DE1248816B - - Google Patents

Info

Publication number
DE1248816B
DE1248816B DES82563A DES0082563A DE1248816B DE 1248816 B DE1248816 B DE 1248816B DE S82563 A DES82563 A DE S82563A DE S0082563 A DES0082563 A DE S0082563A DE 1248816 B DE1248816 B DE 1248816B
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DES82563A
Other languages
German (de)
Other versions
DE1248816C2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to DE1962S0082563 priority Critical patent/DE1248816C2/de
Publication of DE1248816B publication Critical patent/DE1248816B/de
Application granted granted Critical
Publication of DE1248816C2 publication Critical patent/DE1248816C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
DE1962S0082563 1962-11-24 1962-11-24 Expired DE1248816C2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1962S0082563 DE1248816C2 (cg-RX-API-DMAC7.html) 1962-11-24 1962-11-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962S0082563 DE1248816C2 (cg-RX-API-DMAC7.html) 1962-11-24 1962-11-24

Publications (2)

Publication Number Publication Date
DE1248816B true DE1248816B (cg-RX-API-DMAC7.html) 1967-08-31
DE1248816C2 DE1248816C2 (cg-RX-API-DMAC7.html) 1968-03-14

Family

ID=37436410

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1962S0082563 Expired DE1248816C2 (cg-RX-API-DMAC7.html) 1962-11-24 1962-11-24

Country Status (1)

Country Link
DE (1) DE1248816C2 (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
DE1248816C2 (cg-RX-API-DMAC7.html) 1968-03-14

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