DE112008001002A5 - Verfahren und Vorrichtung zur Herstellung von dünnen Scheiben oder Folien aus Halbleiterkörpern - Google Patents

Verfahren und Vorrichtung zur Herstellung von dünnen Scheiben oder Folien aus Halbleiterkörpern Download PDF

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Publication number
DE112008001002A5
DE112008001002A5 DE200811001002 DE112008001002T DE112008001002A5 DE 112008001002 A5 DE112008001002 A5 DE 112008001002A5 DE 200811001002 DE200811001002 DE 200811001002 DE 112008001002 T DE112008001002 T DE 112008001002T DE 112008001002 A5 DE112008001002 A5 DE 112008001002A5
Authority
DE
Germany
Prior art keywords
films
thin slices
semiconductor bodies
producing thin
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200811001002
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EISELE, CHRISTOPHER, DR., 75397 SIMMOZHEIM, DE
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE112008001002A5 publication Critical patent/DE112008001002A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0448—With subsequent handling [i.e., of product]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/202—With product handling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
DE200811001002 2007-04-17 2008-04-15 Verfahren und Vorrichtung zur Herstellung von dünnen Scheiben oder Folien aus Halbleiterkörpern Withdrawn DE112008001002A5 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710018080 DE102007018080B3 (de) 2007-04-17 2007-04-17 Verfahren und Vorrichtung zur Herstellung von dünnen Scheiben oder Folien aus Halbleiterkörpern
PCT/DE2008/000628 WO2008125098A1 (de) 2007-04-17 2008-04-15 Verfahren und vorrichtung zur herstellung von dünnen scheiben oder folien aus halbleiterkörpern

Publications (1)

Publication Number Publication Date
DE112008001002A5 true DE112008001002A5 (de) 2010-01-21

Family

ID=39400050

Family Applications (2)

Application Number Title Priority Date Filing Date
DE200710018080 Expired - Fee Related DE102007018080B3 (de) 2007-04-17 2007-04-17 Verfahren und Vorrichtung zur Herstellung von dünnen Scheiben oder Folien aus Halbleiterkörpern
DE200811001002 Withdrawn DE112008001002A5 (de) 2007-04-17 2008-04-15 Verfahren und Vorrichtung zur Herstellung von dünnen Scheiben oder Folien aus Halbleiterkörpern

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE200710018080 Expired - Fee Related DE102007018080B3 (de) 2007-04-17 2007-04-17 Verfahren und Vorrichtung zur Herstellung von dünnen Scheiben oder Folien aus Halbleiterkörpern

Country Status (6)

Country Link
US (1) US20100117199A1 (de)
EP (1) EP2139657A1 (de)
JP (1) JP2010525559A (de)
KR (1) KR20100015895A (de)
DE (2) DE102007018080B3 (de)
WO (1) WO2008125098A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009060039B4 (de) 2009-12-21 2024-06-06 Att Automotivethermotech Gmbh Motorkühl- und Heizsystem mit Maßnahmen zur Kühlmitteltemperatursteigerung
FR2955275A1 (fr) * 2010-01-18 2011-07-22 Commissariat Energie Atomique Procede de decoupe d'une tranche d'un lingot d'un materiau grace a un faisceau laser
DE102010030358B4 (de) 2010-06-22 2014-05-22 Osram Opto Semiconductors Gmbh Verfahren zum Abtrennen einer Substratscheibe
RU2459691C2 (ru) 2010-11-29 2012-08-27 Юрий Георгиевич Шретер Способ отделения поверхностного слоя полупроводникового кристалла (варианты)
US9527158B2 (en) * 2011-07-29 2016-12-27 Ats Automation Tooling Systems Inc. Systems and methods for producing silicon slim rods
CN106454078B (zh) * 2016-09-26 2019-07-19 Oppo广东移动通信有限公司 一种对焦模式控制方法及终端设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW350095B (en) * 1995-11-21 1999-01-11 Daido Hoxan Inc Cutting method and apparatus for semiconductor materials
US6208458B1 (en) * 1997-03-21 2001-03-27 Imra America, Inc. Quasi-phase-matched parametric chirped pulse amplification systems
US6452091B1 (en) * 1999-07-14 2002-09-17 Canon Kabushiki Kaisha Method of producing thin-film single-crystal device, solar cell module and method of producing the same
FR2807074B1 (fr) * 2000-04-03 2002-12-06 Soitec Silicon On Insulator Procede et dispositif de fabrication de substrats
US7005081B2 (en) * 2001-07-05 2006-02-28 Canon Kabushiki Kaisha Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method
JP4455804B2 (ja) * 2002-05-08 2010-04-21 株式会社ワイ・ワイ・エル インゴットの切断方法と切断装置及びウェーハ並びに太陽電池の製造方法
US7422963B2 (en) * 2004-06-03 2008-09-09 Owens Technology, Inc. Method for cleaving brittle materials

Also Published As

Publication number Publication date
DE102007018080B3 (de) 2008-06-19
WO2008125098A1 (de) 2008-10-23
EP2139657A1 (de) 2010-01-06
KR20100015895A (ko) 2010-02-12
JP2010525559A (ja) 2010-07-22
US20100117199A1 (en) 2010-05-13

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Legal Events

Date Code Title Description
8181 Inventor (new situation)

Inventor name: INVENTOR IS APPLICANT

8127 New person/name/address of the applicant

Owner name: EISELE, CHRISTOPHER, DR., 75397 SIMMOZHEIM, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20111101