DE112009001255A5 - Process for the galvanic copper coating and apparatus for carrying out such a process - Google Patents

Process for the galvanic copper coating and apparatus for carrying out such a process Download PDF

Info

Publication number
DE112009001255A5
DE112009001255A5 DE112009001255T DE112009001255T DE112009001255A5 DE 112009001255 A5 DE112009001255 A5 DE 112009001255A5 DE 112009001255 T DE112009001255 T DE 112009001255T DE 112009001255 T DE112009001255 T DE 112009001255T DE 112009001255 A5 DE112009001255 A5 DE 112009001255A5
Authority
DE
Germany
Prior art keywords
carrying
copper coating
galvanic copper
galvanic
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112009001255T
Other languages
German (de)
Inventor
Matthias Kurrle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apt Advanced Plating Technologies At GmbH
Original Assignee
IPT INTERNAT PLATING TECHNOLOGIES GmbH
IPT INTERNATIONAL PLATING TECHNOLOGIES GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IPT INTERNAT PLATING TECHNOLOGIES GmbH, IPT INTERNATIONAL PLATING TECHNOLOGIES GmbH filed Critical IPT INTERNAT PLATING TECHNOLOGIES GmbH
Publication of DE112009001255A5 publication Critical patent/DE112009001255A5/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
DE112009001255T 2008-05-28 2009-05-22 Process for the galvanic copper coating and apparatus for carrying out such a process Withdrawn DE112009001255A5 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008026985.9 2008-05-28
DE102008026985 2008-05-28
PCT/EP2009/003655 WO2009152915A2 (en) 2008-05-28 2009-05-22 Copper electroplating method and device for carrying out a method of this type

Publications (1)

Publication Number Publication Date
DE112009001255A5 true DE112009001255A5 (en) 2011-04-28

Family

ID=41213451

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102009023124A Withdrawn DE102009023124A1 (en) 2008-05-28 2009-05-20 Process for the galvanic copper coating and apparatus for carrying out such a process
DE112009001255T Withdrawn DE112009001255A5 (en) 2008-05-28 2009-05-22 Process for the galvanic copper coating and apparatus for carrying out such a process

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102009023124A Withdrawn DE102009023124A1 (en) 2008-05-28 2009-05-20 Process for the galvanic copper coating and apparatus for carrying out such a process

Country Status (2)

Country Link
DE (2) DE102009023124A1 (en)
WO (1) WO2009152915A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011080105A1 (en) * 2011-07-29 2013-01-31 Wacker Chemie Ag Process for the purification of polycrystalline silicon fragments
CN104233439B (en) * 2014-09-30 2016-10-05 任晓东 A kind of electroplanting device of jack
CN104264208B (en) * 2014-09-30 2017-05-24 任晓东 Cooling mechanisms of electroplating device of jack
EP3467157B1 (en) 2017-10-09 2020-04-15 IPT - International Plating Technologies GmbH Composition for additional dosing of a metal

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164456A (en) * 1978-06-15 1979-08-14 Dart Industries Inc. Electrolytic process
JPS5929118B2 (en) * 1980-09-19 1984-07-18 セイコーエプソン株式会社 Palladium/nickel alloy plating liquid
EP0181430A1 (en) * 1984-11-13 1986-05-21 Olin Corporation Systems for producing electroplated and/or treated metal foil
JPH04320088A (en) * 1991-04-18 1992-11-10 Cmk Corp Manufacture of printed wiring board
US6024856A (en) * 1997-10-10 2000-02-15 Enthone-Omi, Inc. Copper metallization of silicon wafers using insoluble anodes
AT408353B (en) * 1998-06-19 2001-11-26 Andritz Ag Maschf METHOD AND SYSTEM FOR APPLYING AND ADDING AN ELECTROLYTE
US6458262B1 (en) * 2001-03-09 2002-10-01 Novellus Systems, Inc. Electroplating chemistry on-line monitoring and control system
EP1887108A1 (en) * 2005-05-25 2008-02-13 Think Laboratory Co., Ltd. Gravure cylinder-use copper plating method and device

Also Published As

Publication number Publication date
WO2009152915A2 (en) 2009-12-23
WO2009152915A3 (en) 2010-03-11
DE102009023124A1 (en) 2009-12-03

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R081 Change of applicant/patentee

Owner name: APT ADVANCED PLATING TECHNOLOGIES GMBH, AT

Free format text: FORMER OWNER: IPT INTERNATIONAL PLATING TECHNOLOGIES GMBH, 70567 STUTTGART, DE

R082 Change of representative

Representative=s name: RAIBLE, DEISSLER, LEHMANN PATENTANWAELTE PARTG, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee