DE112007002591A5 - Automatic placement machine for equipping substrates with components - Google Patents

Automatic placement machine for equipping substrates with components Download PDF

Info

Publication number
DE112007002591A5
DE112007002591A5 DE112007002591T DE112007002591T DE112007002591A5 DE 112007002591 A5 DE112007002591 A5 DE 112007002591A5 DE 112007002591 T DE112007002591 T DE 112007002591T DE 112007002591 T DE112007002591 T DE 112007002591T DE 112007002591 A5 DE112007002591 A5 DE 112007002591A5
Authority
DE
Germany
Prior art keywords
components
placement machine
automatic placement
equipping substrates
equipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112007002591T
Other languages
German (de)
Inventor
Werner Liegel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT GmbH and Co KG
Original Assignee
Siemens Electronic Assembly Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Electronic Assembly Systems GmbH and Co KG filed Critical Siemens Electronic Assembly Systems GmbH and Co KG
Publication of DE112007002591A5 publication Critical patent/DE112007002591A5/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
DE112007002591T 2006-12-12 2007-11-12 Automatic placement machine for equipping substrates with components Withdrawn DE112007002591A5 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006058570 2006-12-12
DE102006058570.4 2006-12-12
PCT/EP2007/009782 WO2008071280A1 (en) 2006-12-12 2007-11-12 Pick-and-place robot for placing components on substrates

Publications (1)

Publication Number Publication Date
DE112007002591A5 true DE112007002591A5 (en) 2009-11-05

Family

ID=39229122

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007002591T Withdrawn DE112007002591A5 (en) 2006-12-12 2007-11-12 Automatic placement machine for equipping substrates with components

Country Status (3)

Country Link
CN (1) CN101578931B (en)
DE (1) DE112007002591A5 (en)
WO (2) WO2008071280A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008056734B3 (en) * 2008-11-11 2010-07-22 Siemens Electronics Assembly Systems Gmbh & Co. Kg Automatic assembly machine for assembling electronic member on substrate, has door frame system continuously used when operator operates in member pick-up zone, where member pick-up zone and assembly zone are separated in space
US11420323B2 (en) 2017-05-16 2022-08-23 Abb Schweiz Ag Method and control system for controlling movement sequences of a robot
CN117397384A (en) * 2021-05-31 2024-01-12 西门子股份公司 Method and control device for determining at least one fixture for an assembly line

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088433B2 (en) * 1987-01-20 1996-01-29 ヤマハ発動機株式会社 Chip component mounting device
JPH05304396A (en) * 1991-07-12 1993-11-16 Canon Inc Method and device for deciding mounting order of component
CN1099226C (en) * 1995-07-12 2003-01-15 松下电器产业株式会社 Method and apparatus for mounting electronic components
US5909674A (en) * 1996-12-23 1999-06-01 Philips Electronics North America Corp. Method for optimizing the layout and charge maps of a flowline of pick and place machines
DE19919916C2 (en) * 1999-04-30 2001-07-05 Siemens Ag Process for the time-optimized assembly of printed circuit boards
JP4762480B2 (en) * 2000-08-22 2011-08-31 パナソニック株式会社 Component mounting apparatus and method
JP3589658B2 (en) * 2001-09-28 2004-11-17 松下電器産業株式会社 Optimization device, mounting device and electronic component mounting system
JP2004128400A (en) * 2002-10-07 2004-04-22 Fuji Mach Mfg Co Ltd Component mounting apparatus, program for controlling operation of the same apparatus, and component mounting system

Also Published As

Publication number Publication date
WO2008071529A1 (en) 2008-06-19
WO2008071280A1 (en) 2008-06-19
CN101578931A (en) 2009-11-11
CN101578931B (en) 2014-03-19

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Legal Events

Date Code Title Description
R082 Change of representative

Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELL, DE

Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELLSCHA

R081 Change of applicant/patentee

Owner name: ASM ASSEMBLY SYSTEMS GMBH & CO. KG, DE

Free format text: FORMER OWNER: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GMBH & CO. KG, 81379 MUENCHEN, DE

Effective date: 20110713

R012 Request for examination validly filed

Effective date: 20110513

R120 Application withdrawn or ip right abandoned

Effective date: 20131206