DE102022211620A1 - Power module with top contact - Google Patents

Abstract

The present invention relates to a power module (10) for a power converter for supplying current to an electric axle drive in an electric vehicle and/or a hybrid vehicle, comprising a plurality of semiconductor switching elements (14) for converting an input current generated by an input-side voltage source into an output current by switching the semiconductor switching elements (14), a circuit carrier (12) to which the semiconductor switching elements (14) are connected on the underside, wiring (16a,b) to which the semiconductor switching elements (14) are connected on the top side, a plurality of power connections (18a,b) for feeding in the input current and/or for tapping the output current, wherein at least one of the plurality of power connections (18a,b) extends from the wiring (16a,b) along a direction that is substantially orthogonal to an upper side (121) of the circuit carrier (12).

Description

The invention relates to a power module for a power converter, in particular for an inverter, for supplying current to an electric axle drive of an electric vehicle or a hybrid vehicle, a method for producing a power module for a power converter, a corresponding power converter, in particular an inverter, a corresponding electric axle drive with such a power converter and a corresponding vehicle with such an electric axle drive.

Electric vehicles, such as battery-powered vehicles (Battery Electric Vehicles) and hybrid vehicles, are known in the state of the art. These are powered exclusively or in a supporting manner by one or more electric machines as drive units. In order to supply the electric machines of such electric vehicles with electrical energy, the electric vehicles include electrical energy storage devices, in particular rechargeable electric batteries. These batteries are designed as direct current sources. However, the electric machines usually require alternating current. Therefore, a so-called inverter equipped with power electronics is usually connected between a battery and an electric machine (E-machine) of an electric vehicle.

Such inverters usually comprise semiconductor switching elements, which are typically made of transistors, such as MOSFETs or IGBTs. It is known to design the semiconductor switching elements as so-called half-bridges, which have a high-side device and a low-side device. This high-side or low-side device comprises one or more semiconductor switching elements connected in parallel, which are specifically controlled during operation of the inverter in order to generate several phase currents of an AC current that are offset from one another in time from a DC current fed into the input side of the half-bridges, whereby the phase currents are each variable over time and generally assume a sinusoidal shape.

The semiconductor switching elements are preferably transistors such as MOSFETs or IGBTs and each have several connections for applying a switching current to the respective semiconductor switching element (power connections) and for impressing a switching signal (control connection) in order to pass or block the switching current. Signal pins are used to transmit the switching signal, which are connected on the one hand to the control connection and on the other hand to a control device (or driver device) which comprises a circuit board equipped with driver components. The semiconductor switching elements can be accommodated in a current-insulating protective casing.

The disadvantage of the power modules known from the state of the art is that the external electrical contacts on the power connections require more space for the other components so that the power module can also be contacted. A further disadvantage is that these external electrical contacts in the known power modules come at the expense of the low inductance.

It is an object of the invention to provide a power module for a power converter, in particular an inverter, in order to at least partially eliminate the disadvantages mentioned above.

This object is achieved according to the invention by the power module, the method for producing a power module, the power converter, the electric axle drive and the vehicle according to the independent patent claims. Advantageous embodiments and further developments of the invention emerge from the dependent patent claims.

The invention relates to a power module for a power converter, in particular an inverter, for operating an electric axle drive in an electric vehicle and/or a hybrid vehicle. The power module comprises a plurality of semiconductor switching elements for feeding in an input current and for generating an output current based on the fed-in input current by switching the semiconductor switching elements. The power converter is preferably a DC/AC inverter. In this case, the input current is a DC current provided by a DC voltage source, the output current being an AC current with multiple phase currents. Alternatively, the power converter can be a DC/DC rectifier. In this case, the input current is a DC input current provided by a DC voltage source, the output current being a DC output current different from the DC input current, which is preferably supplied to a vehicle battery for charging it.

The semiconductor switching elements are preferably transistors, such as MOSFETs and/or IGBTs. The semiconductor material underlying the semiconductor switching elements is preferably silicon or a so-called semiconductor with a large band gap, such as silicon carbide (SiC) or gallium nitride (GaN).

The power module further comprises a circuit carrier to which the semiconductor switching elements are connected on the underside, a wiring to which the semiconductor switching elements are connected on the upper side, and a plurality of power connections for feeding in the input current and/or for tapping the output current.

At least one of the plurality of power connections extends from the wiring along a direction that is substantially orthogonal to a top side of the circuit carrier. Thus, one of the plurality of power connections is provided substantially perpendicularly on a top side of the wiring. The wiring preferably provides an electrical contact between the semiconductor circuit elements and the power connections such that the input current can be fed in or the output current can be tapped off.

The invention also relates to a method for producing a power module for a power converter for supplying current to an electric axle drive in an electric vehicle and/or a hybrid vehicle. The method comprises (a) connecting a plurality of semiconductor switching elements to a circuit carrier on the lower side for converting an input current generated by an input-side voltage source into an output current by switching the semiconductor switching elements, (b) connecting the plurality of semiconductor switching elements to a wiring on the upper side, (c) connecting a plurality of power connections to the wiring for feeding in the input current and/or for tapping the output current, wherein at least one of the plurality of power connections extends from the wiring along a direction that is substantially orthogonal to an upper side of the circuit carrier. The method may further comprise (d) encapsulating, for example by applying a potting compound, the power module with an encapsulation such that only end regions of the plurality of power terminals can be electrically contacted on an encapsulation top side of the encapsulation, preferably partially removing the encapsulation such that the end regions of the plurality of power terminals are exposed.

This has the advantage that the power module according to the invention, or the power module obtainable by the method according to the invention, can be contacted not only from the side, i.e. parallel to the plane of the circuit carrier, but also from the top. For example and preferably, the power connections for feeding in the input current can be attached to the top of the power module and the power connections for tapping the output current can be attached to the side. Furthermore, for example and preferably, the power connections for tapping the output current can be attached to the top of the power module and the power connections for feeding in the input current can be attached to the side. The improved surface contactability achieved makes it possible to achieve a more compact design in which the power module can be contacted from all sides with the exception of the bottom. Other components can, for example, be arranged directly on the top of the power module and connected to it via short connections. In addition, a low-inductive connection to the power module can be achieved. A uniformly distributed surface contact, especially along the top side, can also serve as a heat storage and heat spreading element and thus enable not only improved spatial use of the power module but also improved heat dissipation without the need for an additional cooling device, for example.

According to one embodiment, two of the multiple power connections extend from the wiring along a direction that is essentially orthogonal to a top side of the circuit carrier, wherein the two of the multiple power connections are connected to busbars. The busbars preferably connect intermediate circuit capacitors to the power connections for feeding the input current into the power electronics. In addition, the busbars can comprise a positive-pole busbar and a negative-pole busbar. In the case that the power converter is designed as a DC/AC inverter, the busbars are designed as DC busbars for conducting the DC input current. The positive-pole busbar and the negative-pole busbar are further preferably designed to be flat and overlap one another. The first two busbars are thus parallel to one another and are offset from one another when viewed perpendicularly to their surfaces. More preferably, the busbars are provided with a cooling device such that the cooling device cools the surface of the encapsulation in which the power module according to the invention is accommodated. This has the advantage that the cooling device can also cool the power module from the top. If a coolable circuit carrier is provided at the same time, e.g. by means of a cooling device attached to the underside of the circuit carrier, The power module can be cooled from two sides, the bottom and the top.

Preferably, the circuit carrier is designed as a printed circuit board or ceramic substrate. More preferably, the circuit carrier is provided with a cooling device.

According to one embodiment, the wiring is designed as a lead frame and/or as bonding wires. Preferably, the wiring is connected to the semiconductor switching elements and, if applicable, the circuit carrier via a soldered connection, sintered connection, or electrically conductive adhesive connection. One or more lead frames or bonding wires, in particular ribbon bonds or wire bonds, are applied to the top of the semiconductor switching elements and, if applicable, the circuit carrier. It is clear that the lead frame or the bonding wires do not have to be continuous, but can also contact several separate areas of the semiconductor switching elements and, if applicable, the circuit carrier. The connection to the semiconductor switching elements and, if applicable, the circuit carrier can be achieved by a soldered connection, sintered connection, or electrically conductive adhesive connection to the semiconductor switching elements and, if applicable, the circuit carrier. This further simplifies the manufacturing process.

According to one embodiment, the power module has an encapsulation in which the power module is accommodated in such a way that only end regions of the multiple power connections can be electrically contacted on an encapsulation surface of the encapsulation. The entire power module, except for the end regions of the multiple power connections, is therefore encapsulated, preferably held in the encapsulation in a material-locking manner. The encapsulation can be an overmolding or a potting compound, e.g. made of a thermosetting plastic, in which the power module is accommodated. Preferably, a current-insulating injection molding material, e.g. a current-insulating thermosetting plastic, is used. More preferably, the injection molding material, e.g. thermosetting plastic, has sufficient thermal conductivity to enable the cooling of the power module. Even more preferably, the injection molding material has elastic properties. The person skilled in the art is familiar with suitable injection molding materials with current-insulating properties and, if appropriate, sufficient thermal conductivity and/or elastic properties. The encapsulation, preferably an overmolding or a potting compound, essentially forms a cuboid shape, wherein the circuit carrier is accommodated in the essentially cuboid-shaped encapsulation in such a way that it is essentially parallel to an encapsulation top side and an encapsulation bottom side of the essentially cuboid-shaped encapsulation, wherein the semiconductor switching elements are arranged on the top side of the circuit carrier. The best possible mechanical protection can be ensured by encapsulating the power module, with the exception of the end regions of the multiple power connections.

Suitable thermosets include, for example, phenolic resins, polyurethanes, urea and melamine resins, polyester resins, epoxy resins, and silicones. Preferably, the thermoset can be further reinforced by fibers embedded therein, e.g. glass fibers and/or carbon fibers. More preferably, the embedded fibers form a flat textile, e.g. a net or a mat, or a three-dimensional textile, e.g. a hose.

According to one embodiment, the end regions of the multiple power connections can be electrically contacted after partial removal of the encapsulation. This describes the case where the power module is initially completely encapsulated during production, including the end regions. In a subsequent step, the encapsulation is removed, for example by mechanical processing or a laser, and the end regions of the multiple power connections are thereby exposed.

According to one embodiment, the power module further comprises an electrically conductive element which extends from the circuit carrier along a direction substantially orthogonal to a top side of the circuit carrier and which is adapted to guide a signal pin for transmitting control signals for controlling the semiconductor switching elements. For this purpose, the electrically conductive element can accommodate the signal pin (in it) and/or guide it along a surface of the electrically conductive element. The signal pin is preferably electrically connected at one end thereof to the wiring for transmitting control signals and at another end thereof to a driver device. The electrically conductive element can be attached to the circuit carrier via a soldered connection, sintered connection, or electrically conductive adhesive connection. This allows the signal pin to be protected against mechanical stress, e.g. bending or breaking, e.g. during production of the power module.

According to one embodiment, the electrically conductive element is designed as a spacer, standing sleeve, or closed hollow sleeve. The spacer can hold the signal pin on one surface thereof up to, for example, the The standing sleeve or closed hollow sleeve can accommodate the signal pin and guide or lead it to the top of the encapsulation. The spacer, the standing sleeve or closed hollow sleeve can be attached to the circuit carrier using a solder joint, sinter joint or electrically conductive adhesive joint. This can ensure improved protection of the signal pin.

According to one embodiment, the method 8 comprises one or more of (a) connecting the plurality of semiconductor switching elements (14) to the circuit carrier on the underside, (b) connecting the plurality of semiconductor switching elements to the wiring on the top side, and (c) attaching the plurality of power connections via a solder connection, sintered connection, or electrically conductive adhesive connection, preferably wherein two or three of the steps (a), (b), and (c) take place simultaneously. This allows the manufacturing process to be further simplified.

According to a further embodiment, the power module is designed as a half-bridge module with a module high side and a module low side, wherein the module high side and the module low side each comprise one or more semiconductor switching elements connected in parallel. In this case, the half-bridge module itself can function as a complete half-bridge. Alternatively, several half-bridge modules can be combined with one another to form a half-bridge that is expanded in terms of the maximum amount of current that can be carried. The module high sides are connected in parallel to one another to form a high side of the combined half bridge. At the same time, the module low sides are connected in parallel to one another to form a low side of the combined half bridge. In a power converter, in particular an inverter, several, for example three, such combined half bridges can be used, wherein each combined half bridge forms a phase unit, at the current output of which one of several phase currents of the AC current is generated.

The invention further relates to a power converter for supplying current to an electric axle drive, in particular an electric machine installed in the latter with such a power module, a corresponding electric axle drive and a vehicle with such an electric axle drive. The power converter can have an inverter or a rectifier. This results in the advantages already described in connection with the power module according to the invention also for the power converter according to the invention, the electric axle drive according to the invention and the vehicle according to the invention.

In the context of the present disclosure, the expression "such as a substantially orthogonal direction" refers to a direction in relation to a plane defined by the power module, in particular the circuit carrier. Expressions such as "top" and "bottom" or "upper side" and "lower side" refer to opposite sides of the body mentioned, wherein these sides are substantially parallel to the power module, in particular the circuit carrier. Expressions such as "substantially orthogonal" or "substantially parallel" refer to a deviation of less than ±10°, preferably less than ±2°, from the direction mentioned. Expressions such as "substantially cuboidal" or "substantially cuboidal" refer to a hexahedral body, wherein corners are formed on adjacent surfaces, but these corners can also be rounded. Opposite surfaces, e.g. top and bottom, of the "substantially cuboidal" body are not necessarily parallel to one another, but can also have a deviation of less than ±5°, preferably less than ±1°, from the direction mentioned. A surface of the “essentially cuboid” body can also be a hypersurface, whereby the surface is preferably planar.

The invention is explained below by way of example using embodiments shown in the figures.

• 1 a-b eine schematische Ansicht eines Leistungsmoduls gemäß einer Ausführungsform in seitlicher Schnittansicht,
• 2a-h eine schematische Darstellung eines Verfahrens zur Herstellung eines Leistungsmoduls gemäß einer weiteren Ausführungsform in seitlicher Schnittansicht und ggf. Perspektivansicht,
• 3a-b eine schematische Darstellung der Verdrahtung der Halbleiterschaltelemente durch Bändchenbonds in Perspektivansicht,
• 4a-b eine schematische Darstellung der Verdrahtung der Halbleiterschaltelemente durch Stanzgitter in Perspektivansicht, und
• 5 eine schematische Darstellung der Bereitstellung eines elektrisch leitendes Elements auf einem Schaltungsträger.

Show it:

• 1 a -b a schematic view of a power module according to an embodiment in a side sectional view,
• 2a -h a schematic representation of a method for producing a power module according to a further embodiment in a side sectional view and possibly a perspective view,
• 3a -b a schematic representation of the wiring of the semiconductor switching elements by ribbon bonds in perspective view,
• 4a -b a schematic representation of the wiring of the semiconductor switching elements by punched grid in perspective view, and
• 5 a schematic representation of the provision of an electrically conductive element on a circuit carrier.

Identical objects, functional units and comparable components are designated with the same reference symbols throughout the figures. These objects, functional units and comparable components are identical in terms of their technical features, unless the description explicitly or implicitly indicates otherwise.

1a and 1b show a power module 10 according to an embodiment in a side sectional view. The power module 10 is designed for use with a power converter. The power converter is preferably a DC/AC inverter that generates a DC current provided by a DC voltage source (such as a battery) into an AC current with multiple phase currents. Alternatively, the power converter is a DC/DC rectifier that converts a DC input voltage into a DC output voltage that is different from this.

Out of 1a it can be seen that the power module 10 comprises a plurality of semiconductor switching elements 14 for converting an input current generated by an input-side voltage source into an output current by switching the semiconductor switching elements 14. The semiconductor switching elements 14 are attached to their underside on a circuit carrier 12, which in the present case is designed as a multi-layer substrate. The circuit carrier 12 has, for example, a first electrically conductive layer 12a made of copper adjacent to the semiconductor switching elements 14, an insulation layer 12b made of a plastic material, e.g. an epoxy resin, and a second electrically conductive layer made of copper. Wiring 16a,b in the form of a lead frame is arranged on the top side of the semiconductor switching elements 14. The wiring 16a,b is connected on the top side to several power connections 18a,b, which can be electrically contacted from the outside in order to feed in the DC current coming from an intermediate circuit capacitor and/or to deliver the AC current or the phase currents to an electric machine of an electric axle drive to be powered. Although not explicitly shown here, the wiring 16a can alternatively contact the circuit carrier 12 directly.

1a further shows that two power connections 18a,b extend from the wiring 16a,b along a direction that is essentially orthogonal to a top side 121 of the circuit carrier 12. The top side 121 of the circuit carrier 12 can either be the first electrically conductive layer 12a, or the insulating layer 12b at locations where the first electrically conductive layer 12a is not present on the insulating layer 12b. It is clear that further power connections 12 are present, for example on the sides of the power module 10. These are not shown in the present case for the sake of better illustration.

The power module 10 is further accommodated in an encapsulation 20 (or casing) made of a current-insulating material, in particular a thermosetting plastic, such that only end regions 181a,b of the two power connections 18a,b can be contacted. 1 a it is evident that the end regions 181a,b are coplanar with the surface 201 of the encapsulation 20, in particular on an encapsulation top side 202. It is conceivable that the end regions 181a,b can alternatively protrude from the encapsulation 20 or be accommodated in it, in which case the encapsulation 20 must be removed, for example by mechanical and/or chemical processing, or with a laser, in order to make the end regions 181a,b accessible for electrical contact. The encapsulation 20 has a cuboid shape, wherein the circuit carrier 12 is accommodated in the cuboid-shaped encapsulation 20 in such a way that it is substantially parallel to the encapsulation top side 202 and an encapsulation bottom side 203 of the substantially cuboid-shaped encapsulation 20, wherein the semiconductor switching elements 14, the wiring 16a and the power connections 18a,b are present on the encapsulation top side 202.

Out of 1b It can also be seen that the two power connections 18a,b formed on the encapsulation top 202 are electrically connected at the end regions 181a,b thereof to busbars 24a,b, in particular a positive-pole busbar 24a and a negative-pole busbar 24b, in order to enable the DC input current to be fed in. The busbars 24a,b connect intermediate circuit capacitors (not shown) to the respective end regions 181a,b of the power connections 18a,b for feeding the input current into the power electronics. The busbars 24a,b are formed flat along the encapsulation top 202 and partially overlap one another. The surface contact formed as busbars 24a,b functions as a heat storage and heat spreading element, which enables improved heat dissipation.

2a -c, 2e , and 2g -j show a schematic representation of a method for producing a power module 10 according to a further embodiment in a side sectional view. 2d and 2f show the respective view of 2c and 2e in perspective view.

Starting from a 2a shown circuit carrier 12, as shown in 2 B As can be seen, several semiconductor switching elements 14 are attached to the underside of the circuit carrier 12 via an electrically conductive adhesive connection.

Furthermore, as in 2c shown, the semiconductor switching elements 14 are electrically contacted on the top with a wiring 16a,b, which can also electrically contact the circuit carrier 12. The wiring 16a is attached to the semiconductor switching elements 14 and the circuit carrier 12 via an electrically conductive adhesive connection. The wiring 16b is attached only to the semiconductor switching elements 14 via an electrically conductive adhesive connection. 2d It can further be seen that the wiring 16a is designed as a punched grid 17b.

In a next, in 2e and 2f , the wiring 16a,b is provided with a power connection 18a,b, or the lead frame 17b is provided with a power connection 18a,b. The power connections 18a,b are attached to the wiring 16a or 16b via an electrically conductive adhesive connection and extend from the wiring 16a,b or the lead frame 17b along a direction that is essentially orthogonal to the top side 121 of the circuit carrier 12.

In a final, as in 2g In the step shown, the power module 10 is encapsulated with an encapsulation 20 made of an epoxy resin potting material such that the respective end regions 181a,b of the power connections 18a,b can be contacted on the encapsulation top side 202, wherein the end regions 181a,b are formed coplanar with the encapsulation top side 202.

2 hours shows an alternative to 2g . In this case, the power module including the end regions 181a,b is encapsulated with an encapsulation 20 made of an epoxy resin casting material. In this case, the end regions 181a,b must be exposed in an additional step, e.g., with a laser. In the present case, only the end region 181b of the power connection 18b is exposed and provided with a connection 25. This processing step has not yet been carried out in the case of the end region 181a of the power connection 18a, so that it cannot be contacted.

3a -b show, according to 2c -f, a schematic representation of the wiring 16a of the semiconductor switching elements 14 and the application of the power connection 18a in perspective view.

3a shows how the semiconductor switching elements 14 are electrically contacted on the top side with ribbon bonds 17a as wiring 16a, which can also electrically contact the circuit carrier 12. The ribbon bonds 17a are attached to the semiconductor switching elements 14 and the circuit carrier 12 via an electrically conductive adhesive connection.

In a next, in 3b , the ribbon bonds 17a are provided with a power connection 18a. The power connection 18a is attached to the ribbon bonds 17a via an electrically conductive adhesive connection and extends from the ribbon bonds 17a along a direction that is essentially orthogonal to the top side 121 of the circuit carrier 12.

4a -b show the corresponding facts of the 2c -f, where only a punched grid 17b is shown.

4a shows how the semiconductor switching elements 14 are electrically contacted on the top with the lead frame 17b as wiring 16a, which can also electrically contact the circuit carrier 12. The lead frame 17b is attached to the semiconductor switching elements 14 and the circuit carrier 12 via an electrically conductive adhesive connection.

In another, in 4b , the lead frame 17b is provided with a power connection 18a. The power connection 18a is attached to the lead frame 17b via an electrically conductive adhesive connection and extends from the lead frame 17b along a direction that is essentially orthogonal to the top side 121 of the circuit carrier 12.

5 shows a schematic representation of the provision of an electrically conductive element 22 on a circuit carrier 12. The electrically conductive element 22 extends from the circuit carrier 12 along a direction that is essentially orthogonal to a top side 121 of the circuit carrier 12. The electrically conductive element 22 is further adapted to guide a signal pin (not shown), which in turn is intended to control one of the semiconductor switching elements 14 (not shown) by control signals in the form of electrical voltages/currents/pulses.

In 5 the electrically conductive element 22 is designed as a standing sleeve through which the signal pin runs, which electrically connects one of the semiconductor switching elements 14, possibly via the wiring, to a driver device (not shown).

Reference symbols

10

Power module

12

Circuit carrier

12a

first electrically conductive layer

12b

Insulation layer

12a

second electrically conductive layer

14

Semiconductor switching element

16a,b

wiring

17a

Bond wires

17b

Punched grid

18a,b

Power connection

20

encapsulation

22

electrically conductive element

24a, b

Busbar

25

Connection

121

Top

181a, b

End area

201

surface

202

Encapsulation top

203

Encapsulation bottom

Claims (12)

Power module (10) for a power converter for supplying current to an electric axle drive in an electric vehicle and/or a hybrid vehicle, comprising a plurality of semiconductor switching elements (14) for converting an input current generated by an input-side voltage source into an output current by switching the semiconductor switching elements (14), a circuit carrier (12) to which the semiconductor switching elements (14) are connected on the underside, wiring (16a,b) to which the semiconductor switching elements (14) are connected on the top side, a plurality of power connections (18a,b) for feeding in the input current and/or for tapping the output current, wherein at least one of the plurality of power connections (18a,b) extends from the wiring (16a,b) along a direction that is substantially orthogonal to an upper side (121) of the circuit carrier (12). Power module (10) according to Claim 1 wherein two of the plurality of power terminals (18a,b) extend from the wiring (16a,b) along a direction substantially orthogonal to the top side (121) of the circuit carrier (12), and wherein the two of the plurality of power terminals (18a,b) are connected to busbars (24a,b). Power module (10) according to one of the preceding claims, wherein the wiring (16a,b) is designed as a punched grid (16a) and/or bonding wires (16b), preferably wherein the wiring (16a,b) is connected to the semiconductor switching elements (14) via a soldered connection, sintered connection, or electrically conductive adhesive connection, and further preferably additionally to the circuit carrier (12). Power module (10) according to one of the preceding claims, comprising an encapsulation (20) in which the power module (10) is accommodated such that only end regions (181a,b) of the plurality of power connections (18a,b) can be electrically contacted on an encapsulation surface (201) of the encapsulation (20). Power module (10) according to Claim 2 , wherein the end regions (181a,b) of the plurality of power connections (18a,b) can be electrically contacted after partial removal of the encapsulation (20). Power module (10) according to one of the preceding claims, further comprising an electrically conductive element (22) which extends from the circuit carrier (12) along a direction substantially orthogonal to the upper side (121) of the circuit carrier (12) and which is adapted to guide a signal pin for transmitting control signals for controlling the semiconductor switching elements (14). Power module (10) according to Claim 6 , wherein the electrically conductive element (22) is designed as a spacer, standing sleeve, or closed hollow sleeve. Method for producing a power module (10) for a power converter for supplying current to an electric axle drive in an electric vehicle and/or a hybrid vehicle, comprising: (a) connecting a plurality of semiconductor switching elements (14) on the underside for converting an input current generated by an input-side voltage source into an output current by switching the semiconductor switching elements (14) to a circuit carrier (12), (b) connecting the plurality of semiconductor switching elements (14) on the top side to a wiring (16a,b), (c) connecting a plurality of power connections (18a,b) to the wiring (16a,b) for feeding in the input current and/or for tapping the output current, wherein at least one of the plurality of power connections (18a,b) extends from the wiring (16a,b) along a direction that is substantially orthogonal to a top side (121) of the circuit carrier (12), and (d) if necessary, encapsulating, e.g. by Applying a potting compound to the power module (10) with an encapsulation (20) such that only end regions (181a,b) of the plurality of power connections (18a,b) are on a surface (201) of the encapsulation (20) can be electrically contacted, preferably partially removing the encapsulation (20) such that the end regions (181a,b) of the plurality of power connections (18a,b) are exposed. Procedure according to Claim 8 , wherein one or more of (a) the lower-side connection of the plurality of semiconductor switching elements (14) to the circuit carrier (12), (b) the upper-side connection of the plurality of semiconductor switching elements (14) to the wiring (16a,b), and (c) attachment of the plurality of power connections (18a,b) is carried out via a soldered connection, sintered connection, or electrically conductive adhesive connection, preferably wherein two or three of the steps (a), (b), and (c) are carried out simultaneously. Power converter, in particular inverter, for supplying current to an electric axle drive in an electric vehicle and/or a hybrid vehicle, comprising one or more power modules (10) according to one of the Claims 1 until 7 . Electric axle drive for a vehicle, in particular an electric vehicle or hybrid vehicle, comprising an electric machine, a transmission device and a power converter, in particular an inverter, according to Claim 10 . Vehicle, in particular electric vehicle or hybrid vehicle, comprising an electric axle drive according to Claim 10 .

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