DE10345467B3 - Forming control instruction for mask writer for semiconductor manufacturing involves inserting auxiliary surface with second color value into intermediate region before dividing first area so first area is divided into two sub-areas - Google Patents

Forming control instruction for mask writer for semiconductor manufacturing involves inserting auxiliary surface with second color value into intermediate region before dividing first area so first area is divided into two sub-areas Download PDF

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Publication number
DE10345467B3
DE10345467B3 DE10345467A DE10345467A DE10345467B3 DE 10345467 B3 DE10345467 B3 DE 10345467B3 DE 10345467 A DE10345467 A DE 10345467A DE 10345467 A DE10345467 A DE 10345467A DE 10345467 B3 DE10345467 B3 DE 10345467B3
Authority
DE
Germany
Prior art keywords
area
color value
areas
intermediate region
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10345467A
Other languages
German (de)
Inventor
Henning Haffner
Christian Crell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE10345467A priority Critical patent/DE10345467B3/en
Application granted granted Critical
Publication of DE10345467B3 publication Critical patent/DE10345467B3/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31777—Lithography by projection
    • H01J2237/31788—Lithography by projection through mask

Abstract

The method involves providing a circuit layout (10) containing the pattern to be transferred with a first area (30) associated with a first color value characterizing an exposure, at least one second area (20) enclosing the first in at least one intermediate region (40) and associated with a different color value, dividing the first area into rectangular exposure areas (31), translating and storing the exposure areas into/in the control instruction. An auxiliary surface (50) with the second color value is inserted into the intermediate region before dividing the first area so the first area is divided into two sub-areas, one of which is rectangular so it can be filed with a rectangular exposure area in the division step.
DE10345467A 2003-09-30 2003-09-30 Forming control instruction for mask writer for semiconductor manufacturing involves inserting auxiliary surface with second color value into intermediate region before dividing first area so first area is divided into two sub-areas Expired - Fee Related DE10345467B3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10345467A DE10345467B3 (en) 2003-09-30 2003-09-30 Forming control instruction for mask writer for semiconductor manufacturing involves inserting auxiliary surface with second color value into intermediate region before dividing first area so first area is divided into two sub-areas

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10345467A DE10345467B3 (en) 2003-09-30 2003-09-30 Forming control instruction for mask writer for semiconductor manufacturing involves inserting auxiliary surface with second color value into intermediate region before dividing first area so first area is divided into two sub-areas

Publications (1)

Publication Number Publication Date
DE10345467B3 true DE10345467B3 (en) 2005-04-28

Family

ID=34399097

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10345467A Expired - Fee Related DE10345467B3 (en) 2003-09-30 2003-09-30 Forming control instruction for mask writer for semiconductor manufacturing involves inserting auxiliary surface with second color value into intermediate region before dividing first area so first area is divided into two sub-areas

Country Status (1)

Country Link
DE (1) DE10345467B3 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6361911B1 (en) * 2000-04-17 2002-03-26 Taiwan Semiconductor Manufacturing Company Using a dummy frame pattern to improve CD control of VSB E-beam exposure system and the proximity effect of laser beam exposure system and Gaussian E-beam exposure system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6361911B1 (en) * 2000-04-17 2002-03-26 Taiwan Semiconductor Manufacturing Company Using a dummy frame pattern to improve CD control of VSB E-beam exposure system and the proximity effect of laser beam exposure system and Gaussian E-beam exposure system

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Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee