DE102021104814A1 - Proximity detection sensor assemblies, devices and methods - Google Patents

Abstract

Proximity detection sensor assemblies and associated methods and devices are disclosed herein. In some embodiments, a sensor arrangement in an electronic device may include a first circuit layer including a proximity pad and a first reference pad and a second circuit layer including a second reference pad and a temperature pad. The first circuit layer can be located between the second circuit layer and a user-facing surface of the electronic device, the first reference pad can be electrically coupled to the second reference pad, and the first reference pad can be located between the temperature pad and the user-facing surface.

Description

Cross-reference to priority filings

The present application claims the benefit of PCT / CN2020 / 077623 , filed March 3, 2020, entitled "PROXIMITY DETECTION SENSOR ARRANGEMENTS, DEVICES AND METHODS" and by U.S. 16 / 828,381 , filed March 24, 2020, entitled "PROXIMITY DETECTION SENSOR ARRANGEMENTS, DEVICES AND METHODS," which is hereby incorporated by reference in its entirety.

background

Some personal electronic devices, such as smartphones, may incorporate sensors configured to detect the approach of a user (and react, for example, by transitioning from a “rest” state to a “ready” state). Some of such sensors are capacitive sensors that use capacitive coupling to detect changes in the dielectric constant of the material around the sensor.

Figure list

• 1 ist eine Seitenquerschnittsansicht eines Teils einer elektronischen Vorrichtung, die eine Sensoranordnung aufweist, gemäß verschiedenen Ausführungsformen.
• 2 ist ein Blockdiagramm eines beispielhaften Annäherungsdetektionssystems unter Verwendung der Sensoranordnung aus 1 gemäß verschiedenen Ausführungsformen.
• 3A und 3B sind Flussdiagramme von Verfahren einer Referenzaktualisierung und Annäherungsdetektion gemäß verschiedenen Ausführungsformen.
• 4A und 4B sind Draufsichten der Schichten bei einem Beispiel der Sensoranordnung aus 1 gemäß verschiedenen Ausführungsformen.
• 5A und 5B sind Draufsichten der Schichten bei einem anderen Beispiel der Sensoranordnung aus 1 gemäß verschiedenen Ausführungsformen.
• 6 ist ein Blockdiagramm einer beispielhaften elektronischen Vorrichtung, die eine Sensoranordnung aufweisen kann und/oder ein Annäherungsdetektionsverfahren gemäß beliebigen der hier offenbarten Ausführungsformen durchführen kann.

Embodiments will be readily understood from the following detailed description in conjunction with the accompanying drawings. To simplify this description, the same reference numerals refer to the same structural elements. Embodiments are illustrated in the figures of the accompanying drawings by way of example and not in a limiting manner.

• 1 FIG. 3 is a side cross-sectional view of a portion of an electronic device including a sensor assembly in accordance with various embodiments.
• 2 FIG. 13 is a block diagram of an exemplary proximity detection system using the sensor arrangement of FIG 1 according to various embodiments.
• 3A and 3B FIG. 12 are flowcharts of methods of reference updating and proximity detection in accordance with various embodiments.
• 4A and 4B FIG. 13 is top plan views of the layers in an example of the sensor assembly of FIG 1 according to various embodiments.
• 5A and 5B FIG. 13 is top plan views of the layers in another example of the sensor assembly of FIG 1 according to various embodiments.
• 6th FIG. 3 is a block diagram of an exemplary electronic device that may include a sensor arrangement and / or perform an approach detection method in accordance with any of the embodiments disclosed herein.

Detailed description

Proximity detection sensor assemblies and associated methods and devices are disclosed herein. In some embodiments, a sensor arrangement in an electronic device may include a first circuit layer including a proximity pad and a first reference pad and a second circuit layer including a second reference pad and a temperature pad. The first circuit layer can be located between the second circuit layer and a user-facing surface of the electronic device, the first reference pad can be electrically coupled to the second reference pad, and the first reference pad can be located between the temperature pad and the user-facing surface.

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, wherein like numerals refer to like parts throughout, and in which embodiments that may be practiced are shown for illustrative purposes. It goes without saying that other embodiments can be used and structural and logical changes can be made without departing from the scope of protection of the present disclosure. Therefore, the following detailed description is not to be taken in a limiting sense.

Various acts can be described as several discrete acts or acts in sequence in a way that is extremely helpful in understanding the claimed subject matter. However, the order of description should not be construed to imply that these acts necessarily depend on the order. In particular, these operations may not be performed in the order in which they are presented. Operations described can be performed in a different order than in the described embodiment. Various additional processes may be performed and / or described processes may be omitted in additional embodiments.

For the purposes of the present disclosure, the phrase "A and / or B" means (A), (B), or (A and B). For the purpose of In the present disclosure, the phrase “A, B and / or C” means (A), (B), (C), (A and B), (A and C), (B and C) or (A, B and C) ). The phrase “A or B” means (A), (B) or (A and B). The drawings are not necessarily to scale. Although many of the drawings illustrate straight line structures with flat walls and right angled corners, this is for convenience only, and actual devices made using these techniques will have rounded corners, surface roughness, and other features.

The description uses the phrases “in one embodiment” or “in embodiments”, each of which relates to one or more of the same or different embodiments. Furthermore, the terms “having”, “including”, “containing” and the like, as used with reference to the present disclosure, are synonymous. When used to describe a range of dimensions, the phrase “between X and Y” represents an area that includes X and Y. For the sake of simplicity, the phrase " 4th “Used to refer to the collection of drawings 4A-4B to refer, and can use the phrase " 5 “Used to refer to the collection of drawings 5A-5B to refer.

1 Figure 3 is a side cross-sectional view of a portion of an electronic device 115 who have favourited a sensor array 100 according to various embodiments. The electronic device 115 can be any suitable device, such as a wearable device or a handheld device. In some embodiments, the electronic device can 115 for example, a pair of headphones or a pair of headphones (e.g. with or without a headband between the headphones), glasses or a bracelet.

The sensor arrangement 100 may have proximity and temperature sensing capability to provide proximity detection capability of the electronic device 115 relative to conventional electronic devices. In particular, the sensor arrangement 100 a proximity sensor 103 and a temperature sensor 107 exhibit. The proximity sensor 103 can be a proximity pad 102 and a reference pad 106 have, the proximity pad 102 between the reference pad 106 and a user-facing surface 105 of the electronic device 115 is located. The proximity sensor 103 can be a capacitive proximity sensor, the proximity pad 102 and the reference pad 106 serve as capacitive plates; the instantaneous capacitance of the proximity sensor 103 may be the dielectric composition of the materials near the proximity pad 102 (e.g. air and / or the body of a user), and accordingly changes in the instantaneous capacitance of the proximity sensor 103 can be used to detect whether a user is close to the electronic device 115 is or not. In particular, as described below with reference to FIG 4th and 5 describes the instantaneous capacitance of the proximity sensor 103 be compared with a proximity reference (proximity baseline) and deviations in the instantaneous capacity of the proximity sensor 103 from the proximity reference that exceed a threshold may result in a determination that a user is close or no longer close to the electronic device 115 is.

As noted above, the sensor assembly 100 also a temperature sensor 107 exhibit. The temperature sensor 107 can be a temperature pad 108 and a reference pad 104 exhibit. Like the proximity sensor 103 can the temperature sensor 107 also be a capacitor (where the temperature pad 108 and the reference pad 104 serve as capacitive plates), but the orientation of the temperature sensor 107 with reference to the surface facing a user 105 may differ from the orientation of the proximity sensor 103 differentiate; namely can be in the temperature sensor 107 the reference pad 104 between the temperature pad 108 and the surface facing a user 105 are located. The reference pad 104 can accordingly be used to control the temperature pad 108 changes in dielectric composition near the surface facing a user 105 "Shield". In some embodiments, the reference pad 104 and the reference pad 106 be electrically coupled (e.g., short-circuited) to one another and in some such embodiments the reference pad 104 and the reference pad 106 with ground of the electronic device 115 be coupled.

In some embodiments, the elements of the sensor arrangement 100 distributed among different layers of a printed circuit (e.g. flexible printed circuit). For example, in 1 the proximity pad 102 and the reference pad 104 in a single common layer of printed circuitry 110 be included while the reference pad 106 and the temperature pad 108 in another common printed circuit layer 112 may be included. The printed circuit layer 110 may be between the printed circuit layer 112 and the surface facing a user 105 and in some embodiments, the printed circuit layer 110 to the printed circuit layer 112 adjoin (which allows the sensor arrangement 100 only requires two layers of printed circuit board). Other distributions of the elements of the sensor arrangement 100 between printed circuit layers can be used; in some embodiments, the elements of the sensor arrangement 100 be distributed over three or fewer layers of printed circuit boards. In the printed circuit layers, the proximity pad 102 , the reference pad 104 , the reference pad 106 and the temperature pad 108 each may be implemented by areas of conductive material (e.g., copper or other metal) spaced apart by one or more dielectric materials. The approach pad 102 , the reference pad 104 , the reference pad 106 and the temperature pad 108 may take any desired shape, a number of examples of which are given below with reference to FIG 4th and 5 is discussed.

The sensor arrangement 100 may be communicatively coupled to circuitry that measures and utilizes the capacitance of the proximity sensor 103 and the temperature sensor 107 is configured to determine whether a user is close to the electronic device 115 is. For example is 2 Figure 3 is a block diagram of an exemplary proximity detection system 150 that is the sensor assembly 100 the end 1 and a controller 120 according to various embodiments. In some embodiments, the proximity detection system 150 in the electronic device 115 be included, while in other embodiments the controller 120 separate from the electronic device 115 (e.g. in wireless communication with the electronic device 115 ) can be.

To determine if a user is close to the sensor array 100 is, the controller can 120 the capacity of the proximity sensor 103 (e.g. a signal from the proximity sensor 103 is output and that is the capacity of the proximity sensor 103 represents or is related to this) and can receive this capacity with a reference value (baseline value) (e.g. in a memory of the controller 120 is saved). If the capacity of the proximity sensor 103 deviates from the proximity reference value by an amount greater than a threshold, a determination can be made that the user is close to the sensor arrangement 100 is located or not. If for example the capacity of the proximity sensor 103 is greater than the proximity reference by an amount greater than an “upper” threshold, the controller can 120 determine (e.g. generate an indicator) that the user is close to the sensor array 100 is. If the capacity of the proximity sensor 103 the controller can 120 determine (e.g. generate an indicator) that the user is not close to the sensor array 100 is. This particular example is illustrative and control only 120 can implement any desired threshold analysis (e.g., including hysteresis thresholds, etc.) or other analysis.

While using the electronic device 115 can change the temperature of the sensor assembly 100 the instantaneous capacitance of the proximity sensor 103 influence. For example, when a user is close to the user-facing surface 105 of the electronic device 115 body heat from the user can change the temperature of the sensor assembly 100 increase and can lead to an increase in the capacity of the proximity sensor 103 to lead. When the user is then away from the user-facing surface 105 moved away (e.g. when the electronic device 115 has headphones and the user takes off the headphones), this change in the local dielectric composition can lead to a decrease in the capacitance of the proximity sensor 103 lead, but this decrease may be less than the increase in capacitance caused by the increase in the temperature of the sensor array 100 caused. A subsequent cooling of the sensor arrangement 100 and a resulting decrease in the capacitance of the proximity sensor 103 can occur relatively slowly. Without taking into account the effects of temperature, the controller can 120 accordingly miss that a user is no longer in the vicinity of the electronic device 115 is located (e.g. taking off headphones) until the sensor arrangement 100 has cooled down sufficiently.

With the sensor arrangement 100 can change the orientation of the temperature sensor 107 (whereby the reference pad 104 between the temperature pad 108 and the surface facing a user 105 located) mean that the capacity of the temperature sensor 107 compared to the proximity sensor 103 relatively less sensitive to the dielectric composition of the user-facing surface 105 can be, and accordingly the capacitance of the temperature sensor 107 be relatively agnostic to being close to a user. However, the temperature sensor can 107 in the same temperature environment as the proximity sensor 103 are located and can accordingly changes in the capacitance analogous to a function of the temperature of the sensor arrangement 100 Experienced. Consequently, the controller can 120 the capacity of the temperature sensor 107 (e.g. a signal from the temperature sensor 107 is output and the capacity of the temperature sensor 107 represented or with this in Is related) as an indicator of the temperature of the sensor arrangement 100 use to temperature-related effects on the capacitance of the proximity sensor 103 to compensate.

The control 120 can get data from the temperature sensor 107 in any of a number of ways utilize the ability of the controller 120 to accurately detect the approach of the user. For example, in some embodiments, changes in the output of the temperature sensor 107 can be used to trigger an adjustment of the proximity reference used in proximity detection threshold analysis. 3A and 3B are flow charts of the procedures 200 and 250 going through the controller 120 can be implemented for proximity detection. Although the operations of the procedure 200 and 250 with reference to specific embodiments of the sensor assemblies disclosed herein 100 Illustrated can be the procedures 200 and 250 can be used with any suitable sensor arrangement. Activities are each one time and in a special order in 3A and 3B illustrated, but operations can be rearranged and / or repeated as needed. In some embodiments, the controller may 120 the proceedings 200 and 250 perform in parallel.

Starting with the procedure 200 the end 3A can at 202 a current temperature value can be stored as a reference temperature value (baseline temperature value). For example, the controller can 120 a reading of the capacitance of the temperature sensor 107 save as the reference temperature value.

at 204 it can be determined whether a current temperature value (which has been since 202 may have changed) deviates from the reference temperature value by an amount greater than a temperature threshold. For example, the controller can 120 an updated reading of the capacitance of the temperature sensor 107 and can compare it to the reference temperature value to determine if the difference exceeds an associated threshold. The at 204 The temperature threshold used can be, for example, an absolute amount (e.g. corresponding to a specific fixed number of degrees of temperature) or a percentage amount. Furthermore, the use of the singular phrase “temperature threshold” simply serves the brevity of illustration and the at 204 The comparison carried out can have several thresholds (e.g. an "upper" threshold for temperature increases above the reference temperature value and another, "lower" threshold for temperature decreases below the reference temperature value). If at 204 it is determined that the current temperature does not deviate from the reference temperature value by an amount greater than the temperature threshold, the method can to 204 return and then repeat the comparison with a new current temperature value. In some embodiments, this check of the current temperature value can take place on a periodic basis with a configurable period (e.g. with a less frequent check if lower power consumption is desired).

If at 204 it is determined that the current temperature deviates from the reference temperature value by an amount greater than the temperature threshold, the method can 200 to 206 where it can be determined whether a user proximity state indicates that a user was previously determined to be close (e.g. the value of a user_approach_state state variable is 1) or the user was previously determined not to be close (e.g. is the Value of the status variable User_Approach_State equals 0). For example, the controller can 120 read a state variable or other indicator stored in memory to determine if a user is in a final judgment as being close to the sensor array 100 or was not determined.

If at 206 it is determined that a user has previously been determined to be close, the method may 200 to 208 Skip where the proximity reference can be set equal to the current proximity sensor capacitance value minus the proximity sensor capacitance threshold used to determine whether or not a user is close. For example, the controller can 120 a reading of the capacitance of the proximity sensor 103 and can subtract a predetermined proximity sensor capacitance threshold from this reading to generate a new reference (baseline) for further analysis. The predetermined proximity sensor capacitance threshold can be stored in a memory of the controller 120 and can be stored empirically during a calibration of the system 150 to be determined. The procedure 200 can then to 202 skip over and start again.

Returning to 206 can, if at 206 it is determined that the user was previously determined not to be close to the method 200 to 214 Skip where the proximity reference can be set equal to the current proximity sensor capacitance value. For example, the controller can 120 a reading of the capacitance of the proximity sensor 103 and can save this reading as the new reference for further analysis. The procedure 200 can then to 202 skip over and start again.

Taking care of the procedure 250 the end 3B can at 216 it can be determined whether the current proximity sensor capacitance value minus the proximity reference (which is obtained via the method 200 the end 3A is set) is greater than a higher proximity sensor capacitance threshold. For example, the controller can 120 a reading of the capacitance of the proximity sensor 103 and can receive the approximation reference created by the procedure 200 the end 3A is generated, subtract from this reading; the control 120 can then determine whether the value is greater than an upper proximity sensor capacitance threshold (which is used to avoid rapid changes in detection status due to random fluctuations). The upper proximity sensor capacity threshold can be stored in the memory of the controller 120 and can be stored empirically during a calibration of the system 150 to be determined.

If at 216 it is determined that the current proximity sensor capacitance value minus the proximity reference is greater than an upper proximity sensor capacitance threshold, the method may 250 to 218 and the user proximity condition may reflect that the user is determined to be near (e.g., the controller may 120 change the value of the user_approach_state status variable to 1). The procedure 250 can then to 218 go back and start again.

If at 216 it is determined that the current proximity sensor capacitance value minus the proximity reference is not greater than an upper proximity sensor capacitance threshold, the method may 250 to 220 and the user proximity condition may reflect that the user is not determined to be near (e.g., the controller may 120 change the value of the status variable user_approach_state to 0).

The procedure 250 can then to 210 skip where it can be determined whether the approximate reference (which is via the procedure 200 the end 3A is set) minus the current proximity sensor capacitance value is greater than or equal to a lower proximity sensor capacitance threshold. For example, the controller can 120 a reading of the capacitance of the proximity sensor 103 receive and can subtract this reading from the approximate reference; the control 120 can then determine whether the value is greater than or equal to a lower proximity sensor capacitance threshold (which is used to avoid rapid changes in the detection state due to random fluctuations). The lower proximity sensor capacity threshold can be stored in the memory of the controller 120 and can be stored empirically during a calibration of the system 150 to be determined.

If at 210 it is determined that the proximity reference minus the current proximity sensor capacitance value is not greater than or equal to a lower proximity sensor capacitance threshold, the method can 250 to 216 skip over and start again. If at 210 it is determined that the proximity reference minus the current proximity sensor capacitance value is greater than or equal to a lower proximity sensor capacitance threshold, the method can 250 to 222 and the proximity reference can be updated to equal the current proximity sensor capacitance value. The procedure 250 can then to 216 skip over and start again.

The procedure 200 can then to 216 skip where it can be determined whether the current proximity sensor capacitance value (which has been since 214 may have changed) minus the approximate reference (which at 214 has been determined) is greater than an upper proximity sensor capacitance threshold. For example, the controller can 120 a reading of the capacitance of the proximity sensor 103 received and can use the approximate reference that comes with 214 is generated, subtract from this reading; the control 120 can then determine whether the value is greater than an upper proximity sensor capacitance threshold (which is used to avoid rapid changes in detection status due to random fluctuations). The upper proximity sensor capacity threshold can be stored in the memory of the controller 120 and can be stored empirically during a calibration of the system 150 to be determined.

As noted above, the proximity pad 102 , the reference pad 104 , the reference pad 106 and the temperature pad 108 with a sensor arrangement 100 have any desired shapes. For example are 4A and 4B Top views of the printed circuit layers 110 respectively. 112 in one example of the sensor arrangement 100 the end 1 according to various embodiments. In the embodiment from 4th has the sensor arrangement 100 a base shaped like an oval ring; Such an embodiment may be particularly for use in headphones (e.g. the annular base area being sized to fit an ear) or in glasses (e.g. the annular base area being sized to accommodate an ear) fits the area around one eye). The approach pad 102 can take up much of the oval ring footprint in the printed circuit layer 110 occupy, with the reference pad 104 like a wedge between parts of the approach pad 102 is shaped. In the printed circuit layer 112 can the reference pad 106 Occupying much of the oval ring base area, being a dielectric material 114 mostly like a wedge between parts of the reference pad 106 is shaped and the temperature pad 108 within the wedge of the dielectric material 114 is arranged. The temperature pad 108 can be completely within the shadow of the reference pad 104 are located. In the drawings from 4th and 5 For example, conductive elements sharing a printed circuit layer may be isolated from one another by at least a small amount of an intervening material (such as the proximity pad, for example 102 and the reference pad 104 cannot be short-circuited).

5A and 5B are top views of the printed circuit layers 110 respectively. 112 in another example of the sensor arrangement 100 the end 1 according to various embodiments. In the embodiment from 5 has the sensor arrangement 100 a base that is largely rectangular; Such an embodiment can be particularly suitable for use in a bracelet, a chest strap, a plaster or an item of clothing. In the printed circuit layer 110 The proximity pad can occupy much of the rectangular base area and can itself have a rectangular shape, while the reference pad 104 may have a smaller rectangular shape. In the printed circuit layer 112 can the reference pad 106 occupy much of the rectangular base and can be next to a rectangular part made of the dielectric material 114 are located; the temperature pad 108 can within the rectangle made of the dielectric material 114 be arranged. As with the embodiment 4th the temperature pad 108 the end 5 completely within the shadow of the reference pad 104 are located.

The sensor arrangements disclosed here 100 can be included in any suitable electronic component. For example is 6th Figure 3 is a block diagram of an exemplary electronic device 1800 that may have a sensor arrangement and / or perform an approach detection method in accordance with any of the embodiments disclosed herein. A number of components are in 6th than in the electronic device 1800 illustrated, but one or more of these components can be omitted or duplicated as appropriate for the application. In some embodiments, some or all of the components included in the electronic device 1800 be attached to one or more motherboards. In some embodiments, some or all of these components are fabricated on a single system-on-chip (SoC) die.

In addition, the electronic device has 1800 in various embodiments, one or more of the in 6th illustrated components on, but can be the electronic device 1800 include interface circuitry for coupling to the one or more components. For example, the electronic device has 1800 may not be a display device 1806 but may include display device interface circuitry (e.g., connector and drive circuitry) with which a display device 1806 can be coupled. In another set of examples, the electronic device has 1800 may not be an audio input device 1824 or an audio output device 1808 but may include audio input or output device interface circuitry (e.g., connector and support circuitry) with which an audio input device 1824 or an audio output device 1808 can be coupled.

The electronic device 1800 can be a processing device 1802 (e.g., one or more processing devices). As used herein, the term “processing device” or “processor” can refer to any device or part of a device that processes electronic data from registers and / or memory to convert that electronic data into other electronic data that can be stored in registers and / or a memory. In some embodiments, the processing device 1802 be configured to perform some or all of the proximity detection methods disclosed herein. The processing device 1802 may include one or more digital signal processors (DSPs), application specific integrated circuits (ASICs), central processing units (CPUs), graphics processing units (GPUs), crypto processors (specialized processors that execute cryptographic algorithms in hardware), server processors, or any other suitable processing device. The electronic device 1800 can have a memory 1804 which in turn may include one or more storage devices such as volatile memory (e.g. dynamic random access memory (DRAM)), non-volatile memory (e.g. read only memory (ROM)), flash memory, solid state memory and / or a hard disk . In some embodiments, the memory 1804 a memory having a die with the processing device 1802 Splits. This memory can be used as a cache memory and can be an embedded dynamic random access memory (eDRAM) or a spin Have transfer torque magnetic direct access memory (STT-MRAM).

In some embodiments, the electronic device can 1800 a communication chip 1812 have (e.g. one or more communication chips). The communication chip 1812 can, for example, manage wireless communications for the transfer of data to and from the electronic device 1800 be trained. The term "wireless" and its derivatives can be used to describe circuits, devices, systems, methods, techniques, communication channels, etc. that can communicate data through a non-solid medium through the use of modulated electromagnetic radiation. The term does not imply that the associated devices do not contain any wires, although in some embodiments it may.

The communication chip 1812 may implement any of a number of wireless standards or protocols, including but not limited to the Institute for Electrical and Electronic Engineers (IEEE) standards including WiFi (IEEE 802.11 family), IEEE 802.16 standards (e.g., IEEE 802.16-2005- Supplement), Long-Term-Evolution (LTE) project together with any additions, updates and / or revisions (e.g. Advanced LTE project, Ultra Mobile Broadband (UMB) project (also as "3GPP2" labeled) etc.). Broadband Wireless Access (BWA) networks compatible with IEEE 802.16 are commonly referred to as WiMAX networks, an acronym that stands for Worldwide Interoperability for Microwave Access, which is a mark of approval for products that test compliance and interoperability for the IEEE 802.16 standards exist. The communication chip 1812 can work in a network according to Global System for Mobile Communication (GSM), General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMTS), High Speed Packet Access (HSPA), Evolved HSPA (E-HSPA) or LTE. The communication chip 1812 can work according to Enhanced Data for GSM Evolution (EDGE), GSM EDGE Radio Access Network (GERAN), Universal Terrestrial Radio Access Network (UTRAN) or Evolved UTRAN (E-UTRAN). The communication chip 1812 can operate according to Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Evolution-Data Optimized (EV-DO) and derivatives thereof, as well as any other wireless protocol known as 3G, 4G, 5G and beyond. The communication chip 1812 may operate according to other wireless protocols in other embodiments. The electronic device 1800 can have an antenna 1822 to enable wireless communications and / or to receive other wireless communications (such as AM or FM radio transmissions).

In some embodiments, the communication chip 1812 manage wired communications such as electrical, optical, or any other suitable communication protocol (e.g., Ethernet). As noted above, the communication chip 1812 have multiple communication chips. For example, a first communication chip 1812 can be dedicated to shorter range wireless communications, such as WiFi or Bluetooth, and a second communication chip 1812 be dedicated to longer range wireless communications such as Global Positioning System (GPS), EDGE, GPRS, CDMA, WiMAX, LTE, EV-DO, or others. In some embodiments, a first communication chip 1812 can be dedicated to wireless communications and a second communication chip 1812 be dedicated to wired communications.

The electronic device 1800 may include battery / power circuitry 1814 exhibit. The battery / power circuitry 1814 may include one or more energy storage devices (e.g. batteries or capacitors) and / or circuitry for coupling components of the electronic device 1800 with one of the electronic device 1800 separate energy source (e.g. AC grid power).

The electronic device 1800 can be a display device 1806 (or equivalent interface circuitry as discussed above). The display device 1806 can include any visual indicator such as a heads up display, computer monitor, projector, touch screen display, liquid crystal display (LCD), light emitting diode display, or flat panel display.

The electronic device 1800 can be an audio output device 1808 (or equivalent interface circuitry as discussed above). The audio output device 1808 can include any device that produces an audible indicator, such as speakers, headphones, or earphones.

The electronic device 1800 can be an audio input device 1824 (or equivalent interface circuitry as discussed above). The audio input device 1824 can include any device that generates a signal that produces a tone such as microphones, microphone arrays, or digital instruments (e.g. instruments with a digital musical instrument interface (MIDI) output).

The electronic device 1800 can use a GPS device 1818 (or equivalent interface circuitry as discussed above). The GPS device 1818 can be in communication with a satellite-based system and, as is known in the art, a location of the electronic device 1800 receive.

The electronic device 1800 can use a different output device 1810 (or equivalent interface circuitry as discussed above). Examples of the other output device 1810 may include an audio codec, a video codec, a printer, a wired or wireless transmitter for providing information to other devices, or an additional storage device.

The electronic device 1800 can use a different input device 1820 (or equivalent interface circuitry as discussed above). Examples of the other input device 1820 For example, an accelerometer, a gyroscope, a compass, an image capture device, a keyboard, a cursor control device such as a mouse, a stylus, a touch panel, a barcode reader, a quick response (QR) code reader, any sensor or include a radio frequency identification (RFID) reader. In some examples, the other input device may 1820 any of the sensor assemblies disclosed herein 100 lock in.

The electronic device 1800 may be any desired form factor, such as a handheld or mobile electronic device (e.g., cell phone, smartphone, mobile internet device, music player, tablet computer, laptop computer, netbook computer, ultrabook Computer, personal digital assistant (PDA), ultra-mobile PC, etc.), an electronic desktop device, a server device or other networked computing component, a printer, a scanner, a monitor, a set-top box, an entertainment control unit, a Vehicle control unit, digital camera, digital video recorder, or wearable electronic device. In some embodiments, the electronic device can 1800 be any other electronic device that processes data.

The following paragraphs provide various examples of the embodiments disclosed herein.

Example 1 is an electronic device that includes a sensor assembly that includes a first circuit layer that includes a proximity pad and a first reference pad, and a second circuit layer that includes a second reference pad and a temperature pad, with the first circuit layer sandwiched between the second circuit layer and a user-facing surface of the electronic device is located, the first reference pad is electrically coupled to the second reference pad and the first reference pad is located between the temperature pad and the user-facing surface.

Example 2 includes the subject matter of Example 1, and further provides that the first reference pad and the second reference pad are electrically coupled to ground.

Example 3 has the subject matter of any of Examples 1-2 and further states that the electronic device is a wearable electronic device.

Example 4 has the subject matter of any of Examples 1-3, and further provides that the electronic device comprises a headset and the sensor arrangement is contained in the headset.

Example 5 has the subject matter of any of Examples 1-4 and further provides that the first circuit layer and the second circuit layer are flexible printed circuit layers.

Example 6 has the subject matter of any of Examples 1-5 and further states that the sensor assembly comprises a flexible printed circuit board.

Example 7 includes the subject matter of any of Examples 1-6, and further provides that the proximity pad and the second reference pad together are part of a capacitive proximity sensor.

Example 8 includes the subject matter of any of Examples 1-7 and further includes:

a controller electrically coupled to the sensor assembly.

Example 9 includes the subject matter of Example 8, and further specifies that the control for Generating a signal that indicates whether or not a user is in the vicinity of the electronic device is designed based on signals that are generated by the sensor arrangement.

Example 10 comprises the subject matter of any of Examples 8-9, and further provides that the sensor arrangement is designed to generate an approximate capacitance value using the proximity pad and the sensor arrangement is designed to generate a temperature capacitance value using the temperature pad.

Example 11 includes the subject matter of Example 10 and further provides that the controller is configured to adjust a reference proximity capacitance value used to determine whether or not user is in proximity to the electronic device based on the temperature capacitance value .

Example 12 includes the subject matter of Example 11 and further provides that adjusting the reference approximate capacitance value based on the temperature capacitance value includes adjusting the reference approximate capacitance value in response to changes in the temperature capacitance value.

Example 13 has the subject matter of any of Examples 11-12, and further provides that adjusting the reference proximity capacity value when a user is indicated as being in proximity to the electronic device includes setting the reference proximity capacity value equal to the proximity capacity value minus an proximity capacity threshold.

Example 14 includes the subject matter of Example 13, and further provides that adjusting the reference approximate capacitance value when a user is indicated as not being in proximity to the electronic device includes setting the reference approximate capacitance value equal to the approximate capacitance value.

Example 15 is an electronic device having a sensor assembly comprising: a proximity pad, a first reference pad, a second reference pad, and a temperature pad, the proximity pad being between a user-facing surface of the electronic device and the second reference pad the first reference pad is located between the user-facing surface and the temperature pad, and wherein the sensor arrangement is contained in fewer than four circuit layers.

Example 16 includes the subject matter of Example 15 and further provides that the proximity pad and the first reference pad are included in a single circuit layer.

Example 17 has the subject matter of any of Examples 15-16 and further provides that the second reference pad and the temperature pad are included in a single circuit layer.

Example 18 includes the subject matter of any of Examples 15-17, and further provides that the first reference pad and the second reference pad are electrically coupled.

Example 19 includes the subject matter of any of Examples 15-18, and further provides that the first reference pad and the second reference pad are electrically coupled to ground.

Example 20 has the subject matter of any of Examples 15-19 and further states that the electronic device is a wearable electronic device.

Example 21 has the subject matter of any of Examples 15-20, and further states that the electronic device comprises a headphone and the sensor arrangement is included in the headphone.

Example 22 has the subject matter of any of Examples 15-20 and further provides that the sensor assembly comprises a flexible printed circuit.

Example 23 comprises the subject matter of any of Examples 15-22, and further provides that the proximity pad and the second reference pad together are part of a capacitive proximity sensor.

Example 24 includes the subject matter of any of Examples 15-23 and further includes:

a controller electrically coupled to the sensor assembly.

Example 25 includes the subject matter of Example 24, and further provides that the controller is configured to generate a signal indicating whether or not a user is in proximity to the electronic device based on signals transmitted by the Sensor array are generated.

Example 26 has the subject matter of any of Examples 24-25, and further provides that the sensor arrangement for generating a Proximity capacitance value is designed using the proximity pad and the sensor arrangement is designed to generate a temperature capacitance value using the temperature pad.

Example 27 includes the subject matter of Example 26 and further provides that the controller is configured to adjust a reference approximate capacitance value used to determine whether or not user is in proximity to the electronic device based on the temperature capacitance value .

Example 28 includes the subject matter of Example 27 and further provides that adjusting the reference approximate capacitance value based on the temperature capacitance value includes adjusting the reference approximate capacitance value in response to changes in the temperature capacitance value.

Example 29 has the subject matter of any of Examples 27-28 and further provides that adjusting the reference proximity capacity value when a user is indicated as being in proximity to the electronic device includes setting the reference proximity capacity value equal to the proximity capacity value minus an proximity capacity threshold.

Example 30 includes the subject matter of Example 29 and further provides that adjusting the reference approximate capacitance value when a user is indicated as not being in proximity to the electronic device includes setting the reference approximate capacitance value equal to the approximate capacitance value.

Example 31 is a method of proximity detection for an electronic device, comprising: adjusting a reference proximity capacitance value based at least in part on temperature data; and determining whether a user is in proximity to the electronic device, wherein determining if a user is in proximity to the electronic device comprises performing a threshold comparison based at least in part on an approximate capacitance value and the reference approximate capacitance value.

Example 32 includes the subject matter of Example 31 and further provides that adjusting the reference approximate capacitance value based at least in part on temperature data includes: identifying a change in temperature; and in response to identifying the temperature change, adjusting the reference approximation capacitance value.

Example 33 includes the subject matter of any of Examples 31-32 and further provides that adjusting the reference proximity capacitance value is based at least in part on an indicator of whether a user is currently in proximity to the electronic device.

Example 34 includes the subject matter of Example 33, and further provides that adjusting the reference proximity capacitance value comprises: if the indicator indicates that a user is currently near the electronic device, setting the reference proximity capacitance value equal to the proximity capacity value minus an approach capacity threshold having.

Example 35 comprises the subject matter of any of Examples 33-34 and further provides that adjusting the reference proximity capacitance value comprises: if the indicator indicates that a user is not currently near the electronic device, setting the reference proximity capacitance value equal the approximate capacitance value.

In accordance with a present aspect, proximity detection sensor assemblies and associated methods and devices are disclosed. In some embodiments, a sensor arrangement in an electronic device may include a first circuit layer including a proximity pad and a first reference pad and a second circuit layer including a second reference pad and a temperature pad. The first circuit layer can be located between the second circuit layer and a user-facing surface of the electronic device, the first reference pad can be electrically coupled to the second reference pad, and the first reference pad can be located between the temperature pad and the user-facing surface.

QUOTES INCLUDED IN THE DESCRIPTION

This list of the documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• CN 2020/077623 [0001]
• US 16/828381 [0001]

Claims (20)

An electronic device comprising: a sensor assembly comprising: a first circuit layer including an approach pad and a first reference pad, and a second circuit layer having a second reference pad and a temperature pad, wherein the first circuit layer is between the second circuit layer and a user-facing surface of the electronic device, the first reference pad is electrically coupled to the second reference pad, and the first reference pad is located between the temperature pad and the user-facing surface. Electronic device according to Claim 1 wherein the first reference pad and the second reference pad are electrically coupled to ground. Electronic device according to Claim 1 or 2 wherein the electronic device is a wearable electronic device. An electronic device according to any preceding claim, wherein the electronic device comprises a headset and the sensor arrangement is contained in the headset. The electronic device of any preceding claim, wherein the first circuit layer and the second circuit layer are flexible printed circuit layers. An electronic device according to any preceding claim, wherein the sensor arrangement comprises a flexible printed circuit. The electronic device of any preceding claim, wherein the proximity pad and the second reference pad are together part of a capacitive proximity sensor. An electronic device comprising: a sensor assembly comprising: an approach pad, a first reference pad, a second reference pad, and a temperature pad, wherein the proximity pad is located between a user-facing surface of the electronic device and the second reference pad, the first reference pad is located between the user-facing surface and the temperature pad, and wherein the sensor arrangement is contained in fewer than four circuit layers. Electronic device according to Claim 8 wherein the proximity pad and the first reference pad are included in a single layer of circuitry. Electronic device according to Claim 8 or 9 wherein the second reference pad and the temperature pad are contained in a single circuit layer. Electronic device according to one of the Claims 8 until 10 Further comprising: a controller electrically coupled to the sensor assembly. Electronic device according to Claim 11 wherein the controller is configured to generate a signal indicating whether or not a user is in proximity to the electronic device based on signals generated by the sensor arrangement. Electronic device according to Claim 11 or 12th wherein the sensor arrangement is designed to generate a proximity capacitance value using the proximity pad and the sensor arrangement is designed to generate a temperature capacitance value using the temperature pad. Electronic device according to Claim 13 wherein the controller is adapted to adjust a reference approximate capacitance value used to determine whether or not a user is in proximity to the electronic device based on the temperature capacitance value. Electronic device according to Claim 14 wherein adjusting the reference approximate capacitance value based on the temperature capacitance value comprises adjusting the reference approximate capacitance value in response to changes in the temperature capacitance value. Electronic device according to Claim 14 or 15th wherein adjusting the reference proximity capacity value when a user is indicated as being in proximity to the electronic device comprises setting the reference proximity capacity value equal to the proximity capacity value minus an proximity capacity threshold. Electronic device according to Claim 16 wherein adjusting the reference approximate capacitance value when a user is indicated as not being in proximity to the electronic device comprises setting the reference approximate capacitance value equal to the approximate capacitance value. A method of proximity detection for an electronic device, comprising: adjusting a reference proximity capacitance value based at least in part on temperature data; and determining whether a user is in proximity to the electronic device, wherein determining if a user is in proximity to the electronic device comprises performing a threshold comparison based at least in part on an approximate capacitance value and the reference approximate capacitance value. Procedure according to Claim 18 wherein adjusting the approximate reference capacitance value based at least in part on temperature data comprises: identifying a change in temperature; and in response to identifying the temperature change, adjusting the reference approximation capacitance value. Procedure according to Claim 18 or 19th wherein adjusting the reference approximate capacitance value is based at least in part on an indicator of whether a user is currently in proximity to the electronic device.

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