DE10230711B4 - Electrically conductive connection - Google Patents

Abstract

electrical conductive connection between arranged on a metallic carrier Conductor tracks and electronics, characterized in that the conductor tracks (4) on the carrier (1) are applied thick-film conductors, on which a connecting tracks (5) carrying, leading to electronics insulation support is placed on and the interconnected interconnects (4) and Connecting conductor tracks (5) overlap and are welded together.

Description

The The invention relates to an electrically conductive connection between on a metallic carrier arranged conductor tracks and electronics.

at such electrically conductive compounds z. B. one on one mechanically loadable carrier DMS sensor with an evaluation this is done by thick wire bonds. For this purpose, a bond frame or a bondable circuit board is required. Since the bond pads of the frame must be coated with precious metal surfaces is the connection technology thick wire bonding consuming and expensive.

From the DE 44 23 888 A1 is an electrically conductive connection between arranged on a non-metallic carrier tracks and electronics known.

From the DE 34 121 963 A1 a strain sensor is known in which strain gauge resistors and a conductor pattern are applied by sputtering (cathode sputtering) on a metallic carrier. The circuit diagram has input connections as well as output connections via which a connection to evaluation electronics can be made.

task The invention is therefore an electrically conductive connection as well a method for producing an electrically conductive compound to create the type mentioned, the cost and reliably lead to a stable connection, are structurally simple and require little installation effort.

These Task is solved in an electrically conductive connection characterized in that the tracks on the carrier are applied thick-film conductors to which a connecting conductor tracks, leading electronics Isolation carrier applied is and the interconnected interconnects and interconnects cover up and welded together are.

In order to a simple construction of the electrically conductive connection is achieved.

is the metallic carrier electrically conductive, are for insulating the interconnects between the tracks and the carrier one or more insulating layers arranged.

This takes place in a manner that is easy to manufacture in that the insulating layer or insulating layers on the carrier are sintered glass layers.

Of the carrier can be made of steel. This allows the electrically conductive connection be easily exposed to temperatures up to about 250 ° C.

A Particularly simple training is achieved in that the insulation support a flexible film is and the interconnect lines on the flexible Foil laminated copper conductor tracks are, the film preferably is a polyimide film.

One close to each other are smaller than 0.5 mm of the tracks and the interconnect lines is possible in a simple manner, if the conductor tracks and the connecting conductor tracks are laser welded together. At the same time creates an intimate electrically conductive connection.

Of the carrier can be a mechanically resilient and elastically deformable sensor component and the interconnects a sensor components carrying sensor circuit form.

The Sensor circuit may be a strain gauge circuit.

To A simple and mechanical manufacturing leads it when the sensor circuit further electrical or electronic components, in particular Carries SMD components.

Easy can be produced and securely contactable, if the thick-film conductors consist of a sintered conductor paste.

there is preferably the conductor track paste made of silver or silver platinum or silver palladium or copper or gold.

The o. g object is in a process for producing an electrical solved by conductive connection that on the carrier printed the pattern of the tracks with a conductor paste and is baked in a subsequent temperature process, then that the Isolation carrier such is put on, that its connecting tracks on the them each associated conductor tracks come to rest and that thereafter the interconnect tracks by laser pulse loading with their associated interconnects are welded.

On The pattern of printed conductors can be produced in a simple way or more applied to the carrier formed as a metallic carrier Insulating layers are printed.

For this purpose, the insulating layers can be printed by screen printing on the support and in egg be sintered on the carrier in a subsequent sintering process.

Become the individual insulating layers by means of sieves with different Mesh on the carrier applied, so a homogeneous insulating layer is produced, resulting in a particularly high level of security of the insulating effect of the insulating layer leads.

The Pattern of tracks is preferably in the temperature process with a temperature of about 850 ° C baked.

Become first the insulating layers and after their drying, the conductor tracks imprinted, can these layers are sintered in a single temperature process. After burning in the pattern of the tracks, the tracks can equipped with electrical and / or electronic components and be connected conductively.

to Securing against shifting during the Manufacturing process, the insulation carrier after circulation of the interconnect tracks on the tracks on the carrier be fixed.

This takes place in a simple manner in that the insulation carrier by Gluing or by mechanical action against the carrier on the carrier is fixed.

A intimate electrically conductive connection is thereby easily achieved that the interconnect tracks with the tracks by means of the insulation carrier passing laser pulses at one or more welds welded become.

One embodiment The invention is illustrated in the drawing and will be described below described in more detail. The sole figure of the drawing shows a cross-sectional view of a electrical connection.

The illustrated electrical connection has a carrier 1 made of steel with a rectangular cross-section, on one surface of which are two superimposed insulating layers 2 and 3 are applied. The insulating layers 2 and 3 consist of glass and are screenprinted as glass frit paste on the carrier 1 applied and sintered in a temperature process.

Subsequently, on the upper insulating layer 3 likewise in screen printing with conductor paste a pattern of conductor tracks 4 applied, the connection structures are shown lying side by side.

Also these tracks 4 were, preferably together with the insulating layers 2 and 3 sintered in a temperature process of about 850 ° C.

Not shown sensor components were then on the tracks 4 applied and form with the pattern of the tracks 4 a strain gauge circuit through which an elastic deformation due to a mechanical load of the carrier 1 is detected.

The on a flexible Poliimidfolie 6 laminated connecting conductor tracks 5 made of copper with the same connection structures as the conductor tracks 4 , were on the tracks 4 hung up. By a the Poliimidfolie 6 with the interconnects 5 on the tracks 4 pressing downholder 7 became the poliimide film 6 fixed in their position.

In the area of the superposed connection structures of the conductor tracks 4 and the interconnect tracks 5 is the hold-down 7 with a through opening 8th Mistake. Through this opening 8th Through a welding of each interconnected interconnects 4 and interconnect tracks 5 by applying laser beams 9 and generating a plurality of welds. This was the conductor tracks 4 via the leading to an evaluation circuit, not shown leading interconnects 5 connected to this evaluation circuit, in which then an evaluation of the detected elastic deformation of the carrier 1 he follows.

In order to achieve an additional strain relief of the electrically conductive connection, the region of the flexible polyimide film which adjoins the electrically conductive connection could be adhesively bonded to the carrier 1 be connected. This could be realized in a simple manner by means of a prefabricated double-sided adhesive connection.

1

carrier

2

insulating

3

insulating

4

conductor path

5

Connection track

6

Poliimidfolie

7

Stripper plate

8th

opening

9

laser beam

Claims (21)

Electrically conductive connection between interconnects arranged on a metallic carrier and electronics, characterized that the tracks ( 4 ) on the carrier ( 1 ) are applied thick-film conductors, to which a connecting conductor tracks ( 5 ) bearing, leading to the electronics insulation carrier is placed and the interconnected interconnects ( 4 ) and interconnect tracks ( 5 ) overlap and are welded together. Electrically conductive connection according to claim 1, characterized in that the metallic carrier ( 1 ) electrically conductive and between the tracks ( 4 ) and the carrier ( 1 ) one or more insulating layers ( 2 . 3 ) are arranged. Electrically conductive connection according to claim 2, characterized in that the insulating layer or insulating layers ( 2 . 3 ) on the carrier ( 1 ) are sintered glass layers. Electrically conductive connection according to one of Claims 2 and 3, characterized in that the support ( 1 ) consists of steel. Electrically conductive connection according to one of the preceding claims, characterized in that the insulating support is a flexible film and the connecting conductor tracks ( 5 ) are on the flexible film on laminated copper conductor tracks. Electrically conductive connection according to one of the preceding claims, characterized in that the film is a Poliimidfolie ( 6 ). Electrically conductive connection according to one of the preceding claims, characterized in that the conductor tracks ( 4 ) and the interconnect tracks ( 5 ) are laser welded together. Electrically conductive connection according to one of the preceding claims, characterized in that the carrier ( 1 ) is a mechanically resilient and elastically deformable sensor component and the conductor tracks ( 4 ) form a sensor circuit carrying sensor circuit. Electrically conductive connection according to claim 8, characterized characterized in that the sensor circuit comprises a strain gauge circuit is. Electrically conductive connection according to one of claims 8 and 9, characterized in that the sensor circuit further electrical or electronic components, in particular SMD components (Surface Mounted Devices). Electrically conductive connection according to one of the preceding Claims, characterized in that the thick-film conductor tracks from a consist of sintered conductor paste. Electrically conductive connection according to claim 11, characterized in that the conductor track paste of silver or made of silver platinum or silver palladium or of copper or of Gold exists. Process for producing an electrically conductive compound according to one of Claims 1 to 12, characterized in that the carrier ( 1 ) the pattern of the tracks ( 4 ) is printed with a conductor track paste and baked in a subsequent temperature process, that then the insulation carrier is placed such that its connecting tracks ( 5 ) on their respective associated conductor tracks ( 4 ) and that thereafter the interconnect tracks ( 5 ) by laser pulse loading with their associated conductor tracks ( 4 ) are welded. Method according to claim 13, characterized in that the pattern of printed conductors ( 4 ) to one or more of the metallic carrier ( 1 ) trained carrier applied insulating layers ( 2 . 3 ) is printed. Method according to claim 14, characterized in that the insulating layers ( 2 . 3 ) by screen printing on the support ( 1 ) and in a subsequent sintering process on the carrier ( 19 ) are sintered. Method according to claim 15, characterized in that the individual insulating layers ( 2 . 3 ) by means of sieving with different meshes on the support ( 1 ) are applied. Method according to one of claims 13 to 16, characterized in that the pattern of conductor tracks ( 4 ) is baked in the temperature process at a temperature of about 850 ° C. Method according to one of claims 13 to 17, characterized in that after the burning of the pattern of the conductor tracks ( 4 ) the conductor tracks ( 4 ) with electrical and / or electronic components, in particular with sensor components, equipped and conductively connected. Method according to one of claims 13 to 18, characterized in that the insulation carrier after contact of the interconnecting conductor tracks ( 5 ) on the tracks ( 4 ) on the support ( 1 ) is fixed. A method according to claim 19, characterized in that the insulating support by gluing or by mechanical loading against the carrier ( 1 ) on the support ( 1 ) is fixed. Method according to one of claims 13 to 20, characterized in that the connecting conductor tracks ( 5 ) with the tracks ( 4 ) are welded by means of passing through the insulation carrier laser pulses at one or more welds.