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H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
H01M4/00—Electrodes
H01M4/02—Electrodes composed of, or comprising, active material
H01M4/04—Processes of manufacture in general
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
Y02E60/10—Energy storage using batteries
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Engineering & Computer Science
(AREA)
Manufacturing & Machinery
(AREA)
Chemical & Material Sciences
(AREA)
Chemical Kinetics & Catalysis
(AREA)
Electrochemistry
(AREA)
General Chemical & Material Sciences
(AREA)
Battery Electrode And Active Subsutance
(AREA)
Description
Hierzu ι Blatt Zeichnungen.For this purpose ι sheet of drawings.
BERLIN. GEDRUCKT IN DER REICHSDRUCKEREI.BERLIN. PRINTED IN THE REICHSDRUCKEREI.
Claims (1)
Patent-Anspruch:Patent claim:Verfahren zur Herstellung von Elektrodenplatten für elektrische Sammler mittelst nachträglich
zu entfernender oder verlorener Formen, dadurch gekennzeichnet, dafs die die
Elektrodenmasse einschliefsende Form zu gleicher Zeit als Hülle benutzt wird, welche die
Elektroden vor dem Einsetzen in die Formirflüssigkeit vor Beschädigung schützt und erst
in dieser oder nach Herausheben der formirten Platten aus der Formirflüssigkeit zerstört oder
entfernt wird.Process for the production of electrode plates for electrical collectors by means of retrospectives
forms to be removed or lost, characterized in that the
Electrode compound enclosing form is used at the same time as a sheath, which the
Protects electrodes from damage before inserting them into the formir liquid and only
destroyed or destroyed in this or after the formed plates have been lifted out of the forming liquid
Will get removed.
Production of a semiconductor wafer from a semiconducting workpiece comprises subjecting a conducting tool as electrode to an electrical current from a direct voltage source, and applying to the workpiece in the presence of an electrolyte