DE112017001681A5 - Light-emitting component - Google Patents
Light-emitting component Download PDFInfo
- Publication number
- DE112017001681A5 DE112017001681A5 DE112017001681.9T DE112017001681T DE112017001681A5 DE 112017001681 A5 DE112017001681 A5 DE 112017001681A5 DE 112017001681 T DE112017001681 T DE 112017001681T DE 112017001681 A5 DE112017001681 A5 DE 112017001681A5
- Authority
- DE
- Germany
- Prior art keywords
- light
- emitting component
- emitting
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016105777.0A DE102016105777A1 (en) | 2016-03-30 | 2016-03-30 | module |
DE102016105777.0 | 2016-03-30 | ||
PCT/EP2017/057450 WO2017167823A1 (en) | 2016-03-30 | 2017-03-29 | Light-emitting component |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112017001681A5 true DE112017001681A5 (en) | 2019-01-03 |
Family
ID=58464533
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102016105777.0A Withdrawn DE102016105777A1 (en) | 2016-03-30 | 2016-03-30 | module |
DE112017001681.9T Withdrawn DE112017001681A5 (en) | 2016-03-30 | 2017-03-29 | Light-emitting component |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102016105777.0A Withdrawn DE102016105777A1 (en) | 2016-03-30 | 2016-03-30 | module |
Country Status (2)
Country | Link |
---|---|
DE (2) | DE102016105777A1 (en) |
WO (1) | WO2017167823A1 (en) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9754926B2 (en) * | 2011-01-31 | 2017-09-05 | Cree, Inc. | Light emitting diode (LED) arrays including direct die attach and related assemblies |
US8773612B2 (en) * | 2009-02-27 | 2014-07-08 | Toshiba Lighting & Technology Corporation | Light emitting module and illumination apparatus |
JP2011151268A (en) * | 2010-01-22 | 2011-08-04 | Sharp Corp | Light-emitting device |
US8820950B2 (en) * | 2010-03-12 | 2014-09-02 | Toshiba Lighting & Technology Corporation | Light emitting device and illumination apparatus |
JP5846408B2 (en) * | 2010-05-26 | 2016-01-20 | 東芝ライテック株式会社 | Light emitting device and lighting device |
JP5545848B2 (en) * | 2010-06-24 | 2014-07-09 | シチズン電子株式会社 | Semiconductor light emitting device |
US8322882B2 (en) * | 2010-09-22 | 2012-12-04 | Bridgelux, Inc. | Flexible distributed LED-based light source and method for making the same |
US8564000B2 (en) * | 2010-11-22 | 2013-10-22 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
JP6133856B2 (en) * | 2012-06-07 | 2017-05-31 | 四国計測工業株式会社 | LED lighting module and LED lighting device |
JP5991065B2 (en) * | 2012-07-31 | 2016-09-14 | 日亜化学工業株式会社 | Light emitting device |
DE102013114691A1 (en) * | 2013-12-20 | 2015-06-25 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and adaptive headlight for a motor vehicle |
-
2016
- 2016-03-30 DE DE102016105777.0A patent/DE102016105777A1/en not_active Withdrawn
-
2017
- 2017-03-29 DE DE112017001681.9T patent/DE112017001681A5/en not_active Withdrawn
- 2017-03-29 WO PCT/EP2017/057450 patent/WO2017167823A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
DE102016105777A1 (en) | 2017-10-05 |
WO2017167823A1 (en) | 2017-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |