DE1030756B - Method of joining a non-metallic material, e.g. ceramic, to a metal part by soldering - Google Patents
Method of joining a non-metallic material, e.g. ceramic, to a metal part by solderingInfo
- Publication number
- DE1030756B DE1030756B DET13430A DET0013430A DE1030756B DE 1030756 B DE1030756 B DE 1030756B DE T13430 A DET13430 A DE T13430A DE T0013430 A DET0013430 A DE T0013430A DE 1030756 B DE1030756 B DE 1030756B
- Authority
- DE
- Germany
- Prior art keywords
- ceramic
- titanium
- solder
- soldering
- metal part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/122—Metallic interlayers based on refractory metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Description
Verfahren zum Verbinden eines nichtmetallischen Stoffes, beispielsweise Keramik, mit einem Metallteil durch Lötung Die Erfindung betrifft ein Verfahren zum Verbinden .eines .nidhtmetalliischen Stoffes, beispielsweise Keramik, mit einem Metallteil durdh Lötung unter Verwendung einer ti.tan'haltigen Lotlegierung.Method for joining a non-metallic material, for example Ceramic, with a metal part by soldering The invention relates to a method for connecting .eines .nidhtmetalliischen substance, for example ceramic, with a Metal part by soldering using a solder alloy containing titanium.
Es ist bereits bekannt, Keramik und Metallteile miteinander unter Verwendung titannaltiger Aktivlote zu verbinden. Der Zusatz des Aktivators Titan hat den Zweck, die Keramikoberfläche durch das, Lot direkt benetzbar zu machen, so daß eine vorherige Metaltieierung nidht erforderl-idh ist. In der Literatur ist bisher allgemein die Auffassung vertreten worden, daß mindestens 5% Titan :nötig sind, um die gewünschte Benetzung des Lotes auf der Keramik zu erreichen.It is already known to interconnect ceramic and metal parts Use active solders containing titanium to connect. The addition of the activator titanium has the purpose of making the ceramic surface directly wettable by the solder, so that prior metalization is not required. In the literature is hitherto it has generally been held that at least 5% titanium: necessary to achieve the desired wetting of the solder on the ceramic.
Th.. L. E v a n s berichtet in seinem Aufsatz »Ceramic-to-Metal Seals for Vacuum Tubes«, veröffentlicht in der Zeitschrift »Ceramic Age«, August 1954, S. 10, über Metall-Keramik-Lötungen unter Verwendung von vorher erschmolzenen Lotlegierungen aus Silber-Kupfer-Eutektikum mit einem Titang:dhalt von 5 bzw. 8% und bezeichnet diese Löturigen als sehr wenig zuverlässig.Th .. L. E v a n s reports in his essay »Ceramic-to-Metal Seals for Vacuum Tubes ", published in the magazine" Ceramic Age ", August 1954, P. 10, about metal-ceramic soldering using previously melted solder alloys Made of silver-copper eutectic with a titanium content of 5 or 8% and designated this soldering as very unreliable.
Bei den meisten Literaturangaben liegt das Aktivlot nicht als eine einheitlich geschmolzene Legierung vor. Es wird vielfach ein Lötdraht benutzt, der aus einem Hartlot, vorzugsweise aus Silber-Kupfer-Eutektikum, mit einer eingelagerten Titanseele besteht. Durch .die Wahl verschiedener Stärken des Titandrahtes im Verhältnis zum Lotmantel läßt sieh der Prozentgehalt des Titans variieren. Dieser Draht wird meist seitlich an die Lötfuge angelegt. Nach Erreichung des Schmelzpunktes des L otmantels wiird die Titanseele auflegiert und so die Benetzung der Keramik durch das Lot erzielt. H. Bender gibt in seinem Aufsatz »New Developmen ts in Metal-Ceramic-Seals«, erschienen in der Zeitschrift »The Sylvania Technologis:t«, Januar 1955, auf S. 23 und 24 das Optimum der Benetzung des Lotes auf der Keramik unter Berücksichtigung der Haltbarkeit dien Verbindung mit 10 bis 14% Ttangehalt an. Das Minimum .der Benetzbarkeit unter diesen Voraussetzungen soll bei 7'°/o Titangehalt liegen. In der Literatur wird aber durchweg darauf hingewiesen, da;ß derartige Löturigen spröde sind und in den meisten Fällen die Keramik bei Temperaturbeanspruchung zerbricht. So berichtet Bender .in der bereits angeführten Arbeit auf S. 24, daß bei Metall-Keramik-Lötungen mit dem titanhaltigen Zweisdhichtlötdrarht alle Keramiken mit Ausnahme von Sinterto:nerdekeramik zerbrechen. Sintertonerdekeramik ist ein extrem fester Werkstoff (Zugfestigkeit 2400 bis 2650 kg/cm2 gegen 450 bis 600 kg/cm2 für Forsteritkeramik). Infolge der hohen Dielektrizitätskonstanten von 11 bei Sintertonerde ist diese Keramik bei Dezimeterröhren nicht überall ohne weiteres einsetzbar, und man .ist des öfteren auf die weniger feste Specksteinkeramik angewiesen.In most of the literature, the active solder is not present as a uniformly molten alloy. A soldering wire is often used which consists of a hard solder, preferably a silver-copper eutectic, with an embedded titanium core. By choosing different thicknesses of the titanium wire in relation to the solder jacket, the percentage of titanium can be varied. This wire is usually placed on the side of the solder joint. After the soldering jacket has reached its melting point, the titanium core is alloyed on, thus wetting the ceramic with the solder. H. Bender in his essay "New Developments in Metal-Ceramic-Seals", published in the magazine "The Sylvania Technologis: t", January 1955, on p. 23 and 24 under the optimum of the wetting of the solder on the ceramic Taking into account the shelf life, a combination with 10 to 14% Ttan content is recommended. The minimum of wettability under these conditions should be 7% titanium. In the literature, however, it is consistently pointed out that such solder joints are brittle and in most cases the ceramic breaks when exposed to high temperatures. In the work already cited on p. 24, Bender reports that metal-ceramic soldering with the titanium-containing two-layer soldering wire breaks all ceramics with the exception of sintered earth ceramics. Sintered clay ceramics is an extremely strong material (tensile strength 2400 to 2650 kg / cm2 versus 450 to 600 kg / cm2 for forsterite ceramics). As a result of the high dielectric constant of 11 in sintered clay, this ceramic cannot easily be used everywhere in decimeter tubes, and one is often dependent on the less solid soapstone ceramic.
Das erfindungsgemäße Verfahren :ermöglicht die Herstellung zuverlässiger, vakuumdichter Metall-Keramik-Verbindungen.The method according to the invention: enables the production of more reliable, vacuum-tight metal-ceramic connections.
Das erfindungsgemäße Verfahren zum Verbinden eines n:iehtmetallischen Stoffes, beispielsweise Keramik, mit einem Metallteil durch Löturig unten- Verwendung einer vorher ers@dhmolz,enen Lotlegie.rung ist dadurch gekennzeichnet, daß die Lo:tlegierung Titan im Bereich von 0,5 bis 3'%, vorzugsweise 1 bis 2%; enthält.The method according to the invention for connecting a non-ferrous metal Substance, for example ceramic, with a metal part by Löturig down-use a previously created solder alloy is characterized in that the solder alloy Titanium in the range from 0.5 to 3%, preferably 1 to 2%; contains.
Überraschenderweise hat sich nämlich ergeben:, daß der bisher für notwendig erachtete hohe Titangehalt der Aktivlotse nicht nur unnötig ist, sondern sich sogar ungünstig auf die Güte der Löturig auswirkt.Surprisingly, it turned out that the previously for The high titanium content of the active pilot, which is deemed necessary, is not only unnecessary, but even has an unfavorable effect on the quality of the Löturig.
In der kurzen Lötzeit von einigen Minuten bildet sich beispielsweise bei Verwendung des titan!haltigen Zw-eisdhi@dhtlötdrahtes keine einheitliche Silber-Kupfer-Titan-Legierung, sondern es entstehen spröde; intermetallische Verbindungen mit sehr unterschiedlichem Ti-tangehalt, die bei einer späteren Temperaturbeanspruchung der Lötstelle zu Undidhtigkeiten: führen können. Ähnliches geschieht bei der Verwendung einer vorher erschmolzenen titanhaltigen. Lotleg:iierung mit zu hohem Titangdhalt.For example, it forms in the short soldering time of a few minutes when using the titanium! containing Zw-eisdhi @ dhtlötdrahtes no uniform silver-copper-titanium alloy, rather, they are brittle; intermetallic compounds with very different Ti-content, which leads to leaks when the solder joint is exposed to temperature later on: being able to lead. Something similar happens when using a previously melted one titanium-containing. Solder alloying with too high a titanium content.
Wird der Titangehalt einer vorher erschmolzenen Lotlegierung jedoch entsprechend der Erfindung in niedrigen Grenzen gehalten, so entsteht beim Erschmelzen des Lotes eine echte Legierung, und die etwa möglichen. Ausfällungen heiim Abkühlen. auf Zimmertemperatur beschränken sich auf ein Minimum. Ein derartiges Lot besitzt bei noch ausreichender Haftfestigkeit auf nicht metallisierter Keramik die größtmögliche Duktilität. Auch braucht beim Lötvorgang der benetzende Titananteil nicht erst durch die Silber -Kupfer - Eutektikum - Schlcht hindürchzuwarndern wie bei der Verwendung von titanhaltigem Zweischichtl.ötdräht, .sondern kommt im Augenblick des Ersdhmelzens des Lotes mit der Keramik in Berührung. Dadurch ergeben sich sehr homogene und damit zuverlässige, vakuumdichte Lötverbindungen.However, if the titanium content of a previously melted solder alloy kept within low limits according to the invention, it arises during melting of the solder is a real alloy, and the possible ones. Precipitates on cooling. room temperature are kept to a minimum. Has such a solder with still sufficient Adhesion to non-metallized ceramic the greatest possible ductility. The wetting titanium part also needs during the soldering process not only through the silver - copper - eutectic - Schlcht to be warned like when using titanium-containing two-layer soldered wire, but comes at the moment when the solder is hammered into contact with the ceramic. This results in a lot homogeneous and therefore reliable, vacuum-tight soldered connections.
Die Erfindung ist nicht auf Hartlote beschränkt. Vielmehr zeigen auch Weichlote, beispielsweise eine Zinn-Indium-Gold-Legierung, mit dem erfindungsgemäßen Titan.ghalt die beschriebenen günstigen Eigenschaften.The invention is not limited to hard solders. Rather show too Soft solders, for example a tin-indium-gold alloy, with the inventive Titanium has the favorable properties described.
Gemäß einer Weiterbildung der Erfindung, die ganz allgemein anwendbar ist, hat das Metallteil zumindest im Bereich der Verbindung mit .dem nichtmetallischen Stoff eine Wandstärke von weniger als 0,3 mm, vorzugsweise eine solche von nur 0,15 bis 0,20 mm. Wenn man den. Metallpartner so dünn, wählt, d.aß die Werte für die Streckgrenze unter die Werte der Zugfestigkeit der Keramiktele zu- liegen kommen, so ist es nicht mehr erforderlich, daß die Wärmeausdehnungswerte von Metall und Keramik über den ganzen Bereich von. Zimmertemperatur bis zum Schmelzpunkt des Lotes übereinstimmen, da sich der dünnwandige Metallpartner gegebenenfalls, plastisch verformen kann. So können beispielsweise mit gutem Erfolg Stumpflötungen- mit Eisen-Nickel- bzw. Eisen-Nickel-Kobalt-Legierungen undKeramik durchgeführt werden, obwähldiese Metallegierungen nur bis zum Curiepunkt bei. etwa 400 bis 500° C in der Wärmeausdehnung an Keramik anzugleichen sind, bei .dem darüberliegenden Temperaturbereich bis zum Schmelzpunkt-des Lotes aber bekanntlich eine höhere, von der Keramik völlig. abweichende Ausdehnung besitzen. Es ist natürlich ,erforderlich, daß die konstruktive Durchbildung der Metallteile so vorgenommen werden muß, (daß die durch die geschwächte Wandstärke verlorengegangene Festigkeit der Metallteile durch entsprechende Formgebung wieder zurückerlangt wird.According to a further development of the invention, which can be used very generally is, the metal part has at least in the area of the connection with .dem non-metallic Fabric has a wall thickness of less than 0.3 mm, preferably a wall thickness of only 0.15 up to 0.20 mm. If you have the. Metal partner so thin, chooses that the values for the The yield point is below the tensile strength values of the ceramic panels, so it is no longer necessary that the thermal expansion values of metal and Ceramics all over the range of. Room temperature up to the melting point of the solder match, since the thin-walled metal partner, if necessary, plastically can deform. For example, butt joints - with iron-nickel- or iron-nickel-cobalt alloys and ceramics, although these Metal alloys only up to the Curie point. about 400 to 500 ° C in thermal expansion are to be adjusted to ceramic, with .the temperature range above it up to The melting point of the solder is known to be higher than that of the ceramic. different Own expansion. It is, of course, necessary to have constructive training the metal parts must be made in such a way (that the weakened wall thickness lost strength of the metal parts through appropriate shaping is recovered.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DET13430A DE1030756B (en) | 1957-03-28 | 1957-03-28 | Method of joining a non-metallic material, e.g. ceramic, to a metal part by soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DET13430A DE1030756B (en) | 1957-03-28 | 1957-03-28 | Method of joining a non-metallic material, e.g. ceramic, to a metal part by soldering |
Publications (1)
Publication Number | Publication Date |
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DE1030756B true DE1030756B (en) | 1958-05-22 |
Family
ID=7547335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DET13430A Pending DE1030756B (en) | 1957-03-28 | 1957-03-28 | Method of joining a non-metallic material, e.g. ceramic, to a metal part by soldering |
Country Status (1)
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1433158B2 (en) * | 1960-01-28 | 1971-10-21 | Magyar Adocsogyar, Budapest | SOLDER POWDER MIXTURE IN COMPRESSED FORM FOR VACUUM-SEALING MECHANICAL FIRM CONNECTION OF DIFFICULT MATERIALS |
EP0038072A1 (en) * | 1980-04-16 | 1981-10-21 | Mtu Motoren- Und Turbinen-Union MàNchen Gmbh | Metal-ceramic element and its production |
EP0104623A2 (en) * | 1982-09-24 | 1984-04-04 | GTE Products Corporation | Ductile brazing alloy containing reactive metals and precious metals |
EP0110418A2 (en) * | 1982-12-02 | 1984-06-13 | GTE Products Corporation | Ductile brazing alloys containing reactive metals |
EP0135603A1 (en) * | 1983-09-26 | 1985-04-03 | GTE Products Corporation | Ductile low temperature brazing alloy |
EP0195640A1 (en) * | 1985-03-16 | 1986-09-24 | British Aerospace Public Limited Company | Method of joining two members |
EP0263954A1 (en) * | 1986-09-24 | 1988-04-20 | DEMETRON Gesellschaft für Elektronik-Werkstoffe m.b.H. | Method for manufacture of quick acting fuses |
DE3813947A1 (en) * | 1988-04-26 | 1989-11-09 | Asea Brown Boveri | METHOD FOR APPLYING A CATALYST LAYER CONSISTING OF PRECIOUS METALS AND / OR PRECIOUS METAL COMPOUNDS TO A CARRIER OF CERAMIC MATERIAL |
EP0368126A1 (en) * | 1988-11-07 | 1990-05-16 | The Morgan Crucible Company Plc | Silver-copper-aluminum-titanium brazing alloy |
EP0369150A1 (en) * | 1988-11-07 | 1990-05-23 | The Morgan Crucible Company Plc | Silver-copper-titanium brazing alloy containing crust inhibiting element |
AT394151B (en) * | 1990-08-27 | 1992-02-10 | Wolf Hochvakuum Verbindungstec | Method of producing a joint between materials, of which at least one is a ceramic material |
-
1957
- 1957-03-28 DE DET13430A patent/DE1030756B/en active Pending
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1433158B2 (en) * | 1960-01-28 | 1971-10-21 | Magyar Adocsogyar, Budapest | SOLDER POWDER MIXTURE IN COMPRESSED FORM FOR VACUUM-SEALING MECHANICAL FIRM CONNECTION OF DIFFICULT MATERIALS |
EP0038072A1 (en) * | 1980-04-16 | 1981-10-21 | Mtu Motoren- Und Turbinen-Union MàNchen Gmbh | Metal-ceramic element and its production |
EP0104623A3 (en) * | 1982-09-24 | 1985-04-03 | Gte Products Corporation | Ductile brazing alloy containing reactive metals and precious metals |
EP0104623A2 (en) * | 1982-09-24 | 1984-04-04 | GTE Products Corporation | Ductile brazing alloy containing reactive metals and precious metals |
EP0110418A3 (en) * | 1982-12-02 | 1985-08-14 | GTE Products Corporation | Ductile brazing alloys containing reactive metals |
EP0110418A2 (en) * | 1982-12-02 | 1984-06-13 | GTE Products Corporation | Ductile brazing alloys containing reactive metals |
EP0135603A1 (en) * | 1983-09-26 | 1985-04-03 | GTE Products Corporation | Ductile low temperature brazing alloy |
EP0195640A1 (en) * | 1985-03-16 | 1986-09-24 | British Aerospace Public Limited Company | Method of joining two members |
EP0263954A1 (en) * | 1986-09-24 | 1988-04-20 | DEMETRON Gesellschaft für Elektronik-Werkstoffe m.b.H. | Method for manufacture of quick acting fuses |
DE3813947A1 (en) * | 1988-04-26 | 1989-11-09 | Asea Brown Boveri | METHOD FOR APPLYING A CATALYST LAYER CONSISTING OF PRECIOUS METALS AND / OR PRECIOUS METAL COMPOUNDS TO A CARRIER OF CERAMIC MATERIAL |
US4971939A (en) * | 1988-04-26 | 1990-11-20 | Asea Brown Boveri Ltd | Process for applying a catalyst layer composed of noble metals and/or noble-metal compounds to a support made of ceramic material |
EP0368126A1 (en) * | 1988-11-07 | 1990-05-16 | The Morgan Crucible Company Plc | Silver-copper-aluminum-titanium brazing alloy |
EP0369150A1 (en) * | 1988-11-07 | 1990-05-23 | The Morgan Crucible Company Plc | Silver-copper-titanium brazing alloy containing crust inhibiting element |
AT394151B (en) * | 1990-08-27 | 1992-02-10 | Wolf Hochvakuum Verbindungstec | Method of producing a joint between materials, of which at least one is a ceramic material |
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