DE112020000786A5 - Optoelektronisches bauelement - Google Patents

Optoelektronisches bauelement Download PDF

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Publication number
DE112020000786A5
DE112020000786A5 DE112020000786.3T DE112020000786T DE112020000786A5 DE 112020000786 A5 DE112020000786 A5 DE 112020000786A5 DE 112020000786 T DE112020000786 T DE 112020000786T DE 112020000786 A5 DE112020000786 A5 DE 112020000786A5
Authority
DE
Germany
Prior art keywords
optoelectronic component
optoelectronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020000786.3T
Other languages
English (en)
Inventor
Siegfried Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112020000786A5 publication Critical patent/DE112020000786A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE112020000786.3T 2019-02-12 2020-02-11 Optoelektronisches bauelement Pending DE112020000786A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019103492.2 2019-02-12
DE102019103492.2A DE102019103492A1 (de) 2019-02-12 2019-02-12 Optoelektronisches bauelement
PCT/EP2020/053460 WO2020165164A1 (de) 2019-02-12 2020-02-11 Optoelektronisches bauelement

Publications (1)

Publication Number Publication Date
DE112020000786A5 true DE112020000786A5 (de) 2021-10-21

Family

ID=69631521

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102019103492.2A Withdrawn DE102019103492A1 (de) 2019-02-12 2019-02-12 Optoelektronisches bauelement
DE112020000786.3T Pending DE112020000786A5 (de) 2019-02-12 2020-02-11 Optoelektronisches bauelement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102019103492.2A Withdrawn DE102019103492A1 (de) 2019-02-12 2019-02-12 Optoelektronisches bauelement

Country Status (2)

Country Link
DE (2) DE102019103492A1 (de)
WO (1) WO2020165164A1 (de)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7753553B2 (en) * 2005-06-02 2010-07-13 Koniklijke Philips Electronics N.V. Illumination system comprising color deficiency compensating luminescent material
JP5097460B2 (ja) * 2007-06-26 2012-12-12 パナソニック株式会社 化合物半導体素子およびそれを用いる照明装置ならびに化合物半導体素子の製造方法
KR101603777B1 (ko) * 2009-04-16 2016-03-15 삼성전자주식회사 백색 발광 다이오드
WO2010146390A2 (en) * 2009-06-19 2010-12-23 Seren Photonics Limited Light emitting diodes
EP2571065A4 (de) * 2010-12-08 2016-03-23 El Seed Corp Gruppe-iii-nitrid-halbleitervorrichtung und herstellungsverfahren dafür
DE102013200509A1 (de) * 2013-01-15 2014-07-17 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
DE102016101442A1 (de) * 2016-01-27 2017-07-27 Osram Opto Semiconductors Gmbh Konversionselement und strahlungsemittierendes Halbleiterbauelement mit einem solchen Konversionselement

Also Published As

Publication number Publication date
DE102019103492A1 (de) 2020-08-13
WO2020165164A1 (de) 2020-08-20

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Legal Events

Date Code Title Description
R012 Request for examination validly filed