DE10344770A1 - Optical module and optical system - Google Patents

Optical module and optical system Download PDF

Info

Publication number
DE10344770A1
DE10344770A1 DE10344770A DE10344770A DE10344770A1 DE 10344770 A1 DE10344770 A1 DE 10344770A1 DE 10344770 A DE10344770 A DE 10344770A DE 10344770 A DE10344770 A DE 10344770A DE 10344770 A1 DE10344770 A1 DE 10344770A1
Authority
DE
Germany
Prior art keywords
semiconductor element
dollar
series
lens unit
circuit carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10344770A
Other languages
German (de)
Inventor
Josef Dirmeyer
Harald Schmidt
Henryk Frenzel
Danut Bogdan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE10344770A priority Critical patent/DE10344770A1/en
Priority to US10/573,538 priority patent/US20070031137A1/en
Priority to PCT/EP2004/052187 priority patent/WO2005031422A1/en
Priority to EP04766799A priority patent/EP1664882A1/en
Priority to JP2006526636A priority patent/JP2007506126A/en
Publication of DE10344770A1 publication Critical patent/DE10344770A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)

Abstract

Die vorliegende Erfindung betrifft ein optisches Modul mit einem Schaltungsträger (10); einem auf dem Schaltungsträger (10) angeordneten gehäusten Halbleiterelement (12) und einer Linseneinheit (14; 16, 18, 20; 21) zum Projizieren von elektromagnetischer Strahlung auf das Halbleiterelement (12). DOLLAR A Erfindungsgemäß ist zwischen dem Gehäuse (13) des Halbleiterelements (12) und der Linseneinheit (14; 16, 18, 20; 21) wenigstens ein Distanzelement (35) angeordnet. DOLLAR A Die Erfindung erlaubt durch Anordnung eines preiswerten Distanzelements (35) den einfachen Ausgleich etwaig verbliebener Fertigungstoleranzen, beispielsweise zwischen kundenspezifisch ausgebildeten Halbleitergehäusen (13) und Linseneinheiten (14; 16, 18, 20; 21) aus Baureihen unterschiedlicher Fertigungsqualität. Während bislang toleranzüberschreitende Baureihen als Ausschuss keinerlei Verwendung zugeführt werden konnten, ist mit der erfindungsgemäß vorgeschlagenen Verwendung eines Ausgleichselements (35) in vorteilhafter Weise der Aufbau zuverlässiger Kameramoduln ermöglicht, bei dem auch weiterhin grundsätzlich auf jegliche mechanische Fokuseinstellung verzichtet werden kann. Derartige Kameramoduln eignen sich insbesondere bei Anwendungen im Innen- und/oder Außenbereich eines Kraftfahrzeugs.The present invention relates to an optical module with a circuit carrier (10); a packaged semiconductor element (12) arranged on the circuit carrier (10) and a lens unit (14; 16, 18, 20; 21) for projecting electromagnetic radiation onto the semiconductor element (12). DOLLAR A According to the invention, at least one spacer element (35) is arranged between the housing (13) of the semiconductor element (12) and the lens unit (14; 16, 18, 20; 21). DOLLAR A The invention allows by placing a cheap spacer element (35) the simple compensation of any remaining manufacturing tolerances, for example, between custom designed semiconductor housings (13) and lens units (14; 16, 18, 20; 21) from series of different manufacturing quality. While hitherto tolerance-exceeding series could not be used as rejects, the use of a compensating element (35) proposed according to the invention advantageously makes it possible to construct reliable camera modules in which basically any mechanical focus adjustment can be dispensed with. Such camera modules are particularly suitable for applications in the interior and / or exterior of a motor vehicle.

DE10344770A 2003-09-26 2003-09-26 Optical module and optical system Withdrawn DE10344770A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE10344770A DE10344770A1 (en) 2003-09-26 2003-09-26 Optical module and optical system
US10/573,538 US20070031137A1 (en) 2003-09-26 2004-09-15 Optical module comprising a spacer element between the housing of a semiconductor element and a lens unit
PCT/EP2004/052187 WO2005031422A1 (en) 2003-09-26 2004-09-15 Optical module comprising a spacer element between the housing of a semiconductor element and a lens unit
EP04766799A EP1664882A1 (en) 2003-09-26 2004-09-15 Optical module comprising a spacer element between the housing of a semiconductor element and a lens unit
JP2006526636A JP2007506126A (en) 2003-09-26 2004-09-15 Optical module having a spacing element between a semiconductor element housing and a lens unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10344770A DE10344770A1 (en) 2003-09-26 2003-09-26 Optical module and optical system

Publications (1)

Publication Number Publication Date
DE10344770A1 true DE10344770A1 (en) 2005-05-04

Family

ID=34384305

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10344770A Withdrawn DE10344770A1 (en) 2003-09-26 2003-09-26 Optical module and optical system

Country Status (5)

Country Link
US (1) US20070031137A1 (en)
EP (1) EP1664882A1 (en)
JP (1) JP2007506126A (en)
DE (1) DE10344770A1 (en)
WO (1) WO2005031422A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006023467A1 (en) * 2006-05-18 2007-11-22 Siemens Ag Optical device with a dust-binding element and driver assistance system
DE202013010568U1 (en) * 2013-11-22 2015-02-25 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Camera module mounting kit
EP1897365B2 (en) † 2005-06-17 2018-12-12 Robert Bosch Gmbh Camera arrangement with an image sensor sealed from environmental influences
DE102020209779A1 (en) 2020-08-04 2022-02-10 Robert Bosch Gesellschaft mit beschränkter Haftung Image capture device and a method for manufacturing an image capture device

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JP4478442B2 (en) * 2003-12-05 2010-06-09 日本電産サンキョー株式会社 LENS DRIVE DEVICE AND MANUFACTURING METHOD THEREOF
JP2006295714A (en) * 2005-04-13 2006-10-26 Olympus Corp Imaging apparatus
TWI289365B (en) 2005-09-29 2007-11-01 Visera Technologies Co Ltd Wafer scale image module
CN1945857B (en) * 2005-10-09 2012-06-27 采钰科技股份有限公司 Wafer grade image module
US20080122928A1 (en) * 2005-11-09 2008-05-29 Inx Inc. Stealth mounting system for video and sound surveillance equipment
JP5427337B2 (en) 2005-12-21 2014-02-26 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー Semiconductor device, method for manufacturing the same, and camera module
JP2007181043A (en) * 2005-12-28 2007-07-12 Mitsumi Electric Co Ltd Camera module
DE102006013164A1 (en) 2006-03-22 2007-09-27 Robert Bosch Gmbh Method for mounting a camera module and camera module
JP4221427B2 (en) * 2006-08-28 2009-02-12 株式会社タムロン Optical device, imaging device, and electronic apparatus
EP1944966A1 (en) 2007-01-11 2008-07-16 STMicroelectronics (Research & Development) Limited Lens assembly
JP2008203696A (en) * 2007-02-22 2008-09-04 Sony Corp Arrangement structure of lens, camera module and electronic equipment
CN101581817A (en) * 2008-05-13 2009-11-18 鸿富锦精密工业（深圳）有限公司 Spacer ring and camera module therewith
WO2010129460A1 (en) * 2009-05-03 2010-11-11 Lensvector Inc. Camera module with tolerance adjustment using embedded active optics
WO2011008443A2 (en) 2009-06-29 2011-01-20 Lensvector Inc. Wafer level camera module with active optical element
EP2473879A1 (en) * 2009-08-31 2012-07-11 HI-KEY Limited Method for determining the sharpness of a fixed-focus camera, test device for testing the sharpness of a fixed-focus camera, fixed-focus camera as well as method for assembling a fixed-focus camera
JP5017406B2 (en) * 2010-03-24 2012-09-05 株式会社東芝 The camera module
US9065991B2 (en) 2010-11-04 2015-06-23 Lensvector Inc. Methods of adjustment free manufacture of focus free camera modules
US8604576B2 (en) * 2011-07-19 2013-12-10 Opitz, Inc. Low stress cavity package for back side illuminated image sensor, and method of making same
TWI453485B (en) * 2012-04-03 2014-09-21 Largan Precision Co Ltd An optical lens assembly and a laser welding method used for the same
FR2990662B1 (en) * 2012-05-16 2015-08-07 Renault Sa CAMERA RECOVERY INTEGRATED LOGO
US9106819B1 (en) * 2013-10-14 2015-08-11 Google Inc. Camera module with compact X-Y form factor
US9667900B2 (en) 2013-12-09 2017-05-30 Optiz, Inc. Three dimensional system-on-chip image sensor package
US20150244904A1 (en) * 2014-02-27 2015-08-27 Genius Electronic Optical Co., Ltd. Lens with combined barrel and holder
JP6035687B2 (en) * 2014-08-29 2016-11-30 Smk株式会社 The camera module
KR102326535B1 (en) 2014-12-17 2021-11-16 엘지이노텍 주식회사 Lens array and camera module including the array
US10447900B2 (en) 2015-08-06 2019-10-15 Apple Inc. Camera module design with lead frame and plastic moulding
WO2017216385A1 (en) * 2016-06-17 2017-12-21 Connaught Electronics Ltd. Camera for a motor vehicle, comprising an integrally formed housing top part and a lens carrier, as well as motor vehicle and method for manufacturing a camera for a motor vehicle
KR102648387B1 (en) * 2016-10-13 2024-03-18 엘지이노텍 주식회사 Lens driving device, camera module and optical apparatus
US9860430B1 (en) * 2017-03-10 2018-01-02 Honda Motor Co., Ltd. Emblem cover assembly
EP3492804A1 (en) * 2017-12-04 2019-06-05 ZKW Group GmbH Motor vehicle headlight and process
EP3667162A1 (en) * 2018-12-11 2020-06-17 ZKW Group GmbH Lighting device for a motor vehicle headlight
US20210109519A1 (en) * 2019-10-11 2021-04-15 Steering Solutions Ip Holding Corporation Remote sensor system
CN114384659A (en) * 2020-10-16 2022-04-22 宁波舜宇光电信息有限公司 Lens assembly, assembling method thereof and camera module comprising lens assembly
CN113655552A (en) * 2021-08-03 2021-11-16 浙江舜宇光学有限公司 Spacer ring and lens

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US6792179B2 (en) * 2002-12-31 2004-09-14 Intel Corporation Optical thumbtack
US7137745B2 (en) * 2003-03-19 2006-11-21 Oki Electric Industry Co., Ltd. Subassembly and optical module
DE10329988B3 (en) * 2003-06-27 2005-01-13 Infineon Technologies Ag Opto-electronic transmitting and / or receiving arrangement

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1897365B2 (en) † 2005-06-17 2018-12-12 Robert Bosch Gmbh Camera arrangement with an image sensor sealed from environmental influences
DE102006023467A1 (en) * 2006-05-18 2007-11-22 Siemens Ag Optical device with a dust-binding element and driver assistance system
DE202013010568U1 (en) * 2013-11-22 2015-02-25 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Camera module mounting kit
DE102020209779A1 (en) 2020-08-04 2022-02-10 Robert Bosch Gesellschaft mit beschränkter Haftung Image capture device and a method for manufacturing an image capture device

Also Published As

Publication number Publication date
US20070031137A1 (en) 2007-02-08
EP1664882A1 (en) 2006-06-07
WO2005031422A1 (en) 2005-04-07
JP2007506126A (en) 2007-03-15

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Legal Events

Date Code Title Description
ON Later submitted papers
OP8 Request for examination as to paragraph 44 patent law
8139 Disposal/non-payment of the annual fee