inductance decreased. The building blocks can be shown from behind. The frame 10 is used

be arranged in a stack in such a way that one side can accommodate several building blocks 11, 12 and 13.

of each building block next to this conductive plate. Each building block contains "printed" conductor tracks, the

lies and the pins of this one side 25 several electronic components to a binary

of the building blocks protrude. This has the advantage, or connect logic module,

that the building blocks by themselves All the building blocks are multi-pin

attached conductive plates mutually shield 14 to 23 and provided with further on their back,

men. This arrangement is then preferably in such a way that the components

It was found that the pins are connected to other modules through openings in the conductor 30 of a module

the plate protrude and the building blocks and interconnection become. Pins 14,15,18 and 20 and other

wires on opposite sides of the tubes to module 11, pins 16, 21 and others

Plate are arranged. to module 12, pins 17, 19, 22, 23, 24 and other

A special application of the invention is that of the component 13. These connecting pins are used that several components in several parallel 35 different purposes. A first group of Sofien Levels are arranged; then the inventions of a module are used to connect according to several of these conductive plates parallel to supply or bias voltages with different from each other and next to these levels of the same size, one or more pens are arranged on, that the tensile or ground potential connecting the components is placed in a third group Wires close to the associated conductive plate 40 feed signals to and across other devices run, and that the conductive plates as a fourth group are those in the relevant site management are connected to each other. signals formed in a stone to other modules.

This case occurs e.g. B. on when several frames carry to be processed there,
are stacked with memory cores. The connecting pins run in pairs through each of such a storage unit, read slots in an electrically conductive plate 25, with the write or blocking lines meandering through it, preferably a metal plate made of aluminum, the numerous frames and thus ensure numerous, minium, steel or Similar material acts The parallel arranged inductors. If you slide holes in the plate 25 are arranged so that the z. B. grounded, conductive plates between the individual entire plate material-free area to a minimum core arrangements, then run the memory 50 is reduced. The openings are all just as big, control lines close to these plates. The plate that the connecting pins in the plate 25 do not interlock, therefore, reduce the inductive influences caused by the meandering stirring and no electrical connection between the wires.

and on the other hand ensure that the pins 15 and 18 of the building block 11, the pin 16 Signals are transmitted in the manner described above 55 of the building block 12 and pins 1 and 19 of the building block. The stone 13 through these memory control lines may all be used to connect the common ongoing control pulses always run close to ground or reference potential. That's why a plate. they are all connected by a very short wire line

The plates have the further advantage that the earth plate 25 is in the immediate vicinity of the respective

they are connected at the same time as a heat sink or to regulate 60 gene hole through which they run. Of the

the ambient temperature of the components. Connection wire is soldered to plate 25. So

If their properties are undesirable, one or more earth connections can be made in all building blocks.

ter way are temperature dependent. For this purpose, the bonds to the plate 25 are provided, namely with

Plates preferably on a heating device - the smallest possible distance between the earthing

that they set up to a constant temperature and the earth plate,

warms. Other pins are for connections to others

The invention is now also provided on the basis of the building blocks of the figures. An example is a line

described in detail, all of which are shown in FIG. 26, the pin 14 of the building block 11 with a

5 6

Pin 24 of the block 13 connects. Another problem is individual components for power supply of

Device 27 connects the pin 21 of the block 12 with the main feed line. This branch

the pin 23 of the module 13, and a third lead for the three modules 11, 12 and 13 are

device 28 connects the pin 20 of the block 11 with each with 31, 32 and 33 drawn. You carry over

the pin 22 of the module 13. The lines are 5 suitable connection points in the respective module,

insulated so that they can touch each other when they. For example, the line 31 runs to one

cross each other. Terminal pin and from there to a consumer 34,

The signals transmitted during an arithmetic operation from a component containing several active and passive components to a component are usually can. These components are also connected to the reverse binary signals, with a pulse repetition frequency in the io current or reference potential pin 15 MHz range and a high content of harmonics, which in turn takes the shortest possible path with len, since these are square-wave pulses with steep Flanders earth plate 25 is connected. A tap on the ken is. Although sometimes only a few combinations of active and passive components 34 pulse in leads to pin 14 which are long compared to the pulse duration, and it is assumed that statuses are transferred from component to component, 15 and changes again through interaction of the components this is not due to the high frequency behavior. The 34 generates a signal at the pin 14.
Pulses have only a short duration and in a similar way each form the line 33 leads to a half-wave of the basic pulse repetition frequency. The specific supply voltage connection pin of the construction length of the lines on which the impulses are transmitted through stone 13 and from there to several active and complete computer systems, in particular from structural elements 35 and 36. An output connection stone to module, The component 35 is located on the connection pin 24. The negligibly small in comparison to this oscillating return current flows from the consumer via the pin 19, transmission frequencies from which the pulses are also put together on the shortest path with the earth plate 25. The fact that the impulse is connected through.

a periodic switching process in a module 25 It can be seen that the bias or feed generates or are suppressed, changes nothing to current paths once from the current source 30 to the Verder The fact that the high-frequency and ultra-high consumers 34 and on the other hand to the consumer 35 frequency oscillations from module to module both via lines 31 and 33 and through be transmitted. the bottom plate 25 lead. It can also be seen that

The connecting wires place high-frequency over 30 also the line 26 close to the earth plate 25

transmission lines. Each signal is passed through one from pin 14 to pin 24,

Brief change in potential level or amplitude This results in a signal transmission path between

shown in a signal line. This short-term the building block 11 and the building block 13, both

Potential change is from a pin on the line 26 and the plate 25 between the

transfer a line to another pin, and 35 includes pins 15 and 19 near line 26,

although always in the immediate vicinity of the earth plate 25. The transmission path does not need to be close to the

This means that the current from pin 14, for example, can be the reference potential of the generator or the voltage

to the pin 24 via the line 26 and back from the voltage source 30 to run.

Pin 19 of the module 13 through the earth plate 25 to the pin 24 can, for example, as a receiving pin 15 are used in parallel and in the immediate vicinity of the line connection, so that a signal (pulse or impulse 26 flow. This results in the shortest possible pulse train) from pin 14 of module 11 to borrowed signal transmission path between the connection module 13 can be transmitted to in its pins 14 and 24, the components 35 selected as active connections to be processed. By the versind , and back via a similarly short revision of others received by module 11 Transmission path between the reference potential connection 45 signals can generate one or more pulses pin 15 and the reference potential connection pin 19. or are released, which means that

The return current therefore does not flow individually from a direct current path from pin 14 of module 11 to a ground potential source, which is located away from the modules via line 26 to pin 24 and via the two modules, but elements 35 back via pin 29 through the plate the earth and reference plate 25 itself serves as a back 50 25 to the source 30. The signal runs as a pulse current line with the length of the line between the pair of terminals 14-15 on the active transmission pins of comparable length. Forward line 26-25 to connection pair 24-19.
and return line run close together. It can be seen that the transmission of the signals from this is also the reason why so- pins 21-16 to pins 23-17 and the as few as possible interruptions in the earth plate 55 are transmitted from pins 20-15 to the Pins 22-17 in 25 should be provided. The length of the stream is similarly improved.

path in this earth plate should lie with the length of the path through the dense cable routing in Line 26 be comparable. Large openings would be near a tectonic plate between the two buildings the current path through the earth plate inadmissibly stony conditions like a wave transmission extend. 60 so that the delay and distortion

F i g. 2 illustrates schematically and somewhat all of a signal that is sent from module 11 to module 13

more generally the process of such a signal is to be transmitted is considerably reduced,

transfer from building block to building block. The one for feeding, so far that there is only a delay

all building blocks including the building blocks 11, 12 could be further reduced that one

and 13 provided voltage source 30 is on a 65 the building blocks 11 and 13 pressed closer together.

certain point connected to the earth plate 25. This is of course a question of the number of building blocks

This point can be placed close to the point and the dimensions of the individual building blocks. at

where the various connecting lines to a given system (a fixed number of

Blocks) the length of the transmission path All blocks, including blocks 11, 12 or 13,

can thereby be reduced from building block to building block, which are shown in FIG. 1, can with the ones shown in FIG. 3 that one builds the individual building blocks smaller. Ob- and 4 shown foils 45 are provided, and the Probably all building blocks usually have two earth pins (e.g. earth plate 25 can be on the back of the chassis, in 15 and 18 in the building block 11, 17 and 19 in the building 5 in which the building blocks are housed stone 13), not all signals are to be leading. In this case, all signals are from Pins arranged opposite these earth pins. to any component of any building block In addition, the components themselves are not negligible - any other component in the same or casually small. any other building block about circuits

The signal transmission properties of building block io (circuits) and transmission paths that transmit as a result of this, connecting wires, lines, possibly the building blocks can be further improved, that one has the basic elements mentioned above and one arranged close to it applies thought to the individual building blocks. A tectonic plate included. The signal transmission thus follows An example of such an improved building block is in the laws of a high-F due to this network i g. 3 and 4 shown. 15 frequency wave transmission. It turned out

A module can, for example, be a base plate that improves the curve of the signals 40 made of insulating material, which can be significantly reduced on one side and its running time, with several components, e.g. B. 41, 43 provided The plates and foils which are at ground potential can be. In most cases these construction have additional switching capacities compared to the elements signal transformers, resistors, con-20 lines, which the through a curved condensers, Diodes and transistors. The connection run of the lines and / or the conductor tracks in the The wires of these active and passive components compensate for the inductance caused by the components run through holes in the base plate 40 and or compensate. In addition, the foils 45 shield are soldered to conductor tracks 44, which on the other the components of the individual modules when they are in Side of the base plate 40 are applied and the frame 10 are pushed in, electrostatically, so Electrically connect individual components to one another so that no interference pulses are coupled in electrostatically so that the desired circuit of the module can be made.

results. This is a method known per se. The shielding effect is the main function of a

printed circuits. Plate arrangement, as in the case of the FIG. 5 and 6

Of course, the implementation for core memory shown between the individual 30 is also shown. Components of a building block transmit signals, since core memories usually contain small ring-shaped ones all components, regardless of the location, on the magnetic cores 50, which are in a row on several they are attached to the base plate 40, usual wires are drawn. Some wires make up that borrowed from processing input pulses or rows and columns of the core matrix, others run Signals participate in order to generate other signals, 35 diagonally and again others run back and forth which back to other building blocks in the above moving through the cores.

can be forwarded in the written manner. Such a matrix is usually in an iso-

a floating frame 51 is arranged from component to component, and several over the building block The entire Speider is formed by the frames placed one on top of the other via the conductor tracks on the other side Base plate transmit signals. The course of the 4 ° cherwerk. The crossing points of the wires in the Signals, d. H. their curve shape, is basically the individual frames that make up the storage spaces, and the same as that of those signals sent by the block number of memory locations is equal to the number of to be transferred to the block. Row wires times the number of column wires. the

To the signal transmission within a building number of storage locations determines the number of To improve steins is on the same page, on the 45 words to be stored, and the number of bits per The components are applied, a one-piece word is made up of the number of superimposed metal foils with as few interruptions as possible. This core frame assembly upset. The film 45 is only in the same place - can be viewed as a flat circuit component len like the base plate 40 with holes or holes As in FIG. 6 is shown schematically, can

brazen, which are so large that the connection 50 6 frames are placed on top of each other and so 6-bit wires do not touch the metal foil. Form the slide 45 words. The number of bits per word is on is irrelevant with regard to the invention, however, about having a "own" hole in one or more of them Places connected to the conductor track 44. This position increases the difficulty with the number of len are framed by those points of the circuit (or bits per word), as will be shown below determines the earth potential to receive. A part 55 The frames are basically constructed in such a way that the the conductor tracks to be grounded leads, for example, to core matrix arrangements in different levels Ground pin 15, which is to be arranged with the ground plate of the chassis. The individual wires sis or frame is connected to the reference run through the frame and end in connection potential from the power source. The pens.

The earthed foil 45 runs tightly over the under the 60 Some wires, e.g. the wires 52, belong to the base plate 40 located conductor tracks. For example, the one and the same or form one and Signal transmission paths between the individual components - the same line of all matrices, so that they are behind elements always contain the conductor tracks and must be connected to each other. That's why the pins arranged opposite to it at a uniform distance are connected by wires 53, nete earth plate. An insulation layer can be applied to the film 45. As a result, the current flows through in a meandering manner lierschicht be applied, thus by inadvertently the superimposed frames. Also the Do not touch the foil any short circuits - other row and column wires run similarly be resolved. meandering.

The supply current for the row wires is supplied by the voltage source 54. The return circuit contains a load resistor 55, which represents the impedance of the control elements that the Monitor current through row wires 52. On the one hand, these wires 51 form a transmission line of a similar length for a pulse or a signal, the passage of which is controlled by the impedance device 55 on the other hand, the meandering circuit results in a considerable inductance.

In order to prevent this inductance from becoming effective, a ground plate 56, similar to the one described above, arranged between two frames. In reality, each plate forms the cover plate of one Frame and only comes to rest between two matrix frames when the frames are placed on top of each other will. A ground plate 56 is connected to one another and to one pole of the voltage source 54.

These stacked tectonic plates form, together with the row wires 52 and others, Circuit capacitances that compensate for the inductances formed by the meandering wire lines or counteract them. In addition, these plates improve the transmission properties the switching pulses when they run through the wires. All impulses can be transmitted according to the laws of wave transmission are transmitted or "wander", since the matrix wires are always close to the earth plate 56 get lost. This measure enables an additional useful application of the numerous earth plates, when placed between the wires of the matrix frames. The earth plates are off Made of metal and arranged close to the magnetic storage cores drawn onto the wires. As is well known The best operating conditions exist when the temperature of these cores are ordinary it ferrite cores, is kept as constant as possible. Since the earth plates are made of metal, they can also be used as heat conductors.

As in Fig. 6, a heating source 57 be connected to the earth plates in order to supply heat to them or to extract heat from them and to raise and control their temperature so that the temperature of the entire stack is at one slightly higher value rises and is constantly regulated to this value. The temperature can in itself known way with the help of temperature sensors (thermocouples, thermistors) and measured can then be controlled by comparison with a setpoint. As disturbance variables to be regulated act here changes in the ambient temperature and an increase in that of the matrix itself during longer periods Operating time evolved from heat.

55

Claims (8)

Patent claims: 1. Data processing system with several active and passive circuit components that for generating and processing digital signals with each other and with a supply voltage source are connected, characterized in that the components with each other and lines (26, 27, 28) connecting one pole of the supply voltage source in the vicinity at least one conductive plate (25) run as a return line to the other pole of the Supply voltage source is connected so that the voltages and currents represent the digital signals and are transferred between the components, run in the vicinity of this plate, and that those connections of the components which are to receive the potential of the other pole, are connected to the conductive plate by connections (15,16,17,19) which are short in relation to the connecting lines (26, 27, 28). 2. Plant according to claim 1, characterized in that the length of the connections (15, 16,17,19) in the order of magnitude of the distance between the connecting lines (26, 27, 28) from the Plate (25) lies. 3. Plant according to claim 1 or 2, characterized in that the components (41, 42) one side of the base plate (40) of a printed circuit and its connections or feeds through the base plate to printed connection lines in the form of Conductor tracks (44) run on the other side of the base plate, the conductive plate (45) arranged under the components between the base plate and the components and with the Infeeds surrounding openings is provided and that at least a part of the conductor tracks is connected through the base plate to the conductive plate. 4. Plant according to claim 1 or 2, characterized in that the components (50) in several parallel planes (51) are arranged in which the components are connected by connecting wires (52) are connected that several of these conductive plates (56) are parallel to each other and next to each other these planes are arranged in such a way that the wires connecting the components are closely adjacent of the associated conductive plate, and that the conductive plates as a return line to each other are connected. 5. Plant according to claim 4, characterized in that it has one of the conductive plates (56) a constant temperature heater (57). 6. Plant according to claim 1 or 2, characterized in that the components in several Blocks (11,12,13) are arranged, all with several connecting pins in the vicinity of one conductive plate (25) are provided, some of which are pins (14, 20, 21, 22, 23, 24) through wires that run next to the conductive plate and other pins (15, 16,17, 18,19) connected to the plate. 7. Plant according to claim 6, characterized in that the circuit components (11,12,13) arranged in a stack and one side of each building block adjacent to the conductive plate is arranged and the pins of the blocks protrude from this side of the blocks. 8. Plant according to claim 6 or 7, characterized in that the pins through openings in the conductive plate protrude and the building blocks and connecting wires on opposite sides Sides of the plate are arranged. 1 sheet of drawings 809 538/179 4. 68 © Bundesdruckerei Berlin