DE112007003505A5 - Elektrische Leiterbahnen enthaltende Paneel-Vorrichtungen sowie Verfahren zu deren Herstellung - Google Patents

Elektrische Leiterbahnen enthaltende Paneel-Vorrichtungen sowie Verfahren zu deren Herstellung Download PDF

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Publication number
DE112007003505A5
DE112007003505A5 DE112007003505T DE112007003505T DE112007003505A5 DE 112007003505 A5 DE112007003505 A5 DE 112007003505A5 DE 112007003505 T DE112007003505 T DE 112007003505T DE 112007003505 T DE112007003505 T DE 112007003505T DE 112007003505 A5 DE112007003505 A5 DE 112007003505A5
Authority
DE
Germany
Prior art keywords
production
devices containing
electrical interconnects
panel devices
containing electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112007003505T
Other languages
English (en)
Inventor
Jochen Wieschermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE112007003505A5 publication Critical patent/DE112007003505A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
DE112007003505T 2007-03-19 2007-03-19 Elektrische Leiterbahnen enthaltende Paneel-Vorrichtungen sowie Verfahren zu deren Herstellung Withdrawn DE112007003505A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2007/000505 WO2008113304A1 (de) 2007-03-19 2007-03-19 Elektrische leiterbahnen enthaltende paneel-vorrichtungen sowie verfahren zu deren herstellung

Publications (1)

Publication Number Publication Date
DE112007003505A5 true DE112007003505A5 (de) 2010-02-11

Family

ID=38794145

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007003505T Withdrawn DE112007003505A5 (de) 2007-03-19 2007-03-19 Elektrische Leiterbahnen enthaltende Paneel-Vorrichtungen sowie Verfahren zu deren Herstellung

Country Status (3)

Country Link
EP (1) EP2135494A1 (de)
DE (1) DE112007003505A5 (de)
WO (1) WO2008113304A1 (de)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3052749A (en) 1957-11-26 1962-09-04 Martin Marietta Corp Lightweight printed circuit panel
DE3585318D1 (de) 1984-11-22 1992-03-12 Asahi Chemical Ind Expandierbare polyetherimidzusammensetzungen und davon abgeleitete geschaeumte materialien.
JPS63229897A (ja) * 1987-03-19 1988-09-26 古河電気工業株式会社 リジツド型多層プリント回路板の製造方法
TW210422B (de) * 1991-06-04 1993-08-01 Akzo Nv
DE10207589A1 (de) 2002-02-22 2003-10-16 Leoni Ag Verfahren zum Erzeugen einer Leiterbahn auf einem Trägerbauteil sowie Trägerbauteil
DE102005034082A1 (de) * 2005-07-21 2007-02-01 Hirschmann Car Communication Gmbh Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil aus Kunststoff

Also Published As

Publication number Publication date
WO2008113304A1 (de) 2008-09-25
EP2135494A1 (de) 2009-12-23

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee