DE1262395B - Process for producing metallized holes in printed circuits - Google Patents
Process for producing metallized holes in printed circuitsInfo
- Publication number
- DE1262395B DE1262395B DE1966S0102898 DES0102898A DE1262395B DE 1262395 B DE1262395 B DE 1262395B DE 1966S0102898 DE1966S0102898 DE 1966S0102898 DE S0102898 A DES0102898 A DE S0102898A DE 1262395 B DE1262395 B DE 1262395B
- Authority
- DE
- Germany
- Prior art keywords
- printed circuits
- holes
- metallized holes
- producing metallized
- metallized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Laser Beam Processing (AREA)
Description
Verfahren zum Herstellen von metallisierten Bohrungen bei gedruckten Schaltungen Die Erfindung betrifft ein Verfahren zum Herstellen von metallisierten Bohrungen in bei Hitze Kohlenstoff abscheidenden Trägerplatten für gedruckte Schaltungen.Method for producing metallized holes in printed Circuits The invention relates to a method for producing metallized Holes in carrier plates for printed circuits that deposit carbon when hot.
Gedruckte Schaltungen werden gewöhnlich aus Folien aus elektrisch leitendem Material herausgeätzt, die auf plattenförmigen Trägerkörpern aufgebracht sind. Diese Trägerplatten müssen elektrisch isolierend sein und bestehen gewöhnlich aus Kunststoffen wie vernetzten oder nichtvernetzten Hochpolymeren, die auch durch Glasgewebe verstärkt sein können. In den Trägerplatten muß eine Vielzahl feiner auf ihrer Innenwand metallisierter Bohrungen ausgebildet werden, um auf der Vorder- und Rückseite aufgebrachte Leitungsbahnen elektrisch leitend zu verbinden oder um Anschlußdrähten von Bauelementen mechanisch festen und elektrisch gut leitenden Kontakt zu geben.Printed circuits are usually made from sheets of electrical etched out conductive material, which is applied to plate-shaped support bodies are. These carrier plates must be electrically insulating and usually exist Made of plastics such as crosslinked or non-crosslinked high polymers, which are also made by Glass fabric can be reinforced. In the carrier plates a multitude of finer metallized bores are formed on their inner wall in order to and to connect conductive tracks applied to the rear side in an electrically conductive manner or to Connection wires of components mechanically strong and electrically conductive To give contact.
Nach der konventionellen Technik werden diese Bohrungen mit Spezialbohrern und mit Hilfe von Bohrlehren von Hand eingebracht. Dann sind diese Bohrungen einem Katalysator auszusetzen, um in einem Bad den Leiterstoff - gewöhnlich Kupfer -chemisch in dünner Schicht von etwa 3 #t Dicke abscheiden zu können. Diese Metallisierung wird dann galvanisch meist bis auf 30 #t verstärkt. Dieses Verfahren ist nicht nur wegen der Vielzahl der Verfahrensschritte aufwendig, sondern es weist auch den wesentlichen Nachteil auf, bei den meisten Kunststoffen nur rauhe Innenwände der metallisierten Bohrungen zu liefern. Es ist dann oftmals unmöglich, die Anschlußdrähte für die Bauelemente ohne Beschädigung der Metallisierung in die Bohrungen einzuführen.According to the conventional technique, these holes are made with special drills and introduced by hand with the help of drilling jigs. Then these holes are one Exposing a catalyst to chemically dissolve the conductor material - usually copper - in a bath to be able to deposit in a thin layer of about 3 #t thickness. This metallization is then usually galvanically reinforced up to 30 #t. This procedure is not only because of the large number of procedural steps involved, but it also has the essentials Disadvantage, with most plastics only rough inner walls of the metallized To deliver holes. It is then often impossible to get the connection wires for the Introduce components into the bores without damaging the metallization.
Das geschilderte Verfahren wesentlich zu vereinfachen sowie metallisierte Bohrungen gleichbleibender Qualität zu erzielen, ist Aufgabe der Erfindung. Zur Lösung dieser Aufgabe ist nach der Erfindung vorgesehen, die Bohrungen mittels eines Lasers einzuschießen und in einem galvanischen Bad zu metallisieren. Das erfindungsgemäße Verfahren bietet den Vorteil, daß mit den meisten Kunststoffen, mit Ausnahme von Trägerplatten aus verleimten Hartpapierschichten, völlig glatte Bohrungswände und durch ein einmaliges galvanisches Bad die Metallisierungsschicht in ihrer ganzen Dicke mechanisch fest aufgebracht werden kann. Durch geeignete Programmschaltung läßt sich auch ein völlig automatischer Betrieb erzielen. Nach dem konventionellen Verfahren erreicht man dagegen nur bei individueller Behandlung der Bohrungen einigermaßen ausreichend glatte Wände. Die Vorteile des erfindungsgemäßen Verfahrens beruhen nicht nur auf glatten Bohrungen, sondern auch darauf, daß sich bei Trägerplatten aus Stoffen, die in Hitze Kohlenstoff abspalten, an den Bohrungswänden eine sozusagen eingebrannte Kohlenstoffschicht ausbildet. Diese Kohlenstoffschicht ermöglicht ohne Vorbehandlung in einem galvanischen Bad die volle Metallisierungsstärke aufzubringen. Auf aufgepinseltem Graphit werden dagegen nur wesentlich schlechter beständige Metallisierungsschichten erreicht. Das erfindungsgemäße Verfahren läßt sich deshalb auch für andere Erzeugnisse der Galvanotechnik vorteilhaft einsetzen.To simplify the described process significantly as well as metallized The object of the invention is to achieve holes of constant quality. To the Solution to this problem is provided according to the invention, the holes by means of a Insert the laser and metallize it in a galvanic bath. The inventive Procedure has the advantage that with most plastics, with the exception of Carrier plates made of glued hard paper layers, completely smooth bore walls and the metallization layer in its entirety by means of a one-time galvanic bath Thickness can be applied mechanically firmly. By suitable program switching completely automatic operation can also be achieved. After the conventional On the other hand, methods can only be achieved to some extent with individual treatment of the bores sufficiently smooth walls. The advantages of the method according to the invention are based not only on smooth bores, but also on the fact that there are carrier plates From substances that split off carbon in heat, one on the walls of the bore, so to speak forms a burned-in carbon layer. This carbon layer allows without Pretreatment in an electroplating bath to apply the full metallization thickness. On the other hand, only significantly less resistant metallization layers are formed on brushed graphite achieved. The method according to the invention can therefore also be used for other products of electroplating to advantage.
Die Erfindung soll an Hand der Zeichnung weiter erläutert werden.The invention will be explained further with reference to the drawing.
F i g. 1 zeigt ein Teilstück einer Trägerplatte mit beidseitig aufgebrachten Leiterbahnen gedruckter Schaltungen im Querschnitt; F i g. 2 gibt die Aufsicht dieses Teilstückes wieder. F i g. 1 ergibt sich als Querschnitt längs 1-I genommen.F i g. 1 shows a section of a carrier plate with attached on both sides Conductor tracks of printed circuits in cross section; F i g. 2 gives the supervision of this Section again. F i g. 1 results as a cross section taken along 1-I.
In F i g. 1 ist mit 1 eine Trägerplatte, beispielsweise aus glasfaserverstärktem Epoxyharz bezeichnet. Die Trägerplatte kann 1,5 mm dick sein. Folien für die Leiterbahnen 2 von beispielsweise 30 @u Dicke sind auf der Trägerplatte beidseitig aufgebracht. Eine der Bohrungen mit einem Durchmesser von 0,4 bis 0,8 mm ist mit 3 bezeichnet. Auf eine eingebrannte Kohlenstoffschicht4 folgt die Metallisierungsschicht5. Wird für die Leiterbahnen Kupfer verwendet, kann die Metallisierungsschicht 5 in einem Kupferbad galvanisch aufgebracht werden.In Fig. 1 is 1 with a carrier plate, for example made of glass fiber reinforced Called epoxy resin. The carrier plate can be 1.5 mm thick. Foils for the conductor tracks 2 of, for example, 30 μm thick are applied on both sides of the carrier plate. One of the bores with a diameter of 0.4 to 0.8 mm is denoted by 3. The metallization layer 5 follows a burned-in carbon layer 4. Will If copper is used for the conductor tracks, the metallization layer 5 can be in one Electroplated copper bath.
Bei einer gedruckten Schaltung des Ausführungsbeispiels nach F i g. 1 eignet sich zum Einschießen der Bohrungen ein Laser der Energie von einigen Wattsekunden bei Impulszeiten von 1/2 bis 2 Millisekunden. Der heiße Strahl des Lasers brennt die Bohrungen explosionsartig aus und schmilzt auch eventuell einragende Glasfasern einer Verstärkung glatt ab.In a printed circuit of the embodiment according to FIG. 1, a laser of the energy of some is suitable for shooting the holes Watt seconds with pulse times of 1/2 to 2 milliseconds. The laser's hot beam burns the holes explosively and also melts any protruding glass fibers a reinforcement smoothly.
Es hat sich als vorteilhaft erwiesen, helle Kunststoffe möglichst dunkel einzufärben, um mehr Energie der Laserstrahlung zu absorbieren.It has proven advantageous to use light-colored plastics whenever possible To be colored dark in order to absorb more energy of the laser radiation.
Die Bezugszeichen der F i g. 2 decken sich mit denen der F i g. 1.The reference numerals of FIG. 2 coincide with those of FIG. 1.
Claims (2)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1966S0102898 DE1262395B (en) | 1966-03-30 | 1966-03-30 | Process for producing metallized holes in printed circuits |
CH180567A CH465685A (en) | 1966-03-30 | 1967-02-07 | Method for producing metallized holes in carrier plates, in particular for printed circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1966S0102898 DE1262395B (en) | 1966-03-30 | 1966-03-30 | Process for producing metallized holes in printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1262395B true DE1262395B (en) | 1968-03-07 |
Family
ID=7524767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1966S0102898 Pending DE1262395B (en) | 1966-03-30 | 1966-03-30 | Process for producing metallized holes in printed circuits |
Country Status (2)
Country | Link |
---|---|
CH (1) | CH465685A (en) |
DE (1) | DE1262395B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4258468A (en) * | 1978-12-14 | 1981-03-31 | Western Electric Company, Inc. | Forming vias through multilayer circuit boards |
WO2002023962A2 (en) * | 2000-09-18 | 2002-03-21 | T.L.M. - Advancved Laser Technology Ltd. | Method for the formation of a pattern on an insulating substrate |
-
1966
- 1966-03-30 DE DE1966S0102898 patent/DE1262395B/en active Pending
-
1967
- 1967-02-07 CH CH180567A patent/CH465685A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4258468A (en) * | 1978-12-14 | 1981-03-31 | Western Electric Company, Inc. | Forming vias through multilayer circuit boards |
WO2002023962A2 (en) * | 2000-09-18 | 2002-03-21 | T.L.M. - Advancved Laser Technology Ltd. | Method for the formation of a pattern on an insulating substrate |
WO2002023962A3 (en) * | 2000-09-18 | 2002-06-13 | A L T Advanced Laser Technolog | Method for the formation of a pattern on an insulating substrate |
Also Published As
Publication number | Publication date |
---|---|
CH465685A (en) | 1968-11-30 |
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