DE112011101305A5 - Lichtleitsystem - Google Patents

Lichtleitsystem Download PDF

Info

Publication number
DE112011101305A5
DE112011101305A5 DE112011101305T DE112011101305T DE112011101305A5 DE 112011101305 A5 DE112011101305 A5 DE 112011101305A5 DE 112011101305 T DE112011101305 T DE 112011101305T DE 112011101305 T DE112011101305 T DE 112011101305T DE 112011101305 A5 DE112011101305 A5 DE 112011101305A5
Authority
DE
Germany
Prior art keywords
fiber optic
optic system
fiber
optic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112011101305T
Other languages
English (en)
Other versions
DE112011101305B4 (de
Inventor
Anmelder Gleich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE112011101305A5 publication Critical patent/DE112011101305A5/de
Application granted granted Critical
Publication of DE112011101305B4 publication Critical patent/DE112011101305B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C1/00—Dental machines for boring or cutting ; General features of dental machines or apparatus, e.g. hand-piece design
    • A61C1/08—Machine parts specially adapted for dentistry
    • A61C1/088—Illuminating devices or attachments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Epidemiology (AREA)
  • Veterinary Medicine (AREA)
  • Public Health (AREA)
  • General Health & Medical Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dentistry (AREA)
  • Led Device Packages (AREA)
DE112011101305.1T 2010-04-15 2011-04-09 Lichtleitsystem, Verfahren zur Herstellung eines Lichtleitsystems und Anwendung eines Lichtleitsystems Active DE112011101305B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010015068A DE102010015068A1 (de) 2010-04-15 2010-04-15 Lichtleitsystem
DE102010015068.1 2010-04-15
PCT/DE2011/000388 WO2011127902A1 (de) 2010-04-15 2011-04-09 Lichtleitsystem

Publications (2)

Publication Number Publication Date
DE112011101305A5 true DE112011101305A5 (de) 2013-02-21
DE112011101305B4 DE112011101305B4 (de) 2022-08-25

Family

ID=44534845

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102010015068A Withdrawn DE102010015068A1 (de) 2010-04-15 2010-04-15 Lichtleitsystem
DE112011101305.1T Active DE112011101305B4 (de) 2010-04-15 2011-04-09 Lichtleitsystem, Verfahren zur Herstellung eines Lichtleitsystems und Anwendung eines Lichtleitsystems

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102010015068A Withdrawn DE102010015068A1 (de) 2010-04-15 2010-04-15 Lichtleitsystem

Country Status (2)

Country Link
DE (2) DE102010015068A1 (de)
WO (1) WO2011127902A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3114511A4 (de) * 2014-03-07 2017-10-11 Aeponyx Inc. Verfahren und system für wellenlängenabstimmbare optische komponenten und untersysteme
JP6674952B2 (ja) 2014-12-08 2020-04-01 インブイティ・インコーポレイテッド 電気手術の照明および感知のための方法および装置
CA3055530A1 (en) * 2017-03-07 2018-09-13 Danisco Us Inc. Thermostable glucoamylase and methods of use, thereof
US10194975B1 (en) 2017-07-11 2019-02-05 Medtronic Advanced Energy, Llc Illuminated and isolated electrosurgical apparatus
DE102021130545B3 (de) 2021-11-23 2022-12-29 Turck Holding Gmbh Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60226188A (ja) * 1984-04-25 1985-11-11 Matsushita Electric Works Ltd 光電変換素子のパツケ−ジ方法
US20030057421A1 (en) 2001-09-27 2003-03-27 Tzer-Perng Chen High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate
US20050133808A1 (en) * 2003-09-11 2005-06-23 Kyocera Corporation Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
DE10345516B4 (de) * 2003-09-30 2012-03-01 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung aussendendes Halbleiterbauelement und Verfahren zu seiner Herstellung
US8029152B2 (en) * 2005-03-24 2011-10-04 Kyocera Corporation Package for light-emitting device, light-emitting apparatus, and illuminating apparatus
JP2007227480A (ja) 2006-02-21 2007-09-06 Toshiba Corp 半導体発光装置
DE102007004807A1 (de) 2007-01-31 2008-08-07 Osram Opto Semiconductors Gmbh Licht emittierende Einrichtung mit optischem Körper
EP2019249A1 (de) * 2007-07-24 2009-01-28 Dall'Oglio, Stefano Vorrichtung zur Regulierung eines Lichtstrahls von hoher Intensität
DE102007040596B4 (de) * 2007-08-27 2011-01-13 Epsys Paul Voinea E.K. Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung
TWI401820B (zh) * 2007-11-07 2013-07-11 Ind Tech Res Inst 發光元件及其製作方法
DE102008033556A1 (de) * 2008-03-14 2009-09-17 Kaltenbach & Voigt Gmbh Lichtquelle für ein zahnmedizinisches Gerät
WO2010035206A1 (en) 2008-09-25 2010-04-01 Koninklijke Philips Electronics N.V. Coated light emitting device and method for coating thereof

Also Published As

Publication number Publication date
WO2011127902A1 (de) 2011-10-20
DE102010015068A1 (de) 2011-10-20
DE112011101305B4 (de) 2022-08-25

Similar Documents

Publication Publication Date Title
DK2538251T3 (da) Multikerne optisk fiber
DK2369376T3 (da) Flerkerne optisk fiber
DK2357501T3 (da) Flerkoret optisk fiber
DK2613185T3 (da) Optisk multikernefiber
GB2489760B (en) Fibre optic distributed sensing
DK2506045T3 (da) Optisk multimode-fiber
DK2527893T3 (da) Optisk singlemode fiber
GB2501422B (en) Fibre optic distributed sensing
DK3407105T3 (da) Fiberoptisk adapterblok
DK2482106T3 (da) Multimode-fiber
FI20126084A (fi) Taivutettu optinen aaltojohde
IL225047A0 (en) Optical fiber sensing system
DK2626730T3 (da) Polariseringsopretholdende optisk fiber
DK2616861T3 (da) Optisk fiberføring
DK2867626T3 (da) Fiberoptisk detektion
DK2362252T3 (da) Optisk fiber og optisk kommunikationssystem dermed
DK2740000T3 (da) Optisk fiber-dropkabel med lav brandrisiko
EP2722943A4 (de) Mehrkernverstärkung von glasfasern
DK2799920T3 (da) Flerkernet optisk fiber
DK2821824T3 (da) Optisk multikernefiber
EP2660634A4 (de) Glasfaser-fusionsverbindungsvorrichtung
DK2894498T3 (da) Optisk fiber
BR112013013883A2 (pt) fibras de degradação controlada
EP2613184A4 (de) Optische faser
BR112013019929A2 (pt) fibra óptica

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final