DE112017000863A5 - Heat exchanger - Google Patents

Heat exchanger Download PDF

Info

Publication number
DE112017000863A5
DE112017000863A5 DE112017000863.8T DE112017000863T DE112017000863A5 DE 112017000863 A5 DE112017000863 A5 DE 112017000863A5 DE 112017000863 T DE112017000863 T DE 112017000863T DE 112017000863 A5 DE112017000863 A5 DE 112017000863A5
Authority
DE
Germany
Prior art keywords
heat exchanger
exchanger
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112017000863.8T
Other languages
German (de)
Inventor
Jürgen Grünwald
Christian Heneka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mahle International GmbH
Original Assignee
Mahle International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mahle International GmbH filed Critical Mahle International GmbH
Publication of DE112017000863A5 publication Critical patent/DE112017000863A5/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
DE112017000863.8T 2016-02-17 2017-02-14 Heat exchanger Withdrawn DE112017000863A5 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016202435.3A DE102016202435A1 (en) 2016-02-17 2016-02-17 Heat exchanger
DE102016202435.3 2016-02-17
PCT/EP2017/053284 WO2017140671A2 (en) 2016-02-17 2017-02-14 Heat exchanger

Publications (1)

Publication Number Publication Date
DE112017000863A5 true DE112017000863A5 (en) 2018-11-15

Family

ID=58044075

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102016202435.3A Withdrawn DE102016202435A1 (en) 2016-02-17 2016-02-17 Heat exchanger
DE112017000863.8T Withdrawn DE112017000863A5 (en) 2016-02-17 2017-02-14 Heat exchanger

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102016202435.3A Withdrawn DE102016202435A1 (en) 2016-02-17 2016-02-17 Heat exchanger

Country Status (4)

Country Link
US (1) US20200161526A1 (en)
CN (1) CN108701745A (en)
DE (2) DE102016202435A1 (en)
WO (1) WO2017140671A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110425767A (en) * 2019-08-30 2019-11-08 冠冷科技(深圳)有限公司 A kind of thermoelectric semiconductor refrigerating and heating combined equipment facilitating adjustment shape
DE102019214497A1 (en) * 2019-09-23 2021-03-25 Mahle International Gmbh Pipe body arrangement for a temperature control device, temperature control device and electrical device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3138934A (en) * 1962-11-19 1964-06-30 Kysor Industrial Corp Thermoelectric heating and cooling system for vehicles
DE1944453B2 (en) * 1969-09-02 1970-11-19 Buderus Eisenwerk Peltier battery with heat exchanger
JP3451107B2 (en) * 1992-10-05 2003-09-29 株式会社エコ・トゥエンティーワン Electronic cooling device
JP3951315B2 (en) * 1995-05-26 2007-08-01 松下電工株式会社 Peltier module
DE10022726C2 (en) * 1999-08-10 2003-07-10 Matsushita Electric Works Ltd Thermoelectric module with improved heat transfer capacity and method of manufacturing the same
JP3510831B2 (en) * 1999-12-22 2004-03-29 株式会社小松製作所 Heat exchanger
JP2003124531A (en) * 2001-10-11 2003-04-25 Komatsu Ltd Thermoelectric module
JP2003332642A (en) * 2002-05-10 2003-11-21 Komatsu Electronics Inc Thermoelectric conversion element unit
US7032389B2 (en) * 2003-12-12 2006-04-25 Thermoelectric Design, Llc Thermoelectric heat pump with direct cold sink support
US9105809B2 (en) * 2007-07-23 2015-08-11 Gentherm Incorporated Segmented thermoelectric device
US20090236087A1 (en) * 2008-03-19 2009-09-24 Yamaha Corporation Heat exchange device
KR101195674B1 (en) * 2009-01-29 2012-10-30 야마하 가부시키가이샤 Heat exchange unit
DE102009058550A1 (en) * 2009-07-21 2011-01-27 Emcon Technologies Germany (Augsburg) Gmbh Thermoelectric module for use in thermoelectric generator unit for coupling to exhaust gas line device of vehicle, has compensating element exerting force on thermoelectric elements and extended from inner side to other inner side of plates
DE102009058673A1 (en) * 2009-12-16 2011-06-22 Behr GmbH & Co. KG, 70469 Thermoelectric heat exchanger

Also Published As

Publication number Publication date
WO2017140671A2 (en) 2017-08-24
DE102016202435A1 (en) 2017-08-17
WO2017140671A3 (en) 2018-02-01
CN108701745A (en) 2018-10-23
US20200161526A1 (en) 2020-05-21

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Legal Events

Date Code Title Description
R083 Amendment of/additions to inventor(s)
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0035060000

Ipc: H10N0010813000

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee