DE10345390A1 - Abdeckvorrichtung für Bauteile einer Halbleiter-Bearbeitungskammer - Google Patents
Abdeckvorrichtung für Bauteile einer Halbleiter-Bearbeitungskammer Download PDFInfo
- Publication number
- DE10345390A1 DE10345390A1 DE2003145390 DE10345390A DE10345390A1 DE 10345390 A1 DE10345390 A1 DE 10345390A1 DE 2003145390 DE2003145390 DE 2003145390 DE 10345390 A DE10345390 A DE 10345390A DE 10345390 A1 DE10345390 A1 DE 10345390A1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor
- cover device
- peripheral edge
- outer peripheral
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Die vorliegende Erfindung betrifft eine Abdeckvorrichtung (1) für Bauteile einer Halbleiter-Bearbeitungskammer (4), wobei die Abdeckvorrichtung (1) den Umfangsrand des zu bearbeitenden Halbleiters (3) umgibt und die Oberfläche (2; 20, 21) der Abdeckvorrichtung (1) im wesentlichen in Richtung des äußeren Umfangsrandes (25) der Abdeckvorrichtung (1) abfallend geneigt ausgebildet ist.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003145390 DE10345390A1 (de) | 2003-09-30 | 2003-09-30 | Abdeckvorrichtung für Bauteile einer Halbleiter-Bearbeitungskammer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003145390 DE10345390A1 (de) | 2003-09-30 | 2003-09-30 | Abdeckvorrichtung für Bauteile einer Halbleiter-Bearbeitungskammer |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10345390A1 true DE10345390A1 (de) | 2005-05-04 |
Family
ID=34399071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2003145390 Withdrawn DE10345390A1 (de) | 2003-09-30 | 2003-09-30 | Abdeckvorrichtung für Bauteile einer Halbleiter-Bearbeitungskammer |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE10345390A1 (de) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5868847A (en) * | 1994-12-16 | 1999-02-09 | Applied Materials, Inc. | Clamp ring for shielding a substrate during film layer deposition |
US5942039A (en) * | 1997-05-01 | 1999-08-24 | Applied Materials, Inc. | Self-cleaning focus ring |
US6258219B1 (en) * | 1993-09-09 | 2001-07-10 | Applied Materials, Inc. | Two-step deposition process for preventing arcs |
US6364957B1 (en) * | 1997-10-09 | 2002-04-02 | Applied Materials, Inc. | Support assembly with thermal expansion compensation |
JP2003243366A (ja) * | 2001-12-13 | 2003-08-29 | Tokyo Electron Ltd | プラズマ処理装置 |
-
2003
- 2003-09-30 DE DE2003145390 patent/DE10345390A1/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6258219B1 (en) * | 1993-09-09 | 2001-07-10 | Applied Materials, Inc. | Two-step deposition process for preventing arcs |
US5868847A (en) * | 1994-12-16 | 1999-02-09 | Applied Materials, Inc. | Clamp ring for shielding a substrate during film layer deposition |
US5942039A (en) * | 1997-05-01 | 1999-08-24 | Applied Materials, Inc. | Self-cleaning focus ring |
US6364957B1 (en) * | 1997-10-09 | 2002-04-02 | Applied Materials, Inc. | Support assembly with thermal expansion compensation |
JP2003243366A (ja) * | 2001-12-13 | 2003-08-29 | Tokyo Electron Ltd | プラズマ処理装置 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: QIMONDA AG, 81739 MUENCHEN, DE |
|
8139 | Disposal/non-payment of the annual fee |