DE10208044B8 - Method and device for monitoring a manufacturing process - Google Patents

Method and device for monitoring a manufacturing process Download PDF

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Publication number
DE10208044B8
DE10208044B8 DE10208044A DE10208044A DE10208044B8 DE 10208044 B8 DE10208044 B8 DE 10208044B8 DE 10208044 A DE10208044 A DE 10208044A DE 10208044 A DE10208044 A DE 10208044A DE 10208044 B8 DE10208044 B8 DE 10208044B8
Authority
DE
Germany
Prior art keywords
monitoring
manufacturing process
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10208044A
Other languages
German (de)
Other versions
DE10208044B4 (en
DE10208044A1 (en
Inventor
Dirk Knobloch
Knut Dr. Voigtländer
Jan Zimpel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE10208044A priority Critical patent/DE10208044B8/en
Publication of DE10208044A1 publication Critical patent/DE10208044A1/en
Publication of DE10208044B4 publication Critical patent/DE10208044B4/en
Application granted granted Critical
Publication of DE10208044B8 publication Critical patent/DE10208044B8/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/10—Plc systems
    • G05B2219/11—Plc I-O input output
    • G05B2219/1112—Bit addressing, handling
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2223/00—Indexing scheme associated with group G05B23/00
    • G05B2223/02—Indirect monitoring, e.g. monitoring production to detect faults of a system

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
DE10208044A 2002-02-25 2002-02-25 Method and device for monitoring a manufacturing process Expired - Fee Related DE10208044B8 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10208044A DE10208044B8 (en) 2002-02-25 2002-02-25 Method and device for monitoring a manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10208044A DE10208044B8 (en) 2002-02-25 2002-02-25 Method and device for monitoring a manufacturing process

Publications (3)

Publication Number Publication Date
DE10208044A1 DE10208044A1 (en) 2003-09-11
DE10208044B4 DE10208044B4 (en) 2008-10-09
DE10208044B8 true DE10208044B8 (en) 2009-01-22

Family

ID=27740399

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10208044A Expired - Fee Related DE10208044B8 (en) 2002-02-25 2002-02-25 Method and device for monitoring a manufacturing process

Country Status (1)

Country Link
DE (1) DE10208044B8 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009059097B4 (en) 2009-12-18 2011-09-01 Dtf Technology Gmbh Method and device for evaluating the light emitted by a plasma for controlling plasma-assisted vacuum processes
DE102019107295A1 (en) * 2019-03-21 2020-09-24 Aixtron Se Method for determining the state of a CVD reactor under production conditions
DE202021103238U1 (en) * 2021-06-16 2021-06-22 TRUMPF Hüttinger GmbH + Co. KG Signal processing system and power supply device with a signal processing system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658423A (en) * 1995-11-27 1997-08-19 International Business Machines Corporation Monitoring and controlling plasma processes via optical emission using principal component analysis
US5737496A (en) * 1993-11-17 1998-04-07 Lucent Technologies Inc. Active neural network control of wafer attributes in a plasma etch process
US5739051A (en) * 1993-03-04 1998-04-14 Tokyo Electron Limited Method and device for detecting the end point of plasma process
DE19653479C1 (en) * 1996-12-20 1998-09-03 Siemens Ag Process and device for process control and process optimization when bleaching fibrous materials
US5864773A (en) * 1995-11-03 1999-01-26 Texas Instruments Incorporated Virtual sensor based monitoring and fault detection/classification system and method for semiconductor processing equipment
US5877032A (en) * 1995-10-12 1999-03-02 Lucent Technologies Inc. Process for device fabrication in which the plasma etch is controlled by monitoring optical emission
WO2001056072A1 (en) * 2000-01-25 2001-08-02 Infineon Technologies Ag Method for monitoring a manufacturing process
WO2002014967A2 (en) * 2000-08-17 2002-02-21 Teccon S.R.L. Method for carrying out an automated production process

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5739051A (en) * 1993-03-04 1998-04-14 Tokyo Electron Limited Method and device for detecting the end point of plasma process
US5737496A (en) * 1993-11-17 1998-04-07 Lucent Technologies Inc. Active neural network control of wafer attributes in a plasma etch process
US5877032A (en) * 1995-10-12 1999-03-02 Lucent Technologies Inc. Process for device fabrication in which the plasma etch is controlled by monitoring optical emission
US5864773A (en) * 1995-11-03 1999-01-26 Texas Instruments Incorporated Virtual sensor based monitoring and fault detection/classification system and method for semiconductor processing equipment
US5658423A (en) * 1995-11-27 1997-08-19 International Business Machines Corporation Monitoring and controlling plasma processes via optical emission using principal component analysis
DE19653479C1 (en) * 1996-12-20 1998-09-03 Siemens Ag Process and device for process control and process optimization when bleaching fibrous materials
WO2001056072A1 (en) * 2000-01-25 2001-08-02 Infineon Technologies Ag Method for monitoring a manufacturing process
WO2002014967A2 (en) * 2000-08-17 2002-02-21 Teccon S.R.L. Method for carrying out an automated production process

Also Published As

Publication number Publication date
DE10208044B4 (en) 2008-10-09
DE10208044A1 (en) 2003-09-11

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: G05B 19048

8396 Reprint of erroneous front page
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee