DE112007002480A5 - Semiconductor body and method for testing a semiconductor body - Google Patents
Semiconductor body and method for testing a semiconductor body Download PDFInfo
- Publication number
- DE112007002480A5 DE112007002480A5 DE112007002480T DE112007002480T DE112007002480A5 DE 112007002480 A5 DE112007002480 A5 DE 112007002480A5 DE 112007002480 T DE112007002480 T DE 112007002480T DE 112007002480 T DE112007002480 T DE 112007002480T DE 112007002480 A5 DE112007002480 A5 DE 112007002480A5
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor body
- testing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006049324A DE102006049324A1 (en) | 2006-10-19 | 2006-10-19 | Semiconductor body and method for testing a semiconductor body |
DE102006049324.9 | 2006-10-19 | ||
PCT/EP2007/061190 WO2008046904A1 (en) | 2006-10-19 | 2007-10-19 | Semi-conductor body and method for testing a semi-conductor body |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112007002480A5 true DE112007002480A5 (en) | 2010-06-10 |
Family
ID=39156529
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102006049324A Withdrawn DE102006049324A1 (en) | 2006-10-19 | 2006-10-19 | Semiconductor body and method for testing a semiconductor body |
DE112007002480T Withdrawn DE112007002480A5 (en) | 2006-10-19 | 2007-10-19 | Semiconductor body and method for testing a semiconductor body |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102006049324A Withdrawn DE102006049324A1 (en) | 2006-10-19 | 2006-10-19 | Semiconductor body and method for testing a semiconductor body |
Country Status (2)
Country | Link |
---|---|
DE (2) | DE102006049324A1 (en) |
WO (1) | WO2008046904A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013124711A1 (en) * | 2012-02-24 | 2013-08-29 | Freescale Semiconductor, Inc. | A semiconductor device comprising an output driver circuitry, a packaged semiconductor device and associated methods |
ITMI20121059A1 (en) * | 2012-06-18 | 2013-12-19 | St Microelectronics Srl | CONTINUITY TESTS IN ELECTRONIC DEVICES WITH MULTIPLE CONNECTED FEET |
FR3117266B1 (en) * | 2020-12-09 | 2023-10-27 | St Microelectronics Crolles 2 Sas | Electronic device comprising wired connections |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4894605A (en) * | 1988-02-24 | 1990-01-16 | Digital Equipment Corporation | Method and on-chip apparatus for continuity testing |
EP0720023B1 (en) * | 1994-12-30 | 2003-05-07 | STMicroelectronics S.r.l. | Test method for power integrated devices |
FR2769131B1 (en) * | 1997-09-29 | 1999-12-24 | St Microelectronics Sa | SEMICONDUCTOR DEVICE HAVING TWO GROUND CONNECTION POINTS CONNECTED TO A GROUND CONNECTION LEG AND METHOD FOR TESTING SUCH A DEVICE |
IT1311277B1 (en) * | 1999-12-23 | 2002-03-12 | St Microelectronics Srl | ELECTRONIC DEVICE WITH DOUBLE WIRE CONNECTIONS, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND VERIFICATION METHOD |
DE10115613A1 (en) * | 2001-03-29 | 2002-10-10 | Infineon Technologies Ag | Integrated circuit, especially memory component, has at least two test circuits that can be connected to connector field via selection switch |
DE10200649A1 (en) * | 2002-01-10 | 2003-07-24 | Infineon Technologies Ag | Testing method for power semiconductor element with identical cells has cells divided into groups |
JP2004226115A (en) * | 2003-01-20 | 2004-08-12 | Elpida Memory Inc | Semiconductor device and its testing method |
US7183786B2 (en) * | 2003-03-04 | 2007-02-27 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Modifying a semiconductor device to provide electrical parameter monitoring |
JP2005072375A (en) * | 2003-08-26 | 2005-03-17 | Renesas Technology Corp | Semiconductor integrated circuit |
-
2006
- 2006-10-19 DE DE102006049324A patent/DE102006049324A1/en not_active Withdrawn
-
2007
- 2007-10-19 WO PCT/EP2007/061190 patent/WO2008046904A1/en active Application Filing
- 2007-10-19 DE DE112007002480T patent/DE112007002480A5/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2008046904A1 (en) | 2008-04-24 |
DE102006049324A1 (en) | 2008-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE502007006092D1 (en) | COORDINATE MEASURING DEVICE AND METHOD FOR OPERATING A COORDINATE MEASURING DEVICE | |
DE502007005133D1 (en) | TEST BODY AND METHOD FOR MEASURING A COORDINATE MEASURING DEVICE | |
DE502007004934D1 (en) | DEVICE AND METHOD FOR MANUFACTURING A THREE-DIMENSIONAL OBJECT | |
DE502007005046D1 (en) | METHOD AND DEVICE FOR SUPPORTING A GUIDANCE OF A VEHICLE | |
DE112005001350A5 (en) | Method and device for stabilizing a vehicle | |
DE112008002807A5 (en) | Hob and method for operating a hob | |
DE602006009890D1 (en) | Method for adding an effect and device for adding an effect | |
DE112008000710A5 (en) | Hob and method for operating a hob | |
DE602006003328D1 (en) | CLOSING SYSTEM AND METHOD FOR FILLING A LIQUID | |
DE502008001740D1 (en) | Container and method for opening a container | |
DE602006014598D1 (en) | DEVICE FOR DETECTING A LOCK FAILURE AND METHOD THEREFOR | |
DE502007001136D1 (en) | DEVICE AND METHOD FOR FLEXIBLE CLASSIFICATION | |
DE502006000776D1 (en) | Method and device for processing a cable | |
DE502007005763D1 (en) | INDUCTIVE COMPONENT AND METHOD FOR PRODUCING AN INDUCTIVE CONSTRUCTION ELEMENT | |
DE602005026461D1 (en) | METHOD AND DEVICE FOR HEATING A SUBJECT | |
DE602004016225D1 (en) | METHOD FOR WRITING A LONG-SLIPED OBJECT AND DEVICE FOR WRAPPING THIS LONG-SLIPED OBJECT | |
DE112007000166A5 (en) | Method and device for referencing the position of an actuator | |
DE112008000723A5 (en) | Apparatus and method for testing the edge of a semiconductor wafer | |
ATE486005T1 (en) | METHOD FOR OPERATING A CIRCUIT DIVING DEVICE AND A CIRCUIT DEVICE | |
DE602006013337D1 (en) | METHOD FOR FORMPRESSING A PORTION PART WITH A CURVED SECTION AND FORMPRESSING DEVICE | |
DE502005004321D1 (en) | METHOD AND DEVICE FOR CONTROLLING AN INJECTOR | |
DE112007002288A5 (en) | Semiconductor body and method for designing a semiconductor body with a connecting lead | |
DE602007008712D1 (en) | PROBE AND METHOD FOR CHECKING | |
DE112008000876A5 (en) | Hybrid dryer and method of operating such a hybrid dryer | |
DE602007008997D1 (en) | Apparatus and method for testing a fuel flow |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
R016 | Response to examination communication | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20120501 |