DE102021206415A1 - compressor - Google Patents

Abstract

Compressor, comprising a compressor housing (1) with an electrical machine (5) and a compressor unit (6), for example a radial piston compressor unit 6, a power electronics housing (2) with power electronics (4) for controlling the electrical machine (5), with a partition (3) is arranged between the compressor housing (1) and the power electronics housing (2), the partition wall (3) having a surface (31) facing the compressor housing (1) and a surface (32) facing the power electronics housing (2), wherein the surface (31) of the partition (3) facing the compressor housing (1), at least in sections, as an inwardly curved surface, in particular as a concave surface, and/or the surface (32) of the partition (3) facing the power electronics housing (2) , is designed, at least in sections, as an outwardly curved surface, in particular as a convex-shaped surface.

Description

The present invention relates to a compressor, in particular a non-stationary, electrically driven refrigerant compressor, according to the preamble of claim 1.

A compressor essentially comprises a compressor unit, for example a radial piston compressor unit, an electric machine, in particular an electric motor, and power electronics for controlling the electric machine. As a rule, the compressor unit and the electric machine are accommodated in a compressor housing and the power electronics are accommodated in a power electronics housing. The two housings are often designed as a compact unit. A higher pressure generally prevails in the compressor housing than in the housing for accommodating the power electronics. In this respect, a partition is provided between the compressor housing and the housing for accommodating the power electronics.

Designs of electrically driven refrigerant compressors are known from the prior art, in which the power semiconductors (switching elements/IGBT/transistors/mosfets) are arranged on the front wall on a consistently level/planar partition to the electric machine of the compressor. This surface is machined to dissipate the waste heat generated by the power semiconductors.

the DE102011001394A1 shows a design of an electrically driven refrigerant compressor, in which the power semiconductors are arranged on a flat partition. The disadvantage is that the power semiconductors lie on a surface parallel to the printed circuit board, which means that a pressure-enhancing partition wall of the compressor pressure housing is difficult to reproduce or does not save material.

the DE112015000201T5 also shows a design of an electrically driven refrigerant compressor, in which the power semiconductors are arranged on a flat partition. The disadvantage is that the power semiconductors lie on a surface parallel to the printed circuit board, which means that a pressure-enhancing partition wall of the compressor pressure housing is difficult to reproduce or does not save material.

the DE102018110361A1 shows a mounting assembly for accommodating electrical power components for an electrically driven refrigerant compressor.

the DE102018211413A1 shows a bulging partition wall of an electrically driven refrigerant compressor, on which the power semiconductors are arranged indirectly on the partition wall via an intermediate element. In the DE102018211413A1 is also described that during operation of the electric motor due to the increased prevailing pressure, the partition is bulged in the direction of the electronics compartment.

Although usable compressors are proposed here, there is still a need for improvement with regard to the partition wall between the compressor housing and the power electronics housing.

The object of the present invention is to propose an improved compressor, in particular to propose a compressor whose partition wall between the compressor housing and the power electronics housing can absorb high pressures, while at the same time being easy to manufacture, good functional suitability for fastening and heat dissipation of the waste heat from the power semiconductors or a module assembly is ensured, as well as the system requirements of a low use of materials favored and / or radial space restrictions of the compressor are made possible.

In terms of the inventive idea, in addition to the power semiconductors, other heat-affected electronic components, which are attached to the circuit board via electrically conductive connections, in particular soldering contacts, and are thermally connected to the partition, are understood.

According to the invention, this object is achieved by a compressor having the characterizing features of claim 1. Due to the fact that the surface of the partition wall facing the compressor housing, in particular the electric machine, is designed, at least in sections, as an inwardly curved surface, in particular as a concave surface, and/or the surface of the partition wall facing the power electronics housing, in particular the power electronics, as outwardly curved surface, in particular as a convex-shaped surface, is designed, an improved compressor can be provided. In particular, a compressor can be provided with a partition wall that can absorb high pressures, but at the same time ensures good manufacturability, good functional suitability for fastening and heat dissipation of the waste heat from the power semiconductors or a module assembly, which favors system requirements for low material usage and/or radial Space restrictions of the compressor are made possible.

The convex configuration, in particular curvature, preferably in the form of a partial sphere, of the surface facing the power electronics housing or the side of the partition wall of the compressor that accommodates the power semiconductors makes it possible in particular to distribute or arrange the power semiconductors over a number of partial surfaces, in particular mounting surfaces, which preferably are free in their angular position, do not necessarily have to be arranged parallel to the printed circuit board or to one another, do not have to be arranged perpendicular to one another, in particular orthogonally, to the longitudinal axis of the electrically driven refrigerant compressor and/or follow the pressure-related or pressure-optimized curvature of the partition wall in a material-saving manner.

In other words, the power semiconductors can in particular be freely aligned in terms of their angular position, in particular independently of a printed circuit board. The power semiconductors can be positioned on partial surfaces, in particular receiving surfaces, of the pressure-friendly partition, the partition on the side facing the power electronics housing in particular having a pressure-enhancing convex configuration, in particular curvature, preferably in the form of a partial sphere. On the side facing the compressor housing, a pressure-optimized, concave, in particular cup-shaped, partition wall surface is preferably provided. A housing design that is favorable in terms of pressure, in particular an optimized one, is preferably sought. In this context, the pressure-friendly or optimized housing design refers in particular to the design of the partition wall between the power electronics and the electric machine of the compressor. In terms of the inventive idea, a pressure-optimized housing design is essentially a concave curvature of the side of the partition wall facing the electrical machine or compressor unit or compressor housing between the electrical machine and the convex side of the partition wall facing the power electronics or power electronics housing. In particular, the pressure-optimized design of the dividing wall allows an almost uniform wall thickness, as a result of which material savings are made possible in comparison with a straight dividing wall, in particular a straight dividing wall surface facing the power electronics. Material saving is to be understood in this context as follows: the curved or pressure-optimized inside of the partition allows for an almost uniform wall thickness of the partition, which enables material to be saved in comparison with a straight partition, in particular a straight partition side facing the power electronics. In particular, due to the uniform wall thickness dimensioning of the dividing wall, there is an optimized, in particular good, heat dissipation of the waste heat generated by the power semiconductors directly into or via the dividing wall. In particular, due to the non-parallel alignment of the power semiconductors to the printed circuit board of the power electronics, the power semiconductors can be aligned independently of the angle of the printed circuit board, resulting in design freedom in the arrangement of the power semiconductors.

Further advantageous refinements of the proposed invention result in particular from the features of the dependent claims. The objects or features of the various claims can in principle be combined with one another as desired.

In an advantageous embodiment of the invention, it can be provided that the shape of the surface of the partition facing the compressor housing and/or the shape of the surface of the partition facing the power electronics housing is given independently of a pressure difference between the compressor housing and the power electronics housing. In the proposed compressor is accordingly not, as for example in the compressor according to DE102018211413A1 provided that the surface shape is only set by the pressure difference. The compressor proposed here is accordingly already manufactured with the permanently existing surface shape.

In a further advantageous embodiment of the invention, it can be provided that the surface of the partition wall facing the compressor housing has the shape of a ball socket. In particular, the ball socket-shaped design supports the pressure-optimized configuration of the partition wall while at the same time using less material, in particular together with a configuration proposed according to the invention of the surface of the partition wall facing the power electronics.

In a further advantageous embodiment of the invention, it can be provided that the surface of the partition wall facing the power electronics housing is partially spherical, in particular hemispherical, conical or in the form of a semi-cylindrical lateral surface.

The proposed configurations are preferably suitable for the configuration of a pressure-optimized configuration of the partition wall while at the same time using less material, in particular together with a configuration of the compressor housing proposed according to the invention facing surface of the partition. In addition, the power semiconductors can be attached in basically any orientation on the surface of the partition wall facing the power electronics housing, so that in particular improved heat dissipation can be ensured.

In a further advantageous embodiment of the invention, it can be provided that the surface of the partition wall facing the power electronics housing comprises flat partial surfaces, in particular is composed of one another, the partial surface being at an angle of less than 90° to the longitudinal axis of the compressor and/or at an angle other than 180° to one another is aligned. An outwardly curved surface can also be formed in an advantageous manner, in particular in a manner that is advantageous in terms of production technology, with the flat partial surfaces described here. In addition, the flat sub-areas offer advantageous receiving areas for power semiconductors.

In a further advantageous embodiment of the invention, it can be provided that the flat surfaces form a roof-shaped or faceted shape. In this way, the outwardly curved surface can be produced in a manner that is advantageous in terms of production technology.

In a further advantageous embodiment of the invention, it can be provided that the surface of the partition wall facing the power electronics housing comprises two or six partial surfaces. The configuration of two partial areas can be implemented particularly advantageously in terms of production technology. With six sub-areas, there are many recording areas which are, for example, also aligned in different angular positions in relation to the longitudinal axis.

In a further advantageous embodiment of the invention, it can be provided that the surface of the partition wall facing the power electronics housing, in particular at least one partial surface, is equipped with at least one receiving surface for power semiconductors. Defined mounting areas for the power semiconductors can be provided here. For example, an advantageous heat dissipation can take place via the defined receiving surfaces.

In a further advantageous embodiment of the invention, it can be provided that the at least one receiving surface is arranged at an angle of less than 90°, preferably between 45° and less than 90°, to the longitudinal axis of the compressor on the surface of the partition (3) facing the power electronics housing.

In a further advantageous embodiment of the invention, it can be provided that the receiving surface is designed to be recessed, raised or even with the adjacent surface of the partition. The receiving surfaces on the curved partition are preferably slightly raised for good machinability with cutter overflow. Alternatively, the receiving surfaces on the curved partition wall can also be designed during the original forming, for example casting, of the compressor housing or by machining the partition wall. In particular, the arrangement of the power semiconductors on receiving surfaces aligned obliquely to the printed circuit board results in a somewhat longer installation space for the power semiconductors in the axial direction and a shorter installation space in the radial direction, which is advantageous given the existing radially narrow installation space specifications for refrigerant compressors.

In a further advantageous embodiment of the invention, it can be provided that the power electronics include at least one power semiconductor, the at least one power semiconductor being arranged on a part or a receiving surface of the surface of the partition wall facing the power electronics housing.

In a further advantageous embodiment of the invention, it can be provided that the at least one power semiconductor is accommodated in a module assembly, the at least one power semiconductor being accommodated in the module assembly in such a way that it is mounted on the surface of the partition wall facing the power electronics housing, in particular on the assigned mounting surface , may be present. A completely preassembled unit can be provided via the module assembly, the power semiconductor of which is adapted, for example with regard to position and alignment, to the surface of the partition wall facing the power electronics housing, in particular to its receiving surfaces. In other words, an assembly advantage is achieved here, since individual alignment of the power semiconductors during assembly is not necessary.

In a further advantageous embodiment of the invention, it can be provided that the module assembly is equipped with a pressing mechanism, in particular in the form of spring clips or spring elements, which is set up to press the power semiconductor(s) against the respective receiving surface. The pressing mechanism is preferably arranged either between the printed circuit board and the module assembly or between the module assembly and the power semiconductor. The usual screw connection of the power semiconductors on the partition wall can be saved by the pressing mechanism. This results in particular in a further simplified assembly process. The power semiconductors can are in particular pre-assembled and are mounted as a whole in the assembly process on the partition. The pressing mechanism also serves in particular to simplify the manufacturing process.

In a further advantageous embodiment of the inventive idea, it can be provided that the receiving surfaces accommodating the power semiconductors are designed in a circular six-fold mirror-symmetrical arrangement on the partition wall, with one or more, preferably one, power semiconductor being arranged on a receiving surface.

In a further advantageous embodiment of the inventive idea, it can be provided that the receiving surfaces accommodating the power semiconductors are designed in a triangular arrangement, with one or more, preferably two, power semiconductors being arranged on a receiving surface. An ideal angle between the three receiving surfaces is 120°, with this arrangement the number of surfaces to be processed is advantageously reduced to three. Such an embodiment is for example in 3a and 3b shown.

In a further advantageous embodiment of the inventive idea, it can be provided that the receiving surfaces accommodating the power semiconductors are designed in mutually angled partial surfaces on a six-fold mirror-symmetrical arrangement on the partition wall, in particular on the surface of the partition wall facing the power electronics housing, with one or more preferably a power semiconductor is arranged on a receiving surface.

In a further advantageous embodiment of the inventive idea, it can be provided that the receiving surfaces receiving the power semiconductors enclose an obtuse angle (>90°) to one another and via a common center line in a two-way arrangement on the partition wall, in particular on the surface of the partition wall facing the power electronics housing , are configured, with three power semiconductors preferably being arranged on the respective receiving surfaces. This results in particular in a simplified manufacturing process. The number of processing surfaces is also reduced to two. Such an embodiment is for example in 5a and 5b shown.

In a further advantageous embodiment of the inventive idea, it can be provided that receiving surfaces are provided only on one side of the surface of the partition wall facing the power electronics housing, in a fourfold arrangement, the receiving surfaces having one or more power semiconductors.

In a further advantageous embodiment of the inventive idea, it can be provided that the receiving surfaces are arranged in a quadrant of four on the surface of the partition wall facing the power electronics housing, the receiving surfaces having one or more power semiconductors.

• 1 ein erfindungsgemäßer Verdichter in einer geschnittenen seitlichen Ansicht, insbesondere einen Querschnitt, der eine Ausführungsform eines elektrisch angetriebenen Kältemittelverdichters für ein Kraftfahrzeug in Übereinstimmung mit der vorliegenden Erfindung veranschaulicht;
• 2a eine Trennwand, insbesondere eine teilkugelförmige Trennwand, eines erfindungsgemäßen Verdichters in einer perspektivischen Ansicht;
• 2b eine Trennwand, insbesondere eine teilkugelförmige Trennwand, eines erfindungsgemäßen Verdichters in einer Draufsicht;
• 3a eine alternative Ausgestaltung einer Trennwand, insbesondere eine teilkugelförmige Trennwand mit einer dreifachen Aufnahmeflächenausgestaltung mit jeweils zwei Leistungshalbeitern je Aufnahmefläche, eines erfindungsgemäßen Verdichters in einer perspektivischen Ansicht;
• 3b eine alternative Ausgestaltung einer Trennwand, insbesondere eine teilkugelförmige Trennwand mit einer dreifachen Aufnahmeflächenausgestaltung mit jeweils zwei Leistungshalbeitern je Aufnahmefläche, eines erfindungsgemäßen Verdichters in einer Draufsicht;
• 4a eine alternative Ausgestaltung einer Trennwand, insbesondere eine kegelförmige Trennwand mit einer sechsfachen Aufnahmeflächenausgestaltung mit jeweils drei Leistungshalbeitern je Aufnahmefläche, eines erfindungsgemäßen Verdichters in einer perspektivischen Ansicht;
• 4b eine alternative Ausgestaltung einer Trennwand, insbesondere eine kegelförmige Trennwand mit einer sechsfachen Aufnahmeflächenausgestaltung mit jeweils drei Leistungshalbeitern je Aufnahmefläche, eines erfindungsgemäßen Verdichters in einer Draufsicht;
• 5a eine alternative Ausgestaltung einer Trennwand, insbesondere eine teilkugelförmige Trennwand mit einer zweier Aufnahmeflächenausgestaltung mit jeweils drei Leistungshalbeitern je Aufnahmefläche, eines erfindungsgemäßen Verdichters in einer Draufsicht;
• 5b eine Detaildarstellung eines erfindungsgemäßen Verdichters in einer seitlichen Schnittansicht, insbesondere ein Teilquerschnitt, der eine Ausführungsform eines elektrisch angetriebenen Kältemittelverdichters für ein Kraftfahrzeug in Übereinstimmung mit der vorliegenden Erfindung veranschaulicht;
• 6 eine Detaildarstellung eines erfindungsgemäßen Verdichters in einer seitlichen Schnittansicht, insbesondere einen Teilquerschnitt, der eine Ausführungsform eines elektrisch angetriebenen Kältemittelverdichters mit einer Modulbaugruppe für ein Kraftfahrzeug in Übereinstimmung mit der vorliegenden Erfindung veranschaulicht;
• 7 ein erfindungsgemäßer Verdichter in einer geschnittenen seitlichen Ansicht, insbesondere einen Querschnitt, der eine Ausführungsform eines elektrisch angetriebenen Kältemittelverdichters mit eine Modulbaugruppe für ein Kraftfahrzeug in Übereinstimmung mit der vorliegenden Erfindung veranschaulicht;
• 8 eine alternative Ausgestaltung einer Trennwand, insbesondere eine teilkugelförmige Trennwand mit einer Aufnahmeflächenausgestaltung mit vier Leistungshalbeitern, eines erfindungsgemäßen Verdichters in einer Draufsicht;
• 9 eine alternative Ausgestaltung einer Trennwand, insbesondere eine teilkugelförmige Trennwand mit einer vierer Aufnahmeflächenausgestaltung mit jeweils einem Leistungshalbeitern je Aufnahmefläche, eines erfindungsgemäßen Verdichters in einer Draufsicht;

Further features and advantages of the present invention become clear from the following description of preferred exemplary embodiments with reference to the attached figures. show in it

• 1 a compressor according to the invention in a sectional side view, in particular a cross section, which illustrates an embodiment of an electrically driven refrigerant compressor for a motor vehicle in accordance with the present invention;
• 2a a partition wall, in particular a part-spherical partition wall, of a compressor according to the invention in a perspective view;
• 2 B a partition wall, in particular a part-spherical partition wall, of a compressor according to the invention in a plan view;
• 3a an alternative embodiment of a partition wall, in particular a part-spherical partition wall with a triple mounting surface design, each with two power semiconductors per mounting surface, of a compressor according to the invention in a perspective view;
• 3b an alternative embodiment of a partition wall, in particular a part-spherical partition wall with a triple mounting surface design, each with two power semiconductors per mounting surface, of a compressor according to the invention in a plan view;
• 4a an alternative configuration of a partition wall, in particular a conical partition wall with a six-fold mounting surface design, each with three power semiconductors per mounting surface, of a compressor according to the invention in a perspective view;
• 4b an alternative configuration of a partition wall, in particular a conical partition wall with a six-fold mounting surface design, each with three power semiconductors per mounting surface, of a compressor according to the invention in a plan view;
• 5a an alternative configuration of a partition wall, in particular a part-spherical partition wall with a two receiving surface configuration, each with three power semiconductors per receiving surface, of a compressor according to the invention in a plan view;
• 5b a detailed representation of a compressor according to the invention in a side sectional view, in particular a partial cross section, which illustrates an embodiment of an electrically driven refrigerant compressor for a motor vehicle in accordance with the present invention;
• 6 a detailed illustration of a compressor according to the invention in a side sectional view, in particular a partial cross section, which illustrates an embodiment of an electrically driven refrigerant compressor with a module assembly for a motor vehicle in accordance with the present invention;
• 7 a compressor according to the invention in a sectional side view, in particular a cross section, which illustrates an embodiment of an electrically driven refrigerant compressor with a module assembly for a motor vehicle in accordance with the present invention;
• 8th an alternative configuration of a partition wall, in particular a part-spherical partition wall with a receiving surface configuration with four power semiconductors, of a compressor according to the invention in a plan view;
• 9 an alternative configuration of a partition wall, in particular a part-spherical partition wall with a four-receptacle configuration, each with a power semiconductor per receptacle surface, of a compressor according to the invention in a plan view;

Reference List

L

longitudinal axis

M

module assembly

ML

centerline

1

compressor housing

2

power electronics housing

3

partition wall

4

power electronics

5

electric machine

6

Compressor unit, for example radial piston compressor unit

7

recording surface

8th

pressing mechanism

31

Surface of Partition Wall (Compressor Unit Side)

32

Surface of the partition (power electronics side)

33

Feedthrough, in particular glass feedthrough (connection of power electronics to the electrical machine)

41

power semiconductors

42

printed circuit board

43

Electrically conductive connections, in particular soldering contacts

61

drive shaft

62

Piston-working chamber combination

321(a-e)

face

The following description of the idea according to the invention relates, for example, to a radial piston compressor, but is not limited to this principle. Rather, the idea according to the invention can be implemented independently of the compressor principle.

First up 1 referenced.

A compressor according to the invention essentially comprises a compressor housing 1 and a power electronics housing 2, i.e. a housing for accommodating power electronics 4. The compressor housing 1 as such contains the actual compressor unit 6, such as a radial piston compressor unit, and the associated drive device, such as an electric machine 5 , on. As a rule, there is an overpressure in the compressor housing 1 during operation of the compressor or when it is integrated into a system such as an air conditioning system. The pressure in the compressor housing 1 is higher than in the power electronics housing 2. In the power electronics housing 2 there is usually atmospheric pressure.

The power electronics 4 preferably includes at least one power semiconductor 41 and preferably a printed circuit board 42. The power semiconductor 41 and the printed circuit board 42 are preferably connected to one another by means of electrically conductive connections, in particular by soldering contacts 43.

In terms of the inventive idea, power electronics 4 is understood to mean a component unit which connects the central components for controlling the electrical machine 5 and the components connected to it which compressor unit 6 provides and is preferably in communication with a vehicle controller. Electric compressors use the power electronics 4 to control its speed. The power electronics 4 uses a large number of elements, in particular power semiconductors 41, which generate heat during operation.

An IGBT is preferably used as the power semiconductor 41 . This is a semiconductor component that is used in power electronics because it combines the advantages of the bipolar transistor (good conduction behavior, high blocking voltage, robustness) and the advantages of a field effect transistor (almost powerless control). The power semiconductor 41 is preferably connected to the printed circuit board 42, in particular mechanically attached to it and/or electrically contacted with it. During operation, a comparatively high electric current/high electric voltage is conducted by means of the power semiconductors 41, so that the waste heat produced is also comparatively large. Due to the thermal connection to a partition, cooling can be improved and an operating temperature can be lowered.

A printed circuit board 42 (printed circuit board, printed circuit board, PCB) is a carrier for electronic components. It is used for mechanical attachment and electrical connection. Almost every electronic device contains one or more printed circuit boards.

The electrical machine 5 preferably includes a rotor and a stator. The rotor and stator are preferably accommodated in the compressor housing 1 .

The compressor unit 6, in particular a radial piston compressor unit, comprises a drive shaft 61 with an eccentric, and preferably a plurality of piston-working chamber combinations 62 arranged radially around the drive shaft 61. The radial piston compressor is preferably accommodated in the compressor housing 1. The drive shaft 61 is driven by the electric machine 5, possibly with the interposition of a gearbox. The drive shaft 61 has a longitudinal axis L.

The compressor housing 1 is separated from the power electronics housing 2 by a partition wall 3 , in other words, a partition wall 3 is arranged between the compressor housing 1 and the power electronics housing 2 . The partition 3 seals the power electronics housing 2 against the pressure in the compressor housing 1 . In the context of the inventive idea, the partition wall 3 is understood in particular as a component part of the compressor housing 1, through which the electrical machine 5 and the power electronics 4 are separated from one another in a pressure-safe manner. The partition wall 3 has a surface 31 facing the compressor housing 1 and a surface 32 facing the power electronics housing 2 . A bushing 33 , in particular a glass bushing, can be provided in the partition wall 3 for the electrical connection of the power electronics 4 to the electrical machine 5 .

The invention provides that the surface 31 of the partition 3 facing the compressor housing 1, at least in sections, as an inwardly curved surface, in particular as a concave surface, and/or the surface 32 of the partition 3 facing the power electronics housing 2, at least in sections, as an outward curved surface, in particular as a convex surface, is designed.

It should be noted that the shape of the partition wall surface(s) is permanent, in particular the partition wall 3 is manufactured as described above. For example, the shape does not first appear as a result of the pressure difference between the compressor housing 1 and the power electronics housing 2 . Accordingly, there is no provision for the dividing wall 3 to bulge in the direction of the electronics compartment due to the increased prevailing pressure.

It can preferably be provided that the surface 31 facing the compressor housing 1 has, at least in sections, the shape of a ball socket

It can preferably be provided that the surface 32 facing the power electronics housing 2 is partially spherical, in particular hemispherical, conical or in the form of a semi-cylindrical lateral surface.

More preferably, it can be provided that the surface 32 facing the power electronics housing 2 comprises flat sub-areas 321, in particular composed of the aforementioned sub-areas 321, wherein the sub-area 321 or the sub-areas are at an angle other than 90° to the longitudinal axis L of the compressor and/or are aligned at an angle other than 180° to each other. The sub-area or sub-areas are referred to below only with the reference number 321 . The indices a to e indicate the respective partial area in the illustrations.

With regard to the embodiment according to 1 it can be seen, for example, that the surface 31 of the partition wall 3 facing the compressor housing 1 has the shape of a ball socket. Furthermore, here is a key recording for the drive shaft 61 or provided for receiving a bearing.

Furthermore, in the 1 It can be seen that the surface 32 of the partition wall 3 facing the power electronics housing 2 is designed as a surface in the form of a segment of a sphere, in particular a hemispherical surface.

It is also in the 1 recognizable that power semiconductors 41 are mounted on the surface 32 of the partition wall 3 facing the power electronics. As in 1 As can be seen, the power semiconductors 41 are attached indirectly to the surface 32 via, for example, an adhesive heat-conducting pad. However, it is also conceivable to attach the power semiconductors 41 directly to the surface 32 . The printed circuit board, with additional electronic components, is also accommodated in the power electronics housing 2 . The power semiconductors 41 are connected to the printed circuit board 42 by means of electrically conductive connections, in particular soldering contacts 43 . This connection can be electrical and, in particular, also mechanical.

In the 2a and 2 B the surface 32 is also shown again in perspective. The arrangement of the power semiconductors 41 on the surface 32 can also be seen here. The surface 32 is designed here almost entirely as a spherical segment, in particular a hemispherical surface.

Furthermore, it can be provided that the surface 32 and/or at least one of the partial surfaces 321 is equipped with at least one specially designed receiving surface 7 for a power semiconductor 41 . In principle, however, the power semiconductors can also be attached directly to the surface 32 or partial surfaces 321 .

It can further be provided that the at least one receiving surface 7 is arranged at an angle of less than 90°, preferably between 45° and less than 90°, to the longitudinal axis L of the compressor on the surface 32 of the partition wall 3 facing the power electronics housing 5 .

In terms of the inventive idea, a receiving surface 7 is understood to mean a machined flat/planar surface of the partition wall 3, which is used to position and attach the power semiconductors 41 to the partition wall 3 and to introduce heat from the waste heat generated by the power semiconductors into the partition wall 3. The waste heat from the power semiconductors 41 is advantageously dissipated in this way. In terms of the inventive idea, heat dissipation means that the waste heat generated by the power semiconductors 41 is dissipated directly into the partition wall 3 of the compressor housing 1 . For effective heat conduction between two bodies, they should touch as large an area as possible. It is best to use screws or a pressure mechanism 8 to support this, which ensures a contact pressure in the entire operating range and over the service life. Provision can be made here for the side of the power semiconductor 4 facing the receiving surface 7 to be provided with a thermally conductive material, such as a thermally conductive paste.

Specially designed receiving surfaces 7 are, for example, in the 3a and 3b recognizable. The receiving surface 7 can be designed as a raised, in particular slightly raised, surface of the partition 3 or as a recessed, in particular slightly recessed, surface of the partition 3 . It is therefore recessed or raised in relation to the adjoining surface 32. It is also conceivable that the receiving surface 7 lies in one plane with the adjoining surface 32.

In the 4a and 4b a further variant of the surface 32 of the partition wall 3 facing the power electronics housing 2 is shown. It is provided here that the partial surfaces 321 are designed as flat surfaces. The sub-areas 321 form a roof-shaped elevation that extends into the power electronics housing 2 . In this example, six sub-areas 321 are provided. This configuration of the surface 32 by means of a plurality of flat sub-areas 321 can also be referred to as a faceted surface. A faceting stands in particular for an advantageous subdivision of the non-straight surface 32 of the partition wall 3. Several flat/planar partial surfaces 321 form the surface 32 or a substantial part of the surface 32.

In this variant, no separately designed receiving surfaces 7 are provided, rather each partial surface 321 forms a flat receiving surface 7. As in FIGS 4a and 4b As can be seen, one power semiconductor 41 is provided for each receiving area 7 or partial area 321 . In principle, however, not every sub-area 321 or receiving area 7 has to be populated, but of course several power semiconductors 41 can also be provided per sub-area 321 or receiving area 7 .

In the 5a respectively. 5b A further embodiment of the present invention, in particular the design of the surface 32 of the partition wall 3 facing the power electronics housing 2 is shown. It is provided here that the surface 32 of the partition wall 3 is configured by two partial surfaces 321 . The partial areas 321 project into the power electronics housing 2 in a correspondingly angled or curved manner. Provision is also made for one receiving surface 7 to be provided for each partial surface 321 . Three power semiconductors 41 are provided here for each receiving surface 7 . As already mentioned above, the number of receiving surfaces 7 and/or power semiconductors 41 is fundamentally arbitrary.

In the 6 Another embodiment of the present invention is shown. Here it is provided in particular that the power semiconductors are arranged in a module assembly M.

In the sense of the inventive idea, a module assembly M is to be understood in particular as a component unit belonging to the power electronics, which preferably has a base 9 on which the power semiconductors 41 are arranged. The base of the module subassembly is designed in such a way that it corresponds analogously to the side of the partition wall 3 assigned to it. This ensures that the power semiconductors 41 can be attached according to the invention to the respective receiving surface 7 of the partition wall 3 . The module assembly is in turn connected/arranged to a printed circuit board 42 .

The module assembly M is designed geometrically in such a way that it is adapted to the shape of the partition wall 3 . In terms of their angular position, the power semiconductors 41 are arranged on the module assembly M in such a way that they are assigned to the respective corresponding receiving surface 7 . The module subassembly M is fixed on the partition wall 3 by means of corresponding positioning points, and a screw, snap-in or latching connection is also firmly arranged on the partition wall 3 . After assembly, the power semiconductors 41 are firmly pressed against the partition wall 3 to dissipate heat, so that their waste heat is dissipated directly into the partition wall 3 . The module assembly M also preferably has a base 9 on which the power semiconductors 41 are attached and connected to the printed circuit board 42 .

In the 6 a module assembly M for the embodiment of the surface 32 of the partition wall 3 facing the power electronics housing 2 is shown with two partial surfaces 321 .

FIG 7 shown. It can also be seen here that the power semiconductors 41 are already accommodated in the module assembly M with a precise fit, so that they lie as flatly as possible on the surface 32 .

In the 8th A further embodiment of the present invention, in particular the design of the surface 32 of the partition wall 3 facing the power electronics housing 2 is shown. It is provided here that the surface 32 of the partition wall 3 has a receiving surface 7 . The receiving surface 7 here preferably comprises four power semiconductors 41.

In the 9 A further embodiment of the present invention, in particular the design of the surface 32 of the partition wall 3 facing the power electronics housing 2 is shown. It is provided here that the surface 32 of the partition wall 3 is designed with four receiving surfaces 7 in a quadrant of four, each of the four receiving surfaces 7 preferably comprising a power semiconductor 41 .

The proposed compressor is preferably used as a non-stationary, electrically driven refrigerant compressor, in particular as a refrigerant compressor in a motor vehicle. A radial piston compressor unit is preferably used as the compressor unit. Accordingly, the compressor could be addressed as a radial piston compressor. However, other designs or operating principles for the compressor unit are also possible.

The terminology used in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the terms "comprises" and/or "comprising" when used in this specification specify the presence, but not the presence, of the recited features, integers, steps, operations, elements, and/or components or exclude the addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

QUOTES INCLUDED IN DESCRIPTION

This list of the documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• DE 102011001394 A1 [0004]
• DE 112015000201 T5 [0005]
• DE 102018110361 A1 [0006]
• DE 102018211413 A1 [0007, 0015]

Claims (19)

Compressor, comprising - a compressor housing (1) with an electrical machine (5) and a compressor unit (6), - a power electronics housing (2) with power electronics for controlling the electrical machine, wherein - a partition (3) between the compressor housing (1st ) and the power electronics housing (2) is arranged, wherein - the partition wall (3) has a surface (31) facing the compressor housing (1) and a surface (32) facing the power electronics housing (2), characterized in that the compressor housing ( 1) the surface (31) of the partition wall (3) facing, at least in sections, as an inwardly curved surface, in particular as a concave surface, and/or the surface (32) of the partition wall (3) that faces the power electronics housing (2), at least in sections, is designed as an outwardly curved surface, in particular as a convex-shaped surface. compressor after claim 1 , characterized in that the shape of the surface (31) of the partition (3) facing the compressor housing (5) and/or the shape of the surface (32) of the partition (3) facing the power electronics housing (2) is independent of a pressure difference between the compressor housing (1) and power electronics housing (2) is given. Compressor according to at least one of the preceding claims, characterized in that the surface (31) of the partition (3) facing the compressor housing (1) has, at least in sections, the shape of a ball socket. Compressor according to at least one of the preceding claims, characterized in that the surface (32) of the dividing wall (3) facing the power electronics housing (2) is part-spherical, in particular hemispherical, conical or in the form of a semi-cylindrical lateral surface. Compressor according to at least one of the preceding claims, characterized in that the surface (32) of the partition wall (3) facing the power electronics housing (2) comprises flat partial surfaces (321), in particular is composed of one another, the partial surfaces (321) being at an angle of less than 90° ° are aligned to the longitudinal axis (L) of the compressor and / or an angle other than 180 ° to each other. Compressor according to at least one of the preceding claims, characterized in that the flat partial surfaces (321) form a roof-like or facet-like shape. Compressor according to at least one of the preceding claims, characterized in that the surface (32) of the partition (3) facing the power electronics housing (2) comprises two or six partial surfaces (321). Compressor according to at least one of the preceding claims, characterized in that the surface (32) of the partition (3) facing the power electronics housing (2), in particular at least one partial surface (321), is equipped with at least one receiving surface (7) for power semiconductors (41). is. Compressor according to at least one of the preceding claims, characterized in that the at least one receiving surface (7) is at an angle of less than 90°, preferably between 45° and less than 90°, to the longitudinal axis (L) of the compressor on the surface facing the power electronics housing (2). (32) of the partition (3) is arranged. Compressor according to at least one of the preceding claims, characterized in that the receiving surface (7) is designed to be recessed, raised or level with the adjoining surface (32) of the partition wall (3). Compressor according to at least one of the preceding claims, characterized in that the power electronics (4) comprises at least one power semiconductor (41), the at least one power semiconductor (41) being on the surface 32 of the partition wall (3) or is arranged on the receiving surface (7). Compressor according to at least one of the preceding claims, characterized in that at least one power semiconductor (41) is accommodated in a module assembly (M), the at least one power semiconductor (41) being accommodated in the module assembly (M) in such a way that it is on the surface (32) of the partition (3), in particular on the assigned receiving surface (7). Compressor according to at least one of the preceding claims, characterized in that the module assembly (M) is equipped with a pressing mechanism (8), in particular in the form of spring clips or spring elements, which is designed to ensure that the power semiconductor or semiconductors (41). the respective receiving surface (7) is pressed. Compressor according to at least one of the preceding claims, characterized in that the receiving surfaces (7) accommodating the power semiconductors (41) are designed in a circular six-fold mirror-symmetrical arrangement on the surface (32) of the partition (3) facing the power electronics housing (2), wherein one or more, preferably a power semiconductor (41) is arranged on a receiving surface (7). Compressor according to at least one of the preceding claims, characterized in that the receiving surfaces (7) receiving the power semiconductors (41) are designed in a triangular arrangement on the surface (32) of the partition (3) facing the power electronics housing (2), wherein a or several, preferably two, power semiconductors (41) are arranged on a receiving surface (7), with an ideal angle between the three receiving surfaces being 120° in particular. Compressor according to at least one of the preceding claims, characterized in that the receiving surfaces (7) accommodating the power semiconductors (41) are in mutually angled partial surfaces (321) in a six-fold mirror-symmetrical arrangement on the surface (32) of the partition wall facing the power electronics housing (2). (3), are designed, wherein one or more, preferably one, power semiconductors (41) is arranged on a receiving surface (7). Compressor according to at least one of the preceding claims, characterized in that the receiving surfaces (7) accommodating the power semiconductors (41) enclose an obtuse angle to one another, in particular at an angle greater than 90°, less than 180°, and via a common center line (ML) in in a two arrangement on the surface (32) of the partition (3) facing the power electronics housing (2), with three power semiconductors (41) preferably being arranged on the respective receiving surfaces (7). Compressor according to at least one of the preceding claims, characterized in that four receiving surfaces are provided on only one side of the surface 32 of the partition (3) facing the power electronics housing (2), the receiving surfaces (7) each having one or more power semiconductors (41) exhibit. Compressor according to at least one of the preceding claims, characterized in that four receiving surfaces (7) are provided in a quadrant of four on the power electronics housing (2) facing surface (32) of the partition (3), wherein the receiving surfaces (7) one or more Have power semiconductors (41).

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