DE112009000737A5 - Method for producing and constructing a power module - Google Patents

Method for producing and constructing a power module Download PDF

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Publication number
DE112009000737A5
DE112009000737A5 DE112009000737T DE112009000737T DE112009000737A5 DE 112009000737 A5 DE112009000737 A5 DE 112009000737A5 DE 112009000737 T DE112009000737 T DE 112009000737T DE 112009000737 T DE112009000737 T DE 112009000737T DE 112009000737 A5 DE112009000737 A5 DE 112009000737A5
Authority
DE
Germany
Prior art keywords
constructing
producing
power module
module
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112009000737T
Other languages
German (de)
Other versions
DE112009000737B4 (en
Inventor
Werner Graf
Bernd Felber
Christoph Hornstein
Roland Dr. Greul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies Germany GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of DE112009000737A5 publication Critical patent/DE112009000737A5/en
Application granted granted Critical
Publication of DE112009000737B4 publication Critical patent/DE112009000737B4/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
DE112009000737.6T 2008-04-15 2009-03-05 Structure of a three-phase inverter module Active DE112009000737B4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008018841A DE102008018841A1 (en) 2008-04-15 2008-04-15 Method for producing and constructing a power module
DE102008018841.7 2008-04-15
PCT/DE2009/000317 WO2009127179A1 (en) 2008-04-15 2009-03-05 Method for producing and assembly of a power module

Publications (2)

Publication Number Publication Date
DE112009000737A5 true DE112009000737A5 (en) 2011-01-05
DE112009000737B4 DE112009000737B4 (en) 2023-02-02

Family

ID=41051105

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102008018841A Pending DE102008018841A1 (en) 2008-04-15 2008-04-15 Method for producing and constructing a power module
DE112009000737.6T Active DE112009000737B4 (en) 2008-04-15 2009-03-05 Structure of a three-phase inverter module

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102008018841A Pending DE102008018841A1 (en) 2008-04-15 2008-04-15 Method for producing and constructing a power module

Country Status (2)

Country Link
DE (2) DE102008018841A1 (en)
WO (1) WO2009127179A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010050315C5 (en) * 2010-11-05 2014-12-04 Danfoss Silicon Power Gmbh Process for the production of sintered electrical assemblies and power semiconductor modules made therewith
DE102011076324B4 (en) * 2011-05-24 2014-04-10 Semikron Elektronik Gmbh & Co. Kg Power electronic system with connection means of first and second subsystems
DE102011076323B4 (en) * 2011-05-24 2014-04-10 Semikron Elektronik Gmbh & Co. Kg Power electronic system with first and second subsystem
DE102013204889A1 (en) 2013-03-20 2014-09-25 Robert Bosch Gmbh Power module with at least one power component
DE102014219998B4 (en) 2014-10-02 2020-09-24 Vitesco Technologies GmbH Power module, power module group, power output stage and drive system with a power output stage
CN110246808B (en) * 2018-03-09 2021-08-10 南京银茂微电子制造有限公司 Power module with reduced junction temperature and method of manufacturing the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2725952B2 (en) * 1992-06-30 1998-03-11 三菱電機株式会社 Semiconductor power module
US5539254A (en) * 1994-03-09 1996-07-23 Delco Electronics Corp. Substrate subassembly for a transistor switch module
US5773320A (en) * 1995-11-13 1998-06-30 Asea Brown Boveri Ag Method for producing a power semiconductor module
DE19645636C1 (en) * 1996-11-06 1998-03-12 Telefunken Microelectron Power module for operating electric motor with speed and power control
JPH11346480A (en) * 1998-06-02 1999-12-14 Hitachi Ltd Inverter device
US20020034088A1 (en) * 2000-09-20 2002-03-21 Scott Parkhill Leadframe-based module DC bus design to reduce module inductance
DE10102621B4 (en) 2001-01-20 2006-05-24 Conti Temic Microelectronic Gmbh power module
US6943445B2 (en) 2001-03-30 2005-09-13 Hitachi, Ltd. Semiconductor device having bridge-connected wiring structure
DE10141114C1 (en) * 2001-06-08 2002-11-21 Semikron Elektronik Gmbh Circuit device has AC terminal element of circuit substrate cooled via terminal pin of base body thermally connected to heat sink
DE10204200A1 (en) 2002-02-01 2003-08-21 Conti Temic Microelectronic power module
DE10316355C5 (en) * 2003-04-10 2008-03-06 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with flexible external pin assignment
JP2006278913A (en) * 2005-03-30 2006-10-12 Toyota Motor Corp Circuit device and manufacturing method therefor

Also Published As

Publication number Publication date
DE102008018841A1 (en) 2009-10-22
WO2009127179A1 (en) 2009-10-22
DE112009000737B4 (en) 2023-02-02

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R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0025070000

Ipc: H01L0021600000

R016 Response to examination communication
R081 Change of applicant/patentee

Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE

Free format text: FORMER OWNER: CONTI TEMIC MICROELECTRONIC GMBH, 90411 NUERNBERG, DE

R081 Change of applicant/patentee

Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE

Free format text: FORMER OWNER: VITESCO TECHNOLOGIES GERMANY GMBH, 30165 HANNOVER, DE

R084 Declaration of willingness to licence
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final