DE102022111178A1 - TEST DEVICE AND METHOD FOR PROCESSING OPTOELECTRONIC COMPONENTS - Google Patents

Abstract

The invention relates to a test device for testing a large number of optoelectronic components (2), which are attached to a temporary carrier (10, 10a) with their respective main radiation direction (22) facing the latter and the components on a temporary carrier (10, 10a) facing away from the latter Side have at least one contact area (23, 23a). The test device comprises a test carrier (13) which has a plurality of electrically conductive test elements (40, 45, 70) which can be deflected perpendicular to the surface of the test carrier and which are assigned to a subset of the plurality of optoelectronic components (13); the test elements (40, 45, 70) can be moved from a starting position to a test position by the subset of optoelectronic components (2) arranged at a distance from the test carrier (13). A control circuit (91) is designed to control the plurality of electrically conductive test elements (40); and the test carrier (13) is designed to be introduced into a system (12, 14) for spraying and/or pressing together with the large number of optoelectronic components (2) on the temporary carrier (10).

Description

The present invention relates to a test arrangement and a method for processing an optoelectronic component.

In many lighting applications, white light is often required, which is now generated with so-called white LEDs, primarily for reasons of lower power consumption. The color is formed by mixed light, with two main options available. On the one hand, RGB diodes can be used, and on the other hand, white LED light sources can be produced in which primarily blue-luminous components are coated with a yellow-emitting converter. Depending on the coating, the thickness of the converter or the light emitted, variations or conscious adjustments to the color temperature are possible.

The LEDs are coated with a converter during production during the so-called packaging, i.e. the assembly and electrical contacting of the chip into a further processable housing (package). Individual chips or chip clusters are coated with converter plates or liquid-pasty converter-matrix mixtures, depending on the application and package. However, due to variations, the exact color location and thus the color temperature must then be measured by energizing the individual components. These can then be corrected using mechanical measures, such as grinding down the converter material.

However, the so-called steering is relatively time-consuming, which also increases production costs. There is therefore a need for a simpler solution with which a large number of components can be quickly tested.

SUMMARY OF THE INVENTION

This need is taken into account with the subject matter of the independent patent claims. Further training and refinements are the subject of the subclaims.

For this purpose, the inventors propose some special carrier concepts which enable contacting of the optoelectronic components after the converter layer has been applied, with which active color locus control can be implemented. This can be done for chips with both connections at the top, both connections at the bottom, or one connection at the top/bottom.

In a test device for testing a large number of optoelectronic components, these are attached to a temporary carrier with their respective main radiation direction facing the latter. On the side facing away from the temporary carrier, the optoelectronic components comprise at least one contact area. In this respect, this structure is already similar to conventional technologies in which the optoelectronic components are mounted on a temporary support and are then subjected to further process steps.

The test device according to the proposed principle now comprises a test carrier which has a plurality of electrically conductive test elements which can be deflected perpendicular to the surface of the test carrier and which are assigned to a subset of the multitude of optoelectronic components. The test elements can be moved from a starting position to a test position by the subset of optoelectronic components arranged at a distance from the test carrier.

In other words, the test carrier is equipped with deflectable test elements, at least one of which is assigned to one of the optoelectronic components. If the components are arranged at a defined distance above or on the test carrier, the test elements are deflected by the optoelectronic components from a starting position into a test position. This process ensures that the test elements are in electrical contact with the optoelectronic components, so that a large number of these components can be tested together. It is particularly useful if the components have a slightly different height due to previous process steps when they are introduced into the tool, for example after a converter material has been doctored on. This ensures that despite different heights, all components have electrical contact with the control circuit.

The test device further comprises a control circuit that is designed to control the plurality of electrically conductive test elements. According to the invention, the test carrier is designed so that it can be introduced into a tool for spraying and/or pressing together with the large number of optoelectronic components on the temporary carrier.

This process allows the optoelectronic components to be processed as a whole in various ways and, if necessary, also tested during or after processing. In particular, contacting the LED chips after applying a converter layer or a Another layer is possible, which means that active color location control can be achieved.

Some aspects deal with the design of the test facility and in particular the test elements. As already mentioned, the test device is designed in such a way that it remains connected to the optoelectronic components during further process steps. As a result, on the one hand, the optoelectronic components can be tested after each process step or at least several times during further processing, and on the other hand, the test device can be easily removed from the optoelectronic components after the process. In this context, it does not matter whether the optoelectronic components are previously isolated or form part of a wafer.

In one aspect, the test elements are formed by spring contacts. In some embodiments, these spring contacts are designed as pogo pins. In another embodiment, the test elements are each formed by spring needles which protrude from the surface of the test carrier at an angle of less than 90°. These spring needles can, for example, be attached, in particular soldered, to corresponding electrically conductive elements on the surface of the test carrier. It is also possible to attach these directly to the test carrier if it is conductive itself. In addition to soldering, a spot welding process or another type of fastening may also have been implemented.

In a further alternative aspect, the plurality of test elements are formed by a compressible conductive adhesive. This has the advantage that excess material can get into the spaces between the optoelectronic components and electrical contact is still ensured. In a further aspect, a structured support element is provided on the surface of the test carrier. This has openings that are arranged above the test elements, with a thickness of the structured support element corresponding to a height of the test position. When the optoelectronic components are placed on the structured support element, electrical contact is established via the test elements. The structured support element is compressible in some aspects, so that different heights of the optoelectronic components can be compensated for. In some aspects, this can be, for example, a plastic, in particular Viton or PDMS.

In one aspect, the plurality of electrically conductive test elements are connected to the one control circuit via supply lines within the test carrier.

Another aspect concerns the geometric arrangement of the test elements. Depending on the design, a grid dimension of the test elements corresponds to a grid of the contact areas of the subset of the large number of optoelectronic components. In such a case, each of the optoelectronic components can be tested simultaneously. In another aspect, two test elements are each assigned to an optoelectronic component, so the grid size of the test elements is smaller than the corresponding grid of the components. This is useful when contact areas of the components are opposite the light emission side.

Other grid dimensions are also possible, for example if not all optoelectronic components but only samples are to be tested during processing. In any case, this can be useful if significant deviations or variations only occur across several components, but rarely between adjacent components.

Some aspects concern the measures for testing in the test device according to the proposed principle. In some aspects, the test carrier with the plurality of optoelectronic devices can be removed from the tool to test the devices. In some aspects, the test device comprises at least one further test element, which is designed in the shape of a needle for contacting a contact area of at least one optoelectronic component of the subset of optoelectronic components on a side of the at least one optoelectronic component facing away from the test carrier. This means that components can be tested individually or, if several such test needles are used, also in groups. In some aspects, a pitch of these test needles corresponds to a pitch of the test elements on the test carrier.

In a further aspect, the test elements are designed as or have a conductive, compressible film. It is also conceivable to provide a conductive adhesive at some points of the test arrangement or also at some components, so that a subset of the optoelectronic components are electrically connected to the test carrier via the conductive adhesive.

Another aspect concerns the possibility of at least partially depositing the filling material between and on the components before it is introduced into the tool. The side facing away from the temporary support can have one or more More optoelectronic components can be covered by filler material, with an area above the contact area being recessed and the recess being filled with a conductive material. In some aspects, this filler material is dispensed, although it may not necessarily be evenly distributed after the dispensing process. By applying the test arrangement, the filling material is distributed more evenly.

In these examples, a conductive material can be applied to the contact area. This can be a conductive adhesive or another viscous conductive material that is dispensed, for example. In some other aspects, a stub, solder drop, or other conductive material is mechanically deposited on the contact area. The stub protrudes beyond the filling material in some aspects. But it is also possible for the stub or the material to lie below the surface of the filling material. The filling material can cover the stub.

Some further aspects relate to a method for processing an optoelectronic component. In the proposed method, a large number of optoelectronic components are provided on a temporary carrier, with the large number of optoelectronic components having at least one contact area on a side facing away from the temporary carrier. A test carrier is also provided which has a plurality of electrically conductive test elements which can be deflected perpendicular to the surface of the test carrier and which can be assigned to a subset of the multitude of optoelectronic components. The test elements can be moved from a starting position to a test position by the subset of optoelectronic components arranged at a distance from the test carrier. The temporary carrier is arranged on the test carrier in such a way that the test elements contact the at least one contact areas of the plurality of optoelectronic components in an electrically conductive manner. Subsequently, according to the proposed principle, the arrangement consisting of the temporary carrier and the test carrier is introduced into a tool for spraying and/or pressing and the spaces between the optoelectronic components are filled with a filling compound.

In this way, an arrangement can be created in which the elements necessary for a later test are already in contact with the components to be processed. This allows active color locus control to take place, with the connections being designed both at the top and bottom.

For this purpose, in some aspects the filling compound can be introduced into the spaces between the optoelectronic components. However, a more even distribution of the filling material only occurs through the step of arranging the temporary carrier on the test carrier. In some other aspects, the filler is not added until the assembly has been placed into the tool.

The test arrangement can be designed differently. In some aspects, the test elements are designed as pogo pins, the tip of which is pressed towards the optoelectronic components by means of a spring force. Alternatively, a conductive and compressible film can be used as part of the test arrangement. As a further alternative, a conductive adhesive is also available, which is applied to a surface of the test arrangement. In this context, it is also conceivable to design the test arrangement to be conductive either as a whole or at least in some areas. The conductive adhesive can then also be applied to the contact area of the optoelectronic component.

In some aspects, the test arrangement comprises a structured, in particular compressible, support element on the surface of the test carrier with openings. The openings are arranged above the test elements, with a thickness of the structured support element corresponding to a height of the test position.

In some aspects, the temporary carrier can be removed after the filling compound has been introduced, so that in particular an emission surface of the optoelectronic components is exposed. This can be further processed in a suitable manner. After processing, the subset of the large number of optoelectronic components can be tested for their functionality, in particular by contacting the at least one contact area. In addition, a characterization can be carried out, based on the results of which further measures and process steps can be selected and carried out.

In one example, the method includes applying a converter material to an emission region of the plurality of optoelectronic components. The color locus is then measured by contacting the at least one contact area. If the measured color location deviates from a predetermined color location, the applied converter material can be further processed, i.e. sanded off.

In a further aspect, after processing and testing, the filling material introduced is removed again, in particular without leaving any residue. To For this purpose it is intended that the filling material can be evaporated by heating the arrangement. In some aspects, the filler material is a resin, which may be introduced in a liquid state, or a wax or waxy substance.

BRIEF DESCRIPTION OF THE DRAWING

• 1 zeigt einen ersten Schritt eines Testträgers für eine Chip Level Konversion mit einer elektrischen Kontaktierung nach dem vorgeschlagenen Prinzip;
• 2 zeigt den Träger in einem geeigneten Werkzeug nach dem vorgeschlagenen Prinzip;
• 3 stellt den Testträger nach einem ersten Fixierungsschritt und einer weiteren Prozessierung nach einigen Aspekten des vorgeschlagenen Prinzips dar;
• 4 ist die Anordnung mit Testträger nach einem weiteren Prozessschritt;
• 5 zeigt einen Testschritt zur Bestimmung des Farbortes in einer Anordnung nach einigen Aspekten des vorgeschlagenen Prinzips;
• 6 zeigt einen weiteren Prozessschritt nach einigen Aspekten des vorgeschlagenen Prinzips;
• 7 stellt ein weiteres Ausführungsbeispiel eines temporären Trägers gemäß einigen Aspekten des vorgeschlagenen Prinzips dar;
• 8 ist ein weiteres Ausführungsbeispiel eines Testträger mit mehreren Pogo Pins und gegenüber dem ersten Ausführungsbeispiel anders aufgebauten optoelektronischen Bauelementen;
• 9 zeigt ein drittes Ausführungsbeispiel eines Testträgers mit einigen Aspekten des vorgeschlagenen Prinzips;
• 10 zeigt ein viertes Ausführungsbeispiel mit einer alternativen Ausgestaltung einer leitfähigen Folie;
• 11 stellt das Ausführungsbeispiel nach 10 nach einem weiteren Prozessschritt dar gemäß einigen Aspekten des vorgeschlagenen Prinzips;
• 12 zeigt ein fünftes Ausführungsbeispiel eines Testträgers mit einigen Aspekten des vorgeschlagenen Prinzips;
• 13 stellt eine Draufsicht auf eine Vielzahl von optoelektronischen Bauelementen mit aufgebrachten Teststrukturen nach dem vorgeschlagenen Prinzip dar;
• 14 A) bis B) zeigen Prozessschritte für ein sechstes Ausführungsbeispiel eines Testträgers mit einigen Aspekten des vorgeschlagenen Prinzips;
• 15 und 16 sind verschiedene weitere Prozessschritte für das sechste Ausführungsbeispiel des Testträgers mit einigen Aspekten des vorgeschlagenen Prinzips;
• 17 A) bis C) zeigen verschiedene Prozessschritte für ein siebtes Ausführungsbeispiel nach einigen Aspekten des vorgeschlagenen Prinzips;
• 18 A) bis C) zeigen verschiedene Prozessschritte für ein achtes Ausführungsbeispiel nach einigen Aspekten des vorgeschlagenen Prinzips;
• 19 A) bis C) zeigen Ausführungsbeispiele zum Testen optoelektronischer Bauelemente.

Further aspects and embodiments according to the proposed principle will become apparent with reference to the various embodiments and examples described in detail in connection with the accompanying drawings.

• 1 shows a first step of a test carrier for a chip level conversion with electrical contacting according to the proposed principle;
• 2 shows the wearer in a suitable tool according to the proposed principle;
• 3 represents the test carrier after a first fixation step and further processing according to some aspects of the proposed principle;
• 4 is the arrangement with test carrier after a further process step;
• 5 shows a test step for determining the color location in an arrangement according to some aspects of the proposed principle;
• 6 shows a further process step according to some aspects of the proposed principle;
• 7 illustrates another embodiment of a temporary support in accordance with some aspects of the proposed principle;
• 8th is a further exemplary embodiment of a test carrier with several pogo pins and optoelectronic components constructed differently than the first exemplary embodiment;
• 9 shows a third embodiment of a test carrier with some aspects of the proposed principle;
• 10 shows a fourth embodiment with an alternative design of a conductive film;
• 11 reproduces the exemplary embodiment 10 after a further process step according to some aspects of the proposed principle;
• 12 shows a fifth embodiment of a test carrier with some aspects of the proposed principle;
• 13 represents a top view of a large number of optoelectronic components with applied test structures according to the proposed principle;
• 14 A) to B) show process steps for a sixth exemplary embodiment of a test carrier with some aspects of the proposed principle;
• 15 and 16 are various further process steps for the sixth embodiment of the test carrier with some aspects of the proposed principle;
• 17 A) until C ) show various process steps for a seventh embodiment according to some aspects of the proposed principle;
• 18 A) until C ) show various process steps for an eighth embodiment according to some aspects of the proposed principle;
• 19 A) until C ) show exemplary embodiments for testing optoelectronic components.

DETAILED DESCRIPTION

The following embodiments and examples show various aspects and their combinations according to the proposed principle. The embodiments and examples are not always to scale. Various elements can also be enlarged or reduced in size to highlight individual aspects. It goes without saying that the individual aspects and features of the embodiments and examples shown in the figures can easily be combined with one another without thereby affecting the principle according to the invention. Some aspects have a regular structure or shape. It should be noted that in practice minor deviations from the ideal form may occur, but without contradicting the inventive idea.

In addition, the individual figures, features and aspects are not necessarily shown in the correct size, and the proportions between the individual elements do not necessarily have to be fundamentally correct. Some aspects and features are highlighted by enlarging them. However, terms such as "above", "above", "below", "below", "larger", "smaller" and the like are correctly represented in relation to the elements in the figures. So it is possible to derive such relationships between the elements based on the illustrations. However, the proposed principle is not limited to this, but various optoelectronic ones can be used Components with different sizes and functionality can be used in the invention. In the embodiments, elements with the same or similar effects are designed with the same reference numerals.

The 1 shows a temporary carrier 10 with a large number of optoelectronic components 2 attached thereto in preparation for processing with a test arrangement according to the proposed principle. The temporary carrier 10 contains on its surface a holding layer on which the individual optoelectronic components are applied. In detail, these are placed and fastened with their emission area 22 on the adhesive layer 11. The emission region 22 also forms the main radiation direction for the individual optoelectronic components of the arrangement. In addition, the optoelectronic components include a contact area 21 which is arranged next to the emission area 22. The contact area, however, is as in the 1 can be seen, not attached to the adhesive layer 11, but somewhat thinner, so that there is a slight gap between the surface of the contact area 21 and the surface of the adhesive layer 11. In alternative embodiments, the contact area 21 can also rest on the adhesive layer 11. In addition, each of the optoelectronic components includes a further contact region 23 on the side opposite the emission region.

In the 1 The structure shown thus forms a large number of optoelectronic components on a temporary carrier 10. The temporary carrier 10 with the optoelectronic components is used for further processing of the same, for example for structuring the surface 23, but also for so-called rebonding, so that the emission region 22 can be processed in further process steps.

In the 1 It can also be seen that the individual optoelectronic components have slightly different layer thicknesses d and d`. In particular, the right optoelectronic component has the lowest height of all the components shown here. On the one hand, this circumstance results from the previous process steps, in which, for example, semiconductor layers are grown over the wafer with slightly different thicknesses during the epitaxial manufacturing process. During further processing, it is accordingly necessary or expedient that the individual optoelectronic components can be further processed with a surface that is as uniform and uniform as possible.

2 now shows a further step with the test arrangement according to the invention in an injection molding or other tool. The structure with the temporary carrier and the optoelectronic components attached to it is rotated through 180 ° and the temporary carrier 10 is attached to the top of a tool, for example for injection molding or a further process step. A test arrangement 13 is also provided, which includes a large number of individual test elements 40. The test elements are designed in the form of so-called pogo pins, which are needle tips that can be deflected along the Z direction and are supported by a spring 41. The tips 43 of each pogo pin are adjusted under the spring force so that they contact the contact area 23 of each optoelectronic component. Due to the spring 41, the different heights of the individual optoelectronic components can also be compensated for in this way, so that the test elements 40 of the test arrangement 13 contact each of the optoelectronic components.

The test arrangement together with the temporary carrier is introduced into an injection mold or another suitable tool so that the temporary carrier 10 is connected to the side 12 and the test arrangement 13 is connected to the lower side 14. An elastic filling compound 50 is now filled into the space between the individual optoelectronic components along the device 52. This filling compound is designed in such a way that it can be removed again essentially without leaving any residue in a subsequent process step after processing or testing of the individual optoelectronic components. In the exemplary embodiment shown here, this mass also surrounds the area 51, i.e. H. the space between the contact element 21 and the adhesive layer 11. The filling compound fixes the optoelectronic components both in the plane and in the Z direction, so that they do not shift or slip during further processing.

According to 3 The upper area of the pressing tool 12 can then be removed together with the temporary carrier 10 and the adhesive layer 11. A photoresist 30 is applied, which is structured so that the emission areas 22 are essentially exposed. A part of the photoresist 30 forms an overlap 31 beyond the edge of the emission areas 22 and in this way can protect the contact area 21 on the one hand and the edge of the respective optoelectronic components on the other. The test elements 40 continue to touch the contact area 23 due to their spring tension by the springs 41. The layer with the photoresist 30 is applied using conventional photographic techniques and then structured.

4 now shows the result of the next process steps, in which, on the one hand, a converter dye 60 is applied to the emission areas 22 (for example by rubbing) and is firmly connected to them. The photoresist 30 can then be removed so that the existing overlap is now exposed and forms the edges of the emission areas 61. The contact areas 21 are also exposed.

According to the proposed principle, the test arrangement further comprises a control circuit 91, which contacts the individual optoelectronic components at their contact area 21 via a measuring needle 90 and thus, as in the example of 5 shown, which can measure the converted and emitted light. Depending on this measurement result, the color locus can now be adjusted again to a small extent by a suitable measure, for example by grinding the converter material. It is not necessary to sort or relocate the individual components, since the test arrangement 13 with its test elements 40 is still in contact with the corresponding components.

The measuring needle 90 is shown here as a single measuring structure, but it is understood that a large number of such structures can be provided for this process, so that a large number of optoelectronic components can also be measured at the same time. In addition to the regrinding already mentioned, other measures to correct the color location are also conceivable.

In a final step, a further adhesive film 11a is finally applied to the surface of the corresponding converter 60. The material 50, which previously fixed the optoelectronic components in the respective position, can now be removed together with the test arrangement 13. For this purpose, a material 50 is chosen that can be removed in the simplest possible way. An example of this is a material that can be liquefied, removed or dissolved without leaving any residue by gently heating it. In this way, the material 50 is completely removed from the optoelectronic component.

7 shows a further embodiment of a test arrangement based on the proposed principle. In this case, compressible support elements 55 are arranged on the surface of the test carrier 13 around the openings for the test elements 40. The size and position of the support elements 55 is chosen so that they are slightly larger than the optoelectronic components to be placed on them. If the optoelectronic components are now placed with their temporary carrier 10 on the support elements 55, these can be easily compressed due to the different heights of the components. This is in the 7 , represented for example by the middle and right optoelectronic components.

The middle optoelectronic component presses the compressible support element significantly deeper than the right optoelectronic component. The left optoelectronic component 2, on the other hand, only rests gently on the surface of the support surface 55. The spring 41 of the test elements 40 press their tips 43 onto the contact area of the optoelectronic components. The design with the support surface 55 has the advantage that it keeps the area open in the middle for the test elements 40 free of a filled material 50. As a result, the test elements 40 remain clean and free of the filled material 50, which may increase the service life and also the robustness of the carrier according to the proposed principle.

8th shows a further embodiment in which the individual test elements are connected to internal supply lines 42. The internal supply lines 42 lead to a control circuit not shown here for reasons of clarity. In this embodiment, two test elements 40 are assigned to an optoelectronic component. The test elements 40 and their distances from one another are selected so that they contact the respective contact areas 23a and 23b on the side of the optoelectronic components facing them. Here too, differences in thickness in the optoelectronic components 2 and in particular in their semiconductor body 20 are compensated for by the springs 41 of the test elements.

In this context, it is understood that this embodiment can also be combined with the additional support surfaces 55, so that the area around the individual tips of the test elements remains free of filling material. The filling material 50 is along the flow direction 52 8th introduced, encloses the test tips 43 in this exemplary embodiment and reaches the areas between the semiconductor body 20 and the emission area 22 adjacent to the adhesive layer 11.

The pins shown in the previous exemplary embodiments are suitable as test elements, among other things, because the tips are always pressed onto the contact areas of the optoelectronic components via corresponding springs.

However, other configurations can also be implemented in this regard a measuring contact can still be achieved due to different heights. 9 shows a related embodiment in which the test elements are designed as spring needles 45. These protrude at an angle from the surface of the carrier 13 and range from a solder pad to the contact areas 23a and 23b of the optoelectronic components.

Due to the different heights of the optoelectronic components, the spring needles are now pressed towards the test carrier at different distances, which results in mechanical contact with the contact areas. The spring needles are slightly bent in the end area towards the contact areas in order to achieve better contact. The soldering pads 42c are used to fasten the spring needles 45. For example, these are soldered to the pad 42c or otherwise attached to them in a mechanical and electrically conductive manner. Any desired interconnection and control of the individual spring needles 42 can be achieved via various openings 42b and further lines 42a within the test arrangement 13.

In some embodiments, it is possible to set the contact area 23 facing the test carrier to a common potential and to test the functionality of the individual optoelectronic components with a further test element 21 for their respective functionality. For this purpose, it is conceivable that the surface of the test carrier 13 is covered with a compressible and at the same time electrically conductive film 70.

The electrically conductive film 70 is applied flatly to the surface of the test carrier 13 and has a predetermined thickness. When the temporary carrier with the optoelectronic components 2 located thereon is placed on it, the film 70 is pressed in to different depths due to the different thicknesses of the semiconductor bodies 20. The excess material of the film 70 is thereby pressed into the areas between the individual optoelectronic components and forms bulges 72 there. The electrically conductive film 70 can be contacted from the outside, so that the components are placed at a common electrical potential. The conductive film includes, for example, carbon, conductive silver or other conductive materials.

After processing, for example an application of converter material and a subsequent removal of the temporary carrier, the contact 21 located on the top and adjacent to the light exit surface 22 can also be applied with an additional conductive adhesive. 11 shows an exemplary embodiment in which a conductive adhesive 73 is applied to the contact 21 and adjacent to it to the filling material 50. This conductive adhesive can now be guided outwards along the filling material 50 so that various components can be tested in this way. These components can be declared as sacrificial components, ie they are removed after processing has ended. This is particularly useful if the conductive adhesive on the contact area 21 can no longer be removed without leaving residue or if only a small number of components are to be tested.

13 shows a top view of such an embodiment in which the optoelectronic components are arranged in rows and columns. The contact areas 21 adjacent to the emission surface 22 are now contacted via various lines 73. It is not possible to test every single component, but as in the 13 only selected ones are shown in a periodic sequence. As a result, a large number of optoelectronic components can be characterized in their color location with relatively little effort and then, depending on the characterization, further measures can be carried out to adapt the color location.

In a further exemplary embodiment, the test carrier itself can also be implemented with an electrically conductive material, so that the contact areas 23 can be contacted via a conductive adhesive 75.

12 shows such an embodiment in which a compressible conductive adhesive 75 is arranged at regular intervals on the surface of the carrier 13. When the temporary carrier with the optoelectronic components is placed on it, the conductive adhesive 75 is compressed to different degrees due to the different height and thus creates an electrically conductive connection between the contact area 23 and the electrically conductive test carrier 13.

In this embodiment, some of the optoelectronic components are selected statistically distributed over the carrier 10 and prepared as “measuring chips”. The back sides of the selected measuring chips are then provided with a drop of conductive adhesive 75. Now the test arrangement 13 can be arranged and the filling material is applied using a FAM or VIM process and hardened together with the adhesive drops 75. The FAM/VIM process also levels all glue points. All backs of the components and spaces are filled with material 50, only the top of the adhesive dots are free. The resulting composite can now be detached from the carrier 10 and further processed.

In some applications, in order to enable further processing into the finished package, the contact area must be protected, for example by spraying or other methods, before the converter layer is applied. To do this, it is necessary to expose it again afterwards in order to be able to test the component.

14 A) to B) show such an embodiment in which several optoelectronic components, each with their emission area and their contact area 21, are applied to a temporary carrier 10a. As in the other exemplary embodiments, some of the components have different heights. The components are now completely surrounded by a material 15, so that the surface of the components is also covered by it. The material 15 can be the same material 50 as in the other versions. This allows the material to be removed without leaving any residue after processing.

Subsequently, some optoelectronic components are selected as sacrificial elements and the surface is exposed again by means of a laser or mechanically, so that an opening 15a is created in the material 15. This is done using a laser that dissolves and removes the material at this point. The resulting opening lies above a contact area of the component 2 and thus allows the optoelectronic component to be contacted. An electrically conductive material, for example a conductive adhesive 71, is filled into the resulting opening 15a and the contact area is thus contacted.

15 shows the subsequent step in which the test assembly 13 and an electrically conductive and compressible film 70a are applied to the surface of the material 15 and the conductive layer in the opening. The material in the opening 15a is contacted with the conductive film 70a, thus preparing the structure for further process steps. Excess adhesive 71 is pressed into the film so that sufficient electrical contact is ensured.

In this exemplary embodiment, the conductive material is in the form of a conductive adhesive 71, so that after testing the component remains as a sacrificial component. An alternative embodiment is shown in: 16 , in which the arrangement 13 has a conductive and at the same time compressible adhesive film 71b. This is pressed into the opening 15a when the temporary carrier 10a with the optoelectronic components 2 is placed and pressed on and thus contacts the component. The advantage of this arrangement is that no additional application step is necessary. Depending on the film 70b used, it can also be removed again without leaving any residue, so that further use of the component remains possible.

Alternatively, further configurations can be implemented in which the filling material 15 can be applied in different ways.

17A until 17C show a further embodiment in which both the conductive adhesive 71 and the filling material 15 are applied using a so-called dispensing process. This method creates droplet-shaped structures in and around the components, in particular the filling material 15 being applied (“dispensed”) so that the contact areas on the surface of the component remain free. This process can be done in different ways.

In one aspect, after placing the individual points with conductive material 71 of the conductive material on the contact area, a larger amount of filling material 15 is applied to the surface of the components by means of a further dispensing process. This takes place in areas around the adhesive points 71, with the amount of material 15 being adjustable. Alternatively, these steps can also be reversed so that first the filling material 15 is placed around the contact areas and then the adhesive dots 71 are placed.

The hard and electrically conductive test arrangement 13 is then positioned and pressed onto the filling material 15 and the not yet hardened points 72 with the electrically conductive material. This will make like in 17C shown, the individual materials are leveled so that an essentially uniform surface remains. This can then be hardened. In further process steps, the temporary carrier 10a is removed in order to further process the component.

Presented in a different aspect in the 18A) until 18C ) after the filling material 15 has been applied, an opening 15a is made on the surface of one of the components and a stub S is bonded there. The length of the stub is chosen so that when the carrier 13 is subsequently arranged with the conductive film, the material of the stub is bent and pressed into the conductive film without simultaneously damaging the contact itself with the contact area or the semiconductor body. The advantage of this arrangement is the use of existing processing elements.

In the previous exemplary embodiments, the converter takes place after an order layer 60 detaches and completely removes the photoresist layer, so that the contact area 21 is exposed again next to the emission area 22 of the optoelectronic component. However, such an approach is not absolutely necessary; the measurement process can also be carried out with photoresist applied.

This has the advantage that necessary measures such as sanding can then be carried out over a larger area and together with the photoresist layer, which enables better control of this process. The 19A) until 19C ) show various embodiments in which testing the optoelectronic component with applied photoresist is possible. In 19A) the measuring device 90 pierces the photoresist and in this way contacts the contact area 21 of the component directly. However, this requires that the thickness of the photoresist layer and the position of the contact area 21 be determined with sufficient precision so that the needle 90 also reliably contacts the contact area at a predetermined penetration depth.

In contrast, this allows 19B) an improved contacting, since the material of the photoresist layer above the contact area 21 is completely removed by means of a laser or another mechanical measure. The measuring needle 90 or the test element can now contact the optoelectronic component from above and thus precisely determine the color location, for example.

In another embodiment, for example 18A) until 18C ), a sacrificial component is provided with a stub S that protrudes vertically upwards to the surface of the photoresist. In some embodiments, the stub S projects beyond the surface of the photoresist layer or the converter material, but can in any case be reached from the outside through the measuring needle. Here too, the top of the stub S can be additionally freed using a laser to ensure secure contact. After testing, the component must be removed because it is no longer suitable for further use.

For example, a wax or a liquid resin can be used as a filling material for the above-mentioned embodiments. The former can be deformed depending on the temperature and can be converted into a gaseous state at relatively low temperatures and thus removed without leaving any residue. A resin can easily be removed chemically. However, material in or around the sacrificial layers does not need to be completely removed. Depending on the design, the test carrier 13 can consist of a hard and non-compressible material. In this case, compressible elements should be provided between the contact areas of the components and the test carrier. These can be the proposed measuring needles, measuring syringes or compressible films. In some versions, the test carrier itself is made of plastic and is therefore compressible to a certain extent. The support elements can be part of the test carrier or can also be applied to it subsequently.

REFERENCE SYMBOL LIST

1

Test arrangement

2

optoelectronic component

10, 10a

temporary carrier

11, 11a

Holding layer, adhesive film

12

upper tool part

13

Test carrier

14

lower tool part

15

material

15

opening

20

Semiconductor body

21

Contact area

22

Emission range, main radiation direction

23, 23a

Contact area

30

Photoresist

31

overlap

40

Test carrier

41

Spring element

42, 42a

cables

42b

Via

42c

Solder pad

43

Great

45

Spring needles

50

filling material

52

Fill direction

55, 55a

Support element

60

converter

61

Edge

70, 70a

conductive film

71

Conductive adhesive

72

Foil material

73

Conductor track

75

Conductive adhesive

90

measuring needle

91

Control circuit

d

Layer thickness

Claims (21)

Test device for testing a large number of optoelectronic components (2), the test device comprising: - a test carrier (13) which has a plurality of electrically conductive test elements (40, 45, 70) which can be deflected perpendicular to the surface of the test carrier and which are assigned to a subset of the plurality of optoelectronic components (13); wherein the test elements (40, 45, 70) of the subset of optoelectronic components (2) arranged at a distance from the test carrier (13) can be moved from a starting position to a test position; - a control circuit (91) which is designed to control the plurality of electrically conductive test elements (40); and - The test carrier (13) is designed to be inserted into a tool (12, 14) for spraying and/or pressing. Test device after Claim 1 , in which the components are attached to a temporary carrier (10, 10a) with their respective main radiation direction (22) facing the latter and the components have at least one contact area (23, 23a) on a side facing away from the temporary carrier (10, 10a); wherein the test carrier (13) is designed to be inserted into the tool together with the large number of optoelectronic components (2) on the temporary carrier (10). Test device after Claim 1 or 2 , in which the large number of test elements (40) are formed by spring contacts, in particular pogo pins. Test device after Claim 1 or 2 , in which the plurality of test elements (40) are formed by spring needles (45) which protrude from the surface of the test carrier (13) at an angle of less than 90 °. Test device after Claim 1 or 2 , in which the plurality of test elements (40) are formed by a compressible conductive adhesive (71) or a conductive compressible film (70). Test device after Claim 3 , in which the spring needles (45) are attached, in particular soldered, to the surface of the test carrier (13). Test device according to one of the preceding claims, in which the plurality of electrically conductive test elements (40) are connected to the one control circuit (91) via supply lines (42) within the test carrier (13). Test device according to one of the preceding claims, in which a grid dimension of the test elements (40) corresponds to a grid of the contact areas (23, 23a, 23b) of the subset of the plurality of optoelectronic components (2). Test device according to one of the preceding claims, in which two of the plurality of test elements (40) are each assigned two contact areas (23a, 23b) of an optoelectronic component of the subset of optoelectronic components (2). Test device according to one of the preceding claims, further comprising at least one further test element (91), which is in particular needle-shaped and for contacting a contact area (21) of at least one optoelectronic component (2) of the subset of optoelectronic components on a side facing away from the test carrier (13). at least one optoelectronic component (2) is designed. Test device according to one of the preceding claims, further comprising: - a structured support element (55) on the surface of the test carrier with openings which are arranged above the test elements (40), a thickness of the structured support element (55) corresponding to a height of the test position. Test device according to one of the preceding claims, in which the structured support element (55) is compressible and in particular has a plastic, for example Viton or PDMS. Test device according to one of the preceding claims, in which the test elements are designed as or have a conductive film. Test device according to one of the preceding claims, in which the side facing away from the temporary carrier is covered by filling material, an area above the contact area being recessed and the recess being filled with a conductive material. Test device according to one of the preceding claims, in which the contact area (23, 23a) facing away from the temporary carrier (10, 10a) has a stub which is in electrical contact in particular with a conductive film. Method for processing an optoelectronic component, comprising: - providing a plurality of optoelectronic components (2) on a temporary carrier (10), the plurality of optoelectronic components (2) having at least one contact region (21) on a side facing away from the temporary carrier (10). exhibit; - Providing a test carrier (13) which has a plurality of electrically conductive test elements (40, 45, 70) which can be deflected perpendicular to the surface of the test carrier and which can be assigned to a subset of the plurality of optoelectronic components (13); wherein the test elements (40, 45, 70) of the subset of optoelectronic components (2) arranged at a distance from the test carrier (13) can be moved from a starting position to a test position; - Arranging the temporary carrier on the test carrier in such a way that the test elements contact the at least one contact areas of the plurality of optoelectronic components in an electrically conductive manner; - Introducing the arrangement of the temporary carrier and the test carrier into a tool for injection and/or pressing; - Filling the spaces between the optoelectronic components with a filling compound. Procedure according to Claim 16 , in which the step of filling comprises: applying a filling compound into spaces between the optoelectronic components and distributing the filling compound through the step of arranging the temporary carrier on the test carrier. Procedure according to one of the Claims 16 until 17 , in which the test elements have at least one of the following elements: - a pogo pin whose tip is pressed in one direction by means of a spring force; - a conductive and compressible film; - a conductive adhesive which is applied to a surface of the test arrangement; or - a conductive adhesive on the at least one contact area of at least some of the optoelectronic components. Procedure according to one of the Claims 16 until 18 , in which the test arrangement has a structured, in particular compressible support element (55) on the surface of the test carrier with openings which are arranged above the test elements (40), a thickness of the structured support element (55) corresponding to a height of the test position. Procedure according to one of the Claims 16 until 19 , further comprising: - removing the temporary carrier from the optoelectronic components; - Processing an exposed surface of the plurality of optoelectronic components; - electrical testing of the subset of the large number of optoelectronic components, in particular by contacting the at least one contact area (21). Procedure according to Claim 20 , in which the step of processing comprises: - applying a converter material to an emission region of the plurality of optoelectronic components; -Measuring the color locus by contacting the at least one contact area (21); - Processing the applied converter material if the measured color locus deviates from a predetermined color locus.

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